CN104947039B - Thermal baffle and reaction chamber - Google Patents
Thermal baffle and reaction chamber Download PDFInfo
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- CN104947039B CN104947039B CN201410111411.8A CN201410111411A CN104947039B CN 104947039 B CN104947039 B CN 104947039B CN 201410111411 A CN201410111411 A CN 201410111411A CN 104947039 B CN104947039 B CN 104947039B
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Abstract
The invention provides a kind of thermal baffle and reaction chamber, thermal baffle is arranged at cold pumping hole, for blocking the radiation of light source or reflected light to cold pumping hole, including first baffle and fixture, the quantity of first baffle is at least two, at least two first baffle in the vertical directions are sequentially stacked, and there is vertical interval between two adjacent first baffles of in the vertical direction；Also, fixture is used to fix at least two first baffles.The thermal baffle that the present invention is provided, what it can improve heat blocks efficiency, such that it is able to avoid the cooling effectiveness of cooling device low and regeneration frequency is high, and then can improve the stability and continuation of technical process.
Description
Technical field
The invention belongs to semiconductor equipment manufacturing technology field, and in particular to a kind of thermal baffle and reaction chamber.
Background technology
Physical vapour deposition (PVD)（Physical Vapor Deposition, hereinafter referred to as PVD）Technology is normal microelectronic
Process technology, is mainly used in the deposition of the metallic films such as aluminium, copper, to obtain metal contact, metal interconnecting wires etc..PVD sets
Standby processing chamber is vacuum environment, and usual processing chamber needs to reach high vacuum, for example, processing chamber needs to reach 10- 8The base vacuum of Torr.
In order to realize the high vacuum of processing chamber, by cooling device（For example, cold pump）Gas in absorbing process chamber
To improve vacuum.Fig. 1 is the structural representation of existing processing chamber.Fig. 2 is the top view of baffle plate in Fig. 1.Please join in the lump
Fig. 1 and Fig. 2 is read, cooling device is arranged on the lower section of processing chamber 10, and is connected with processing chamber 10；Cooling device includes one
Level cold drawing 11, secondary cold plate 12 and baffle plate 13.Wherein, one-level cold drawing 11 is arranged on what cooling device was connected with processing chamber 10
At position, its temperature is general in 80~100K, is mainly used to the vapor in condensation process chamber 10；Secondary cold plate 12 is located at one
Level cold drawing 11 lower section, be mainly used in condensation process chamber 10 via the exhaust outlet 111 on one-level cold drawing 11 towards two grades
The nitrogen of cold drawing 12, argon gas and oxygen, also, activated carbon is additionally provided with secondary cold plate 12, it is mainly used in absorbing process chamber
In room 10 via the exhaust outlet 111 on one-level cold drawing 11 towards the hydrogen of secondary cold plate 12, helium and neon, it is cold by one-level
Plate 11 and secondary cold plate 12 are condensed to gas in processing chamber 10, such that it is able to realize the high vacuum of processing chamber 10；Gear
Plate 13 is arranged in processing chamber 10, and is arranged on the surface at the position that cooling device is connected with processing chamber 10, is used
To block the direct radiation of one-level cold drawing 11 and secondary cold plate 12 to avoid it from being subject to light source.
In actual applications, when carrying out low temperature（<300℃）During depositing operation, the temperature phase under the irradiation of light source of baffle plate 13
To relatively low, this cause the baffle plate 13 as radiation source can realize the temperature of one-level cold drawing 11 and secondary cold plate 12 will not rise compared with
Height, can to a certain extent avoid the gases such as the water vapour, the argon gas that are condensed in one-level cold drawing 11 and secondary cold plate 12 from entering again
Enter in processing chamber 10, such that it is able to improving the cooling effectiveness of cooling device and reducing the regeneration frequency of cooling device.
However, work as carrying out high temperature（>300℃）During depositing operation, the temperature under the irradiation of light source of baffle plate 13 is of a relatively high,
It is higher that this causes that the baffle plate 13 can realize that the temperature of one-level cold drawing 11 and secondary cold plate 12 rises as radiation source, causes one-level cold
The gases such as water vapour, the argon gas condensed on plate 11 and secondary cold plate 12 are reentered in processing chamber 10, so as to cause cooling to fill
The cooling effectiveness put is low and cooling device regeneration frequency is high.
The content of the invention
Present invention seek to address that technical problem present in prior art, there is provided a kind of thermal baffle and reaction chamber,
It can improve the efficiency of blocking of heat, thus the cooling effectiveness of cooling device can be avoided low high with regeneration frequency, so that can
To improve the stability and continuation of technical process；And, the thermal baffle not only goes for low temperature process process, and
Go for elevated temperature processes, such that it is able to improve the applicability of thermal baffle.
A kind of thermal baffle is provided to solve problem of the invention, cold pumping hole is arranged at, for blocking light source or reflection
Radiation of the light to the cold pumping hole, including first baffle and fixture, the quantity of the first baffle is at least two, at least two
The individual first baffle in the vertical direction is sequentially stacked, and is deposited between two adjacent first baffles of in the vertical direction
In vertical interval；Also, the fixture is used to fix first baffle described at least two.
Preferably, also including second baffle, second baffle degree in a vertical angle with the first baffle is set, and described the
The upper end of two baffle plates is fixed on the lateral wall of the first baffle, and the second baffle is used to stop heat from the first gear
The side-wall outer side of plate is radiated to the underface of the first baffle.
Wherein, the quantity at least two of the second baffle, the upper end of each second baffle is fixed on described
Second baffle is arranged in order in the horizontal direction on the lateral wall of one baffle plate, and described at least two, and in the horizontal direction
There is level interval between two adjacent second baffles.
Preferably, between two adjacent first baffles, and also set in the gap that the vertical interval is formed
Thermal insulation board is equipped with, is used to reduce the heat transfer between two adjacent first baffles.
Wherein, it is provided with multiple through holes on each described second baffle, and the two neighboring second baffle is described
The center line of through hole is not arranged on the same straight line, to prevent heat that the underface of the first baffle is radiated to from the through hole.
Wherein, the scope of the vertical interval is in 5~10mm.
Wherein, the scope of the level interval is in 5~10mm.
Preferably, each described first baffle and/or the second baffle are using the stainless steel material system with single-surface mirror
Into, and the first baffle and/or the second baffle the single-surface mirror be located at its surface near thermal source on.
Present invention also offers a kind of reaction chamber, including cooling device, thermal baffle and fixing device, the cooling dress
The bottom wall put in the reaction chamber is connected with the reaction chamber, is used to condense the gas in the reaction chamber improve
The vacuum of reaction chamber；The thermal baffle is arranged in the reaction chamber, is used to block the cooling device prevent
Heat radiation is to the cooling device；The fixing device be used for by the thermal baffle be fixed on the cooling device with it is described
Reaction chamber is connected the surface at position；The above-mentioned thermal baffle that the thermal baffle is provided using the present invention.
Preferably, exist between the lower end of the second baffle of the thermal baffle and the bottom wall of the reaction chamber pre-
If spacing.
Wherein, the scope of the default spacing is not less than 10mm.
The present invention has following beneficial effects：
The thermal baffle that the present invention is provided, at least two first baffles that its in the vertical direction is sequentially stacked, and it is adjacent
Two first baffle in the vertical directions there is vertical interval, two adjacent first baffles are needed by the vertical interval shape
Into gap carry out heat transfer so that the two heat transference efficiency is not high, and this is caused from the first baffle near thermal source to farthest
Heat from the first baffle of thermal source is gradually decreased, i.e. so that farthest away from thermal source（That is, it is cold near thermal baffle lower section is located at
But device）First baffle heat it is minimum, should be radiated to cooling device as radiation source farthest away from the first baffle of thermal source
Heat is smaller, will not cause that the gas such as water vapour, argon gas that cooling device is condensed is reentered in processing chamber, therefore, this with
Prior art is compared, and can improve the efficiency of blocking of heat, thus the cooling effectiveness of cooling device can be avoided low and regeneration frequency
Rate is high, such that it is able to improve the stability and continuation of technical process；And, the thermal baffle not only goes for low temperature work
Skill process, and go for elevated temperature processes, such that it is able to improve the applicability of thermal baffle.
The reaction chamber that the present invention is provided, it is passed through the thermal baffle provided using the present invention, can avoid cooling device
Cooling effectiveness is low and regeneration frequency is high, so as to can not only improve the efficiency of reaction chamber evacuation, and work can be improved
The stability and continuation of skill process.
Brief description of the drawings
Fig. 1 is the structural representation of existing processing chamber；
Fig. 2 is the top view of baffle plate in Fig. 1；
Fig. 3 is the structural representation of thermal baffle provided in an embodiment of the present invention；
Fig. 4 is the structural representation of at least two first baffles in Fig. 3；
Fig. 5 is the structural representation of at least two second baffles in Fig. 3；
Fig. 6 is the structural representation of reaction chamber provided in an embodiment of the present invention；And
Fig. 7 is the structural representation of thermal baffle fixed in Fig. 6.
Specific embodiment
To make those skilled in the art more fully understand technical scheme, the present invention is carried below in conjunction with the accompanying drawings
The thermal baffle and reaction chamber of confession are described in detail.
Fig. 3 is the structural representation of thermal baffle provided in an embodiment of the present invention.Fig. 4 is at least two first gear in Fig. 3
The structural representation of plate.Fig. 5 is the structural representation of at least two second baffles in Fig. 3.Also referring to Fig. 3, Fig. 4 and Fig. 5,
The thermal baffle that the present embodiment is provided is arranged at cold pumping hole, for blocking the radiation of light source or reflected light to cold pumping hole, including the
One baffle plate 10, fixture 11, second baffle 12 and thermal insulation board 13.Wherein, the quantity of first baffle 10 is at least two, in this reality
Apply in example, the quantity of first baffle 10 is three, including first baffle 101, first baffle 102 and first baffle 103, at least two
The in the vertical direction of individual first baffle 10 is sequentially stacked, and exists between two adjacent first baffles 10 of in the vertical direction vertical
Straight spacing H, as shown in Figure 4；Also, fixture 11 is used to fix at least two first baffles 10, in the present embodiment, fixture
11 is stud, also, to realize there is vertical interval H between two adjacent first baffles 10, in two adjacent first gear
Cushion block is provided between plate 10（Not shown in figure）, in actual applications, fixture 11 can also be fixed using other modes, with
And realize there is vertical interval H between two adjacent first baffles 10 using other modes.Preferably, vertical interval H
Scope is in 5~10mm.Two adjacent first baffles 10 need by the vertical interval H-shaped into gap carry out heat transfer, make
The two heat transference efficiency is not high, this is caused near the first baffle 101 of thermal source to the first baffle 103 farthest away from thermal source
Heat gradually decrease, i.e. so that farthest away from thermal source（That is, near positioned at thermal baffle lower section cooling device）First baffle
103 heat is minimum, for example, the temperature of first baffle 101 is 600 DEG C, the temperature of first baffle 102 is 300 DEG C, first baffle
103 temperature is 100 DEG C, should be smaller to the heat that cooling device is radiated as radiation source farthest away from the first baffle 103 of thermal source,
Will not cause that the gas such as water vapour, argon gas that cooling device is condensed is reentered in processing chamber, therefore, this and prior art phase
Than, the efficiency of blocking of heat can be improved, thus the cooling effectiveness of cooling device can be avoided low high with regeneration frequency, so that can
To improve the stability and continuation of technical process；And, the thermal baffle not only goes for low temperature process process, and
Go for elevated temperature processes, such that it is able to improve the applicability of thermal baffle.
Second baffle 12 is set with the perpendicular angle of first baffle 10, and the upper end of second baffle 12 is fixed on first gear
On the lateral wall of plate 10, second baffle 12 is used to stop that heat is radiated to first baffle 10 from the side-wall outer side of first baffle 10
Underface.Wherein, the quantity of second baffle 12 can be one or more.In the present embodiment, the quantity of second baffle 12
At least two, the upper end of each second baffle 12 is fixed on the lateral wall of first baffle 10, also, at least two second gear
Plate 12 is arranged in order in the horizontal direction, and there is level interval L between adjacent in the horizontal direction two second baffles 12,
As shown in Figure 5.Preferably, the scope of level interval L is in 5~10mm.Specifically, the quantity of second baffle 12 is three, including
Second baffle 121, second baffle 122, second baffle 123, the quantity of second baffle 12 and the quantity of first baffle 10 are equal, and
The two is corresponded, and each second baffle 12 is fixed on the lateral wall of corresponding first baffle 10, and second baffle 121 is consolidated
It is scheduled on the lateral wall of first baffle 101, second baffle 122 is fixed on the lateral wall of first baffle 102, second baffle 123
It is fixed on the lateral wall of first baffle 103, in this case, the numerical value of level interval L and the numerical value phase of vertical interval H
Deng.
In actual applications, it is also possible in advance by the stacked fixation of the mutual level of at least two second baffle 12 and adjacent
There is level interval L between two baffle plates 12, and be fixed at least two fixed second baffles 12 as overall upper end
On the lateral wall of first baffle 10, in this case, level interval L and vertical interval H can be independently arranged, i.e. the two can
With equal or unequal, the scope of vertical interval H or level interval L is in 5~10mm.
It is readily appreciated that there is level interval L between two adjacent second baffles 12 with two adjacent first baffles 10
Between exist vertical interval H principle it is similar, it can cause the heat transference efficiency between two adjacent second baffles 12
Not high, this causes that the heat from the second baffle near thermal source to the second baffle farthest away from thermal source is gradually decreased, i.e. so that
Farthest away from thermal source（That is, near positioned at thermal baffle lower section cooling device）Second baffle 123 heat it is minimum, should be farthest away from
The second baffle of thermal source is smaller to the heat that cooling device is radiated as radiation source, will not also cause that the water that cooling device is condensed steams
The gases such as vapour, argon gas are reentered in processing chamber, thus can further improve the efficiency of blocking of heat, such that it is able to enter one
Step avoids the cooling effectiveness of cooling device low high with regeneration frequency, and then can further improve the stability of technical process and hold
Continuous property.
In this embodiment, it is preferred that, cooling device is reached with right from the side-wall outer side of thermal baffle for the ease of gas
It is condensed, as shown in figure 3, in each second baffle 12（That is, stop that heat is radiated to from the side-wall outer side of first baffle 10
The surface of the underface of first baffle 10）On be provided with multiple through holes 124, and the through hole 124 of two neighboring second baffle 12
Center line is not arranged on the same straight line, in other words, projected area of each second baffle 12 on second baffle 12 adjacent thereto
Domain without or part be located at the adjacent second baffle 12 on through hole 124 region in, to prevent heat from through hole
124 underfaces for being radiated to first baffle 10, this can not only realize the flowing of gas, and can realize preventing heat from passing
Pass, such that it is able to realize the practicality of the thermal baffle.
Additionally preferably, thermal insulation board 13 is arranged between two adjacent first baffles 10, and vertical interval H-shaped into
In gap, it is used to reduce the heat transfer between two adjacent first baffles 10, this can further reduce two neighboring first
Heat transfer between baffle plate 10, thus can be with further such that less farthest away from the heat of the first baffle 103 of thermal source.
In the present embodiment, first baffle 10 and second baffle 12 are used to stop the transmission of heat, and the two all should be used
Resistant to elevated temperatures material is made, resistant to elevated temperatures material include stainless steel material, in the present embodiment, each first baffle 10 and/or
Second baffle 12 is made of with the stainless steel material of single-surface mirror, also, first baffle 10 and/or second baffle 12 one side
Mirror be located at its surface near thermal source on, this allows that heat is reflexed to thermal source by single-surface mirror, such that it is able to further such that
It is relatively low near the first baffle of cooling device and/or the temperature of second baffle.
It should be noted that in actual applications, can specifically be set according to actual conditions second baffle 12 structure and
Size, for example, when first baffle 10 be arranged on reaction chamber centre position or first baffle 10 periphery wall not with reaction
When the internal perisporium of chamber is contacted, second baffle 12 can be the baffle plate for surrounding the circumferential loop configuration for being formed of first baffle 10；When
When the lateral wall of first baffle 10 relies on the madial wall of reaction chamber, the second plate washer 12 is the outside for being arranged on first baffle 10
The part baffle plate of the side of the internal perisporium away from reaction chamber of wall.In addition, to be further easy to side of the gas from thermal baffle
Wall outside reaches cooling device and is condensed with to it, exists between the lower end of second baffle 12 and the bottom wall of reaction chamber default
Spacing, also, the scope of default spacing is not less than 10mm.
Also, it should be noted that thermal baffle provided in an embodiment of the present invention, the not specific side wall for limiting second baffle
On through hole quantity and the contour shape at radial direction interface.
In addition, it is necessary to explanation, in the present embodiment, first baffle 10 and second baffle 12 are plane formula baffle plate.
But, the invention is not limited in this, in actual applications, first baffle 10 or second baffle 12 can also keep off for curved face type
Plate, or the baffle plate that various plane formula baffle groups are shaped as.
Fig. 6 is the structural representation of reaction chamber provided in an embodiment of the present invention.Fig. 7 is thermal baffle fixed in Fig. 6
Structural representation.Also referring to Fig. 6 and Fig. 7, the reaction chamber 20 that the present embodiment is provided includes cooling device 21, heat-insulated gear
Plate 22 and fixing device 23.Wherein, cooling device 21 is connected in the bottom wall of reaction chamber 20 with reaction chamber 20, is used to condense
, to improve the vacuum of reaction chamber 20, cooling device includes cold pump for gas in reaction chamber 20, the concrete structure of cold pump and
It is of the prior art similar, will not be described in detail herein；Thermal baffle 22 is arranged in reaction chamber 20, is used to block cooling device
21 to prevent heat radiation to cooling device 21, wherein, the thermal baffle 22 that thermal baffle 22 is provided using above-described embodiment, tool
Body ground, the lateral wall of the first baffle 10 of thermal baffle 22 is in contact with the madial wall of reaction chamber 20, in this case, the
Two plate washers are the part baffle plate of the side of the internal perisporium away from reaction chamber 20 of the lateral wall for being arranged on first baffle 10, are such as schemed
Shown in 6.
Fixing device 23 is connected at position for thermal baffle 22 to be fixed on into cooling device 21 with reaction chamber 20
Surface；Fixing device 23 includes support column 231 and installed part 232, wherein, the quantity of support column 231 is multiple, and is arranged on
The upper surface of installed part 231 and farthest away between the lower surface of the first baffle 10 of thermal source, and interfixed with the two, it is used to support
The plurality of first baffle 10 for interfixing, in the present embodiment, the quantity of support column 231 and position are consolidated with thermal baffle 22
The quantity and position for determining part 11 are corresponded, and in this case, support column 231 and fixture 11 can use monoblock type knot
Structure, but, in actual applications, the quantity of support column 231 and position can also be mutually only with the quantity of fixture 11 and position
Erect and put.
The structure of installed part 232 is loop configuration, and it is arranged on the position that cooling device 21 is connected with reaction chamber 20
Surface, be used to fix the plurality of support column 231, to fix thermal baffle 22, gas in reaction chamber 20 via this every
Through hole 124 on the second baffle 12 of heat shield 22 enters the lower section of first baffle 10, and enters from the annular distance of the installed part 232
Cooling device 21, so that cooling device 21 is condensed to improve the vacuum of reaction chamber 20 to the gas in reaction chamber 20
Degree.
In this embodiment, it is preferred that, the lower end of the second baffle 12 of thermal baffle 22 and the bottom wall of reaction chamber 20 it
Between there is default spacing M.It is further preferred that the scope of default spacing M is that, not less than 10mm, this is caused in reaction chamber 20
The gap that gas can also be formed via the default spacing M enters the underface of first baffle 10, thus can improve cooling dress
The cooling effectiveness put, such that it is able to improve the evacuation efficiency of reaction chamber 20.
It should be noted that in the present embodiment, as shown in fig. 6, the second baffle 12 of thermal baffle 22 is to be arranged on the
The part baffle plate of the side of the internal perisporium away from reaction chamber 20 of the lateral wall of one baffle plate 10.But, the present invention does not limit to
In this, in actual applications, the structure snd size of second baffle 12 can be specifically set according to actual conditions, for example, when heat-insulated
Baffle plate 22 be arranged on reaction chamber 20 centre position or thermal baffle 22 lateral wall not with the madial wall of reaction chamber 20
During contact, second baffle 12 can be the baffle plate for surrounding the circumferential loop configuration for being formed of first baffle 10.
The reaction chamber that the present embodiment is provided, it is passed through the thermal baffle 22 provided using above-described embodiment, can avoided
The cooling effectiveness of cooling device is low and regeneration frequency is high, so as to can not only improve the efficiency of reaction chamber evacuation, Er Qieke
To improve the stability and continuation of technical process.
It is understood that the embodiment of above principle being intended to be merely illustrative of the present and the exemplary implementation for using
Mode, but the invention is not limited in this.For those skilled in the art, original of the invention is not being departed from
In the case of reason and essence, various changes and modifications can be made therein, and these variations and modifications are also considered as protection scope of the present invention.
Claims (11)
1. a kind of thermal baffle, is arranged at cold pumping hole, for blocking the radiation of light source or reflected light to the cold pumping hole, its feature
It is, including first baffle and fixture, the quantity of the first baffle is at least two, and first baffle exists described at least two
It is sequentially stacked on vertical direction, and there is vertical interval between two adjacent first baffles of in the vertical direction；Also,
The fixture is used to fix first baffle described at least two.
2. thermal baffle according to claim 1, it is characterised in that also including second baffle, the second baffle and institute
State the perpendicular angle of first baffle to set, the upper end of the second baffle is fixed on the lateral wall of the first baffle, described
Second baffle is used to stop that heat is radiated to the underface of the first baffle from the side-wall outer side of the first baffle.
3. thermal baffle according to claim 2, it is characterised in that the quantity at least two of the second baffle, often
The upper end of the individual second baffle is fixed on the lateral wall of the first baffle, and
Second baffle is arranged in order in the horizontal direction described at least two, and adjacent in the horizontal direction two described second
There is level interval between baffle plate.
4. thermal baffle according to claim 1, it is characterised in that between two adjacent first baffles, and
Thermal insulation board is additionally provided with the gap that the vertical interval is formed, is used to reduce between two adjacent first baffles
Heat transfer.
5. thermal baffle according to claim 3, it is characterised in that be provided with each described second baffle multiple logical
Hole, and the center line of the through hole of the two neighboring second baffle is not arranged on the same straight line, to prevent heat from described
Through hole is radiated to the underface of the first baffle.
6. thermal baffle according to claim 1, it is characterised in that the scope of the vertical interval is in 5~10mm.
7. thermal baffle according to claim 3, it is characterised in that the scope of the level interval is in 5~10mm.
8. thermal baffle according to claim 2, it is characterised in that each described first baffle and/or the second gear
Plate is made of the stainless steel material with single-surface mirror, and
The single-surface mirror of the first baffle and/or the second baffle is located on its surface near thermal source.
9. a kind of reaction chamber, including cooling device, thermal baffle and fixing device, the cooling device is in the reaction chamber
Bottom wall be connected with the reaction chamber, be used to condense vacuum of the gas in the reaction chamber to improve reaction chamber
Degree；The thermal baffle is arranged in the reaction chamber, is used to block the cooling device to prevent heat radiation to described
Cooling device；The fixing device is connected for the thermal baffle to be fixed on into the cooling device with the reaction chamber
Surface at position；Characterized in that, the thermal baffle is using the heat-insulated gear described in the claims 1-8 any one
Plate.
10. reaction chamber according to claim 9, it is characterised in that also including second baffle, the second baffle and institute
State the perpendicular angle of first baffle to set, the upper end of the second baffle is fixed on the lateral wall of the first baffle, described
Second baffle is used to stop that heat is radiated to the underface of the first baffle from the side-wall outer side of the first baffle, it is described every
There is default spacing between the lower end of the second baffle of heat shield and the bottom wall of the reaction chamber.
11. reaction chambers according to claim 10, it is characterised in that the scope of the default spacing be not less than
10mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410111411.8A CN104947039B (en) | 2014-03-24 | 2014-03-24 | Thermal baffle and reaction chamber |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410111411.8A CN104947039B (en) | 2014-03-24 | 2014-03-24 | Thermal baffle and reaction chamber |
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| Publication Number | Publication Date |
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| CN104947039A CN104947039A (en) | 2015-09-30 |
| CN104947039B true CN104947039B (en) | 2017-07-04 |
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| DE102017106431A1 (en) * | 2017-03-24 | 2018-09-27 | Aixtron Se | Apparatus and method for reducing the water partial pressure in an OVPD coating device |
| US11270898B2 (en) * | 2018-09-16 | 2022-03-08 | Applied Materials, Inc. | Apparatus for enhancing flow uniformity in a process chamber |
| CN110173411A (en) * | 2019-06-21 | 2019-08-27 | 北京北方华创微电子装备有限公司 | Cold pump closure and reaction chamber |
| WO2021170209A1 (en) * | 2020-02-24 | 2021-09-02 | Applied Materials, Inc. | Vacuum processing apparatus, vacuum system, gas partial pressure control assembly, and method of controlling partial pressure of a gas in a vacuum processing chamber |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE2907055A1 (en) * | 1979-02-23 | 1980-08-28 | Kernforschungsanlage Juelich | HEAT RADIATION SHIELD FOR CRYOPUM PUMPS |
| US5972183A (en) * | 1994-10-31 | 1999-10-26 | Saes Getter S.P.A | Getter pump module and system |
| JP4230564B2 (en) * | 1998-06-11 | 2009-02-25 | パナソニック株式会社 | Sputtering equipment |
| CN101403102B (en) * | 2008-10-30 | 2011-05-11 | 桂林实创真空数控设备有限公司 | Continuous vacuum transition chamber with linear vacuum motive seal and X-ray radiation protection function |
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