CN104966678B - A kind of parallel welder of integrative packaging microwave device array and method - Google Patents
A kind of parallel welder of integrative packaging microwave device array and method Download PDFInfo
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- CN104966678B CN104966678B CN201510270691.1A CN201510270691A CN104966678B CN 104966678 B CN104966678 B CN 104966678B CN 201510270691 A CN201510270691 A CN 201510270691A CN 104966678 B CN104966678 B CN 104966678B
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- cover plate
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- positioning fixture
- array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81053—Bonding environment
- H01L2224/81095—Temperature settings
- H01L2224/81096—Transient conditions
- H01L2224/81098—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8111—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving protection against electrical discharge, e.g. removing electrostatic charge
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Package Closures (AREA)
Abstract
The invention discloses a kind of parallel welder of integrative packaging microwave device array and method, the front of positioning fixture is provided with the welding chamber of multiple arrays arrangement, the welding intracavitary is welded with insulating radiation substrate, the insulating radiation substrate is positive concordant with positioning fixture, the fixed via of multiple array arrangements is opened up on the fixture cover plate, the peripheral frame size of the fixed via and device to be welded matches, the fixture insulating barrier is covered in the back side of fixture cover plate, and the cover plate insulating barrier is covered in the front beyond the welding chamber of positioning fixture.Integrative packaging microwave device the quick of caused amount of heat during array parallel seam welding can be achieved to shed.Avoiding the device of array arrangement, caused heat spreads between each other in capping procedure successively, causes device temperature to rise rapidly, device inside solder reflow, sizing material aging, a series of hidden danger such as bare chip failure.
Description
Technical field
The present invention relates to a kind of electronic device sealing process, more particularly to a kind of integrative packaging microwave device array
The parallel welder of formula and method.
Background technology
As modern radar is towards array, the development of multiple-unit, to microwave device, rapidly and efficiently low cost is extensive
The demand of batch micro operations starts to become strong, and the solution way that microwave device is exactly a kind of forward position is manufactured by integrative packaging
Footpath.After pin is realized by welding manner and ceramic substrate and peripheral frame that sealing is close and is connected, how in costlinesses such as bare chips
Precision element realizes being fully sealed for integrative packaging device by way of being capped plate and rapidly and efficiently sealing again after installing
It is next to need problems faced.
Realize and be tightly connected between cover plate and peripheral frame, the capping mode of parallel seam welding has the characteristics of its is unique：Reliability
Height, cost is low, and service speed is fast, and manual difficulty is low etc., is just widely used in integrative packaging microwave device encapsulation field.It
Principle be to be generated heat by electric resistance welding mode, realize that the melting welding of cover plate and peripheral frame connects, during seam weld between cover plate and peripheral frame due to
Resistance be present, heat is produced when passing through electric current, peripheral frame is melted and is connected together with the edge of cover plate, form welding.But
Because welding caloric value is big, leakage current destroys the reasons such as internal bare chip easily by pin, is also limited at present by only device
Parallel seam welding.Further develop with the array trend of modern radar, the demand of microwave device flood tide is allowed by only carrying out
The technique of parallel seam welding turns into the bottleneck on whole manufacture streamline, and often accumulation does not largely cover device, operator in this place
Member's labor intensity is big, longevity of service.
In order to solve this problem, the array for attempting generally to be used using preceding working procedure in parallel seam welding technique is solved
Scheme, it is intended to disposably complete the capping of multiple devices, face the problem of new again：The device capping procedure successively of array arrangement
In caused heat spread between each other, cause device temperature to rise rapidly, device inside solder reflow be present, sizing material aging,
A series of hidden danger such as bare chip failure.The development of integrative packaging microwave device is tended in a device to install multiple naked again
Chip, because caused high current can be imported into device inside by pin etc. during parallel seam welding, cause to bare chip
Destroy.Problem above greatly limit use range and use of the parallel seam welding in integrative packaging microwave device encapsulation field
Efficiency, limit the extensive manufacture of integrative packaging microwave device.
The content of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of integrative packaging microwave device array
Parallel welder and method, improve injury of the seam weld efficiency reduction to bare chip.
The present invention is achieved by the following technical solutions：The inventive system comprises positioning fixture, fixture cover plate, fastening
Screw, fixture insulating barrier and cover plate insulating barrier, the front of the positioning fixture is provided with the welding chamber of multiple arrays arrangement, described
Welding intracavitary is welded with insulating radiation substrate, and the insulating radiation substrate is positive concordant with positioning fixture, the fixture cover plate
On open up the fixed via of multiple arrays arrangement, the peripheral frame size of the fixed via and device to be welded matches, described
Fixed via and welding chamber match, and the front of the fixture cover plate is concordant, and the back side of the fixture cover plate leads in each fixation
The both sides in hole offer the receiving step for accommodating device pin to be welded, are set respectively on positioning fixture and the fixture cover plate
There is corresponding trip bolt hole, the fixture insulating barrier is covered in the back side of fixture cover plate, and the cover plate insulating barrier is covered in
Front beyond the welding chamber of positioning fixture.
One of preferred embodiment as the present invention, the welder also includes shop bolt, the positioning fixture and folder
Corresponding alignment pin nail is respectively equipped with tool cover plate.
Positioning fixture and the fixture cover plate is made up of the material that thermal coefficient of expansion matches with device to be welded, selected from can
Cut down one kind in alloy, copper alloy, aluminium alloy, carbon aluminium silicon composite material, Al-Si composites.
Positioning fixture and the fixture cover plate go into battle column arrangement welding chamber and array arrangement fixed via horizontal stroke
2 are all higher than to longitudinal number.
The fixture insulating barrier and cover plate insulating barrier are respectively organic heat-resistant insulating film, selected from Kapton, are gathered
One or more compoundings in ester film, polyurethane film, silicone resin film.
The insulating radiation substrate is selected from the compounding of one or both of beryllium oxide, aluminium nitride.
A kind of parallel welding method of integrative packaging microwave device array, comprises the following steps：
(1) device to be welded is tipped upside down on one by one on the fixed via of fixture cover plate, positioning fixture and insulating radiation substrate
One layer of heat dissipating silicone grease of upper coating, then fixture cover plate is mutually fixed with positioning fixture, form the integrated apparatus assembled；
(2) the device cover plate long side for treating welding device carries out spot welding, realizes the device cover plate and housing of device to be welded
Point connection；
(3) integrated apparatus for completing spot welding is subjected to vacuum(-)baking, removes steam and volatile lower-molecular substance；
(4) array order is pressed, seam weld is scrolled sequentially through in the long side of device cover plate successively, is carried out again after completion a line next
OK, the long side high temperature of device cover plate is completed from melting, and is formed long side edge opening sealing, is then sequentially completed the short side to device cover plate again
Edge opening sealing.
The power of the spot-welding technology：1200~2000W, spot welding time are 0.1~0.3 second.
The rolling rate that the device cover plate long side and short side order roll across is 1~4mm/s, and power is 1800~2000W,
Pulse width is 10ms, repetition period 80ms.
Positioning fixture is rotated by 90 ° after the device cover plate long side order is spaced at least one minute after rolling across, then to device-cover
Plate carries out short side edge opening sealing.
The present invention has advantages below compared with prior art：The present invention uses the positioning fixture of array arrangement, clamp cover
The combination of plate, shop bolt, trip bolt, array parallel seam welding is realized to integrative packaging microwave device, seam can be passed through
The once mobile over long distances disposable seam weld for realizing long side or short side to the multiple integrative packaging devices of a line of welding roll wheel,
Can be again by the way that once mobile realize realizes disposable seam weld to the another side of a line device over long distances, significantly after rotated 90 degree
Seam weld efficiency is improved, alleviates labor intensity and the operating time of operating personnel.
The present invention uses fixture insulating barrier and cover plate insulating barrier pin and parallel seam welding to integrative packaging microwave device
Frock clamp realizes electric insulation, and it is micro- to integrative packaging through pin introducing to avoid the caused electric current during parallel seam welding
The infringement of bare chip in wave device.
Integration envelope can be achieved by installing the high heat-radiating substrate that insulate additional on the frock position of array device seam weld in the present invention
Microwave device the quick of caused amount of heat during array parallel seam welding is filled to shed.Avoid array arrangement
Caused heat spreads device between each other in capping procedure successively, causes device temperature to rise rapidly, device inside solder weight
Melt, sizing material aging, a series of hidden danger such as bare chip failure, integral insulation, avoid electric current and poured into by device bottom plate in device
Portion causes the problem of device damage.
Brief description of the drawings
Fig. 1 is the structural representation before the integrative packaging microwave device of the present invention does not cover；
Fig. 2 is integrative packaging microwave device capping assemble flow schematic diagram；
Fig. 3 is Fig. 1 decomposing schematic representation.
Fig. 4 is the schematic diagram of positioning fixture；
Fig. 5 is Fig. 4 upward view；
Fig. 6 is the schematic diagram of fixture cover plate；
Fig. 7 is the structural representation after assembling；
Fig. 8 is the schematic cross-section in Fig. 7；
Fig. 9 is the schematic diagram of long side seam weld；
Figure 10 is the schematic diagram of short side seam weld.
Embodiment
Embodiments of the invention are elaborated below, the present embodiment is carried out lower premised on technical solution of the present invention
Implement, give detailed embodiment and specific operating process, but protection scope of the present invention is not limited to following implementation
Example.
As shown in Figures 1 to 3, the housing 6 of integrative packaging microwave device includes substrate 1, peripheral frame 2, bottom plate 3, pin 4.Its
In possess circuitous pattern inside substrate 1, surface is equipped with bare chip, and realizes electric interconnection with modes such as spun golds on bare chip；
Pin 4 is device welding equipment point, and with being connected inside the circuit of substrate 1, device Electricity Functional is realized by the input and output of pin 4.Enclose
Frame 2 and bottom plate 3 are used for the sealing for realizing bottom device and side.
Housing 6 can realize close connection, shape with device cover plate 5 by way of both sides long side and short side distinguish parallel seam welding
Into the integrative packaging microwave device 7 after sealing.
As shown in Fig. 4~8, welder includes positioning fixture 8, fixture cover plate 9, trip bolt 10, fixture insulating barrier 12
With cover plate insulating barrier 13,
Positioning fixture 8 is nearly square fixture, the positive welding chamber 81 for being provided with multiple arrays and arranging, in the welding chamber 81
It is welded with insulating radiation substrate 82, the insulating radiation substrate 82 positive concordant, back side of positioning fixture 8 with positioning fixture 8
Positioning hole is provided with so that positioning fixture 8 itself positions on parallel seam sealing machine,
Fixture cover plate 9 is the square cover plate of sheet, and the fixed via 91 of multiple array arrangements, institute are opened up on fixture cover plate 9
The peripheral frame size for stating fixed via 91 and device to be welded matches, and the fixed via 91 and welding chamber 81 match, described
The front of fixture cover plate 9 is concordant, and the back side of the fixture cover plate 9 offers in the both sides of each fixed via 91 treats for receiving
The receiving step 92 of device pin is welded, protection pin does not stress, indeformable, on the positioning fixture 8 and fixture cover plate 9 respectively
Provided with corresponding trip bolt hole, the fixture insulating barrier 12 is covered in the back side of fixture cover plate 9, the cover plate insulating barrier 13
The front being covered in beyond the welding chamber 81 of positioning fixture 8.Welder also includes shop bolt 11, the He of positioning fixture 8
Corresponding alignment pin nail is respectively equipped with fixture cover plate 9.
Shop bolt 11 is after device is fixed on positioning fixture 8, is used for fixture cover plate 9 after covering fixture cover plate 9 and determines
The precision positioning of position fixture 8；After trip bolt 10 completes the precision positioning of tool cover plate and positioning fixture 8 for pin 11 to be positioned,
For fastening clips cover plate 9 and positioning fixture 8.
The positioning fixture 8 and fixture cover plate 9 are made up of the material that thermal coefficient of expansion matches with device to be welded, are selected from
One kind in kovar alloy, copper alloy, aluminium alloy, carbon aluminium silicon composite material, Al-Si composites.
The welding chamber 81 and the fixed via of array arrangement that array is arranged on the positioning fixture 8 and fixture cover plate 9
91 horizontal and vertical number is all higher than 2.
The fixture insulating barrier 12 and cover plate insulating barrier 13 are respectively organic heat-resistant insulating film, thin selected from polyimides
One or more compoundings in film, polyester film, polyurethane film, silicone resin film.In integrated encapsulation microwave device
The crucial sensitive components such as bare chip provides protection.
The insulating radiation substrate 82 is selected from the compounding of one or both of beryllium oxide, aluminium nitride.Insulating radiation substrate
82 can realize that integrative packaging microwave device the quick of caused amount of heat during array parallel seam welding sheds.
As shown in Figure 9 and Figure 10, the parallel welding method of a kind of integrative packaging microwave device array, including following step
Suddenly：
(1) jig for attaching insulating barrier 12 on positioning fixture 8, cover plate insulating barrier 13 is mounted on fixture cover plate 9, multiple one
Change encapsulation microwave device housing to be placed in fixture cover plate 9 by array arrangement back-off, recycle shop bolt 11 to align, folder
Tool cover plate 9 and positioning fixture 8 are assembled together and clamped, and after turn-over, realize that integrative packaging is micro- using the locking of trip bolt 10
The assembling of wave device and array sealing weld clamp；
(2) array order is pressed successively in the device of integrative packaging microwave device using the seam weld roller of parallel seam welding equipment
Part cover plate long side dubs, using the spot-welding technology, realizes that housing and cover plate contraposition are assembled and realize a connection；
(3) be fitted into and complete spot welding fix integrative packaging microwave device integrally carries out vacuum and baked and banked up with earth, remove
Steam and volatile lower-molecular substance.
(4) pressed using the seam weld roller of parallel seam welding equipment in Fig. 9, I, II, III, IV, V order are in integrative packaging
The device cover plate long side direction of microwave device rolls across roller successively, completes integrative packaging microwave device device cover plate long side high temperature
From molten, formation long side edge opening sealing；
Positioning fixture 8 is rotated by 90 °, and reuses the seam weld roller of parallel seam welding equipment by by Figure 10, I, II, III, IV
Order direction successively integrative packaging microwave device device cover plate short side order roll across, complete integrative packaging microwave device
Part device cover plate short side high temperature forms short side edge opening sealing from melting；Finally realize the battle array of multiple integrative packaging microwave devices
The efficient rapid batch capping of column.
Power during the present embodiment spot-welding technology：1500W, spot welding time are 0.2 second.
The overall vacuum that carries out baked and banked up with earth the time as 60 minutes, and it is 100pa to bake and bank up with earth vacuum.
Using the seam weld roller of parallel seam welding equipment by array order successively in the device of integrative packaging microwave device
Cover plate long side and the rolling rate that rolls across of short side order are 3mm/s, power：1900W pulse widths：10ms, repetition period：
80ms。
Using the seam weld roller of parallel seam welding equipment by array order successively in the device of integrative packaging microwave device
Positioning fixture 8 is rotated by 90 ° after cover plate long side order is spaced 1 minute after rolling across.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. the parallel welder of a kind of integrative packaging microwave device array, it is characterised in that including positioning fixture, clamp cover
Plate, trip bolt, fixture insulating barrier and cover plate insulating barrier, the front of the positioning fixture are provided with the welding of multiple arrays arrangement
Chamber, the welding intracavitary are welded with insulating radiation substrate, the insulating radiation substrate positive concordant, folder with positioning fixture
The peripheral frame size phase of the fixed via of multiple array arrangements, the fixed via and device to be welded is opened up on tool cover plate
Match somebody with somebody, the fixed via and welding chamber match, and the front of the fixture cover plate is concordant, and the back side of the fixture cover plate is each
The both sides of fixed via offer the receiving step for accommodating device pin to be welded, on positioning fixture and the fixture cover plate
Corresponding trip bolt hole is respectively equipped with, the fixture insulating barrier is covered in the back side of fixture cover plate, the cover plate insulating barrier
The front being covered in beyond the welding chamber of positioning fixture.
A kind of 2. parallel welder of integrative packaging microwave device array according to claim 1, it is characterised in that institute
Stating welder also includes shop bolt, and corresponding alignment pin nail is respectively equipped with positioning fixture and the fixture cover plate.
A kind of 3. parallel welder of integrative packaging microwave device array according to claim 1, it is characterised in that institute
State positioning fixture and fixture cover plate to be made up of the material that the thermal coefficient of expansion of thermal coefficient of expansion and device to be welded matches, be selected from
One kind in kovar alloy, copper alloy, aluminium alloy, carbon aluminium silicon composite material, Al-Si composites.
A kind of 4. parallel welder of integrative packaging microwave device array according to claim 1, it is characterised in that institute
State positioning fixture and fixture cover plate is gone into battle the horizontal and vertical number of the welding chamber of column arrangement and the fixed via of array arrangement
Mesh is all higher than 2.
A kind of 5. parallel welder of integrative packaging microwave device array according to claim 1, it is characterised in that institute
It is respectively organic heat-resistant insulating film to state fixture insulating barrier and cover plate insulating barrier, and it is sub- that organic heat-resistant insulating film is selected from polyamides
One or more compoundings in amine film, polyester film, polyurethane film, silicone resin film.
A kind of 6. parallel welder of integrative packaging microwave device array according to claim 1, it is characterised in that institute
State the compounding that insulating radiation substrate is selected from one or both of beryllium oxide, aluminium nitride.
7. the welding method of the parallel welder of a kind of integrative packaging microwave device array as claimed in claim 1, it is special
Sign is, comprises the following steps：
(1) device to be welded is tipped upside down on one by one on the fixed via of fixture cover plate, applied on positioning fixture and insulating radiation substrate
One layer of heat dissipating silicone grease is covered, then fixture cover plate is mutually fixed with positioning fixture, forms the integrated apparatus assembled；
(2) the device cover plate long side for treating welding device carries out spot welding, realizes that the device cover plate of device to be welded and the point of housing connect
Connect；
(3) integrated apparatus for completing spot welding is subjected to vacuum(-)baking, removes steam and volatile lower-molecular substance；
(4) array order is pressed, is scrolled sequentially through seam weld in the long side of device cover plate successively, next line is carried out again after completing a line,
The long side high temperature of device cover plate is completed from melting, long side edge opening sealing is formed, is then sequentially completed the short side side to device cover plate again
Mouth sealing.
A kind of 8. welding method according to claim 7, it is characterised in that the power of the spot-welding technology：1200~
2000W, spot welding time are 0.1~0.3 second.
9. a kind of welding method according to claim 7, it is characterised in that the device cover plate long side and short side order roll across
Rolling rate be 1~4mm/s, power is 1800~2000W, pulse width 10ms, repetition period 80ms.
10. a kind of welding method according to claim 7, it is characterised in that between the device cover plate long side order rolls across afterwards
Positioning fixture is rotated by 90 ° after at least one minute, then carries out short side edge opening sealing to device cover plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510270691.1A CN104966678B (en) | 2015-05-25 | 2015-05-25 | A kind of parallel welder of integrative packaging microwave device array and method |
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| CN201510270691.1A CN104966678B (en) | 2015-05-25 | 2015-05-25 | A kind of parallel welder of integrative packaging microwave device array and method |
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| CN104966678A CN104966678A (en) | 2015-10-07 |
| CN104966678B true CN104966678B (en) | 2017-11-24 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105414848A (en) * | 2015-12-18 | 2016-03-23 | 安徽华东光电技术研究所 | Parallel seam welding tool structure |
| CN108098232B (en) * | 2018-01-30 | 2019-07-30 | 中国电子科技集团公司第三十八研究所 | A kind of array holder that parallel seam welding covers and the welding method using the fixture |
| CN111889845A (en) * | 2020-08-28 | 2020-11-06 | 中国电子科技集团公司第五十八研究所 | Clamping fixture for alloy sealing cap and use method |
| CN112873100B (en) * | 2021-03-30 | 2024-05-03 | 中国电子科技集团公司第三十八研究所 | Fixing clamp for testing microwave assembly |
| CN114043059B (en) * | 2021-12-01 | 2023-04-07 | 中国电子科技集团公司第四十四研究所 | Array parallel seam welding carrier adopting independent sliding block to perform elastic clamping |
| CN115533413A (en) * | 2022-09-22 | 2022-12-30 | 上海航天电子通讯设备研究所 | Universal clamping method and device for parallel sealing and welding of packaging device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0645409A (en) * | 1992-07-22 | 1994-02-18 | Rohm Co Ltd | Method and apparatus for wire bonding |
| JP2005175014A (en) * | 2003-12-08 | 2005-06-30 | Matsushita Electric Ind Co Ltd | Semiconductor device |
| JP2008078442A (en) * | 2006-09-22 | 2008-04-03 | Kyocera Corp | Clamp member for wire bonding |
| JP5401709B2 (en) * | 2010-02-02 | 2014-01-29 | アピックヤマダ株式会社 | Bonding apparatus and bonding method for semiconductor device |
| JP2012164800A (en) * | 2011-02-07 | 2012-08-30 | Tosaku Kojima | Wire bonding method, circuit device and circuit device packaging method |
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