CN104934408B - A kind of inductor with metal charge structure - Google Patents
A kind of inductor with metal charge structure Download PDFInfo
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Abstract
The present invention provides a kind of inductor with metal charge structure, and the metal charge structure comprises at least：Several contour metal derbies and some metal lines being radially distributed with the pin baseline；Described metal wire one end is connected with pin baseline to be grounded, and the other end is gathered in the middle part of the described first region without Metal Distribution and non-intersect；The metal derby does not contact with the metal wire.Shape, size and the interval of the metal derby that sparse region is formed are distributed in inductor metal by optimizing, the eddy current effect of metal derby can be reduced, effectively increases the quality factor of inductor；The metal wire being radially distributed is formed in other metal levels in addition to top layer, metal wire one end ground connection, the effect of screen layer is served, effectively reduces the eddy current effect of metal charge structure, increase the quality factor of inductor significantly.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, more particularly to a kind of inductance with metal charge structure
Device.
Background technology
At present, IC-components include more metal layers, the metal in each layer metal level, should according to the difference of device
With according to different Density Distributions in insulating materials silicon dioxide layer, metal material is generally copper.But due to silicon dioxide ratio
The hardness of metallic copper is big, and to be filled with metallic copper silicon dioxide layer carry out cmp (CMP) when, it is necessary to apply
Certain pressure, under the effect of the pressure, metal copper layer distribution are distributed closeer than sparse region than metal copper layer
Region will have relatively thin thickness.The silicon dioxide material layer of metallic copper with different densities distribution, through chemical machinery
Effect diagram after grinding is as shown in Figure 1a.In fig 1 a, metallic copper 11 is embedded in silicon dioxide layer 10, and left side is metal
Copper 11 is distributed sparse region, and right side is the densely distributed region of metallic copper 11, because right side metallic copper 11 is distributed than comparatively dense,
More metallic copper 11 make it that the hardness on right side is small compared to left side, and this is allowed under the effect of the pressure, and right side is extruded ground
Than more serious, it is thin that the thickness in the densely distributed region of right side metallic copper 11 compared to left side metallic copper 11 is distributed sparse region,
And, it is necessary to the silicon dioxide layer 10 for being filled with metallic copper 11 keeps certain target thickness in the preparation process of device,
Within the scope of this density for just needing metallic copper 11 to be distributed is maintained at certain, and it is difficult to accomplish this point in existing process.For
The silicon oxide layer for being filled with metallic copper 11 is avoided the different phenomenon of thickness occur after carrying out cmp, typically can be in gold
Category distribution automatically forms hanging metal charge structure (floating dummy metal) than sparse region, so that should
The metal in region reaches certain density, and as shown in Figure 1 b, Fig. 1 b are in the prior art in the automatic shape in the sparse region of Metal Distribution
Into the structural representation of hanging metal charge structure.Here hanging metal charge structure, vacantly refers to metal
Packing structure does not connect current potential, that is to say, that is not connected with original functional circuit；Here the metal charge knot automatically formed
Structure automatically generates in design, and size is certain.Hanging metal charge structure is metal derby 12 one by one in Fig. 1 b, is filled out
Fill in the sparse space of signal wire 13, the material of the metal derby 12 is typically identical with the material of signal wire 13, whole technique
Process checks that window 14 is monitored by the density of setting.
However, being formed in the sparse space of the metal level after metal charge structure, eddy current effect can be introduced
（eddy current effect）, i.e., electric current is produced in metal charge structure, this will increase the energy damage of inductor
Consumption, so as to reduce the quality factor of inductor（Quality factor, Q）, the quality factor is stored in inductor
The ratio of energy and the energy of loss, the quality factor of inductor is higher, then shows that the inductor volume power consumption is smaller, efficiency is got over
It is high.Meanwhile the formation of metal charge structure can also increase electric capacity, and then cause the self-resonant frequency of inductor（self-
Resonant frequency, SRF）Reduce, the quality factor of inductor is impacted.For example, in 65nm technologies, automatically
Formed metal charge structure after, the peak value of the quality factor of inductor reduces 18% or so, its self-resonant frequency by
14.9GHz it is reduced to 13.7GHz；In 90nm technologies, after automatically forming metal charge structure, the quality factor of inductor
Peak value reduce 28% or so, its self-resonant frequency is reduced to 11GHz by 12.9GHz.Due to quality factor as inductor most
Important performance indications, its size will produce large effect to the performance of phase noise and circuit, therefore, how form gold
On the basis of belonging to packing structure, the quality factor for effectively improving inductor starts to turn into the focus studied at present.
The content of the invention
In view of the above the shortcomings that prior art, it is an object of the invention to provide one kind to have metal charge structure
Inductor, for solve in the prior art inductor metal be distributed sparse region automatically form metal charge structure with
Afterwards, eddy current effect is introduced, i.e., electric current can be produced in metal charge structure, causes the energy loss of inductor to increase, and then
Cause the problem of inductor quality factor reduces.
In order to achieve the above objects and other related objects, the present invention provides a kind of inductance with metal charge structure
Device, it comprises at least bottom rectangular metal layer, the top layer rectangular metal layer on the bottom rectangular metal layer, positioned at described
At least one layer of intermediate rectangular metal level between bottom rectangular metal layer and top layer rectangular metal layer, it is characterised in that the bottom
Layer rectangular metal layer comprises at least the pin baseline of the pin and the connection pin positioned at its four vertex；The pin
Baseline connects adjacent pin to surround the first region without Metal Distribution, in the described first region without Metal Distribution formed with
Metal charge structure；The metal charge structure comprises at least：
Several contour metal derbies and some metal lines being radially distributed with the pin baseline；
Described metal wire one end is connected with pin baseline to be grounded, and the other end is gathered described first without Metal Distribution
It is in the middle part of region and non-intersect；The metal derby does not contact with the metal wire.
As a kind of preferred scheme of the inductor with metal charge structure of the present invention, the top layer rectangular metal
Layer comprises at least：Inductor metal coil in the middle part of the top layer rectangular metal layer, positioned at the top layer rectangular metal layer
The pin of four vertex and two middle side parts, connect the connection of the pin of the inductor metal coil and two middle side part
Line, and the pin baseline of connection four vertex pins；In inductor metal coil inside region, inductor metal line
Formed in circle and the region between pin and pin baseline, and the region connected between pin without baseline and inductor gold
Belong to several contour metal derbies of coil.
As a kind of preferred scheme of the inductor with metal charge structure of the present invention, the intermediate rectangular metal
Layer comprises at least the pin baseline of the pin and the connection pin positioned at its four vertex；The pin baseline will be adjacent
Pin connection is to surround the second region without Metal Distribution, formed with metal charge in the described second region without Metal Distribution
Structure；The metal charge structure comprises at least：
Several contour metal derbies and some metal lines being radially distributed with the pin baseline；
Described metal wire one end is connected with pin baseline to be grounded, and the other end is gathered described second without Metal Distribution
It is in the middle part of region and non-intersect；The metal derby does not contact with the metal wire.
It is described to be formed at each layer square as a kind of preferred scheme of the inductor with metal charge structure of the present invention
The projection of metal wire in the horizontal plane in shape metal level is overlapped, is formed between adjacent wires and is less than or equal to more than 0 degree
90 degree of angle.
As a kind of preferred scheme of the inductor with metal charge structure of the present invention, the metal derby is pros
Shape.
It is uniform as a kind of preferred scheme of the inductor with metal charge structure of the present invention, the metal derby
It is distributed in the described first region without Metal Distribution.
As a kind of preferred scheme of the inductor with metal charge structure of the present invention, the metal derby and metal
The material of line is identical with the material of pin baseline in bottom rectangular metal layer.
As a kind of preferred scheme of the inductor with metal charge structure of the present invention, the bar number of the metal wire
For 4~32.
As a kind of preferred scheme of the inductor with metal charge structure of the present invention, the bar number of the metal wire
For 8.
As the present invention the inductor with metal charge structure a kind of preferred scheme, the adjacent wires it
Between angle it is equal.
As a kind of preferred scheme of the inductor with metal charge structure of the present invention, the width of the metal wire
For 3 times of the second minimum design rule, the minimum dimension that second minimum design rule is allowed by technique.
As a kind of preferred scheme of the inductor with metal charge structure of the present invention, the metal charge point
The density of cloth is equal to the first minimum design rule, and the first described minimum design rule is the minimum value of Metal Distribution density.
As described above, the inductor with metal charge structure of the present invention, has the advantages that：Pass through optimization
Shape, size and the interval of the metal derby that sparse region is formed are distributed in inductor metal, not only meets Metal Distribution
Density requirements, and the eddy current effect of metal derby can be reduced, effectively increase the quality factor of inductor；Except top layer with
The metal wire being radially distributed is formed in other outer metal levels, metal wire one end ground connection, the effect of screen layer is served, makes
Parasitic capacitance and the dead resistance increase of inductor are obtained, after parasitic capacitance increase, its corresponding capacitive reactance reduces, simultaneously because posting
Raw resistance is also increase, and the impedance of total substantially increases, and it is bright that this allows for caused electric current in metal charge structure
It is aobvious to reduce, the eddy current effect of metal charge structure is effectively reduced, increases the quality factor of inductor significantly.
Brief description of the drawings
Fig. 1 a are shown as the silicon dioxide material layer of the metallic copper of the prior art with different densities distribution, through chemistry
Effect diagram after mechanical lapping.
Fig. 1 b are shown as of the prior art and automatically form hanging gold in the sparse region of Metal Distribution in the prior art
Belong to the structural representation of packing structure.
Fig. 2 a be shown as the present invention the inductor with metal charge structure in bottom rectangular metal layer the first nothing
The schematic diagram of metal charge structure is formed uniformly in Metal Distribution region.
The inductor with metal charge structure that Fig. 2 b are shown as the present invention is further in top layer rectangular metal layer
It is formed uniformly the schematic diagram of metal derby.
Fig. 2 c be shown as the present invention the inductor with metal charge structure under a variety of design rules inductor product
The schematic diagram that prime factor Q values change with frequency.
Component label instructions
10 silicon dioxide layers
11 metallic coppers
12nd, 22 metal derby
13 signal wires
14th, 24 density check window
20 pins
21 pin baselines
23 metal wires
25 inductor metal coils
26 connecting lines
Embodiment
Illustrate embodiments of the present invention below by way of specific instantiation, those skilled in the art can be by this specification
Disclosed content understands other advantages and effect of the present invention easily.The present invention can also pass through specific realities different in addition
The mode of applying is embodied or practiced, the various details in this specification can also be based on different viewpoints with application, without departing from
Various modifications or alterations are carried out under the spirit of the present invention.
Fig. 2 a to Fig. 2 c are referred to, it is necessary to illustrate, the diagram provided in the present embodiment only illustrates in a schematic way
The basic conception of the present invention, though only showing the component relevant with the present invention in schema rather than according to package count during actual implement
Mesh, shape and size are drawn, and kenel, quantity and the ratio of each component can be a kind of random change during its actual implementation, and its
Assembly layout kenel may also be increasingly complex.
Fig. 2 a to Fig. 2 c are referred to, the present invention provides a kind of inductor with metal charge structure, and it is comprised at least
Bottom rectangular metal layer, the top layer rectangular metal layer on the bottom rectangular metal layer, positioned at the bottom rectangular metal
At least one layer of intermediate rectangular metal level between layer and top layer rectangular metal layer, it is characterised in that the bottom rectangular metal layer
Including at least the pin 20 positioned at its four vertex and the pin baseline 21 of the connection pin 20；The pin baseline 21
Adjacent pin 20 is connected to surround the first region without Metal Distribution, formed with gold in the described first region without Metal Distribution
Belong to packing structure；The metal charge structure comprises at least：
With several contour metal derbies 22 of the pin baseline 21 and some metal lines 23 being radially distributed；
Described one end of metal wire 23 is connected with pin baseline 21 to be grounded, and the other end is gathered described first without metal point
It is in the middle part of the region of cloth and non-intersect；The metal derby 22 does not contact with the metal wire 23.As shown in Figure 2 a, Fig. 2 a are bottom square
The schematic diagram of metal charge structure is formed uniformly in shape metal level in first region without Metal Distribution.
Specifically, being formed after the metal charge structure, the density of Metal Distribution should be greater than or equal to the first minimum
Design rule, the first minimum design rule described here are the minimum value of Metal Distribution density.The density of the Metal Distribution
For（Density checks that area+density of window internal pin baseline checks that area+density of metal derby in window checks metal in window
The area of line）/ density checks area × 100% of window, and the present embodiment Midst density checks that the area of window 24 is 150 μ ms 150
μm, to mark the one piece of predetermined area come in fig. 2 a.First minimum design rule refers to Metal Distribution
Density should be greater than or equal to a certain value, to meet density requirements, be unlikely to because different zones Metal Distribution density difference is very big,
Cause described in above-mentioned Fig. 1 a after cmp, the big region of density be extruded than more serious.Preferably, this reality
Apply in example, the density of the Metal Distribution is equal to the first minimum design rule.
Specifically, the metal derby 22 does not contact with the metal wire 23；The width of the metal wire 23 should be second most
1~3 times of small design rule, it is preferable that in the present embodiment, the width of the metal wire is 3 times of the second minimum design rule,
The minimum dimension that second minimum design rule is allowed by technique, if the size of metal wire is less than a certain value, with regard to nothing
Method is made.The bar number of the metal wire 23 is 4~32, it is preferable that in the present embodiment, the bar number of the metal wire 23 is
8.
The metal wire 23 being radially distributed is formed in the described first region without Metal Distribution, the one end of metal wire 23 leads to
Cross to be connected with pin baseline 21 and be grounded, this just serves the effect of screen layer so that the parasitic capacitance and parasitism of inductor
Resistance increases, and after parasitic capacitance increase, its corresponding capacitive reactance reduces, simultaneously because dead resistance is also increase, whole knot
The impedance of structure substantially increases, and this allows for caused electric current in metal charge structure and is obviously reduced, and effectively reduces metal
The eddy current effect of packing structure, the quality factor of inductor is increased significantly.
Specifically, the metal derby 22 is square-shaped metal block, it is evenly distributed in described first without Metal Distribution
Region；The height of the metal derby 22 is equal to the height of pin baseline 21, and the length of side of the metal derby 22 is set equal to the second minimum
Meter rule.
One metal derby is divided into N2Individual small metal derby, wherein N are natural number, and before and after segmentation, eddy current effect is in metal
Caused energy loss formula is respectively in block：
Pdiss=（dB/dt）2×π×h×R0 4/8ρ （1）
Pdiss=（dB/dt）2×π×h×R0 4/(8ρ×N2) （2）
Formula（1）Represent in a metal derby due to energy loss caused by eddy current effect（Pdiss, power
dissipation）, R0 represents the half of the metal derby length of side；Formula（2）Represent that the metal derby is divided into N2Individual little Jin
Belong to block, this N2Individual small square-shaped metal block is because gross energy caused by eddy current effect is lost, R0Represent two points of the metal derby length of side
One of.Contrast equation（1）And formula（2）As can be seen that the quantity that a metal derby is divided into small metal derby is more, then produce
Energy loss it is smaller.That is, after metal derby is formed, because density checks that the area of window 24 is to preset
, and the area of pin baseline 21 is also definite value, therefore on the premise of the area of metal wire 23 formed is certain, Metal Distribution it is close
The timing of degree one, the density of metal derby 22 is also definite value, then, now density checks that the quantity of metal derby 22 in window 24 is more,
Then caused energy loss is smaller.Therefore in the present embodiment, the length of side of metal derby 22 is equal to the second minimum design rule.
Interval between metal derby 22 should arbitrarily take in the 3rd minimum design rule to the region between spacer maximum value
Value.Because density checks that the area of window 24 is set in advance, and the area of pin baseline 21 is also definite value, therefore when formation
On the premise of the area of metal wire 23 is certain, the density of Metal Distribution is smaller, and the area of metal derby 22 is also smaller, i.e., metal derby 22 it
Between interval it is bigger, therefore, the maximum that the metal derby 22 is spaced is：When the density of Metal Distribution is set equal to the first minimum
When counting regular, possessed interval between metal derby 22；The metal derby 22 that 3rd minimum design rule is allowed by technique
Between minimum interval.
Specifically, it has been investigated that, when the density of Metal Distribution is more than or equal to the first minimum design rule, Er Qiejin
Belong to the length of side of block 22 equal in the case of the second minimum design rule, the interval between metal derby is bigger, then metal derby 22 produces
Eddy current effect can be smaller, more can effectively raise the quality factor of inductor.Therefore, when the length of side of metal derby 22 is equal to second
After minimum design rule, to increase the interval between metal derby from the 3rd minimum design rule as much as possible, as long as final cause
Metal Distribution density is not less than the first minimum design rule.
Specifically, the material of the material of the metal derby 22 and metal wire 23 and pin baseline 21 in bottom rectangular metal layer
It is identical.
Fig. 2 b be in top layer rectangular metal layer inductor metal coil inside region, inductor metal coil and pin and
The signal of metal derby is further formed uniformly in region between pin baseline, and the region connected between pin without baseline
Figure, as shown in Figure 2 b, the top layer rectangular metal layer comprises at least：Inductor gold in the middle part of the top layer rectangular metal layer
Belong to coil 25, positioned at described four vertex of top layer rectangular metal layer and the pin 20 of two middle side parts, connect the inductor gold
Belong to the connecting line 26 of the pin 20 of coil 25 and two middle side part, and the pin base of connection four vertex pins 20
Line 21；Area between the inside region of inductor metal coil 25, inductor metal coil 25 and pin 20 and pin baseline 21
Formed and several contour metals of the inductor metal coil 25 in region without baseline connection between domain, and pin 20
Block 22.Because inductor metal coil 25 is located at top layer rectangular metal layer, therefore the metal charge structure formed in top layer and bottom
It is otherwise varied in layer rectangular metal layer, metal derby 22 is only formed, does not form metal wire 23.
Specifically, the metal derby 22 is square-shaped metal block, it is evenly distributed in the inner side of inductor metal coil 25
Region between region, inductor metal coil 25 and pin 20 and pin baseline 21, and connected between pin 20 without baseline
Region in.Formed in the top layer rectangular metal layer after metal derby 22, the density of Metal Distribution should be greater than or equal to the layer
The first minimum design rule, it is preferable that the density of Metal Distribution be equal to this layer the first minimum design rule.
Specifically, the length of side of metal derby 22 is equal to second minimum design rule of this layer in the top layer rectangular metal layer；
Specifically, the interval in the top layer rectangular metal layer between metal derby 22, is advised in the 3rd minimal design of this layer
It is to any value in the section of spacer maximum value, this layer of spacer maximum value then：When the density of Metal Distribution is equal to the layer
The first minimum design rule when, possessed interval between metal derby.Obviously, it is preferable that this in the present embodiment layer metal point
The density of cloth is equal to first minimum design rule of this layer, and the length of side of metal derby 22 is equal to second minimum design rule of this layer,
The now spacer maximum value at intervals of this layer between metal derby 22.
In addition, the intermediate rectangular metal level comprises at least the pin and the connection pin positioned at its four vertex
Pin baseline；The pin baseline connects adjacent pin to surround the second region without Metal Distribution, and described second without gold
Belong in the region of distribution formed with metal charge structure；The metal charge structure comprises at least：
Several contour metal derbies and some metal lines being radially distributed with the pin baseline；
Described metal wire one end is connected with pin baseline to be grounded, and the other end is gathered described second without Metal Distribution
It is in the middle part of region and non-intersect；The metal derby does not contact with the metal wire.
Specifically, each layer metal level of others is formed after the metal charge structure, the density of Metal Distribution
More than or equal to first minimum design rule of this layer.
Specifically, the metal derby does not contact with the metal wire；The width of the metal wire should be as the second of this layer
1~3 times of minimum design rule, it is preferable that in the present embodiment, the width of the metal wire is the 3 of the second minimum design rule
Times；The bar number of the metal wire is 4~32, it is preferable that in the present embodiment, the bar number of the metal wire 23 is 8.
Specifically, the projection of the metal wire being formed in each layer rectangular metal layer in the horizontal plane is overlapped, phase
Formed between adjacent metal wire and be more than 0 degree of angle for being less than or equal to 90 degree.
Specifically, the metal derby 22 is square-shaped metal block, it is evenly distributed in described second without Metal Distribution
Region.The length of side of metal derby is equal to second minimum design rule of this layer in other described each layer metal levels；It is described other each
Interval in layer metal level between metal derby, arbitrarily taken in the section of the 3rd minimum design rule to spacer maximum value of this layer
Value, the spacer maximum value of this described layer are：When the density of Metal Distribution is equal to first minimum design rule of this layer, metal derby
Between possessed interval.Obviously, it is preferable that the first minimum that the density of this in the present embodiment layer Metal Distribution is equal to this layer is set
Meter rule, the length of side of metal derby are equal to second minimum design rule of this layer, now between metal derby at intervals of between this layer
Every maximum.
Specifically, the material of the metal derby and metal wire is identical with the material of pin baseline in this layer of metal level.
Fig. 2 c are the schematic diagram that inductor Q value changes with frequency under a variety of design rules, as shown in Figure 2 c,
Curve representated by square be when inductor metal is distributed sparse region and automatically forms metal derby, the quality of inductor because
Sub- Q values with frequency change；Curve representated by triangle is to be distributed sparse region in inductor metal to form the present invention's
During metal charge structure, the Q value of inductor with frequency change.From Fig. 2 c, when frequency is 15GHz,
The Q value of two kinds of designs reaches maximum, after automatically forming metal derby in the sparse region of inductor metal distribution,
The maximum of its quality factor q is 20；And it is distributed sparse region in inductor metal and forms metal charge knot of the invention
After structure, the maximum of its quality factor q then reaches 29.Therefore deduce that, add after the metal charge structure, can be with
Effectively improve the quality factor of inductor.
In summary, the present invention provides a kind of inductor with metal charge structure, by optimization in inductor gold
Category is distributed shape, size and the interval for the metal derby that sparse region is formed, and not only meets the density requirements of Metal Distribution, and
And the eddy current effect of metal derby can be reduced, effectively increase the quality factor of inductor；In other gold in addition to top layer
The metal wire being radially distributed is formed in category layer, metal wire one end ground connection, serves the effect of screen layer so that inductor
Parasitic capacitance and dead resistance increase, after parasitic capacitance increase, its corresponding capacitive reactance reduces, simultaneously because dead resistance is also
Increase, the impedance of total substantially increases, and this allows for caused electric current in metal charge structure and is obviously reduced, effectively
The eddy current effect for reducing metal charge structure, increase the quality factor of inductor significantly.So effective gram of present invention
Take various shortcoming of the prior art and have high industrial utilization.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe
Know the personage of this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as
Into all equivalent modifications or change, should by the present invention claim be covered.
Claims (12)
1. a kind of inductor with metal charge structure, it is characterised in that comprise at least：Bottom rectangular metal layer, it is located at
Top layer rectangular metal layer on the bottom rectangular metal layer, positioned at the bottom rectangular metal layer and top layer rectangular metal layer it
Between at least one layer of intermediate rectangular metal level, it is characterised in that the bottom rectangular metal layer comprise at least positioned at its four top
The pin baseline of pin and the connection pin at angle；The pin baseline connects adjacent pin to surround first without gold
Belong to the region of distribution, formed with metal charge structure in the described first region without Metal Distribution；The metal charge knot
Structure comprises at least：
Several contour metal derbies and some metal lines being radially distributed with the pin baseline；
Described metal wire one end is connected with pin baseline to be grounded, and the other end is gathered in the described first region without Metal Distribution
Middle part and non-intersect；The metal derby does not contact with the metal wire.
2. the inductor according to claim 1 with metal charge structure, it is characterised in that the top layer rectangle gold
Category layer comprises at least：Inductor metal coil in the middle part of the top layer rectangular metal layer, positioned at the top layer rectangular metal
The pin of four vertex of layer and two middle side parts, connects the connection of the pin of the inductor metal coil and two middle side part
Line, and the pin baseline of connection four vertex pins；In inductor metal coil inside region, inductor metal line
Formed in circle and the region between pin and pin baseline, and the region connected between pin without baseline and inductor gold
Belong to several contour metal derbies of coil.
3. the inductor according to claim 1 with metal charge structure, it is characterised in that the intermediate rectangular gold
Belong to the pin baseline that layer comprises at least pin and the connection pin positioned at its four vertex；The pin baseline is by phase
The connection of adjacent pin is to surround the second region without Metal Distribution, formed with metal filled in the described second region without Metal Distribution
Thing structure；The metal charge structure comprises at least：
Several contour metal derbies and some metal lines being radially distributed with the pin baseline；
Described metal wire one end is connected with pin baseline to be grounded, and the other end is gathered in the described second region without Metal Distribution
Middle part and non-intersect；The metal derby does not contact with the metal wire.
4. the inductor with metal charge structure according to claim 1 or 3, it is characterised in that：It is formed at each layer
The projection of the metal wire in the horizontal plane in rectangular metal layer is overlapped, is formed between adjacent wires more than 0 degree small
In the angle equal to 90 degree.
5. the inductor according to claim 1 with metal charge structure, it is characterised in that：The metal derby is just
It is square.
6. the inductor according to claim 1 with metal charge structure, it is characterised in that：The metal derby is uniform
Be distributed in the described first region without Metal Distribution.
7. the inductor according to claim 1 with metal charge structure, it is characterised in that：The metal derby and gold
The material for belonging to line is identical with the material of pin baseline in bottom rectangular metal layer.
8. the inductor according to claim 1 with metal charge structure, it is characterised in that：The bar of the metal wire
Number is 4~32.
9. the inductor according to claim 8 with metal charge structure, it is characterised in that：The bar of the metal wire
Number is 8.
10. the inductor with metal charge structure described in claim 8 or 9, it is characterised in that：The adjacent metal wire
Between angle it is equal.
11. the inductor according to claim 1 with metal charge structure, it is characterised in that：The metal wire
Width is 3 times of the second minimum design rule, the minimum dimension that second minimum design rule is allowed by technique.
12. the inductor according to claim 1 with metal charge structure, it is characterised in that：It is described metal filled
The density of thing distribution is equal to the first minimum design rule, and the first described minimum design rule is the minimum of Metal Distribution density
Value.
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| CN102738127A (en) * | 2012-06-29 | 2012-10-17 | 杭州电子科技大学 | Novel fractal PGS (Program Generation System) structure |
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| CN102082143A (en) * | 2009-12-01 | 2011-06-01 | 中芯国际集成电路制造(上海)有限公司 | Figure filler structure inserted about inductor |
| CN102299134A (en) * | 2011-07-22 | 2011-12-28 | 华东师范大学 | On-chip integrated inductor internally inserted with dummy metal arrays |
| CN102412230A (en) * | 2011-11-28 | 2012-04-11 | 上海华虹Nec电子有限公司 | Inductance ground shielding structure for radio frequency process |
| CN102738127A (en) * | 2012-06-29 | 2012-10-17 | 杭州电子科技大学 | Novel fractal PGS (Program Generation System) structure |
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