CN104962868B - A kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD - Google Patents
A kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD Download PDFInfo
- Publication number
- CN104962868B CN104962868B CN201510405173.6A CN201510405173A CN104962868B CN 104962868 B CN104962868 B CN 104962868B CN 201510405173 A CN201510405173 A CN 201510405173A CN 104962868 B CN104962868 B CN 104962868B
- Authority
- CN
- China
- Prior art keywords
- ingot
- substrate
- electron gun
- scanned
- lamination paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
A kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD, it is related to a kind of preparation method of Ti/Al reactions lamination paper tinsel.The technical problem for be easily introduced impurity the present invention is to solve current Ti/Al laminations paper tinsel preparation method low production efficiency, production cost height, Ti/Al bed boundarys, polluting, be unfavorable for obtaining higher self- propagating speed.The present invention：First, EBPVD preliminary preparations；2nd, ingot is preheated；3rd, deposition separating layer；4th, lamination paper tinsel is deposited.Ti/Al reactions lamination foil construction of the present invention is uniform, thickness degree is controllable, and interface is complete clear pollution-free, and production efficiency is high, cost is low, and the various substrates of the present invention can cause the temperature of the substrate in preparation process less than 200 DEG C in order to avoid causing the burning of Ti/Al reaction lamination paper tinsels；Ti/Al reaction lamination paper tinsels prepared by the present invention can release great heat in a manner of self- propagating in a short time, can apply to special welding field.
Description
Technical field
The present invention relates to a kind of preparation method of Ti/Al reaction lamination paper tinsels.
Background technology
With the rapid development using space technology, information technology, new energy and new material as the new and high technology of representative, for
Material Joining Technology proposes higher requirement.By taking space environment as an example, limited by airborne vehicle load, traditional thawing welding
It can not use in space；And often technical process is complex for the higher soldering of reliability, also is difficult to realize in space.
, it is necessary to which some prototype parts are quickly and accurately welded on circuit boards in super large-scale integration manufacture, and electronic device is past
Past very sensitive to heat, this just needs to shorten the Connection Time as far as possible, reduces the influence to peripheral devices.Ti/Al reacts
Lamination paper tinsel is a kind of new stratiform composite material containing energy, and local heat source can be used as to melt solder or directly as intermediate layer
The instant liquid connection of connected piece is realized, is had great importance for Special Welding Technique.Ti/Al reaction lamination paper tinsel welding
Technology mainly has following characteristics：(1) self-propagating reaction of Ti/Al laminations paper tinsel can be at room temperature by the energy pulse of a very little
Trigger, by rational thermal Equilibrium Design, the heat that the self- propagating process of lamination paper tinsel can be relied on to discharge realizes the connection of mother metal,
Without external heat source and equipment；(2) because diffusion length is very small, in lamination paper tinsel, the self- propagating speed of reaction surface is very
It hurry up, the temperature rise rate of the dynamic mixing zone of atom is exceedingly fast, and will not significantly improve the temperature of connected piece, and this to react lamination paper tinsel
Also there is important application in the connection of some strict limit temperatures；(3) size of lamination paper tinsel can be cut randomly, Ke Yishi
The accurate connection of existing tiny area, is welded particularly suitable for integrated antenna package；(4) due to no solder welding, phase can be realized
It is more green than in conventional brazing.Ti/Al laminations paper tinsel is mainly prepared by sputtering with the method for cold rolling at present, and sputtering obtains
Although Ti/Al laminations paper tinsel with very good heterogeneous microstructure, this process operating efficiency is low, production cost
It is high；Though cold rolling cost is relatively low, the Ti/Al bed boundarys that lamination paper tinsel is made are easily introduced impurity, pollute, and it is higher to be unfavorable for acquisition
Self- propagating speed.Electro beam physics vapour deposition (EBPVD) technology is electron beam technology and physical vapour deposition (PVD) (PVD) technology
The product being combined, EBPVD general principle are directly to bombard heating evaporation target in the vacuum chamber using focused high-energy electron beam
Material, target steam condensation form sedimentary in substrate surface.Electron gun can be divided into Pierre's Si rifle and e type rifles.Wherein Pierre Si
The sedimentation rate of rifle is exceedingly fast, and production efficiency is high.Additionally, due to being to deposit in the vacuum chamber, can almost not have to consider foreign gas
The problem of pollution.
The content of the invention
The present invention is to solve the preparation method low production efficiency of current Ti/Al laminations paper tinsel, production cost height, Ti/Al layers
Interface is easily introduced impurity, pollutes, is unfavorable for obtaining the technical problem of higher self- propagating speed, and proposes a kind of use
The method that EBPVD prepares Ti/Al reaction lamination paper tinsels.
The method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD of the present invention is carried out according to the following steps：
First, EBPVD preliminary preparations：Cleaning ingot I and ingot II, cleaning EBPVD equipment vacuums room, installation base plate,
Two electron guns are provided with described EBPVD equipment vacuums room, are electron gun I and electron gun II respectively, by the ingot after cleaning
Material I is placed in the lower section of electron gun I, and the ingot II after cleaning is placed in the lower section of electron gun II, separating layer material is placed on into ingot
Between material I and ingot II, substrate is wiped, closes baffle plate；Described ingot I is pure Ti, and described ingot II is pure Al；
2nd, ingot is preheated：Vacuum chamber is closed, is evacuated to vacuum as 6 × 10-3During Pa, electron gun I and electron gun are opened
II, the electric current of electron gun I is arranged to 0.02A~0.1A, the electric current of electron gun II is arranged to 0.02A~0.1A, right using electron gun I
Ingot I is scanned 5min~7min, 5min~7min is scanned to ingot II using electron gun II, then by electron gun I
Current regulation to 0.1A~0.3A, the current regulation of electron gun II to 0.1A~0.3A is entered using electron gun I to ingot I
Row scanning 5min~10min, 5min~10min is scanned using electron gun II to ingot II；
3rd, deposition separating layer：One closed in electron gun I and electron gun II, by another current regulation electron gun
For 0.04A~0.05A, the position of the electron gun is adjusted, the electron gun is scanned separating layer material, open baffle plate, it is right
Separating layer material is scanned 1min~2min, and substrate rotates around substrate axis during being scanned, and closes baffle plate；
4th, lamination paper tinsel is deposited：The electric current for setting electron gun I be 0.3A~1.4A, the electric current of electron gun II be 0.3A~
1.4A, baffle plate is opened, deposition lamination paper tinsel shuts baffle plate to estimated lamination paper tinsel thickness is reached, closes electron gun, closes vacuum system
System, vacuum chamber is opened, the lamination paper tinsel of deposition is peeled off from substrate, obtain Ti/Al reaction lamination paper tinsels；
The method of described deposition lamination paper tinsel is：Ingot I is scanned using electron gun I, while utilizes electron gun II
Ingot II is scanned, periodically alternately blocks ingot I and ingot II with small front apron, substrate is quiet during being scanned
Only；
The method of described deposition lamination paper tinsel is：Periodically alternately ingot I and ingot II are swept using electron gun
Retouch, ingot I is scanned with electron gun I when scanning ingot I and simultaneously closes off electron gun II, the electricity consumption when scanning ingot II
Sub- rifle II is scanned to ingot II and simultaneously closes off electron gun I, and substrate is static during being scanned；
The method of described deposition lamination paper tinsel is：Ingot I is scanned using electron gun I, while utilizes electron gun II
Ingot II is scanned, substrate is rotated or swung around substrate axis during being scanned, and the ingot I in vacuum chamber
One panel superheater is set between ingot II so that the steam of ingot I and ingot II forms respective separate space；
Described substrate is rotated as substrate around substrate axis in the horizontal plane along clockwise or counterclockwise always around substrate axis
Rotate；It is that substrate is certain along rotating clockwise or counterclockwise in the horizontal plane around substrate axis that described substrate is swung around substrate axis
Angle backwards rotation identical angle returns to origin again, do periodically move repeatedly.
The Ti/Al reactions lamination paper tinsel preparation method of the present invention is uniform compared with cold rolling process Rotating fields, and thickness degree is controllable, and interface is complete
Whole clear pollution-free, high compared with sputtering method production efficiency, cost is relatively low, and the various substrates of the present invention can preparing
During substrate temperature be less than 200 DEG C in case cause Ti/Al reaction lamination paper tinsel burning；Ti/Al reactions prepared by the present invention
Lamination paper tinsel can release great heat in a manner of self- propagating in a short time, can apply to special welding field；
The present invention can be realized for Ti/Al lamination paper tinsels by adjusting the electric current of electron gun and the forms of motion of substrate
Ti layers and Al thickness degree regulation and control, gross thickness can control by adjusting electron gun current, the motion of substrate and sedimentation time
System.
One layer of Al and one layer of Ti thickness sum is modulation period, Ti/Al MULTILAYER COMPOSITEs paper tinsel modulation week prepared by the present invention
Phase is 0.01 μm~5 μm.
Brief description of the drawings
Fig. 1 is the schematic diagram that the Ti/Al for preparing of the present invention reacts lamination paper tinsel, 11 is Al, 12 is Ti；
Fig. 2 is the EBPVD equipment schematic diagrams after the completion of step 1 of the present invention, and 1 is vacuum chamber, and 2 be substrate, and 3 be ingot I, 4
It is electron gun II for electron gun I, 5,6 be ingot II, and 7 be baffle plate, and 8 be substrate axis, and 20 be separating layer material；
Fig. 3 is that the method for the deposition lamination paper tinsel described in step 4 of the present invention is that ingot I is swept using electron gun I
Retouch, while ingot II is scanned using electron gun II, substrate is rotated or swung around substrate axis during being scanned, and
And a panel superheater is set so that the steam of ingot I and ingot II is formed each between the ingot I and ingot II in vacuum chamber
Separate space when schematic diagram, 1 is vacuum chamber, and 2 be substrate, and 3 be ingot I, and 4 be electron gun I, and 5 be electron gun II, and 6 be ingot
Material II, 8 be substrate axis, and 9 be panel superheater；
Fig. 4 is that the method for the deposition lamination paper tinsel described in step 4 of the present invention is that ingot I is swept using electron gun I
Retouch, while ingot II is scanned using electron gun II, periodically alternately ingot I and ingot II are blocked with small front apron,
Schematic diagram when substrate is static during being scanned, 1 is vacuum chamber, and 2 be substrate, and 3 be ingot I, and 4 be electron gun I, and 5 be electricity
Sub- rifle II, 6 be ingot II, and 8 be substrate axis, and 10 be small front apron；
Fig. 5 is the big heat sink monoblock type substrate schematic diagram described in the specific embodiment of the invention three, and 13 be substrate axis
Connector；
Fig. 6 is the recirculated water cooling substrate described in the specific embodiment of the invention four, and 13 be the connector of substrate axis, and 14 are
Water inlet, 15 be delivery port；
Fig. 7 is the static water-cooling base plate described in the specific embodiment of the invention five, and 13 be the connector of substrate axis, and 16 are
Water inlet and delivery port；
Fig. 8 is the top view of the sectional type substrate described in the specific embodiment of the invention six, and 17 be small substrate, and 18 be anti-
Penetrate screen；
Fig. 9 is Fig. 8 A-A sectional views, and 17 be small substrate, and 18 be radiation shield, and 13 be the connector of substrate axis, and 19 be base
Seat；
Figure 10 is the substrate of the installation radiative cylinder described in the specific embodiment of the invention seven, and 22 be heat loss through radiation cylinder, 13
For the connector of substrate axis；
Figure 11 is the substrate of the installation water cooling box described in the specific embodiment of the invention eight, and 23 be graphite, and 24 be cold
But water box, 13 be the connector of substrate axis；
Figure 12 is the substrate schematic diagram after step 4 of the present invention deposition lamination paper tinsel and when also unstripped, and 25 be separating layer,
27 be substrate, and 26 be Ti/Al lamination paper tinsels, and 13 be the connector of substrate axis；
Figure 13 is the XRD that Ti/Al prepared by experiment one reacts the side that ingot is faced in lamination paper tinsel；
Figure 14 is to test the SEM photograph that a Ti/Al prepared reacts lamination paper tinsel, and shinny part is Ti in figure, obfuscation
Part is Al.
Embodiment
Embodiment one：Present embodiment for it is a kind of with EBPVD prepares Ti/Al reaction lamination paper tinsel method be by with
What lower step was carried out：
First, EBPVD preliminary preparations：Cleaning ingot I and ingot II, cleaning EBPVD equipment vacuums room, installation base plate,
Two electron guns are provided with described EBPVD equipment vacuums room, are electron gun I and electron gun II respectively, by the ingot after cleaning
Material I is placed in the lower section of electron gun I, and the ingot II after cleaning is placed in the lower section of electron gun II, separating layer material is placed on into ingot
Between material I and ingot II, substrate is wiped, closes baffle plate；Described ingot I is pure Ti, and described ingot II is pure Al；
2nd, ingot is preheated：Vacuum chamber is closed, is evacuated to vacuum as 6 × 10-3During Pa, electron gun I and electron gun are opened
II, the electric current of electron gun I is arranged to 0.02A~0.1A, the electric current of electron gun II is arranged to 0.02A~0.1A, right using electron gun I
Ingot I is scanned 5min~7min, 5min~7min is scanned to ingot II using electron gun II, then by electron gun I
Current regulation to 0.1A~0.3A, the current regulation of electron gun II to 0.1A~0.3A is entered using electron gun I to ingot I
Row scanning 5min~10min, 5min~10min is scanned using electron gun II to ingot II；
3rd, deposition separating layer：One closed in electron gun I and electron gun II, by another current regulation electron gun
For 0.04A~0.05A, the position of the electron gun is adjusted, the electron gun is scanned separating layer material, open baffle plate, it is right
Separating layer material is scanned 1min~2min, and substrate rotates around substrate axis during being scanned, and closes baffle plate；
4th, lamination paper tinsel is deposited：The electric current for setting electron gun I be 0.3A~1.4A, the electric current of electron gun II be 0.3A~
1.4A, baffle plate is opened, deposition lamination paper tinsel shuts baffle plate to estimated lamination paper tinsel thickness is reached, closes electron gun, closes vacuum system
System, vacuum chamber is opened, the lamination paper tinsel of deposition is peeled off from substrate, obtain Ti/Al reaction lamination paper tinsels；
The method of described deposition lamination paper tinsel is：Ingot I is scanned using electron gun I, while utilizes electron gun II
Ingot II is scanned, periodically alternately blocks ingot I and ingot II with small front apron, substrate is quiet during being scanned
Only；
The method of described deposition lamination paper tinsel is：Periodically alternately ingot I and ingot II are swept using electron gun
Retouch, ingot I is scanned with electron gun I when scanning ingot I and simultaneously closes off electron gun II, the electricity consumption when scanning ingot II
Sub- rifle II is scanned to ingot II and simultaneously closes off electron gun I, and substrate is static during being scanned；
The method of described deposition lamination paper tinsel is：Ingot I is scanned using electron gun I, while utilizes electron gun II
Ingot II is scanned, substrate is rotated or swung around substrate axis during being scanned, and the ingot I in vacuum chamber
One panel superheater is set between ingot II so that the steam of ingot I and ingot II forms respective separate space；
Described substrate is rotated as substrate around substrate axis in the horizontal plane along clockwise or counterclockwise always around substrate axis
Rotate；It is that substrate is certain along rotating clockwise or counterclockwise in the horizontal plane around substrate axis that described substrate is swung around substrate axis
Angle backwards rotation identical angle returns to origin again, do periodically move repeatedly.
Embodiment two：Present embodiment is with the difference of embodiment one：Separation described in step 1
Layer material is sodium chloride or calcium chloride.Other steps are identical with embodiment one.
Embodiment three：Present embodiment is with one of embodiment one or two difference：Institute in step 1
The substrate stated is big heat sink monoblock type substrate, recirculated water cooling substrate, static water-cooling base plate, sectional type substrate, installation radiative cylinder
Substrate or the substrate for installing water cooling box additional, and substrate thickness is more than 40mm.Other steps and embodiment one or two-phase
Together.
Embodiment four：Present embodiment is with the difference of embodiment three：As shown in fig. 6, described follows
Water inlet and delivery port, substrate hollow sealing are provided with ring water-cooling base plate, recirculated water plays the work of cooling in its internal flow
With 13 be the connector of substrate axis, and 14 be water inlet, and 15 be delivery port.Other steps are identical with embodiment three.
Embodiment five：Present embodiment is with the difference of embodiment three：As shown in fig. 7, described is quiet
Only water-cooling base plate is the hollow cylinder shape of sealing, inner filling water, and heat sink using water reduces the temperature of substrate, and 13 be substrate
The connector of axle, 16 be water inlet and delivery port.Other steps are identical with embodiment three.
Embodiment six：Present embodiment is with the difference of embodiment three：As shown in FIG. 8 and 9, it is described
Sectional type substrate is that six pieces of small substrates are uniformly distributed on pedestal, and the other parts of pedestal are paved with radiation shield, and sectional type substrate is torn open
Unload simply, six pieces of small substrates need to be only pulled down when peeling off Ti/Al lamination paper tinsels without pedestal is integrally taken, substantially reduce labor
Momentum and labor intensity, 17 be small substrate, and 18 be radiation shield, and 13 be the connector of substrate axis, and 19 be pedestal.Other steps and tool
Body embodiment three is identical.
Embodiment seven：Present embodiment is with the difference of embodiment three：As shown in Figure 10, it is described plus
The substrate of dress radiative cylinder is the cylindrical radiation heat-dissipating cylinder that hollow uncovered is provided with substrate, and heat loss through radiation drum outer wall scribbles height
Emissivity coating is to accelerate the heat exchange of substrate and chamber walls and environment, and so as to reduce substrate temperature, 22 be heat loss through radiation cylinder, and 13
For the connector of substrate axis.Other steps are identical with embodiment three.
Embodiment eight：Present embodiment is with the difference of embodiment three：As shown in figure 11, it is described plus
The substrate for filling water cooling box is to have installed graphite additional on substrate, and cooling water box are arranged in graphite, graphite and substrates into intimate
Contact makes its cooling, and 23 be graphite, and 24 be cooling water box, and 13 be the connector of substrate axis.Other steps and specific embodiment party
Formula three is identical.
Beneficial effects of the present invention are verified by tests below：
Experiment one：This experiment is a kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD, specifically according to the following steps
Carry out：
First, EBPVD preliminary preparations：Cleaning ingot I and ingot II, cleaning EBPVD equipment vacuums room, installation base plate,
Two electron guns are provided with described EBPVD equipment vacuums room, are electron gun I and electron gun II respectively, by the ingot after cleaning
Material I is placed in the lower section of electron gun I, and the ingot II after cleaning is placed in the lower section of electron gun II, separating layer material is placed on into ingot
Between material I and ingot II, substrate is wiped, closes baffle plate；Described ingot I is pure Ti, and described ingot II is pure Al；
2nd, ingot is preheated：Vacuum chamber is closed, is evacuated to vacuum as 6 × 10-3During Pa, electron gun I and electron gun are opened
II, the electric current of electron gun I is arranged to 0.05A, the electric current of electron gun II is arranged to 0.05A, and ingot I is swept using electron gun I
7min is retouched, 7min is scanned to ingot II using electron gun II, then by the current regulation of electron gun I to 0.2A, by electronics
The current regulation of rifle II is scanned 10min to ingot I using electron gun I, ingot II is carried out using electron gun II to 0.2A
Scan 10min；
3rd, deposition separating layer：One closed in electron gun I and electron gun II, by another current regulation electron gun
For 0.05A, the position of the electron gun is adjusted, the electron gun is scanned separating layer material, baffle plate is opened, to separating layer thing
Matter is scanned 2min, and substrate rotates around substrate axis during being scanned, and closes baffle plate；
4th, lamination paper tinsel is deposited：The electric current for setting electron gun I is 0.6A, and the electric current of electron gun II is 1.2A, opens baffle plate,
Deposition lamination paper tinsel shuts baffle plate to estimated lamination paper tinsel thickness is reached, and closes electron gun, closes vacuum system, opens vacuum chamber,
The lamination paper tinsel of deposition is peeled off from substrate, obtains Ti/Al reaction lamination paper tinsels；
The method of described deposition lamination paper tinsel is：Ingot I is scanned using electron gun I, while utilizes electron gun II
Ingot II is scanned, substrate rotates around substrate axis during being scanned, and ingot I and ingot in vacuum chamber
One panel superheater is set between II so that the steam of ingot I and ingot II forms respective separate space；
Described substrate is rotated as substrate around substrate axis in the horizontal plane along rotating always clockwise around substrate axis.
Separating layer material described in step 1 is sodium chloride；
Substrate described in step 1 is recirculated water cooling substrate, as shown in fig. 6, being provided with described recirculated water cooling substrate
Water inlet and delivery port, substrate hollow sealing, recirculated water play a part of cooling in its internal flow, and 13 be the connection of substrate axis
Part, 14 be water inlet, and 15 be delivery port.
Figure 13 is the XRD that Ti/Al prepared by experiment one reacts the side that ingot is faced in lamination paper tinsel, can be with from figure
Find out in addition to Ti and Al substantially without other phases.
Figure 14 is the SEM photograph of Ti/Al reaction lamination paper tinsels prepared by this experiment, and shinny part is Ti in figure, obfuscation
Part is Al, and as can be seen from the figure Ti/Al reacts the even structure of lamination paper tinsel, and interface is complete clear pollution-free.
Claims (7)
- A kind of 1. method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD, it is characterised in that prepare Ti/Al reaction laminations with EBPVD The method of paper tinsel is carried out according to the following steps：First, EBPVD preliminary preparations：Ingot I and ingot II are cleaned, clears up EBPVD equipment vacuums room, installation base plate is described EBPVD equipment vacuums room in be provided with two electron guns, be electron gun I and electron gun II respectively, the ingot I after cleaning put In the lower section of electron gun I, the ingot II after cleaning is placed in the lower section of electron gun II, separating layer material is placed on the He of ingot I Between ingot II, substrate is wiped, closes baffle plate；Described ingot I is pure Ti, and described ingot II is pure Al；Described substrate For big heat sink monoblock type substrate, recirculated water cooling substrate, static water-cooling base plate, sectional type substrate, the substrate for installing radiative cylinder additional or Install the substrate of water cooling box additional, and substrate thickness is more than 40mm；2nd, ingot is preheated：Vacuum chamber is closed, is evacuated to vacuum as 6 × 10-3During Pa, electron gun I and electron gun II are opened, The electric current of electron gun I is arranged to 0.02A~0.1A, the electric current of electron gun II is arranged to 0.02A~0.1A, using electron gun I to ingot Material I is scanned 5min~7min, 5min~7min is scanned to ingot II using electron gun II, then by electron gun I Current regulation, by the current regulation of electron gun II to 0.1A~0.3A, is carried out to 0.1A~0.3A using electron gun I to ingot I 5min~10min is scanned, 5min~10min is scanned to ingot II using electron gun II；3rd, deposition separating layer：One closed in electron gun I and electron gun II, it is the current regulation of electron gun by another 0.04A~0.05A, the position of the electron gun is adjusted, the electron gun is scanned separating layer material, open baffle plate, to dividing Absciss layer material is scanned 1min~2min, and substrate rotates around substrate axis during being scanned, and closes baffle plate；4th, lamination paper tinsel is deposited：The electric current for setting electron gun I is 0.3A~1.4A, and the electric current of electron gun II is 0.3A~1.4A, is beaten Baffle plate is opened, deposition lamination paper tinsel shuts baffle plate to estimated lamination paper tinsel thickness is reached, closes electron gun, closes vacuum system, opens Vacuum chamber, the lamination paper tinsel of deposition is peeled off from substrate, obtain Ti/Al reaction lamination paper tinsels；The method of described deposition lamination paper tinsel is：Ingot I is scanned using electron gun I, while using electron gun II to ingot Material II is scanned, and periodically alternately blocks ingot I and ingot II with small front apron, substrate is static during being scanned；The method of described deposition lamination paper tinsel is：Periodically alternately ingot I and ingot II are scanned using electron gun, when Ingot I is scanned with electron gun I and simultaneously closes off electron gun II when scanning ingot I, the electron gun when scanning ingot II II pair of ingot II is scanned and simultaneously closes off electron gun I, and substrate is static during being scanned；The method of described deposition lamination paper tinsel is：Ingot I is scanned using electron gun I, while using electron gun II to ingot Material II is scanned, and substrate is rotated or swung around substrate axis during being scanned, and ingot I and ingot in vacuum chamber One panel superheater is set between material II so that the steam of ingot I and ingot II forms respective separate space；Described substrate is rotated as substrate around substrate axis in the horizontal plane along rotating always clockwise or counterclockwise around substrate axis； Described substrate is swung as substrate around substrate axis in the horizontal plane along rotating clockwise or counterclockwise certain angle around substrate axis Backwards rotation identical angle returns to origin to degree again, does and periodically moves repeatedly；Described substrate causes the temperature of the substrate in preparation process to be less than 200 DEG C.
- A kind of 2. method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD according to claim 1, it is characterised in that step Separating layer material described in one is sodium chloride or calcium chloride.
- 3. a kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD according to claim 1, it is characterised in that described Recirculated water cooling substrate on be provided with water inlet (14) and delivery port (15), substrate hollow sealing.
- 4. a kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD according to claim 1, it is characterised in that described Sectional type substrate be that six pieces small substrate (17) is uniformly distributed on pedestal (19), the other parts of pedestal are paved with radiation shield (18)。
- 5. a kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD according to claim 1, it is characterised in that described Installation radiative cylinder substrate be on substrate be provided with hollow uncovered cylindrical radiation heat-dissipating cylinder (22), heat loss through radiation cylinder (22) outer wall scribbles high emissivity coating.
- 6. a kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD according to claim 1, it is characterised in that described The substrate of installation water cooling box be to have installed graphite (23) additional on substrate, cooling water box (24) are arranged in graphite (23), Graphite (23) contacts with substrates into intimate.
- 7. a kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD according to claim 1, it is characterised in that described Static water-cooling base plate for sealing hollow cylinder shape and set water inlet and delivery port (16), inner filling water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510405173.6A CN104962868B (en) | 2015-07-10 | 2015-07-10 | A kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510405173.6A CN104962868B (en) | 2015-07-10 | 2015-07-10 | A kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104962868A CN104962868A (en) | 2015-10-07 |
| CN104962868B true CN104962868B (en) | 2017-11-17 |
Family
ID=54216950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510405173.6A Active CN104962868B (en) | 2015-07-10 | 2015-07-10 | A kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104962868B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104169456A (en) * | 2012-03-14 | 2014-11-26 | 佳能安内华股份有限公司 | Sputtering device |
-
2015
- 2015-07-10 CN CN201510405173.6A patent/CN104962868B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104169456A (en) * | 2012-03-14 | 2014-11-26 | 佳能安内华股份有限公司 | Sputtering device |
Non-Patent Citations (2)
| Title |
|---|
| Ti/Ti-Al微层板的设计与EB-PVD 工艺制备研究;马李;《哈尔滨工业大学博士毕业论文》;20081231;第3、46、57页 * |
| 溅射气压对Ti／A1多层膜结构和热稳定性的影响;田维，郭巧杭;《实验室研究与探索》;20110731;摘要，实验条件部分 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104962868A (en) | 2015-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5186243B2 (en) | Steam generator, vapor deposition device | |
| CN107710331A (en) | Thermal photovoltaic electric power generator | |
| US5405517A (en) | Magnetron sputtering method and apparatus for compound thin films | |
| CN105777210B (en) | A kind of aluminium nitride ceramics copper-clad plate and preparation method thereof | |
| TWI616549B (en) | High rate deposition systems and processes for forming hermetic barrier layers | |
| CN106048596B (en) | A kind of cold spraying in-situ preparation preparation method of Ti2AlC phase ceramics coating | |
| CN104962867B (en) | It is a kind of to prepare the method that Zr/Ni reacts lamination paper tinsel with EBPVD | |
| CN113621920B (en) | Vacuum coating method of vacuum coating machine | |
| EP2742539B1 (en) | Sputtering systems for liquid target materials | |
| CN104911549B (en) | Method for preparing Al/Ni reaction laminated foil by EBPVD (electron beam physical vapor deposition) | |
| CN104962868B (en) | A kind of method that Ti/Al reaction lamination paper tinsels are prepared with EBPVD | |
| CN209243159U (en) | A kind of device for evaporation coating | |
| CN104962866B (en) | A kind of method that Zr/Al reaction lamination paper tinsels are prepared with EBPVD | |
| CN103526159A (en) | Equipment and method for depositing copper-indium-gallium-selenium absorption layer on glass or metal substrate | |
| CN102822386A (en) | Method for manufacturing aluminum electrode using wetting process and aluminum electrode manufactured thereby | |
| CN107620047A (en) | A kind of reaction chamber and processing method for PVD plated films | |
| CN208701194U (en) | A kind of novel device for preparing film | |
| US20140110245A1 (en) | Non-bonded rotatable targets and their methods of sputtering | |
| Cheng et al. | Optimization of post-selenization process of Co-sputtered CuIn and CuGa precursor for 11.19% efficiency Cu (In, Ga) Se 2 solar cells | |
| CN107190261B (en) | A kind of High-temperature antioxidant niobium alloy surface recombination silicide coating and preparation method | |
| JP6048667B2 (en) | Sputtering equipment | |
| CN104300039B (en) | Utilize the apparatus and method of heater manufacture solar cell | |
| US20150179418A1 (en) | Miniature physical vapour deposition station | |
| CN108286036A (en) | A kind of original position oxygenating type scanning electron beam vapor deposition (IOC-SEVD) devices and methods therefor | |
| CN109379895A (en) | For the equipment, the system for carrying out sputtering sedimentation on substrate and the method for manufacturing the equipment for carrying out material deposition on substrate of material deposition to be carried out on substrate in vacuum deposition process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |