CN104962919B - 一种银纳米线的刻蚀液及刻蚀方法 - Google Patents
一种银纳米线的刻蚀液及刻蚀方法 Download PDFInfo
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- CN104962919B CN104962919B CN201510472684.XA CN201510472684A CN104962919B CN 104962919 B CN104962919 B CN 104962919B CN 201510472684 A CN201510472684 A CN 201510472684A CN 104962919 B CN104962919 B CN 104962919B
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- Prior art keywords
- silver wire
- etching liquid
- nano silver
- etching
- diameter
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- 238000005530 etching Methods 0.000 title claims abstract description 66
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 61
- 239000007788 liquid Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000004094 surface-active agent Substances 0.000 claims abstract description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 7
- 235000011114 ammonium hydroxide Nutrition 0.000 claims abstract description 7
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 7
- 239000003223 protective agent Substances 0.000 claims abstract description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 4
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 claims description 4
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical group [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 claims description 2
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 claims description 2
- -1 diphenylamine sulfonic acid sodium salt Chemical class 0.000 claims description 2
- 235000011187 glycerol Nutrition 0.000 claims description 2
- RQAKESSLMFZVMC-UHFFFAOYSA-N n-ethenylacetamide Chemical class CC(=O)NC=C RQAKESSLMFZVMC-UHFFFAOYSA-N 0.000 claims description 2
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical class C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 claims description 2
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 claims description 2
- 229920000136 polysorbate Polymers 0.000 claims description 2
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 claims description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims 1
- 239000008367 deionised water Substances 0.000 abstract 1
- 229910021641 deionized water Inorganic materials 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 230000008859 change Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003595 mist Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- UXAMZEYKWGPDBI-UHFFFAOYSA-N C(CCCCCCCCCCCCCCC)Br(C)(C)C Chemical class C(CCCCCCCCCCCCCCC)Br(C)(C)C UXAMZEYKWGPDBI-UHFFFAOYSA-N 0.000 description 2
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001447 ferric ion Inorganic materials 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000003643 water by type Substances 0.000 description 2
- 241000370738 Chlorion Species 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004033 diameter control Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 229910001448 ferrous ion Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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CN201510472684.XA CN104962919B (zh) | 2015-07-31 | 2015-07-31 | 一种银纳米线的刻蚀液及刻蚀方法 |
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CN104962919A CN104962919A (zh) | 2015-10-07 |
CN104962919B true CN104962919B (zh) | 2017-09-22 |
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CN108048842A (zh) * | 2017-12-13 | 2018-05-18 | 天津宝兴威科技股份有限公司 | 一种银纳米线导电膜的刻蚀液及其使用方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1502722A (zh) * | 2002-11-26 | 2004-06-09 | 关东化学株式会社 | 以银为主成分的金属薄膜的蚀刻液组合物 |
CN103907216A (zh) * | 2011-10-27 | 2014-07-02 | 默克专利股份有限公司 | 对包含银纳米线的基质的选择性蚀刻 |
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JP2010242124A (ja) * | 2009-04-01 | 2010-10-28 | Tosoh Corp | エッチング用組成物及びエッチング方法 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1502722A (zh) * | 2002-11-26 | 2004-06-09 | 关东化学株式会社 | 以银为主成分的金属薄膜的蚀刻液组合物 |
CN103907216A (zh) * | 2011-10-27 | 2014-07-02 | 默克专利股份有限公司 | 对包含银纳米线的基质的选择性蚀刻 |
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Effective date of registration: 20170615 Address after: 230088 A118, 602 Mount Huangshan Road, hi tech Zone, Anhui, Hefei Applicant after: HEFEI SILVER TECHNOLOGY CO., LTD. Address before: 230088 Anhui high tech Zone, Mount Huangshan, No. 602 Hefei Road, A105 Applicant before: Hefei Vigon Material Technologies Co., Ltd. |
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Effective date of registration: 20181009 Address after: 230088 A105, 602 Mount Huangshan Road, hi tech Zone, Hefei, Anhui. Patentee after: Hefei Vigon Material Technologies Co., Ltd. Address before: 230088 A118, 602 Mount Huangshan Road, hi tech Zone, Hefei, Anhui. Patentee before: HEFEI YINPAI TECHNOLOGY CO., LTD. |
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Effective date of registration: 20200529 Address after: 230088 103, floor 1, OPP CommScope building, No.7, Mengyuan Road, hi tech Zone, Hefei City, Anhui Province Patentee after: HEFEI YINPAI TECHNOLOGY Co.,Ltd. Address before: 230088 A105, 602 Mount Huangshan Road, hi tech Zone, Anhui, Hefei Patentee before: HEFEI VIGON MATERIAL TECHNOLOGIES Co.,Ltd. |
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Effective date of registration: 20201202 Address after: Room 105, 602 Huangshan Road, hi tech Zone, Hefei City, Anhui Province Patentee after: HEFEI VIGON MATERIAL TECHNOLOGIES Co.,Ltd. Address before: 230088 103, floor 1, OPP CommScope building, No.7, Mengyuan Road, hi tech Zone, Hefei City, Anhui Province Patentee before: HEFEI YINPAI TECHNOLOGY Co.,Ltd. |