CN104934337A - Bonding wire forming method and bonding wire equipment - Google Patents
Bonding wire forming method and bonding wire equipment Download PDFInfo
- Publication number
- CN104934337A CN104934337A CN201410110894.XA CN201410110894A CN104934337A CN 104934337 A CN104934337 A CN 104934337A CN 201410110894 A CN201410110894 A CN 201410110894A CN 104934337 A CN104934337 A CN 104934337A
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- weldment
- bonding wire
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- wire
- forming method
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 230000009514 concussion Effects 0.000 claims description 24
- 239000006096 absorbing agent Substances 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract 8
- 238000012545 processing Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
- H01L2224/78631—Means for wire tension adjustments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
A method for forming bonding wires and a bonding wire device thereof are provided, the method for forming the bonding wires comprises the following steps: providing a welding piece which is provided with a first side and a second side which are opposite to each other, and a through hole which is communicated with the first side and the second side, wherein a welding wire which does not protrude out of the first side penetrates through the through hole; and moving the welding piece towards the direction of the second side and vibrating the welding piece to enable the welding wire to extend out of the first side, so that the welding wire extends out of the first side of the welding piece in a mode of vibrating the welding piece to achieve the purpose of automatically repairing the short tail.
Description
Technical field
The present invention relates to a kind of routing processing procedure, espespecially a kind of weldering line forming method and bonding equipment thereof.
Background technology
In existing semiconductor packaging, be, by routing technology (namely through gold thread or copper cash etc.), bonding wire is electrically connected to bearing part as lead frame or base plate for packaging by chip, this bearing part is electrically connected to the external device (ED) as circuit board by the conductive component of such as soldered ball again.
Existing routing technology (wire bonding) can by ultra sonic oscillation state, initial spheroid is formed on semiconductor device or bearing part by steel mouth, to carry out pommel pressurization (ball bond) operation, make weld pad surface mutually affixed with pommel, again by this spheroid line stretcher body to second half conductor means or bearing part weld pad on the surface, to carry out contact pressurization (bond) operation, finally with steel mouth, unnecessary bonding wire is cut off again.
As shown in Figure 1A, it is the cross-sectional schematic that existing routing device 1 carries out routing processing procedure, and this routing device 1 comprises weldment 10 just like steel mouth and a wire clamp 11.In time carrying out the pommel pressurization operation of routing processing procedure, a bonding wire 6 is through the through wires hole 100 of this weldment 10, and this wire clamp 11 is for this bonding wire 6 clamping, recycles this weldment 10 and makes this bonding wire 6 form a pommel 60 on the weld pad 80 of a chip 8.This pommel 60 to be pressurised is fixed in after on this weld pad 80 to make this pommel 60, redraws the weld pad 90 of this bonding wire 6 to one bearing part 9 on the surface.
Then, contact pressurization operation is carried out.As shown in Figure 1B, this wire clamp 11 is opened, this bonding wire 6 is electrically connected with this weld pad 90.Then, as shown in Fig. 1 C to Fig. 1 D, close this wire clamp 11 with this bonding wire 6 clamping, move up this weldment 10(direction of arrow A as shown in Figure 1B again), to break this bonding wire 6, and make the bonding wire 6 ' remained on this routing device 1 produce line tail 6a, and this line tail 6a stretches out the lower end 10a of this weldment 10, to prepare the pommel pressurization operation of the routing processing procedure carried out next time.
So, after carrying out existing contact pressurization operation, this bonding wire 6 ' does not often produce this line tail 6a, and as shown in Fig. 1 D ', i.e. short-tail (short tail) phenomenon, causes the spheroid pressurization operation cannot carried out next time.
In addition, at present when there is short-tail phenomenon, need repair to manually, particularly, first this routing device 1 be switched to manual mode, again with artificial threading again, then test the state of routing running, manually remove unnecessary line tail afterwards, then this routing device 1 is switched to automatic mode, finally confirm routing quality, so very consuming time and cost of manufacture can be increased.
Therefore, how to overcome variety of problems of the prior art, become the problem of desiring most ardently solution at present in fact.
Summary of the invention
In view of the disadvantages of above-mentioned prior art, object of the present invention, for providing a kind of weldering line forming method and bonding equipment thereof, can not only save time, and significantly can reduce cost of manufacture.
Bonding equipment of the present invention comprises: weldment, and it has the first relative side and the second side and the through hole being communicated with this first side and the second side, and this through hole is for receiving bonding wire; And concussion system, for driving this weldment, make this weldment produce concussion.
The present invention also provides a kind of weldering line forming method, and comprising: provide a weldment, it has the first relative side and the second side and the through hole being communicated with this first side and the second side, and is equipped with the bonding wire not protruding this first side in this through hole; And move this weldment towards the direction of this second side, and shake this weldment, make this bonding wire stretch out this first side.
In aforesaid weldering line forming method, drive this weldment by a concussion system, make this weldment produce concussion.
In aforesaid weldering line forming method and bonding equipment thereof, this through hole is bellmouth.
In aforesaid weldering line forming method and bonding equipment thereof, this concussion system is ultrasonic vibrating system.
In aforesaid weldering line forming method and bonding equipment thereof, also comprise wire fixing device, such as vacuum absorber, magnetic absorption device or clamping piece, with fixing or unclamp this bonding wire.In addition, when this weldment mobile, this wire fixing device is moved in the direction towards this first side.
As from the foregoing, weldering line forming method of the present invention and bonding equipment thereof, by the mode of this weldment of concussion, this bonding wire is made to stretch out the first side of this weldment, to reach the object that short-tail is repaired automatically, so compared to existing manual repair mode, weldering line forming method of the present invention can not only save time, and significantly can reduce cost of manufacture.
Accompanying drawing explanation
Figure 1A is the cross-sectional schematic of the pommel pressurization operation of existing routing processing procedure;
Figure 1B to Fig. 1 D is the cross-sectional schematic of the contact pressurization operation of existing routing operation; Wherein, Fig. 1 D ' is the actual conditions of Fig. 1 D;
Fig. 2 A to Fig. 2 C is the cross-sectional schematic of the first embodiment of weldering line forming method of the present invention; And
Fig. 3 A to Fig. 3 C is the cross-sectional schematic of the first embodiment of weldering line forming method of the present invention.
Symbol description
1 routing device
10,20 weldments
10a lower end
100 through wires holes
11 wire clamps
2,3 bonding equipments
20a first side
20b second side
200 through holes
21,31 wire fixing devices
22 concussion systems
4,5,6,6 ' bonding wire
4a first end
4b second end
6a line tail
60 pommels
7,8 chips
70,80,90 weld pads
9 bearing parts
A, B, the C direction of arrow.
Embodiment
By particular specific embodiment, embodiments of the present invention are described below, those skilled in the art can understand other advantage of the present invention and effect easily by content disclosed in the present specification.
Notice, structure, ratio, size etc. that this specification institute accompanying drawings illustrates, content all only for coordinating specification to disclose, for understanding and the reading of those skilled in the art, be not intended to limit the enforceable qualifications of the present invention, so the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, " first ", the term such as " second " and " ", be also only be convenient to describe understand, but not for limiting the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
Fig. 2 A to Fig. 2 C is the cross-sectional schematic of the first embodiment of weldering line forming method of the present invention.In the present embodiment, the operation condition of described weldering line forming method, after pressurizeing operation when the contact completing routing processing procedure, when the bonding wire 4 on a bonding equipment 2 presents abnormal condition (as short-tail phenomenon), the work need repaired the bonding wire 4 on this bonding equipment 2.
In addition, described bonding equipment 2 provides a weldment 20, and it has the first relative side 20a and the second side 20b and the through hole 200 being communicated with this first side 20a and the second side 20b.
As shown in Figure 2 A, after the pommel pressurization operation carrying out routing processing procedure, a bonding wire 5 is stretched to the weld pad 90 of a bearing part 9 on the surface.Then, after pending contact pressurization operation, the bonding wire 4 that (or retain) has completed routing processing procedure is equipped with, and the first end 4a(lower end as shown in the figure of this bonding wire 4 in this through hole 200) do not protrude this first side 20a(i.e. this bonding wire 4 and present short-tail phenomenon).
In the present embodiment, this through hole 200 is bellmouth, and the aperture of this through hole 200 convergent from top to bottom, with when carrying out the pommel pressurization operation of routing processing procedure, be beneficial to the output controlling this bonding wire 5.
In addition, described bonding equipment 2 also comprises a wire fixing device 21, and it is located at above the second side 20b of this weldment 20, to fix the second end 4b(upper end as shown in the figure of this bonding wire 4), and this wire fixing device 21 is clamping piece, as wire clamp.
In addition, described bonding equipment 2 also provides a concussion system 22, and it is mechanically connected this weldment 20, and the mechanism of this concussion system 22, the of a great variety of assembly, there is no particular restriction.
As shown in Fig. 2 B to Fig. 2 C, towards the second side 20b of this weldment 20 direction (namely upwards, as direction of arrow A) this weldment 20 mobile, and the direction of the first side 20a towards this weldment 20 (namely downward, as direction of arrow B) this wire fixing device 21 mobile, drive this weldment 20 by this concussion system 22 afterwards, namely move back and forth up and down to shake this weldment 20(, as direction of arrow C), make the first end 4a of this bonding wire 4 stretch out the first side 20a of this weldment 20, to form line tail.
In the present embodiment, because of the bore of the lower port of this through hole 200 minimum (diameter slightly larger than this bonding wire 4), so this concussion system 22 need produce ultrasonic vibrating, with the first side 20a making the first end 4a of this bonding wire 4 stretch out this weldment 20.
In addition, after this bonding wire 4 forms line tail, this weldment 10 is moved on the weld pad 70 of a chip 7, to carry out the pommel pressurization operation of routing processing procedure next time.
Fig. 3 A to Fig. 3 C is the cross-sectional schematic that bonding wire 4 of the present invention forms the second embodiment of method.The Main Differences of the present embodiment and the first embodiment is the wire fixing device 31 of bonding equipment 3.
As shown in Figure 3A, when after the contact pressurization operation completing routing processing procedure, under the state of Fig. 2 A, the second end 4b of this bonding wire 4 is fixed by another wire fixing device 31.
In the present embodiment, this wire fixing device 31 is vacuum absorber or magnetic absorption device (as electromagnet), to inhale the second end 4b of this bonding wire 4 solid under air tension (Air Tension).
As shown in Fig. 3 B to Fig. 3 C, unclamp this wire fixing device 21.Afterwards, this weldment 20(is moved namely upwards in direction towards the second side 20b of this weldment 20, as direction of arrow A), and shake this weldment 20(by this concussion system 22 and namely move back and forth up and down, as direction of arrow C), the first end 4a of this bonding wire 4 is made to stretch out the first side 20a of this weldment 20, to form line tail.
In the present embodiment, when this weldment 20 moves up, and before this weldment 20 of concussion, this wire fixing device 31 transfixion.
Weldering line forming method of the present invention, mainly by the mode of this weldment 20 of concussion, the first end 4a of this bonding wire 4 is made to stretch out the first side 20a of this weldment 20, to reach the object that short-tail is repaired automatically, so compared to existing manual repair mode, weldering line forming method of the present invention can not only save time, and significantly can reduce cost of manufacture.
In addition, the present invention also provides a kind of bonding equipment 2,3, comprising: a weldment 20 and concussion system 22.
Described weldment 20 has the first relative side 20a and the second side 20b and the through hole 200 being communicated with this first side 20a and the second side 20b, and this through hole 200 is for receiving a bonding wire 4.
Described concussion system 22 drives this weldment 20, makes this weldment 20 produce concussion.
In an embodiment, this through hole 200 is bellmouth.
In an embodiment, described bonding equipment 2,3 also comprises a wire fixing device 21,31, and for fixing or unclamping this bonding wire 4, and this wire fixing device 21,31 is vacuum absorber, magnetic absorption device or clamping piece.
In sum, weldering line forming method of the present invention and bonding equipment thereof, mainly shake this weldment by this concussion system, to form line tail, and reaches the object of automatically repairing short-tail phenomenon.
Above-described embodiment only for illustrative principle of the present invention and effect thereof, but not for limiting the present invention.Any those skilled in the art all without prejudice under spirit of the present invention and category, can modify to above-described embodiment.Therefore the scope of the present invention, should listed by claims.
Claims (12)
1. a bonding equipment, comprising:
Weldment, it has the first relative side and the second side and the through hole being communicated with this first side and the second side, and this through hole is for receiving bonding wire; And
Concussion system, for driving this weldment, makes this weldment produce concussion.
2. bonding equipment according to claim 1, is characterized in that, this through hole is bellmouth.
3. bonding equipment according to claim 1, is characterized in that, this concussion system is ultrasonic vibrating system.
4. bonding equipment according to claim 1, is characterized in that, this equipment also comprises at least one wire fixing device, and it is for fixing or unclamping this bonding wire.
5. bonding equipment according to claim 4, is characterized in that, this wire fixing device is vacuum absorber, magnetic absorption device or clamping piece.
6. weld a line forming method, comprising:
There is provided a weldment, it has the first relative side and the second side and the through hole being communicated with this first side and the second side, and is equipped with the bonding wire not protruding this first side in this through hole; And
This weldment is moved in direction towards this second side, and shakes this weldment, makes this bonding wire stretch out this first side.
7. weldering line forming method according to claim 6, is characterized in that, this through hole is bellmouth.
8. weldering line forming method according to claim 6, is characterized in that, drives this weldment by a concussion system, makes this weldment produce concussion.
9. weldering line forming method according to claim 8, is characterized in that, this concussion system is ultrasonic vibrating system.
10. weldering line forming method according to claim 6, is characterized in that, the method also comprises fixes this bonding wire by a wire fixing device.
11. weldering line forming methods according to claim 10, is characterized in that, this wire fixing device is vacuum absorber, magnetic absorption device or clamping piece.
12. weldering line forming methods according to claim 10, is characterized in that, when this weldment mobile, this wire fixing device is moved in the direction towards this first side.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103109872A TWI534919B (en) | 2014-03-17 | 2014-03-17 | Bonding wire forming method and its bonding wire device |
| TW103109872 | 2014-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104934337A true CN104934337A (en) | 2015-09-23 |
Family
ID=54121445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410110894.XA Pending CN104934337A (en) | 2014-03-17 | 2014-03-24 | Bonding wire forming method and bonding wire equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104934337A (en) |
| TW (1) | TWI534919B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09162223A (en) * | 1995-12-08 | 1997-06-20 | Can Electron:Kk | Wire bonding capillary |
| JP2000216190A (en) * | 1999-01-26 | 2000-08-04 | Sumitomo Electric Ind Ltd | Bonding tool and bonding method |
| US20030146267A1 (en) * | 2002-02-01 | 2003-08-07 | Esec Trading Sa | Method for the calibration of a Wire Bonder |
| CN1516633A (en) * | 2001-06-21 | 2004-07-28 | ������-����Ͷ�ʹ�˾ | Controlled attenuation capillary bonding tool with planar surface |
| CN1700433A (en) * | 2004-05-20 | 2005-11-23 | 三星Techwin株式会社 | Wire welding method and wire welding employing the same |
| US20060261132A1 (en) * | 1999-02-25 | 2006-11-23 | Reiber Steven F | Low range bonding tool |
| CN1974105A (en) * | 2005-11-28 | 2007-06-06 | 李正求 | Wire bonding capillary having two-step high bottleneck |
| CN102931106A (en) * | 2011-08-09 | 2013-02-13 | 株式会社东芝 | Making method of lead wire bonding device and semiconductor device |
-
2014
- 2014-03-17 TW TW103109872A patent/TWI534919B/en active
- 2014-03-24 CN CN201410110894.XA patent/CN104934337A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09162223A (en) * | 1995-12-08 | 1997-06-20 | Can Electron:Kk | Wire bonding capillary |
| JP2000216190A (en) * | 1999-01-26 | 2000-08-04 | Sumitomo Electric Ind Ltd | Bonding tool and bonding method |
| US20060261132A1 (en) * | 1999-02-25 | 2006-11-23 | Reiber Steven F | Low range bonding tool |
| CN1516633A (en) * | 2001-06-21 | 2004-07-28 | ������-����Ͷ�ʹ�˾ | Controlled attenuation capillary bonding tool with planar surface |
| US20030146267A1 (en) * | 2002-02-01 | 2003-08-07 | Esec Trading Sa | Method for the calibration of a Wire Bonder |
| CN1700433A (en) * | 2004-05-20 | 2005-11-23 | 三星Techwin株式会社 | Wire welding method and wire welding employing the same |
| CN1974105A (en) * | 2005-11-28 | 2007-06-06 | 李正求 | Wire bonding capillary having two-step high bottleneck |
| CN102931106A (en) * | 2011-08-09 | 2013-02-13 | 株式会社东芝 | Making method of lead wire bonding device and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201537647A (en) | 2015-10-01 |
| TWI534919B (en) | 2016-05-21 |
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