CN104952756A - Test device and test system for three-dimensional packaging base plate - Google Patents
Test device and test system for three-dimensional packaging base plate Download PDFInfo
- Publication number
- CN104952756A CN104952756A CN201510326002.4A CN201510326002A CN104952756A CN 104952756 A CN104952756 A CN 104952756A CN 201510326002 A CN201510326002 A CN 201510326002A CN 104952756 A CN104952756 A CN 104952756A
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- base plate
- packaging
- test
- fixture
- measured
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Abstract
The invention provides a test device and a test system for a three-dimensional packaging base plate. An electric contact pad and an electric test pad are formed on a switching cover plate; when one surface of the packaging base plate to be tested is fixed on a clamp, one end of a conductive through hole is connected with one part of spring needles on the clamp; the electric contact pad on the switching cover plate is connected with the other end of the conductive through hole, and the other part of spring needles are connected with the electric test pad; therefore the two ends of the conductive through hole are led out by the spring needles, and test on the connectivity and the resistivity of the conductive through hole can be facilitated by a testing machine through the spring needles.
Description
Technical field
The present invention relates to field of semiconductor manufacture, particularly relate to a kind of testing apparatus and test macro of 3 D stereo base plate for packaging.
Background technology
3 D stereo encapsulation is in the encapsulation perpendicular to the above nude film of stacking on the direction of chip surface, interconnected two panels.3 D stereo encapsulation mainly comprises following three types: the encapsulation of embedded type 3 D stereo, the encapsulation of active base plate type three-dimensional encapsulation, lamination-type 3 D stereo.Wherein, the encapsulation of lamination-type 3 D stereo is main adopts base plate for packaging by die package together.
The manufacturing process of base plate for packaging is as follows: carry out metalized to the through hole after base plate for packaging perforation, and on plated-through hole, form the salient point of low melting point, make it to become conductive through hole, the metal level in recycling hole and metal solder joint (normally Cu) carry out the interconnection of vertical direction.In this process, have the quality that several factors has influence on base plate for packaging, can affect metal enter in through hole as through-hole wall exists out of plumb, cause metal filled discontinuous, air-tightness is bad, thus the connectedness affected when base plate for packaging uses and impedance operator.
Summary of the invention
The object of the present invention is to provide a kind of testing apparatus and test macro of 3 D stereo base plate for packaging, the test of connectedness to 3 D stereo base plate for packaging and impedance operator can be realized.
To achieve these goals, the present invention proposes a kind of testing apparatus of 3 D stereo base plate for packaging, for testing the connectedness of base plate for packaging to be measured and resistance, comprise: switching cover plate and fixture, wherein, described switching cover plate comprises fixed area and outer region, is provided with multiple electric contact mat in described fixed area, described outer region is provided with multiple testing electrical property pad, described electric contact mat and the electrical connection of testing electrical property pad; Described fixture comprises multiple spring needle; Described base plate for packaging to be measured comprises multiple conductive through hole running through its two surface, when described base plate for packaging one side to be measured is fixed on described fixture, described conductive through hole one end is connected with a part of spring needle, the fixed area of described switching cover plate covers the another side of described base plate for packaging to be measured, described electric contact mat is connected with the other end of described conductive through hole, and another part spring needle is connected with described testing electrical property pad.
Further, in the testing apparatus of described 3 D stereo base plate for packaging, by the inner cabling electrical connection of plank between described electric contact mat and the electrical connection of testing electrical property pad.
Further, in the testing apparatus of described 3 D stereo base plate for packaging, described electric contact mat is identical with the number of described conductive through hole, and position one_to_one corresponding.
In the present invention, also proposed a kind of test macro of 3 D stereo base plate for packaging, comprise: the testing apparatus of test machine and 3 D stereo base plate for packaging as described above, wherein, the fixture of the testing apparatus of described 3 D stereo base plate for packaging is fixed on described test machine, spring needle on described fixture is connected with the test channel on described test machine, with the test of the connectedness and resistance of carrying out base plate for packaging to be measured.
Further, in the test macro of described 3 D stereo base plate for packaging, also comprise robot arm system, described robot arm system captures described base plate for packaging to be measured and switching cover plate respectively successively, and both is separately fixed on described fixture.
Further, in the test macro of described 3 D stereo base plate for packaging, described robot arm system comprises the first mechanical arm and the second mechanical arm, the size of described first mechanical arm and the size fit of described base plate for packaging to be measured, the size of described second mechanical arm and the size fit of described switching cover plate.
Further, in the test macro of described 3 D stereo base plate for packaging, also comprise test board, described test board is fixed on described test machine, and described fixture and described test board fix.
Further, in the test macro of described 3 D stereo base plate for packaging, described fixture is screwed on described test board.
Compared with prior art, beneficial effect of the present invention is mainly reflected in: switching cover plate is formed with electric contact mat and testing electrical property pad, when base plate for packaging one side to be measured is fixed on fixture, conductive through hole one end is connected with a part of spring needle on fixture, electric contact mat on switching cover plate is connected with the other end of conductive through hole, another part spring needle is connected with testing electrical property pad, thus the two ends of conductive through hole are all drawn by spring needle, be convenient to test machine carries out connectedness and resistance to conductive through hole test by spring needle.
Accompanying drawing explanation
Fig. 1 a is the generalized section of base plate for packaging in one embodiment of the invention;
Fig. 1 b is the vertical view of base plate for packaging in one embodiment of the invention;
Fig. 2 is the vertical view of cover plate of transferring in one embodiment of the invention;
Fig. 3 is the structural representation of the test macro of 3 D stereo base plate for packaging in one embodiment of the invention.
Embodiment
Below in conjunction with schematic diagram, the testing apparatus of 3 D stereo base plate for packaging of the present invention and test macro are described in more detail, which show the preferred embodiments of the present invention, should be appreciated that those skilled in the art can revise the present invention described here, and still realize advantageous effects of the present invention.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as limitation of the present invention.
In order to clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the present invention chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, a large amount of implementation detail must be made to realize the specific objective of developer, such as, according to regarding system or the restriction about business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
In the following passage, more specifically the present invention is described by way of example with reference to accompanying drawing.According to the following describes and claims, advantages and features of the invention will be clearer.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, the aid illustration embodiment of the present invention lucidly.
Please refer to Fig. 1 a and Fig. 1 b, under normal circumstances, base plate for packaging 10 to be measured comprises the conductive through hole 11 running through its both side surface, mentioned by background technology, may be there are some performance issues in conductive through hole 11, therefore, need the test it being carried out to connectedness and resistance.Connectedness can be tested by being connected conductive through hole 11 two ends with the test of resistance, therefore, the two ends of conductive through hole 11 can all be drawn by spring needle by the testing apparatus proposing a kind of 3 D stereo base plate for packaging in the present embodiment, are convenient to test machine and test it.
In the present embodiment, proposing a kind of testing apparatus of 3 D stereo base plate for packaging, for testing the connectedness of the conductive through hole 11 in base plate for packaging 10 to be measured and resistance, comprising: switching cover plate and fixture;
Please refer to Fig. 2, wherein, described switching cover plate 20 comprises fixed area 21 and outer region (non-label), multiple electric contact mat 23 is provided with in described fixed area 21, described outer region is provided with multiple testing electrical property pad 22, described electric contact mat 23 and testing electrical property pad 22 are electrically connected, concrete, and both are electrically connected by the inner cabling 24 of plank;
Described fixture comprises multiple spring needle; Described base plate for packaging to be measured 10 comprises multiple conductive through hole 11 running through its two surface, when described base plate for packaging to be measured 10 one side is fixed on described fixture, described conductive through hole 11 one end is connected with a part of spring needle, the fixed area 21 of described switching cover plate 20 covers the another side of described base plate for packaging to be measured 10, described electric contact mat 23 is connected with the other end of described conductive through hole 11, and another part spring needle is connected with described testing electrical property pad 22.
Wherein, described electric contact mat 23 is identical with the number of described conductive through hole 11, and position one_to_one corresponding, to connect whole conductive through holes 11.Therefore, the number of electric contact mat 23, testing electrical property pad 22 all can be decided by the number of conductive through hole 11, in this no limit.
Please refer to Fig. 3, a kind of test macro of 3 D stereo base plate for packaging is also proposed in the another aspect of the present embodiment, comprise: the testing apparatus of test machine 40 and 3 D stereo base plate for packaging as described above, wherein, the fixture 30 of the testing apparatus of described 3 D stereo base plate for packaging is fixed on described test machine 40, spring needle 31 on described fixture 30 is connected with the test channel on described test machine 40, to carry out the connectedness of base plate for packaging 10 to be measured and the test of resistance.
In the present embodiment, the test macro of described 3 D stereo base plate for packaging also comprises robot arm system 50, and described robot arm system 50 captures described base plate for packaging to be measured 10 and switching cover plate 20 respectively successively, and both is separately fixed on described fixture 30.Described robot arm system 50 comprises the first mechanical arm 51 and the second mechanical arm 52, the size of described first mechanical arm 51 and the size fit of described base plate for packaging to be measured 10, the size of described second mechanical arm 52 and the size fit of described switching cover plate 20, to facilitate the crawl carrying out different parts, be convenient to the operation realizing automation.
In the present embodiment, the test macro of described 3 D stereo base plate for packaging also comprises test board 60, and described test board 60 is fixed on described test machine 40, and described fixture 30 fixes with described test board 60.Wherein, described fixture 30 is screwed on described test board 60.
Base plate for packaging 10 to be measured is arranged on fixture 30, fixture 30 is arranged on after on tester table 40, because conductive through hole 11 two ends on base plate for packaging 10 to be measured all can be connected with the test channel on tester table 40 by spring needle 31 respectively, therefore, the test to conductive through hole 11 can be realized.
To sum up, in the testing apparatus of the 3 D stereo base plate for packaging provided in the embodiment of the present invention and test macro, switching cover plate is formed with electric contact mat and testing electrical property pad, when base plate for packaging one side to be measured is fixed on fixture, conductive through hole one end is connected with a part of spring needle on fixture, electric contact mat on switching cover plate is connected with the other end of conductive through hole, another part spring needle is connected with testing electrical property pad, thus the two ends of conductive through hole are all drawn by spring needle, be convenient to test machine carries out connectedness and resistance to conductive through hole test by spring needle.
Above are only the preferred embodiments of the present invention, any restriction is not played to the present invention.Any person of ordinary skill in the field; in the scope not departing from technical scheme of the present invention; the technical scheme disclose the present invention and technology contents make the variations such as any type of equivalent replacement or amendment; all belong to the content not departing from technical scheme of the present invention, still belong within protection scope of the present invention.
Claims (8)
1. the testing apparatus of a 3 D stereo base plate for packaging, for testing the connectedness of base plate for packaging to be measured and resistance, it is characterized in that, comprise: switching cover plate and fixture, wherein, described switching cover plate comprises fixed area and outer region, is provided with multiple electric contact mat in described fixed area, described outer region is provided with multiple testing electrical property pad, described electric contact mat and the electrical connection of testing electrical property pad; Described fixture comprises multiple spring needle; Described base plate for packaging to be measured comprises multiple conductive through hole running through its two surface, when described base plate for packaging one side to be measured is fixed on described fixture, described conductive through hole one end is connected with a part of spring needle, the fixed area of described switching cover plate covers the another side of described base plate for packaging to be measured, described electric contact mat is connected with the other end of described conductive through hole, and another part spring needle is connected with described testing electrical property pad.
2. the testing apparatus of 3 D stereo base plate for packaging as claimed in claim 1, is characterized in that, by the inner cabling electrical connection of plank between described electric contact mat and the electrical connection of testing electrical property pad.
3. the testing apparatus of 3 D stereo base plate for packaging as claimed in claim 1, it is characterized in that, described electric contact mat is identical with the number of described conductive through hole, and position one_to_one corresponding.
4. the test macro of a 3 D stereo base plate for packaging, it is characterized in that, comprise: the testing apparatus of test machine and as claimed any one in claims 1 to 33 D stereo base plate for packaging, wherein, the fixture of the testing apparatus of described 3 D stereo base plate for packaging is fixed on described test machine, spring needle on described fixture is connected with the test channel on described test machine, with the test of the connectedness and resistance of carrying out base plate for packaging to be measured.
5. the test macro of 3 D stereo base plate for packaging as claimed in claim 4, it is characterized in that, also comprise robot arm system, described robot arm system captures described base plate for packaging to be measured and switching cover plate respectively successively, and both is separately fixed on described fixture.
6. the test macro of 3 D stereo base plate for packaging as claimed in claim 5, it is characterized in that, described robot arm system comprises the first mechanical arm and the second mechanical arm, the size of described first mechanical arm and the size fit of described base plate for packaging to be measured, the size of described second mechanical arm and the size fit of described switching cover plate.
7. the test macro of 3 D stereo base plate for packaging as claimed in claim 4, it is characterized in that, also comprise test board, described test board is fixed on described test machine, and described fixture and described test board fix.
8. the test macro of 3 D stereo base plate for packaging as claimed in claim 7, it is characterized in that, described fixture is screwed on described test board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510326002.4A CN104952756A (en) | 2015-06-12 | 2015-06-12 | Test device and test system for three-dimensional packaging base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510326002.4A CN104952756A (en) | 2015-06-12 | 2015-06-12 | Test device and test system for three-dimensional packaging base plate |
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| CN104952756A true CN104952756A (en) | 2015-09-30 |
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| CN201510326002.4A Pending CN104952756A (en) | 2015-06-12 | 2015-06-12 | Test device and test system for three-dimensional packaging base plate |
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Citations (7)
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| US20110298488A1 (en) * | 2010-06-07 | 2011-12-08 | Texas Instruments Incorporated | Through carrier dual side loop-back testing of tsv die after die attach to substrate |
| CN102937695A (en) * | 2012-10-19 | 2013-02-20 | 北京大学 | Silicon through-hole ultrathin wafer testing structure and testing method |
| US20130052760A1 (en) * | 2011-08-26 | 2013-02-28 | Samsung Electronics Co., Ltd. | Method of inspecting and manufacturing a stack chip package |
| CN103487607A (en) * | 2012-06-07 | 2014-01-01 | 矽品精密工业股份有限公司 | Test device and test method |
| CN204102893U (en) * | 2014-10-17 | 2015-01-14 | 中芯国际集成电路制造(北京)有限公司 | A kind of semi-conductor test structure |
| CN104701206A (en) * | 2015-03-02 | 2015-06-10 | 上海华岭集成电路技术股份有限公司 | Three-dimensional packaging chip silicon through hole testing device |
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2015
- 2015-06-12 CN CN201510326002.4A patent/CN104952756A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102074544A (en) * | 2009-10-22 | 2011-05-25 | 台湾积体电路制造股份有限公司 | Through-silicon via structure and a process for forming the same |
| US20110298488A1 (en) * | 2010-06-07 | 2011-12-08 | Texas Instruments Incorporated | Through carrier dual side loop-back testing of tsv die after die attach to substrate |
| US20130052760A1 (en) * | 2011-08-26 | 2013-02-28 | Samsung Electronics Co., Ltd. | Method of inspecting and manufacturing a stack chip package |
| CN103487607A (en) * | 2012-06-07 | 2014-01-01 | 矽品精密工业股份有限公司 | Test device and test method |
| CN102937695A (en) * | 2012-10-19 | 2013-02-20 | 北京大学 | Silicon through-hole ultrathin wafer testing structure and testing method |
| CN204102893U (en) * | 2014-10-17 | 2015-01-14 | 中芯国际集成电路制造(北京)有限公司 | A kind of semi-conductor test structure |
| CN104701206A (en) * | 2015-03-02 | 2015-06-10 | 上海华岭集成电路技术股份有限公司 | Three-dimensional packaging chip silicon through hole testing device |
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