CN104942687B - A kind of IGBT module busbar polishing method and polishing frock - Google Patents
A kind of IGBT module busbar polishing method and polishing frock Download PDFInfo
- Publication number
- CN104942687B CN104942687B CN201410113323.1A CN201410113323A CN104942687B CN 104942687 B CN104942687 B CN 104942687B CN 201410113323 A CN201410113323 A CN 201410113323A CN 104942687 B CN104942687 B CN 104942687B
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- CN
- China
- Prior art keywords
- busbar
- module
- frock
- polishing
- size
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention discloses a kind of method of IGBT module busbar polishing and frock is polished, steps of the method are：（1）By the way that burnishing surface size and the distribution of each busbar in module is calculated, while utilize the distance after busbar bending in module between its burnishing surface and module lid；（2）According to step（1）Data obtain polish frock；（3）Directly by step（2）Obtained polishing frock is fixed on busbar, and module is fixed on support, and operation is polished to all busbars using polishing machine.The frock is for implementing the above method.The present invention has the advantages that principle is simple, easy to operate, enormously simplify the busbar polishing operation of IGBT module, reduces labor intensity.
Description
Technical field
Present invention relates generally to IGBT module（Insulated gate bipolar transistor）Production field, refer in particular to one kind and be applied to
The method and polishing frock of IGBT module busbar polishing.
Background technology
Existing IGBT module is after whole production test links are completed, it is necessary to be polished to module substrate and busbar.Mesh
Before, as shown in figure 1, traditional busbar polishing mode is：（1）Busbar is fixed on support；（2）Beaten manually using sand paper afterwards
Mill module bus bar is polished；（3）Repeat step（2）, until the polishing of all busbars is completed.In above process, it is necessary to one
Each and every one busbar individually polished manually, and it is inconsistent to have thereby resulted in the polishing effect of each busbar, have impact on module
Outward appearance；Meanwhile in the case where wasting the plenty of time it is also possible to being damaged to busbar and module lid, i.e., because busbar is thrown
Light region is smaller, and busbar is easily damaged in polishing process or scratches lid.
The content of the invention
The technical problem to be solved in the present invention is that：For technical problem existing for prior art, the present invention provides one
Kind principle is simple, busbar polishing operation easy to operate, enormously simplify IGBT module, reduces the IGBT module of labor intensity
The method and polishing frock of busbar polishing.
In order to solve the above technical problems, the present invention uses following technical scheme：
A kind of method of IGBT module busbar polishing, its step are：
（1）By the way that burnishing surface size and the distribution of each busbar in module is calculated, while utilize mother in module
Distance after row's bending between its burnishing surface and module lid；
（2）According to step（1）Data obtain polish frock；
（3）Directly by step（2）Obtained polishing frock is fixed on busbar, and module is fixed on support, utilizes throwing
Ray machine is polished operation to all busbars.
As a further improvement on the present invention：The step（2）The step of be：
(2.1) after calculating busbar bending, busbar needs the size of burnishing surface, for determining empty size in frock；
(2.2) according to bus bar position in module, the distance between each cavity in frock is determined；
(2.3) frock size is designed according to module lid size；
(2.4) distance after being bent using busbar in module between its burnishing surface and module lid, the thickness of frock is determined.
Invention further provides a kind of polishing frock for being used for implementing the above method to include being used for being buckled in module
Plate body, in offering cavity at the bus bar position of respective modules on the plate body.
Compared with prior art, the advantage of the invention is that：The IGBT module busbar polishing method of the present invention and buffer
Tool, principle is simple, busbar polishing operation easy to operate, enormously simplify IGBT module, reduces labor intensity, and polishing
During protect module lid not come to harm, can also effective control module busbar polishing effect, ensure that polishing is consistent
Property；From practical standpoint, the present invention can meet the needs of a variety of package modules.
Brief description of the drawings
Fig. 1 is the schematic flow sheet of existing polishing method.
Fig. 2 is the schematic flow sheet of polishing method of the present invention.
Fig. 3 is the structural representation of present invention polishing frock.
Fig. 4 is the principle schematic diagram of buffer's dress of the present invention in specific application.
Marginal data：
1st, plate body；2nd, module；3rd, busbar；4th, it is empty.
Embodiment
The present invention is described in further details below with reference to Figure of description and specific embodiment.
As shown in Fig. 2 the method for the IGBT module busbar polishing of the present invention, its step are：
（1）By the way that the burnishing surface size of each busbar 3 and distribution in module 2 is calculated, while using in module 2
Distance after the bending of busbar 3 between its burnishing surface and the lid of module 2；
（2）According to step（1）Data obtain polish frock；
（3）Directly by step（2）Obtained polishing frock is fixed on busbar 3, and module 2 is fixed on support, is utilized
Polishing machine is polished operation to all busbars 3.It is disposable simultaneously to all on the polishing top cover of module 2 this makes it possible to realize
Big busbar 3 is polished, and substantially prevents the damage in polishing process to the lid of module 2 and busbar 3 simultaneously.
In the present embodiment, step（2）Detailed process be：
(2.1) after calculating the bending of busbar 3, busbar 3 needs the size of burnishing surface, for determining that cavity 4 is big in frock
It is small；
(2.2) according to the position of busbar 3 in module 2, determine each empty the distance between 4 in frock；
(2.3) frock size is designed according to the lid size of module 2；
(2.4) distance after being bent using busbar 3 in module 2 between its burnishing surface and the lid of module 2, the thickness of frock is determined
Degree.
As shown in figure 3, invention further provides IGBT module busbar to polish frock, the frock is come according to the above method
Design, it includes the plate body 1 for being buckled in module 2, and cavity 4 is offered in the opening position of busbar 3 of respective modules 2 on plate body 1.
In specific application, can be in same plate body 1（Such as steel plate）On carve the polishing areas of busbar 3 of all different type modules 2.
The above is only the preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-described embodiment,
All technical schemes belonged under thinking of the present invention belong to protection scope of the present invention.It should be pointed out that for the art
For those of ordinary skill, some improvements and modifications without departing from the principles of the present invention, the protection of the present invention should be regarded as
Scope.
Claims (2)
1. the method for a kind of IGBT module busbar polishing, it is characterised in that step is：
（1）By the way that burnishing surface size and the distribution of each busbar in module is calculated, while busbar is curved on computing module
Distance after folding between its burnishing surface and module lid；
（2）According to step（1）Data obtain polish frock：
(2.1) after calculating busbar bending, busbar needs the size of burnishing surface, for determining empty size in frock；
(2.2) according to bus bar position in module, the distance between each cavity in frock is determined；
(2.3) frock size is designed according to module lid size；
(2.4) distance after being bent using busbar in module between its burnishing surface and module lid, the thickness of frock is determined；
（3）Directly by step（2）Obtained polishing frock is fixed on busbar, and module is fixed on support, utilizes polishing machine
Operation is polished to all busbars.
2. a kind of be used for implementing the polishing frock of method in the claims 1, it is characterised in that including for being buckled in module
（2）On plate body（1）, in the plate body（1）Upper respective modules（2）Busbar（3）Opening position offers cavity（4）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410113323.1A CN104942687B (en) | 2014-03-25 | 2014-03-25 | A kind of IGBT module busbar polishing method and polishing frock |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410113323.1A CN104942687B (en) | 2014-03-25 | 2014-03-25 | A kind of IGBT module busbar polishing method and polishing frock |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104942687A CN104942687A (en) | 2015-09-30 |
| CN104942687B true CN104942687B (en) | 2017-11-14 |
Family
ID=54158028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410113323.1A Active CN104942687B (en) | 2014-03-25 | 2014-03-25 | A kind of IGBT module busbar polishing method and polishing frock |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104942687B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07221053A (en) * | 1994-01-31 | 1995-08-18 | Matsushita Electric Works Ltd | Method for polishing semiconductor substrate and manufacture of non-punch-through type semiconductor device using method for polishing semiconductor substrate |
| JPH1177512A (en) * | 1997-09-09 | 1999-03-23 | Oki Electric Ind Co Ltd | Automatic polishing method for lead terminal of surface mounting package and equipment therefor |
| KR100416808B1 (en) * | 2002-02-04 | 2004-01-31 | 삼성전자주식회사 | Polishing head of chemical mechanical polishing apparatus for manufacturing semiconductor device and chemical mechanical polishing apparatus having it |
| CN201505856U (en) * | 2009-08-20 | 2010-06-16 | 浙江工业大学 | Matching die polishing device |
| CN102335856B (en) * | 2011-11-21 | 2013-07-24 | 重庆川仪自动化股份有限公司 | Polishing method of small-volume or ultra-thin or various specifications of gem products |
| CN202498431U (en) * | 2012-03-27 | 2012-10-24 | 蓝思旺科技(深圳)有限公司 | Jig for polishing glass surfaces |
-
2014
- 2014-03-25 CN CN201410113323.1A patent/CN104942687B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104942687A (en) | 2015-09-30 |
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Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CSR TIMES ELECTRIC Co.,Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20201026 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |
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| TR01 | Transfer of patent right |