CN104966678A - Integrated packaging microwave device array parallel welding apparatus and method - Google Patents
Integrated packaging microwave device array parallel welding apparatus and method Download PDFInfo
- Publication number
- CN104966678A CN104966678A CN201510270691.1A CN201510270691A CN104966678A CN 104966678 A CN104966678 A CN 104966678A CN 201510270691 A CN201510270691 A CN 201510270691A CN 104966678 A CN104966678 A CN 104966678A
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- cover plate
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- welding
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- positioning fixture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81053—Bonding environment
- H01L2224/81095—Temperature settings
- H01L2224/81096—Transient conditions
- H01L2224/81098—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8111—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving protection against electrical discharge, e.g. removing electrostatic charge
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Package Closures (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses an integrated packaging microwave device array parallel welding apparatus and method. The front side of a positioning clamp is provided with a plurality of welding chambers arranged in arrays; insulation heat dissipation substrates are welded in the welding chambers, and are level with the front side of the positioning clamp; a clamp cover plate is provided with a plurality of fixing through holes arranged in arrays; the fixing through holes match the frame dimension of a device to be welded; a clamp insulating layer covers the back side of the clamp cover plate; a cover plate insulating layer covers the front surface of the positioning clamp except the welding chambers. The apparatus and method can rapidly dissipate great heat generated in the array parallel welding process of an integrated packaging microwave device, and avoid the problems of device temperature rapid rising, device internal welding flux remelting, rubber aging and bare chip loss caused by heat diffusion in successive covering processes of array devices.
Description
Technical field
The present invention relates to a kind of electronic device sealing process, in particular the parallel welder of a kind of integrative packaging microwave device array and method.
Background technology
Along with modern radar is towards array, the development of multiple unit, to microwave device rapidly and efficiently the demand of the extensive batch micro operations of low cost start to become strong, manufactured the solution route in microwave device a kind of forward position just by integrative packaging.At pin by welding manner and ceramic substrate with enclose after frame achieves and seal compact siro spinning technology, the sealing completely that the mode how rapidly and efficiently to seal by adding cover plate again after the expensive precision elements such as bare chip install realizes integrative packaging device next needs problems faced.
At cover plate with enclose between frame and realize being tightly connected, the capping mode of parallel seam welding has the feature of its uniqueness: reliability is high, and cost is low, and service speed is fast, and manual difficulty is low, is just widely used in integrative packaging microwave device encapsulation field.Its principle is generated heat by electric resistance welding mode, realizes cover plate and be connected with the melting welding of enclosing frame, and cover plate and enclose owing to there is resistance between frame during seam weldering, by producing heat during electric current, making to enclose frame and melt with the edge of cover plate and connect together, and is formed and welds.But because welding caloric value is large, leakage current easily destroys the reasons such as inner bare chip by pin, be also confined to the parallel seam welding by only device at present.Along with the array trend of modern radar further develops, the bottleneck become by the technique of only carrying out parallel seam welding on whole manufacture streamline allows to the demand of microwave device flood tide, often pile up a large amount of non-capping device at this place, labor intensity of operating staff is large, longevity of service.
In order to address this problem, the array solution adopting preceding working procedure generally to adopt is attempted in parallel seam welding technique, attempt the disposable capping completing multiple device, face again new problem: the heat that the device of array arrangement produces in capping procedure successively spreads each other, device temperature is caused to rise rapidly, a series of hidden danger such as there is device inside solder reflow, sizing material is aging, bare chip inefficacy.The development of integrative packaging microwave device is tended to again install multiple bare chip in a device, because the big current produced in parallel seam welding process can be imported into device inside by pin etc., causes the destruction to bare chip.Above problem greatly limit the scope of application of parallel seam welding in integrative packaging microwave device encapsulation field and service efficiency, limits the extensive manufacture of integrative packaging microwave device.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide the parallel welder of a kind of integrative packaging microwave device array and method, improve the injury of seam weldering efficiency minimizing to bare chip.
The present invention is achieved by the following technical solutions: the inventive system comprises positioning fixture, fixture cover plate, trip bolt, fixture insulating barrier and cover plate insulating barrier, the front of described positioning fixture is provided with the welding chamber of multiple array arrangement, insulating radiation substrate is welded with in described welding chamber, described insulating radiation substrate is concordant with the front of positioning fixture, described fixture cover plate is offered the fixed via of multiple array arrangement, the frame size of enclosing of described fixed via and device to be welded matches, described fixed via and welding chamber match, the front of described fixture cover plate is concordant, the back side of described fixture cover plate offers the accommodation step for holding device pin to be welded in the both sides of each fixed via, described positioning fixture and fixture cover plate are respectively equipped with corresponding fastening screw nail, described fixture insulating barrier covers the back side of fixture cover plate, described cover plate insulating barrier covers the front beyond the welding chamber of positioning fixture.
As one of optimal way of the present invention, described welder also comprises shop bolt, and described positioning fixture and fixture cover plate are respectively equipped with corresponding alignment pin nail.
Described positioning fixture and fixture cover plate are that the material that thermal coefficient of expansion and device to be welded match is made, and are selected from the one in kovar alloy, copper alloy, aluminium alloy, carbon aluminium silicon composite material, Al-Si composites.
The go into battle welding chamber of column arrangement and the horizontal and vertical number of fixed via of array arrangement of described positioning fixture and fixture cover plate is all greater than 2.
Described fixture insulating barrier and cover plate insulating barrier are respectively organic heat-resistant insulating film, are selected from one or more composite in polyimide film, polyester film, polyurethane film, silicone resin film.
Described insulating radiation substrate is selected from one or both composite in beryllium oxide, aluminium nitride.
The parallel welding method of a kind of integrative packaging microwave device array, comprises the following steps:
(1) device to be welded is tipped upside down on one by one on the fixed via of fixture cover plate, positioning fixture and insulating radiation substrate apply one deck heat dissipating silicone grease, then fixture cover plate and positioning fixture are fixed, form the integrated apparatus assembled;
(2) spot welding is carried out on the long limit of device cover plate for the treatment of welding device, and the point of the device cover plate and housing that realize device to be welded is connected;
(3) integrated apparatus completing spot welding is carried out vacuum(-)baking, removing steam and volatile lower-molecular substance;
(4) by array order, on the long limit of device cover plate, order is rolled and is stitched weldering successively, carries out next line again after completing a line, completes the long limit high temperature of device cover plate from molten, form the mouth sealing of limit, long limit, and then complete the minor face limit mouth sealing to device cover plate successively.
The power of described spot-welding technology: 1200 ~ 2000W, the spot welding time is 0.1 ~ 0.3 second.
The rolling rate that the described long limit of device cover plate and minor face order roll across is 1 ~ 4mm/s, and power is 1800 ~ 2000W, and pulse duration is 10ms, and the repetition period is 80ms.
Described device cover plate long limit order rolls across rear interval positioning fixture half-twist after at least one minute, then carries out the mouth sealing of minor face limit to device cover plate.
The present invention has the following advantages compared to existing technology: the positioning fixture that the present invention adopts array to arrange, fixture cover plate, shop bolt, the combination of trip bolt, array parallel seam welding is achieved to integrative packaging microwave device, mobile the achieving of vice-minister's distance by seam welding roll wheel is welded the long limit of a line multiple integrative packaging device or the disposable seam of minor face, the weldering of disposable seam can be realized by mobile realization of vice-minister's distance to the another side of a line device again after 90-degree rotation, increase substantially seam weldering efficiency, alleviate labour intensity and the operating time of operating personnel.
The present invention adopts fixture insulating barrier and cover plate insulating barrier to achieve electric insulation to the pin of integrative packaging microwave device and parallel seam welding frock clamp, avoids the electric current that produces in parallel seam welding process and introduces infringement to bare chip in integrative packaging microwave device through pin.
The present invention, by installing the high heat-radiating substrate of insulation additional on the frock position of array device seam weldering, can realize shedding fast of the amount of heat that integrative packaging microwave device produces in array parallel seam welding process.The heat that the device avoiding array arrangement produces in capping procedure successively spreads each other, device temperature is caused to rise rapidly, device inside solder reflow, sizing material is aging, a series of hidden danger such as bare chip inefficacy, integral insulation, avoids electric current and pours into by device base plate the problem that device inside causes device damage.
Accompanying drawing explanation
Fig. 1 is the structural representation before the non-capping of integrative packaging microwave device of the present invention;
Fig. 2 is integrative packaging microwave device capping assemble flow schematic diagram;
Fig. 3 is the decomposing schematic representation of Fig. 1.
Fig. 4 is the schematic diagram of positioning fixture;
Fig. 5 is the upward view of Fig. 4;
Fig. 6 is the schematic diagram of fixture cover plate;
Fig. 7 is the structural representation after assembling;
Fig. 8 is the schematic cross-section in Fig. 7;
Fig. 9 is the schematic diagram of long side seam weldering;
Figure 10 is the schematic diagram of minor face seam weldering.
Embodiment
Elaborate to embodiments of the invention below, the present embodiment is implemented under premised on technical solution of the present invention, give detailed execution mode and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
As shown in Figures 1 to 3, the housing 6 of integrative packaging microwave device comprises substrate 1, encloses frame 2, base plate 3, pin 4.Wherein possess circuitous pattern in substrate 1 inside, bare chip is equipped with on surface, and on bare chip, realize electricity by modes such as spun golds interconnected; Pin 4 is device welding equipment point, is connected with the inside circuit of substrate 1, and device Electricity Functional is realized by the input and output of pin 4.Enclose frame 2 and base plate 3 for realizing the sealing of bottom device and side.
Housing 6 and device cover plate 5 realize compact siro spinning technology by the mode of long limit, both sides and minor face parallel seam welding respectively, form the integrative packaging microwave device 7 after sealing.
As shown in Fig. 4 ~ 8, welder comprises positioning fixture 8, fixture cover plate 9, trip bolt 10, fixture insulating barrier 12 and cover plate insulating barrier 13,
Positioning fixture 8 is nearly square fixture, front is provided with the welding chamber 81 of multiple array arrangement, insulating radiation substrate 82 is welded with in described welding chamber 81, described insulating radiation substrate 82 is concordant with the front of positioning fixture 8, the back side of positioning fixture 8 has location hole and locates on parallel seam sealing machine for positioning fixture 8
Fixture cover plate 9 is the square cover plate of sheet, fixture cover plate 9 is offered the fixed via 91 of multiple array arrangement, the frame size of enclosing of described fixed via 91 and device to be welded matches, described fixed via 91 and welding chamber 81 match, the front of described fixture cover plate 9 is concordant, the back side of described fixture cover plate 9 offers the accommodation step 92 for holding device pin to be welded in the both sides of each fixed via 91, protection pin does not stress, indeformable, described positioning fixture 8 and fixture cover plate 9 are respectively equipped with corresponding fastening screw nail, described fixture insulating barrier 12 covers the back side of fixture cover plate 9, described cover plate insulating barrier 13 covers the front beyond the welding chamber 81 of positioning fixture 8.Welder also comprises shop bolt 11, and described positioning fixture 8 and fixture cover plate 9 are respectively equipped with corresponding alignment pin nail.
Shop bolt 11, for after being fixed on positioning fixture 8 until device, covers the precision positioning for fixture cover plate 9 and positioning fixture 8 after fixture cover plate 9; Trip bolt 10 is after pin 11 to be positioned completes the precision positioning of tool cover plate and positioning fixture 8, for fastening clips cover plate 9 and positioning fixture 8.
Described positioning fixture 8 and fixture cover plate 9 are that the material that thermal coefficient of expansion and device to be welded match is made, and are selected from the one in kovar alloy, copper alloy, aluminium alloy, carbon aluminium silicon composite material, Al-Si composites.
The horizontal and vertical number of the welding chamber 81 of array arrangement on described positioning fixture 8 and fixture cover plate 9 and the fixed via 91 of array arrangement is all greater than 2.
Described fixture insulating barrier 12 and cover plate insulating barrier 13 are respectively organic heat-resistant insulating film, are selected from one or more composite in polyimide film, polyester film, polyurethane film, silicone resin film.In integrated encapsulation microwave device, the crucial sensitive components such as bare chip provides protection.
Described insulating radiation substrate 82 is selected from one or both composite in beryllium oxide, aluminium nitride.Insulating radiation substrate 82 can realize shedding fast of the amount of heat that integrative packaging microwave device produces in array parallel seam welding process.
As shown in Figure 9 and Figure 10, the parallel welding method of a kind of integrative packaging microwave device array, comprises the following steps:
(1) jig for attaching insulating barrier 12 on positioning fixture 8, fixture cover plate 9 mounts cover plate insulating barrier 13, multiple integrative packaging microwave device housing is put in fixture cover plate 9 by array arrangement back-off, the contraposition of recycling shop bolt 11, fixture cover plate 9 and positioning fixture 8 are assembled together and are clamped, after turn-over, trip bolt 10 locking is used to realize the assembling of integrative packaging microwave device and array sealing weld clamp;
(2) use the seam welding roll of parallel seam welding equipment wheel to dub on the long limit of device cover plate of integrative packaging microwave device successively by array order, adopt this spot-welding technology, realize housing and assemble with cover plate contraposition and realize a little being connected;
(3) fixed integrative packaging microwave device entirety is carried out vacuum and baked and banked up with earth be fitted into and complete spot welding, removing steam and volatile lower-molecular substance.
(4) the seam welding roll of parallel seam welding equipment wheel is used to press in Fig. 9, the order of I, II, III, IV, V rolls across roller successively at the device cover plate long side direction of integrative packaging microwave device, complete integrative packaging microwave device device cover plate long limit high temperature from molten, form the mouth sealing of limit, long limit;
Positioning fixture 8 90-degree rotation, re-use the seam welding roll wheel of parallel seam welding equipment by by Figure 10, the order direction of I, II, III, IV rolls across in the device cover plate minor face of integrative packaging microwave device order successively, complete integrative packaging microwave device device cover plate minor face high temperature from molten, form the mouth sealing of minor face limit; Finally achieve the efficient rapid batch capping of array of multiple integrative packaging microwave device.
Power during the present embodiment spot-welding technology: 1500W, the spot welding time is 0.2 second.
It is 60 minutes that entirety carries out the vacuum time of baking and banking up with earth, and baking and banking up with earth vacuum degree is 100pa.
The rolling rate using the seam welding roll of parallel seam welding equipment wheel to roll across on the long limit of device cover plate of integrative packaging microwave device and minor face order successively by array order is 3mm/s, power: 1900W pulse duration: 10ms, repetition period: 80ms.
Use the seam welding roll of parallel seam welding equipment wheel by array order successively interval positioning fixture 8 half-twist after 1 minute after the device cover plate of integrative packaging microwave device long limit order rolls across.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the parallel welder of integrative packaging microwave device array, it is characterized in that, comprise positioning fixture, fixture cover plate, trip bolt, fixture insulating barrier and cover plate insulating barrier, the front of described positioning fixture is provided with the welding chamber of multiple array arrangement, insulating radiation substrate is welded with in described welding chamber, described insulating radiation substrate is concordant with the front of positioning fixture, described fixture cover plate is offered the fixed via of multiple array arrangement, the frame size of enclosing of described fixed via and device to be welded matches, described fixed via and welding chamber match, the front of described fixture cover plate is concordant, the back side of described fixture cover plate offers the accommodation step for holding device pin to be welded in the both sides of each fixed via, described positioning fixture and fixture cover plate are respectively equipped with corresponding fastening screw nail, described fixture insulating barrier covers the back side of fixture cover plate, described cover plate insulating barrier covers the front beyond the welding chamber of positioning fixture.
2. the parallel welder of a kind of integrative packaging microwave device array according to claim 1, it is characterized in that, described welder also comprises shop bolt, and described positioning fixture and fixture cover plate are respectively equipped with corresponding alignment pin nail.
3. the parallel welder of a kind of integrative packaging microwave device array according to claim 1, it is characterized in that, described positioning fixture and fixture cover plate are that the material that thermal coefficient of expansion and device to be welded match is made, and are selected from the one in kovar alloy, copper alloy, aluminium alloy, carbon aluminium silicon composite material, Al-Si composites.
4. the parallel welder of a kind of integrative packaging microwave device array according to claim 1, it is characterized in that, the go into battle welding chamber of column arrangement and the horizontal and vertical number of fixed via of array arrangement of described positioning fixture and fixture cover plate is all greater than 2.
5. the parallel welder of a kind of integrative packaging microwave device array according to claim 1, it is characterized in that, described fixture insulating barrier and cover plate insulating barrier are respectively organic heat-resistant insulating film, are selected from one or more composite in polyimide film, polyester film, polyurethane film, silicone resin film.
6. the parallel welder of a kind of integrative packaging microwave device array according to claim 1, is characterized in that, described insulating radiation substrate is selected from one or both composite in beryllium oxide, aluminium nitride.
7. the parallel welding method of a kind of integrative packaging microwave device array as claimed in claim 1, is characterized in that, comprise the following steps:
(1) device to be welded is tipped upside down on one by one on the fixed via of fixture cover plate, positioning fixture and insulating radiation substrate apply one deck heat dissipating silicone grease, then fixture cover plate and positioning fixture are fixed, form the integrated apparatus assembled;
(2) spot welding is carried out on the long limit of device cover plate for the treatment of welding device, and the point of the device cover plate and housing that realize device to be welded is connected;
(3) integrated apparatus completing spot welding is carried out vacuum(-)baking, removing steam and volatile lower-molecular substance;
(4) by array order, on the long limit of device cover plate, order is rolled and is stitched weldering successively, carries out next line again after completing a line, completes the long limit high temperature of device cover plate from molten, form the mouth sealing of limit, long limit, and then complete the minor face limit mouth sealing to device cover plate successively.
8. the parallel welding method of a kind of integrative packaging microwave device array according to claim 7, it is characterized in that, the power of described spot-welding technology: 1200 ~ 2000W, the spot welding time is 0.1 ~ 0.3 second.
9. the parallel welding method of a kind of integrative packaging microwave device array according to claim 7, it is characterized in that, the rolling rate that the described long limit of device cover plate and minor face order roll across is 1 ~ 4mm/s, and power is 1800 ~ 2000W, pulse duration is 10ms, and the repetition period is 80ms.
10. the parallel welding method of a kind of integrative packaging microwave device array according to claim 7, it is characterized in that, described device cover plate long limit order rolls across rear interval positioning fixture half-twist after at least one minute, then carries out the mouth sealing of minor face limit to device cover plate.
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| CN201510270691.1A CN104966678B (en) | 2015-05-25 | 2015-05-25 | A kind of parallel welder of integrative packaging microwave device array and method |
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| CN201510270691.1A CN104966678B (en) | 2015-05-25 | 2015-05-25 | A kind of parallel welder of integrative packaging microwave device array and method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105414848A (en) * | 2015-12-18 | 2016-03-23 | 安徽华东光电技术研究所 | Parallel seam welding tool structure |
| CN108098232A (en) * | 2018-01-30 | 2018-06-01 | 中国电子科技集团公司第三十八研究所 | The array holder and the welding method using the fixture of a kind of parallel seam welding capping |
| CN111889845A (en) * | 2020-08-28 | 2020-11-06 | 中国电子科技集团公司第五十八研究所 | Clamping fixture for alloy sealing cap and use method |
| CN112873100A (en) * | 2021-03-30 | 2021-06-01 | 中国电子科技集团公司第三十八研究所 | Fixing clamp for microwave assembly test |
| CN114043059A (en) * | 2021-12-01 | 2022-02-15 | 中国电子科技集团公司第四十四研究所 | Array parallel seam welding carrier adopting independent sliding block to perform elastic clamping |
| CN115533413A (en) * | 2022-09-22 | 2022-12-30 | 上海航天电子通讯设备研究所 | Universal clamping method and device for parallel sealing and welding of packaging device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105414848A (en) * | 2015-12-18 | 2016-03-23 | 安徽华东光电技术研究所 | Parallel seam welding tool structure |
| CN108098232A (en) * | 2018-01-30 | 2018-06-01 | 中国电子科技集团公司第三十八研究所 | The array holder and the welding method using the fixture of a kind of parallel seam welding capping |
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| CN112873100A (en) * | 2021-03-30 | 2021-06-01 | 中国电子科技集团公司第三十八研究所 | Fixing clamp for microwave assembly test |
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| CN114043059A (en) * | 2021-12-01 | 2022-02-15 | 中国电子科技集团公司第四十四研究所 | Array parallel seam welding carrier adopting independent sliding block to perform elastic clamping |
| CN115533413A (en) * | 2022-09-22 | 2022-12-30 | 上海航天电子通讯设备研究所 | Universal clamping method and device for parallel sealing and welding of packaging device |
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