CN104934385B - Thermally conductive and heat spreading function mould group is had both for integrated circuit or photoelectric cell - Google Patents
Thermally conductive and heat spreading function mould group is had both for integrated circuit or photoelectric cell Download PDFInfo
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- CN104934385B CN104934385B CN201410105910.6A CN201410105910A CN104934385B CN 104934385 B CN104934385 B CN 104934385B CN 201410105910 A CN201410105910 A CN 201410105910A CN 104934385 B CN104934385 B CN 104934385B
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- heat
- transfer device
- radiator
- thermally conductive
- mould group
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Abstract
The present invention propose it is a kind of have both thermally conductive and heat spreading function mould group for integrated circuit or photoelectric cell, it includes have a module, a heat-transfer device and a radiator.The wherein wears groove that radiator has a piercing hole and is connected to the piercing hole.In in actual use, heat-transfer device is placed in advance in the piercing hole of radiator, is then arranged in the wears groove of radiator by module again, so as to being tightly engaged into heat-transfer device in radiator and module, reaches optimal radiating efficiency.In addition, one end of module, heat-transfer device and radiator will form one coplanar, this is coplanar to be arranged on for a heater element, so as to reaching the effect of heat dissipation.
Description
Technical field
The present invention relates to a kind of thermally conductive and heat spreading function mould group that has both for integrated circuit or photoelectric cell, and it is special
Not, it is related to a kind of knockdown having both thermally conductive and heat dissipation mould group.
Background technique
Due under the promotion of technology and new material, semiconducter IC element produced, photoelectric cell etc. at present, in addition to function
Can be stronger and stronger outer, volume also moves towards lightening, also therefore pursue lightness and assign it is high performance simultaneously, partly lead
The heat that body IC element, photoelectric cell etc. are supervened is similarly surprising, since semiconducter IC element, photoelectric cell etc. are produced
Raw heat will have a direct impact on the operation performance and service life of semiconducter IC element, photoelectric cell etc., so that radiating management
Important key as the development of current electronic industry.
And the radiator with heat pipe is that a kind of common antipyretic and heat dissipation, the structure mainly include at present
Heat pipe and radiator, it is antipyretic and heat dissipation principle be by one end of heat pipe directly or indirectly with semiconducter IC element or light
Electric device contact, using working fluid and capillary structure set by heat pipe inside, to absorb semiconducter IC element or photoelectricity
Heat spreading function is carried out on heat caused by element, then quick conduction to radiator, becomes and is quite relied on for counsel on radiating management now
A kind of radiating mode.
However, inevitably gap can all occur in an assembling process in heat pipe in the prior art and radiator, make heat pipe
Thermal resistance is generated between radiator, thus heat transfer and heat spreading function is caused to be greatly affected, therefore in order to solve the problem above-mentioned, it is existing
There is technology just medium such as heat-conducting glue of the coating with conductive force on the outer surface of heat pipe, to fill up group between heat pipe and radiator
Generated gap when dress.
Numerous about case before the related patents of heat pipe now, in this measure, wherein an example please refers to Chinese platform to explain
The radiator of gulf patent announcement I 315231 method and its structure (day for announcing 2009/10/01) in conjunction with heat pipe are
A kind of radiator to promote heat transfer efficiency method and its structure in conjunction with heat pipe, which mainly includes a radiator and one
Heat pipe, wherein the central location of the radiator be equipped with one accommodating wears groove, to be installed with the heat pipe, in the wears groove periphery to
It is outer extend it is multiple it is corresponding wear seam, and wear one perforation of other end connection of seam in this, then this is placed in jig and wears seam inside, by
This is worn seam to strut, is strutted the periphery of the wears groove with related, so that the inner edge diameter of the wears groove is greater than the heat pipe, wears the heat pipe
After the wears groove, finally remove the jig, the inner wall of wears groove made to fit closely the outer peripheral surface in heat pipe, with reach heat pipe with
Preferable conduction efficiency between radiator.
However, the prior art is strutted the periphery of the wears groove using jig, the inner edge diameter of the wears groove is made to be greater than the heat
Pipe still has radiator elastic properties of materials tired or the doubt of rupture in such a way that the sharp heat pipe is arranged in the wears groove, and radiator
Material be I'm afraid can not the strength that is applied of the long-term load jig.In addition, this wears seam position, and waste can after jig removal
Thermally conductive radiator space keeps its radiating efficiency impacted and declines.
Summary of the invention
To solve the problems of prior art, the present invention provides a kind of having both for integrated circuit or photoelectric cell
Thermally conductive and heat spreading function mould group (Heat conducting/dissipating module for integrated
Circuit or optoelectronics devices), it includes have a module, a heat-transfer device (Heat conducting
) and a radiator (Heat Dissipation Device) device.Wherein, radiator have a piercing hole and
The wears groove being connected to the piercing hole.In in actual use, heat-transfer device is placed in advance in the piercing hole of radiator, then
It being arranged in the wears groove of radiator by module again, so as to being tightly engaged into heat-transfer device in radiator and module, making it
Reach optimal radiating efficiency.
In addition, heat-transfer device has a flat end, there is radiator one first smooth end and module to have one second
Smooth end.After the completion of assembling steps above-mentioned, the flat end of the heat-transfer device, the first smooth end of radiator and module
The second smooth end will be formed one coplanar, this is coplanar to be arranged on for a heater element, to reach the effect of heat dissipation.
Wherein, which can be a light-emitting diode, a solar cell device, semiconductor element and other logical
The electronic component of heat can be generated after electricity.
In addition to this, heat-transfer device can be a heat pipe (Heat pipe) or a thermal conductivity column (Heat column), or
One temperature-uniforming plate (Vapor Chamber) element with vertical thickness, and module and radiator are by same material institute
It is fabricated.
Compared to the prior art, it is provided by the present invention it is a kind of have both it is thermally conductive and heat dissipation mould group, utilize close-fitting engaging
Mode enables heat-transfer device to be fixed in radiator by module, and also has and enable heat-transfer device and radiator
The function being tightly engaged into, to increase the efficiency of its heat dissipation.In this way, just there is no concern that the material of radiator can be flexible tired
Weary problem.
Detailed description of the invention
Fig. 1 be painted it is of the invention it is a kind of for integrated circuit or photoelectric cell have both thermally conductive and heat spreading function mould group in
The decomposition diagram of one preferred embodiment.
Fig. 2 be painted it is of the invention it is a kind of for integrated circuit or photoelectric cell have both thermally conductive and heat spreading function mould group in
Schematic diagram is completed in the combination of one preferred embodiment.
Fig. 3 be painted it is of the invention it is a kind of for integrated circuit or photoelectric cell have both thermally conductive and heat spreading function mould group in
The decomposition diagram of another preferred embodiment.
Fig. 4 be painted it is of the invention it is a kind of for integrated circuit or photoelectric cell have both thermally conductive and heat spreading function mould group in
Schematic diagram is completed in the combination of another preferred embodiment.
Fig. 5 be painted it is of the invention it is a kind of for integrated circuit or photoelectric cell have both thermally conductive and heat spreading function mould group in
One heater element of another preferred embodiment is completed schematic diagram.
Fig. 6 be painted it is of the invention it is a kind of for integrated circuit or photoelectric cell have both thermally conductive and heat spreading function mould group in
Another heater element of another preferred embodiment is completed schematic diagram.
Fig. 7 be painted it is of the invention it is a kind of for integrated circuit or photoelectric cell have both thermally conductive and heat spreading function mould group in
Another heater element of another preferred embodiment is completed schematic diagram.
Fig. 8 be painted it is of the invention it is a kind of for integrated circuit or photoelectric cell have both thermally conductive and heat spreading function mould group in
Another heater element of another preferred embodiment is completed schematic diagram.
Wherein, the reference numerals are as follows:
1: having both thermally conductive and heat dissipation mould group 10: module
30: heat-transfer device 50: radiator
70: the smooth end of heater element 110: the second
310: flat end 311: flat end
312: flat end 313: flat end
510: piercing hole 530: wears groove
550: the first smooth ends
Specific embodiment
It needs first to illustrate herein, although having used in present specification full text (including claim) certain specific
Vocabulary censures specific element, and those of ordinary skill is when, it is recognized that certain manufacturers can in the application technical field
The same element can be called with different nouns.Therefore, when understanding present specification full text (including claim)
Should not be in such a way that the difference of title be as element is distinguished, and it should be with the difference of element functionally as the mark of differentiation
It is quasi-.In addition, in present specification, " comprising " as used herein and " having " two word are all open term entirely, therefore are answered
This is construed as " including but not limited to ".
Below for of the invention a kind of thermally conductive and heat spreading function mould is had both for integrated circuit or photoelectric cell
Group carries out the explanation of a thin portion.Referring to Fig. 1, Fig. 1 is painted a kind of having both for integrated circuit or photoelectric cell of the invention
Thermally conductive and heat spreading function mould group is in the decomposition diagram of a preferred embodiment.As shown in Figure 1, preferably in of the invention one
In specific embodiment, it is provided by the present invention it is a kind of have both it is thermally conductive and heat dissipation mould group 1 include a module 10, a heat-transfer device
30 and a radiator 50.Wherein, radiator 50 has a piercing hole 510 and what is be connected to the piercing hole 510 one wear
Slot 530；In addition to this, heat-transfer device 30 separately has a flat end 310, and radiator 50 separately has one first smooth end 550, with
And module 10 separately has one second smooth end 110.
Of the invention a kind of lead for integrated circuit or having both for photoelectric cell is painted referring again to Fig. 1 and Fig. 2, Fig. 2
Heat and the mould group of heat spreading function are in the combination completion schematic diagram of a preferred embodiment.In in actual use, heat-transfer device 30
It is placed in the piercing hole 510 of radiator 50 in advance, then squeezes into and be arranged in by force in a manner of close-fitting by module 10 again
In the wears groove 530 of radiator 50, so as to being tightly engaged into heat-transfer device 30 between radiator 50 and module 10, while
It allows module 10 to be tightly engaged between heat-transfer device 30 and radiator 50, reaches optimal heat transfer and radiating efficiency.
And after the completion of above-mentioned assembling steps, the flat end 310 of heat-transfer device 30, the first smooth end 550 of radiator 50 and
The smooth end 110 of the second of module 10 will be formed it is one coplanar, i.e., as shown in Figure 2.And this is coplanar for heater element setting
Thereon, to reach the effect that it accelerates heat dissipation.Wherein, which can be a light-emitting diode, a solar energy
The electronic component of heat can be generated after cell device, semiconductor element and other energizations.And heat-transfer device 30 can be a heat
Conduit (Heat pipe) or a thermal conductivity column (Heat column) or a temperature-uniforming plate (Vapor Chamber) with vertical thickness
Element.In addition, module 10 can be as, by made of manufactured by same material, being also possible to by it with the radiator 50
Made of the higher material of his thermal coefficient is manufactured.
Make referring to Fig. 3, Fig. 3 is painted a kind of thermally conductive and heat dissipation that has both for integrated circuit or photoelectric cell of the invention
Mould group is in the decomposition diagram of another preferred embodiment.As shown in figure 3, in another preferable specific implementation of the invention
In example, a kind of thermally conductive and heat spreading function the mould group 1 that has both for integrated circuit or photoelectric cell provided by the present invention includes
There are a module 10, two heat-transfer devices 30 and a radiator 50.Wherein, radiator 50 have two piercing holes 510 and with
One wears groove 530 of the piercing hole 510 connection.In addition to this, heat-transfer device 30 separately has a flat end 310, and radiator 50 is another
Separately there is one second smooth end 110 with one first smooth end 550 and module 10.It is worth noting that, this two heat-transfer device
30 be to exist to be respectively arranged at the both sides position with module 10 for symmetrical centre, and this two piercing hole 510 is also to distinguish
It is set to the both sides position with wears groove 530 for symmetrical centre and exists.
Of the invention a kind of lead for integrated circuit or having both for photoelectric cell is painted referring again to Fig. 3 and Fig. 4, Fig. 4
Heat and the mould group of heat spreading function are in the combination completion schematic diagram of another preferred embodiment.In in use, two heat-transfer devices 30
It is placed in two piercing holes 510 of radiator 50 in advance, then squeezes into and wear by force in a manner of close-fitting by module 10 again
In the wears groove 530 of radiator 50, so as to being tightly engaged into two heat-transfer devices 30 between radiator 50 and module 10, together
When also allow module 10 to be tightly engaged between two heat-transfer devices 30 and radiator 50, reach optimal radiating efficiency.And
After the completion of above-mentioned assembling steps, the flat end 310 of two heat-transfer devices 30, the first smooth end 550 of radiator 50 and
The smooth end 110 of the second of module 10 will be formed it is one coplanar, i.e., as shown in Figure 4.And this is coplanar for heater element setting
Thereon, to reach the effect that it accelerates heat dissipation.Wherein, which can be a light-emitting diode, a solar energy
The electronic component of heat can be generated after cell device, semiconductor element and other energizations；Two heat-transfer device 30 can be one
Heat pipe (Heat pipe) or a thermal conductivity column (Heat column) or a temperature-uniforming plate (Vapor with vertical thickness
Chamber) element.In addition, module 10 can be as with the radiator 50 by made of manufactured by same material, can also
Be as manufactured by the higher material of other thermal coefficients made of.
It is worth noting that, provided by the present invention a kind of thermally conductive and heat dissipation is had both for integrated circuit or photoelectric cell
The shape of module 10, heat-transfer device 30 and radiator 50 that the mould group 1 of effect is included is not limited to such as Fig. 1 or Fig. 2 institute
Show, the shape that can play identical effect with it such as is all contained among scope of the presently claimed invention.
Make referring to Fig. 5, Fig. 5 is painted a kind of thermally conductive and heat dissipation that has both for integrated circuit or photoelectric cell of the invention
Mould group is completed schematic diagram in the heater element of another preferred embodiment.The present invention completes above-mentioned assembling steps
Afterwards, heater element 70 be able to be installed on by the second smooth end 110, flat end 310 be formed by with the first smooth end 550 it is coplanar
On, accelerate thermally conductive and heat dissipation effect to reach it, i.e., as shown in Figure 5.
In addition, heat-transfer device 30 of the invention can also be a L-type or the heat pipe (Heatpipe) of other flexure types.Please
Join Fig. 6, Fig. 7 and Fig. 8, wherein Fig. 6, Fig. 7 and Fig. 8 are painted a kind of having both for integrated circuit or photoelectric cell of the invention
Thermally conductive and heat spreading function mould group is completed schematic diagram in another heater element of another preferred embodiment.The present invention is complete
After above-mentioned assembling steps, heater element 70 is able to be installed on the flat end 311,312 or 313 of heat-transfer device 30,
Accelerate thermally conductive and heat dissipation effect to reach it, i.e., as shown in Fig. 6, Fig. 7 and Fig. 8.Wherein, heater element 70 can be one and shine
The electronic component of heat can be generated after diode element, a solar cell device, semiconductor element and other energizations.
Compared to the prior art, provided by the present invention a kind of thermally conductive and scattered for having both for integrated circuit or photoelectric cell
The mould group of heat effect enables heat-transfer device to be fixed in radiator by module in the way of close-fitting pressure engaging, and
And also have the function of enabling heat-transfer device to be tightly engaged into radiator, to increase the efficiency of its heat dissipation.In this way, just not
It must worry the problem of existing radiator material has elastic fatigue.In addition to this, provided by the present invention a kind of for integrating
Circuit or photoelectric cell have both thermally conductive and heat spreading function mould group after being completed, it will generate one by heat-transfer device, dissipate
Thermal is formed by coplanar with module, or directly in generating a flat end on heat-transfer device, pacifies for the element for needing to radiate
Loaded on thereon, to reach the effect that it accelerates heat dissipation.
By the above detailed description of preferred embodiments, it would be desirable to the feature and spirit of this creation are more clearly described, and
Not scope of the invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, the purpose is to wish
Various changes can be covered and have being arranged in the scope of the scope of the claims to be applied of the invention of equality.Therefore, originally
The scope for inventing applied scope of the claims should illustrate the most wide explanation of work according to above-mentioned, to cause it to cover institute
Possible change and the arrangement of tool equality.
Claims (10)
1. a kind of have both thermally conductive and heat spreading function mould group, characterized by comprising: one for integrated circuit or photoelectric cell
Module；One heat-transfer device；And a radiator, with a piercing hole and the wears groove being connected to the piercing hole；Wherein this is led
Thermal is placed in advance in the piercing hole, is then arranged in the wears groove by the module again, and heat-transfer device is located at module
One or both sides, so as to being tightly engaged into the heat-transfer device in the radiator and the module；Heat-transfer device be " L " type or its
The heat pipe of his flexure type, heater element are installed on the flat end of heat-transfer device, and heat-transfer device protrudes from radiator
Top, and to protrude from the part above radiator L-shaped for the heat-transfer device.
2. having both thermally conductive and heat dissipation mould group as described in claim 1, wherein the heat-transfer device has a flat end.
3. having both thermally conductive and heat dissipation mould group as claimed in claim 2, wherein the radiator also has one first smooth end,
The module has one second smooth end, and when the heat-transfer device is tightly engaged into after the radiator by the module, this is flat
Smooth end, the first smooth end and the second smooth end are coplanar.
4. thermally conductive and heat dissipation mould group is had both as claimed in claim 2, wherein a heater element is set to the heat-transfer device
On the flat end.
5. having both thermally conductive and heat dissipation mould group as claimed in claim 4, heat can be generated after wherein the heater element is switched on
Electronic component.
6. have both as claimed in claim 5 it is thermally conductive and heat dissipation mould group, wherein the heater element be a light-emitting diode,
One solar cell device or an integrated circuit component.
7. having both thermally conductive and heat dissipation mould group as described in claim 1, wherein the heat-transfer device is a heat pipe, a thermal conductivity column
An or samming panel element.
8. having both thermally conductive and heat dissipation mould group as described in claim 1, wherein the heat-transfer device is a metal or non-metallic material
Expect column.
9. having both thermally conductive and heat dissipation mould group as claimed in claim 8, wherein the heat-transfer device is a copper pipe or a ceramics pole.
10. having both thermally conductive and heat dissipation mould group as described in claim 1, wherein the module and the radiator are by same
It is formed manufactured by kind material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410105910.6A CN104934385B (en) | 2014-03-20 | 2014-03-20 | Thermally conductive and heat spreading function mould group is had both for integrated circuit or photoelectric cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410105910.6A CN104934385B (en) | 2014-03-20 | 2014-03-20 | Thermally conductive and heat spreading function mould group is had both for integrated circuit or photoelectric cell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104934385A CN104934385A (en) | 2015-09-23 |
| CN104934385B true CN104934385B (en) | 2018-12-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410105910.6A Expired - Fee Related CN104934385B (en) | 2014-03-20 | 2014-03-20 | Thermally conductive and heat spreading function mould group is had both for integrated circuit or photoelectric cell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104934385B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2864561Y (en) * | 2005-11-17 | 2007-01-31 | 元瑞科技股份有限公司 | Radiation sheet and heat transfer pipe combined structure improvement |
| CN101076239A (en) * | 2006-05-19 | 2007-11-21 | 协禧电机股份有限公司 | Method for combining radiating fin with heat-transfer pipe |
| CN103206633A (en) * | 2013-04-12 | 2013-07-17 | 特能传热科技（中山）有限公司 | High-power lamp |
-
2014
- 2014-03-20 CN CN201410105910.6A patent/CN104934385B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2864561Y (en) * | 2005-11-17 | 2007-01-31 | 元瑞科技股份有限公司 | Radiation sheet and heat transfer pipe combined structure improvement |
| CN101076239A (en) * | 2006-05-19 | 2007-11-21 | 协禧电机股份有限公司 | Method for combining radiating fin with heat-transfer pipe |
| CN103206633A (en) * | 2013-04-12 | 2013-07-17 | 特能传热科技（中山）有限公司 | High-power lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104934385A (en) | 2015-09-23 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20160601 Address after: 201306 Shanghai Xinyuan Lingang Industrial District Road No. 555 financial center room 211 Applicant after: EnRay Tek Optoelectronics (Shanghai) Co., Ltd. Address before: Brunei Darussalam Bandar Seri Begawan Applicant before: New Light Source Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181211 Termination date: 20210320 |