CN104979310B - A kind of intelligent microchannel heat sink for charger - Google Patents
A kind of intelligent microchannel heat sink for charger Download PDFInfo
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- CN104979310B CN104979310B CN201510383605.8A CN201510383605A CN104979310B CN 104979310 B CN104979310 B CN 104979310B CN 201510383605 A CN201510383605 A CN 201510383605A CN 104979310 B CN104979310 B CN 104979310B
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- Prior art keywords
- runner
- annular
- confluxes
- charger
- level
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 230000005611 electricity Effects 0.000 claims description 2
- 238000012856 packing Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000011093 chipboard Substances 0.000 abstract description 4
- 239000002826 coolant Substances 0.000 description 9
- 238000001816 cooling Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The present invention provides a kind of intelligent microchannel heat sink for charger, including upper plate, lower plate, cover plate, temperature sensor；Water stream channel, outlet pipe mounting groove are respectively equipped with upper plate and lower plate.The upper plate includes water inlet pipe；The water inlet tube wall is provided with seal groove；The cover plate enclosed inside circuit board is simultaneously fixed on upper plate with pin.The present invention preferably resolves the problem of centre is radiated, and reliability is high, and control is simple, and the heat abstractor directly can be fitted on the chip board of charger, plugs quick and convenient.
Description
Technical field
The invention belongs to integrated chip technical field of heat dissipation, and in particular to a kind of intelligent microchannel for integrated chip dissipates
Thermal.
Background technology
With continuing to develop for computer technology, the volume of electronic equipment is less and less, and power and integrated level are significantly
Degree is improved, and the generation of high heat flux turns into a kind of irresistible trend, and then the cooling problem of electronic equipment is just increasingly
It is prominent.Data shows that the Problem of Failure of current 55% electronic chip is all due to that overheat is caused, therefore is studied effective and feasible
Heat dissipation of electronic chip device the problem of have become extremely urgent.
Cold microchannel liquid is the surface for being directly fitted in cooled plate radiating module, passes through liquid forced convertion in water cooling version
Heat is taken away, the effect of cooling is reached.This radiating mode has that thermal resistance is low, heat radiation power is larger, coolant is not by gravity shadow
Ring, in the presence of water pump, the advantages of operational blocks which partition system being radiated, therefore, microchannel, which has been included board, to be applied and electronics
Equipment cooling field.But in practical application, microchannel make it that spreader surface temperature field is extremely uneven, it is impossible to produced for concentrating
Hot spot carries out targetedly cooling radiating, is easily destroyed the electricity characteristic of equipment.
The content of the invention
It is an object of the invention to provide a kind of intelligent microchannel heat sink for charger, charging can be preferably realized
Chip board uniformly radiates machine at work, and reliability is high, plugs quick and convenient.
For achieving the above object, the present invention uses following technical side for the intelligent microchannel heat sink of charger
Case：
A kind of intelligent microchannel heat sink for charger, including lower plate, the upper plate fitted with lower plate, cover plate；Institute
State lower face and annular channel and the two neighboring lower annular of connection under some circles laid from inside to outside are provided with to the one side of upper plate
Some inferior division runners of runner；The upper face is provided with annular channel on some circles laid from inside to outside to the one side of lower plate
And some top set's runners of the two neighboring upper annular channel of connection；Annular under annular channel and some circles on some circles
Runner corresponding matching forms some ring shapes and confluxed runner；And inferior division runner and top set's runner corresponding matching form straight branch
Runner；
The cover plate is installed on upper plate, and the upper plate convex is provided with water inlet pipe, and cover plate sets the receipts around water inlet pipe
Circuit board is provided with cavity volume, the host cavity；The inwall of the water inlet pipe is provided with temperature sensor, the temperature sensor and institute
State circuit board connection；Water inlet pipe connection annular is confluxed runner；The annular of the outmost turns runner that confluxes is connected with outlet pipe；
The water inlet pipe confluxes flow passage also by the annular of straight branch flow passage and innermost circle.
Compared with prior art, the beneficial effects of the present invention are：
1st, the intelligent microchannel heat sink of the charger is used to directly be fitted on chip board (such as integrated IGBT board), and
Set make the sphere of circulation of coolant larger layer by layer by some annulars runner that confluxes, solve well chip plate temperature compared with
Height, the problem of radiating slow；
2nd, temperature sensor can monitor the temperature of the heat abstractor centre coolant in real time, in time by this
Temperature signal input so that the control of the device is simple and convenient, with real-time；
3rd, on the basis of annular confluxes runner and straight branch flow passage setting structure, annulars at different levels are confluxed runner and straight branch
The diameter and length of runner can be designed according to fluid interchange characteristic of the heat dissipation characteristics and fluid of thermal source in configuration microchannel,
Effectively raise the local convective heat transfer coefficient and heat exchange area of heat abstractor；
4th, the heat abstractor can realize heat abstractor surface temperature field distribution uniform, protect the electric power of equipment special
Property, the life-span of extension device；
5th, the Intelligent heat dissipation device can directly be fitted in the surface of equipment, widely applicable, convenient disassembly.
Brief description of the drawings
Fig. 1 is stereogram of the present invention for the intelligent microchannel heat sink of charger；
Fig. 2 is partial cross-sectional perspective view of the present invention for the intelligent microchannel heat sink of charger；
Fig. 3 is the upward view of upper plate, presents one side of the upper face to lower plate；
Fig. 4 is the top view of lower plate, presents one side of the lower face to upper plate.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment, the present invention is furture elucidated, it should be understood that these embodiments are merely to illustrate
The present invention rather than limitation the scope of the present invention, after the present invention has been read, those skilled in the art are each to the present invention's
The modification for planting the equivalent form of value falls within the application appended claims limited range.
As shown in Figures 1 to 4, the present invention discloses a kind of intelligent microchannel heat sink for charger, including lower plate
1st, upper plate 2, the cover plate 3 fitted with lower plate 1.The upper plate 2 and lower plate 1 are connected by four pins..The lower plate 1 is in face of upper
The one side of plate 2 be provided with annular channel under some circles for laying from inside to outside and the two neighboring lower annular channel of connection it is some under
Branch flow passage；The upper plate 2 is provided with annular channel and connection phase on some circles laid from inside to outside in face of the one side of lower plate 1
Some top set's runners of adjacent two upper annular channels.Annular channel correspondence is matched somebody with somebody under annular channel and some circles on some circles
Conjunction forms some ring shapes and confluxed runner；And inferior division runner and top set's runner corresponding matching form straight branch flow passage.Wherein,
The conflux diameter and length of runner and straight branch flow passage of annular is heat dissipation characteristics and fluid according to thermal source in configuration microchannel
Fluid interchange characteristic design, e.g., in the present embodiment, annular conflux runner include set from inside to outside one-level annular converge
Conflux runner 5, three-level annular of stream runner 4, two-stage ring shape is confluxed runner 6；Straight branch flow passage includes the straight branch flow passage 7, two of one-level
Level straight branch flow passage 8, the straight branch flow passage 9 of three-level.The cover plate 3 is installed on upper plate 2, and the convex of upper plate 2 is provided with water inlet
Pipe 21.Cover plate 3, which is set, is provided with circuit board 32 in the host cavity 31 around water inlet pipe 21, the host cavity.The water inlet pipe 21
Inwall is provided with temperature sensor 33.The temperature sensor 33 is connected with the circuit board 32.The water inlet pipe 21 connects annular remittance
Stream runner to the annular runner that confluxes by the water inlet pipe 21 so that inject coolant and full of in whole heat abstractor.Meanwhile, institute
The annular runner that confluxes for stating outmost turns is connected with outlet pipe 22, and coolant passes through outlet pipe after heat abstractor internal circulation flow
22.Wherein, water inlet pipe 21 confluxes flow passage also by the annular of straight branch flow passage and innermost circle.The outlet pipe 22 is arranged on
In the outlet pipe mounting groove formed between upper plate 2 and lower plate 1, connected with the three-level annular runner 6 that confluxes, and outlet pipe pass through it is O-shaped
Packing ring is sealed with upper plate 2 and lower plate 1.The cover plate 3 is fixed on the outside of water inlet pipe 21 of upper plate 2 by four pins.
The signal output part of the temperature sensor 33 is sealed with the inwall of water inlet pipe 21 with sealing ring.
The one-level annular runner 4 that confluxes confluxes in runner 5 positioned at two-stage ring shape, and two-stage ring shape confluxes runner 5 positioned at three
Level annular is confluxed in runner 6；One-level annular is confluxed between runner 4 and water inlet pipe 21 to be connected by the straight branch flow passage 7 of 8 one-levels；
One-level annular runner 4 and two-stage ring the shape runner 5 that confluxes that confluxes is connected by 16 two grades straight branch flow passages 8；Two-stage ring shape is confluxed
Runner 5 and the three-level annular runner 6 that confluxes are connected by the straight branch flow passage 9 of 32 three-levels.In the present embodiment, the one-level,
Two grades, three-level annular conflux the circular flow channel that runner is concentric, symmetrical orderly coolant flow is formed in heat abstractor
Passage is can realize uniform radiating.The upper plate 2 confluxes in the annular of outmost turns is provided with positioning boss 23 on the outside of runner, under
Plate 1 is provided with groove (non-label) the aligning and being brought into close contact for upper and lower plate coordinated with positioning boss 23, prevents leak.
The present invention is fitted in when in use for the intelligent microchannel heat sink of charger needs radiating in charger
Equipment (such as chip board) surface, is confluxed runner and straight branch flow passage at different levels by injecting coolant in water inlet pipe 21 in annulars at different levels
In while circulate the heat of absorption equipment and being flowed out from outlet pipe 22 heat is taken away, realize radiating.Cross some rings
The shape runner that confluxes sets make the sphere of circulation of coolant larger layer by layer, solves that chip plate temperature is higher well, and radiating is slow
The problem of.Meanwhile, temperature sensor can monitor the temperature of the heat abstractor centre coolant in real time, in time should
The temperature signal input at place so that the control of the device is simple and convenient, with real-time.
Claims (8)
1. a kind of intelligent microchannel heat sink for charger, it is characterised in that：That is fitted including lower plate, with lower plate is upper
Plate, cover plate；It is adjacent that the lower face is provided with annular channel and connection under some circles laid from inside to outside to the one side of upper plate
Some inferior division runners of two lower annular channels；The upper face is provided with some circles laid from inside to outside to the one side of lower plate
Some top set's runners of upper annular channel and the two neighboring upper annular channel of connection；If on some circles annular channel and
The dry lower annular channel corresponding matching of circle forms some ring shapes and confluxed runner；And inferior division runner and top set's runner corresponding matching
Form straight branch flow passage；
The cover plate is installed on upper plate, and the upper plate convex is provided with water inlet pipe, and cover plate sets the host cavity around water inlet pipe,
Circuit board is provided with the host cavity；The inwall of the water inlet pipe is provided with temperature sensor, the temperature sensor and the electricity
Road plate connection；Water inlet pipe connection annular is confluxed runner；Some ring shapes are confluxed in runner, and the annulars of outmost turns is confluxed stream
Road is connected with outlet pipe；The water inlet pipe confluxes flow passage also by the annular of straight branch flow passage and innermost circle.
2. the intelligent microchannel heat sink according to claim 1 for charger, it is characterised in that：The temperature is passed
The signal output part of sensor is sealed with water inlet inside pipe wall with sealing ring.
3. the intelligent microchannel heat sink according to claim 1 for charger, it is characterised in that：The annular is converged
One-level that stream runner includes setting from inside to outside, two grades, three-level annular confluxes runner；Straight branch flow passage include one-level, two grades, three
The straight branch flow passage of level；The one-level annular runner that confluxes confluxes in runner positioned at two-stage ring shape, and the two-stage ring shape runner that confluxes is located at
Three-level annular is confluxed in runner；One-level annular is confluxed between runner and water inlet pipe to be connected by 8 straight branch flow passages of one-level, one-level
Annular runner and two-stage ring the shape runner that confluxes that confluxes is connected by 16 two grades straight branch flow passages, and two-stage ring shape is confluxed runner and three
The level annular runner that confluxes passes through the straight branch flow passage of 32 three-levels and connected.
4. the intelligent microchannel heat sink according to claim 3 for charger, it is characterised in that：The one-level,
Two grades, three-level annular conflux runner be concentric circular flow channel.
5. the intelligent microchannel heat sink according to claim 1 for charger, it is characterised in that：The upper plate and
Lower plate is connected by four pins.
6. the intelligent microchannel heat sink according to claim 3 for charger, it is characterised in that：The outlet pipe
Install in the outlet pipe mounting groove that is formed between the upper and lower plates, connected with the three-level annular runner that confluxes, and outlet pipe passes through O
Type packing ring is sealed with upper plate and lower plate.
7. the intelligent microchannel heat sink according to claim 1 for charger, it is characterised in that：The cover plate leads to
Four pins are crossed to be fixed on the outside of the water inlet pipe of upper plate.
8. the intelligent microchannel heat sink according to claim 7 for charger, it is characterised in that：The upper plate exists
The annular of outmost turns confluxes runner outside provided with positioning boss, and lower plate is provided with the groove coordinated with positioning boss.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510383605.8A CN104979310B (en) | 2015-07-02 | 2015-07-02 | A kind of intelligent microchannel heat sink for charger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510383605.8A CN104979310B (en) | 2015-07-02 | 2015-07-02 | A kind of intelligent microchannel heat sink for charger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104979310A CN104979310A (en) | 2015-10-14 |
| CN104979310B true CN104979310B (en) | 2017-08-04 |
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ID=54275690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510383605.8A Active CN104979310B (en) | 2015-07-02 | 2015-07-02 | A kind of intelligent microchannel heat sink for charger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104979310B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112582360B (en) * | 2020-12-10 | 2024-01-26 | 江苏佳成冷却系统有限公司 | Split-flow type micro-channel radiator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1870255A (en) * | 2005-05-24 | 2006-11-29 | 富准精密工业(深圳)有限公司 | Liquid-cooling heat sink |
| CN101814470A (en) * | 2010-04-15 | 2010-08-25 | 华中科技大学 | Micro-channel heat sink for electronic encapsulation device |
| CN102655130A (en) * | 2012-05-04 | 2012-09-05 | 孙正军 | Compressor type chip temperature reducing system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7316263B2 (en) * | 2003-11-19 | 2008-01-08 | Intel Corporation | Cold plate |
-
2015
- 2015-07-02 CN CN201510383605.8A patent/CN104979310B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1870255A (en) * | 2005-05-24 | 2006-11-29 | 富准精密工业(深圳)有限公司 | Liquid-cooling heat sink |
| CN101814470A (en) * | 2010-04-15 | 2010-08-25 | 华中科技大学 | Micro-channel heat sink for electronic encapsulation device |
| CN102655130A (en) * | 2012-05-04 | 2012-09-05 | 孙正军 | Compressor type chip temperature reducing system |
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| Publication number | Publication date |
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| CN104979310A (en) | 2015-10-14 |
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