CN104919082A - Magnetron sputtering magnetic field-generating device - Google Patents
Magnetron sputtering magnetic field-generating device Download PDFInfo
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- CN104919082A CN104919082A CN201480004542.4A CN201480004542A CN104919082A CN 104919082 A CN104919082 A CN 104919082A CN 201480004542 A CN201480004542 A CN 201480004542A CN 104919082 A CN104919082 A CN 104919082A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
- H01F7/0205—Magnetic circuits with PM in general
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
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Abstract
A magnetron sputtering magnetic field-generating device having a racetrack shape obtained from linear sections and corner sections is provided, comprising, on a non-magnetic base: (a) a linear central magnetic pole member; (b) a circumferential magnetic pole member set so as to surround the central magnetic pole member; (c) multiple vertical permanent magnets disposed between the central magnetic pole member and the circumferential magnetic pole member and magnetized in the direction perpendicular to the target surface; and (d) multiple first and second horizontal permanent magnets disposed on both sides thereof and magnetized in the direction that is parallel to the target surface. The poles of the first and second horizontal permanent magnets on the sides that face the vertical permanent magnets are the same as the poles of the vertical permanent magnets on the side that faces the target surface.
Description
Technical field
The present invention relates to a kind of magnetic field generating arrangement be assembled in the magnetic controlled tube sputtering apparatus used to form film at substrate surface.
Background technology
Sputtering refers to and forms the atom of target or the phenomenon of molecule by pounding inert substance high velocity bombardment such as argons (Ar), by making this by the atom that pounds or molecule attached on substrate, can form film.Magnetron sputtering system can by introducing magnetic field at cathode internal, thus on substrate, improve target material gather speed, and, due to the bombardment of electron pair substrate can not be caused, therefore, be a kind of can the method for film formation at low temp.Therefore, in the manufacturing process of electronic unit or the reflectance coatings etc. such as semiconducter IC, flat-panel monitor, solar cell, in order to form film at substrate surface, mostly magnetron sputtering system can be used.
Magnetic controlled tube sputtering apparatus, has the substrate of anode side, the target (negative electrode) arranged opposite with substrate and is configured in the magnetic field generating arrangement of generated beneath in vacuum chamber.Glow discharge is caused by applying voltage between antianode and negative electrode, make rare gas element (the Ar gas etc. of about the 0.1Pa) ionization in vacuum chamber, on the other hand, utilize the magnetic field formed by magnetic field generating arrangement to catch the secondary electron discharged from target, carry out trochoid motion at target material surface.Trochoid motion due to electronics facilitates the ionization of gas molecule, and therefore, the formation speed of film significantly becomes large compared with not using the situation in magnetic field, and the adhesion strength of film becomes large.
No. 2008-156735, TOHKEMY discloses the magnetron sputtering magnetic field generating arrangement 200 as shown in Figure 15 (a) and Figure 15 (b), and it has: the substrate 210 formed by nonmagnetic material, in the bar-shaped central pole piece 220 that its surface is arranged, be arranged on the periphery pole piece 230 of the oblong shape around it, and the multiple permanent magnets 240 be configured between described central pole piece and described periphery pole piece, 250, described permanent magnet 240, 250 are magnetized in the horizontal direction, and the magnetic pole of identical polar configures in the mode opposed with described central pole piece, and, the height of described central pole piece and the height of described periphery pole piece are more than the height of described permanent magnet, by using this magnetic field generating arrangement, having can expand at corner part especially with the field region of required intensity (flux density level component is more than 10mT) in order to be closed by the rare gas element of isoionic state, therefore, the erosion areas of corner part can be made to expand, and make the erosion of line part and corner part become even.
But the magneticflux-density of the part opposed with central pole piece in the magnetic field obtained by this magnetic field generating arrangement is lower than other parts, therefore, the erosive progression of the middle body (part opposed with central pole piece) of target can be slower.In order to improve the service efficiency of target further, expecting that exploitation is a kind of by the distribution equalization of the magneticflux-density on target, and can relatively accelerate the technology of the erosive progression of the part opposed with the central pole piece of target.
No. 7-74439, JP JP discloses a kind of magnetic controlled tube sputtering apparatus, and it has: inner side magnetic pole; Magnetic pole inside this is surrounded and there is the outside magnetic pole of opposite polarity; And from the target that two magnetic poles near described inner side magnetic pole laterally magnetic pole configure, described two magnetic poles are arranged to be had the permanent magnet magnetized of vertical direction or is made up of soft-magnetic body and has the permanent magnet magnetized of horizontal direction between described two magnetic poles, and, the outer side of described outside magnetic pole arrange have reverse permanent magnet magnetized with described horizontal direction, described magnetic controlled tube sputtering apparatus can stably to keep on target isoionic while, prevent the erosion of the local of target, thus extend the life-span of target significantly.
But, magnetic controlled tube sputtering apparatus described in No. 7-74439, JP JP is in order to prevent the erosion of the local of target, and permanent magnet is set to always than target more lateral (outside of outside magnetic pole), therefore, magnetic force generating apparatus can be produced maximize and this problem of causing cost to increase.
Summary of the invention
The technical task that invention will solve
Therefore, a kind of progress of the erosion by making the part opposed with the center pole parts of target is the object of the present invention is to provide relatively to accelerate, and by the distribution equalization of the magneticflux-density on target, thus the magnetron sputtering magnetic field generating arrangement of the utilising efficiency of target can be improved.
The means of technical solution problem
In view of above-mentioned purpose, after studying with keen determination, the present inventor obtains following result, namely, in the region of the runway shape be made up of center pole parts and the periphery pole piece of linearity, be arranged on multiple permanent magnets that the direction parallel with target surface is magnetized, thus form magnetron sputtering magnetic field generating arrangement, wherein, by described permanent magnet being replaced as by the multiple permanent magnet be magnetized on the direction vertical with target surface and the magnet unit of the multiple permanent magnet combination be magnetized on the direction parallel with target surface being configured in its both sides, thus the magneticflux-density vertical component on the target surface opposed with central pole piece (component vertical with target surface) is reduced, the erosion of the part opposed with the central pole piece of target can be made relatively to accelerate.By finding above content, the present inventor achieves the present invention.
Namely, and magnetron sputtering magnetic field generating arrangement of at target material surface produce magnetic field opposed with target of the present invention has: by line part and corner part form run-track shaped, it is characterized in that having by the substrate that nonmagnetic material is formed: the center pole parts of (a) linearity; (b) periphery pole piece, it is set to described center pole parts enclose; C () multiple vertical permanent magnet, is set between described center pole parts and described periphery pole piece: by described center pole parts enclose, and direction of magnetization is perpendicular to described target material surface; D () multiple first horizontal permanent magnet, is set between described center pole parts with described vertical permanent magnet: the magnetic pole of a side is opposed with described center pole parts, and the magnetic pole of the opposing party is opposed with described vertical permanent magnet; And (e) multiple second horizontal permanent magnet, be set between described periphery pole piece with described vertical permanent magnet: the magnetic pole of a side is opposed with described periphery pole piece, the magnetic pole of the opposing party is opposed with described vertical permanent magnet,
The pole of the side opposed with described vertical permanent magnet of described first horizontal permanent magnet and the second horizontal permanent magnet and the extremely identical of the side opposed with described target material surface of described vertical permanent magnet.
The total of the direction of magnetization length of described first horizontal permanent magnet and the second horizontal permanent magnet is preferably 50 ~ 95% of the interval of described center pole parts and described periphery pole piece.
The thickness in the direction vertical with described target material surface of described first horizontal permanent magnet and the second horizontal permanent magnet is equal, when their described thickness is set to 100, the thickness in the direction vertical with described target material surface of described vertical permanent magnet is preferably 0 ~ 150.
Forming the thickness in the direction vertical with described target material surface of the vertical permanent magnet of described corner part, the first horizontal permanent magnet and the second horizontal permanent magnet, is preferably 30 ~ 100% of the thickness in the direction vertical with described target material surface of the described vertical permanent magnet of the described line part of formation, the first horizontal permanent magnet and the second horizontal permanent magnet respectively.
Form the thickness in the direction vertical with described target material surface of the second horizontal permanent magnet of described corner part, preferably thin than the thickness in the direction vertical with described target material surface of the first horizontal permanent magnet of the described corner part of formation.
Forming the vertical permanent magnet of described corner part, the first horizontal permanent magnet and the second horizontal permanent magnet, preferably accounting for more than 30% of the area in the gap of described center pole parts and described periphery pole piece when overlooking.
The described center pole parts of described corner part can be made up of described vertical permanent magnet, the first horizontal permanent magnet and the second horizontal permanent magnet pad with the nonmagnetic material of filling the part beyond described vertical permanent magnet, the first horizontal permanent magnet and the second horizontal permanent magnet with the gap of described periphery pole piece.
Also part or all removing in the end of the center pole parts of the described corner part of formation, periphery pole piece and vertical permanent magnet can be formed magnetron sputtering magnetic field generating arrangement.
Another magnetron sputtering magnetic field generating arrangement of the present invention, has by the substrate that nonmagnetic material is formed: the center pole parts of (a) linearity; (b) periphery pole piece, it is set to described center pole parts enclose; (c) consequent pole parts, it is set to described center pole parts enclose between described center pole parts and described periphery pole piece; D () multiple first horizontal permanent magnet, is set between described center pole parts with described consequent pole parts: the magnetic pole of a side is opposed with described center pole parts, and the magnetic pole of the opposing party is opposed with described consequent pole parts; And (e) multiple second horizontal permanent magnet, be set between described periphery pole piece with described consequent pole parts: the magnetic pole of a side is opposed with described periphery pole piece, the magnetic pole of the opposing party is opposed with described consequent pole parts,
The side opposed with described consequent pole parts of described first horizontal permanent magnet and the second horizontal permanent magnet extremely identical.
The width of described consequent pole parts, is preferably the length of 10 ~ 75% of the thickness in the direction vertical with described target material surface of described first horizontal permanent magnet and the second horizontal permanent magnet.
The thickness in the direction vertical with described target material surface of described first horizontal permanent magnet and the second horizontal permanent magnet is equal, when their described thickness is set to 100, the thickness in the direction vertical with described target material surface of preferred described consequent pole parts is 0 ~ 150.
Also part or all removing in the end of the center pole parts of the described corner part of formation, periphery pole piece and consequent pole parts can be formed magnetron sputtering magnetic field generating arrangement.
When putting on the magnetic field of described target material surface for the direction detection orthogonal with direction of principal axis on described line part, the maximum value of the magneticflux-density in preferably parallel with described target material surface direction is larger than the magneticflux-density in the direction vertical with described target material surface of the part opposed with described center pole parts.
Become the position of zero in the magneticflux-density in the direction vertical with described target material surface in the magnetic field putting on described target material surface, the magneticflux-density in preferably parallel with described target material surface direction is more than 10mT.
Invention effect
The magnetic field generating arrangement of the application of the invention, the progress of the erosion of the part opposed with the center pole parts of target is relative to be accelerated, and the progress of the erosion of target can be made to become more even, therefore, it is possible to improve the utilising efficiency of target.
The magnetic field generating arrangement of the application of the invention, just becomes the component not needing mechanicalness to shake target or magnetic field generating arrangement, therefore, it is possible to the miniaturization of implement device and the reduction of cost.
Accompanying drawing explanation
Fig. 1 (a) is the vertical view of the example representing magnetron sputtering magnetic field generating arrangement of the present invention.
Fig. 1 (b) is the A-A sectional view of Fig. 1 (a).
Fig. 1 (c) is the B-B sectional view of Fig. 1 (a).
Fig. 2 (a) is the vertical view of another example representing magnetron sputtering magnetic field generating arrangement of the present invention.
Fig. 2 (b) is the C-C sectional view of Fig. 2 (a).
Fig. 2 (c) is the D-D sectional view of Fig. 2 (a).
Fig. 3 (a) is the vertical view of another example representing magnetron sputtering magnetic field generating arrangement of the present invention.
Fig. 3 (b) is the E-E sectional view of Fig. 3 (a).
Fig. 3 (c) is the F-F sectional view of Fig. 3 (a).
Fig. 4 (a) is the vertical view of another example representing magnetron sputtering magnetic field generating arrangement of the present invention.
Fig. 4 (b) is the G-G sectional view of Fig. 4 (a).
Fig. 4 (c) is the H-H sectional view of Fig. 4 (a).
Fig. 5 (a) is the vertical view of another example representing magnetron sputtering magnetic field generating arrangement of the present invention.
Fig. 5 (b) is the I-I sectional view of Fig. 5 (a).
Fig. 5 (c) is the J-J sectional view of Fig. 5 (a).
Fig. 6 (a) is the vertical view of another example representing magnetron sputtering magnetic field generating arrangement of the present invention.
Fig. 6 (b) is the K-K sectional view of Fig. 6 (a).
Fig. 6 (c) is the L-L sectional view of Fig. 6 (a).
Fig. 7 is the sectional view of another example of the corner part magnet representing magnetron sputtering magnetic field generating arrangement of the present invention.
Fig. 8 is the vertical view of another example of the corner part representing magnetron sputtering magnetic field generating arrangement of the present invention.
Fig. 9 is the vertical view of another example of the corner part representing magnetron sputtering magnetic field generating arrangement of the present invention.
Figure 10 (a) is the vertical view of the magnetic field generating arrangement representing embodiment 1.
Figure 10 (b) is the M-M sectional view of Figure 10 (a).
Figure 11 (a) is the vertical view of the magnetic field generating arrangement representing comparative example 1.
Figure 11 (b) is the N-N sectional view of Figure 11 (a).
Figure 12 (a) is the schematic diagram of the A line of the magnetic field generating arrangement representing embodiment 1, B line, C line and D line.
Figure 12 (b) is the schematic diagram of the A line of the magnetic field generating arrangement representing comparative example 1, B line, C line and D line.
Figure 13 is the chart that the parallel component of the magneticflux-density generated utilizing the magnetic field generating arrangement of embodiment 1 on target surface and vertical component are drawn out along A line, B line, C line and D line.
Figure 14 is the chart parallel component of the magneticflux-density utilizing the magnetic field generating arrangement of comparative example 1 to generate on target surface and vertical component drawn out along A line, B line, C line and D line.
Figure 15 (a) is the vertical view of an example of the magnetron sputtering magnetic field generating arrangement represented in the past.
Figure 15 (b) is the 0-0 sectional view of Figure 15 (a).
Embodiment
[1] magnetron sputtering magnetic field generating arrangement
(A) overall formation
Magnetron sputtering magnetic field generating arrangement of the present invention is the device in the magnetic field for generating runway shape at target material surface, such as, as shown in Fig. 1 (a), Fig. 1 (b) and Fig. 1 (c), have opposed with target 7 and by line part 20 and two corner parts 30,30 formed run-track shaped.
(1) first is formed
The feature of the first magnetron sputtering magnetic field generating arrangement 1 is: have in the substrate 6 be made up of nonmagnetic material: the center pole parts 2 of (a) linearity; (b) periphery pole piece 3, it is arranged in the mode of being surrounded by described center pole parts 2; (c) multiple vertical permanent magnet 4a, 5a, they between described center pole parts 2 and described periphery pole piece 3 described center pole parts 2 to be surrounded and direction of magnetization configures perpendicular to the mode of described target material surface 7a; (d) multiple first horizontal permanent magnet 4b, 5b, they are arranged with described vertical opposed with described center pole parts 2 with the magnetic pole of a side between permanent magnet 4a, 5a, that the magnetic pole of the opposing party is opposed with described vertical permanent magnet 4a, 5a mode at described center pole parts 2; And (e) multiple second horizontal permanent magnet 4c, 5c, they are arranged with described vertical opposed with described periphery pole piece 3 with the magnetic pole of a side between permanent magnet 4a, 5a, that the magnetic pole of the opposing party is opposed with described vertical permanent magnet 4a, 5a mode in described periphery pole piece 3, the pole of the side opposed with described vertical permanent magnet 4a, 5a of described first horizontal permanent magnet 4b, 5b and second horizontal permanent magnet 4c, 5c and the extremely identical of the side opposed with described target material surface 7a of described vertical permanent magnet 4a, 5a.
The formation of (i) line part
Such as, as shown in Fig. 1 (a) and Fig. 1 (b), line part 20 by being arranged on being formed with lower component in the substrate 6 that is made up of nonmagnetic material, they respectively: the center pole parts 2 of (a) corner column, b two periphery pole piece 3 of () corner column are parallel with described center pole parts 2 and arrange at intervals in the both sides of described center pole parts 2, (c) multiple vertical permanent magnet 4a, they are rectangle when overlooking, and configure with connecting in such a way between described center pole parts 2 and described periphery pole piece 3, that is: parallel with described center pole parts 2 and periphery pole piece 3, direction of magnetization is vertical with described target material surface 7a, and the magnetic pole (being N pole in the drawings) of the homopolarity of a side is opposed with described target material surface 7a, (d) multiple first horizontal permanent magnet 4b, they are rectangle when overlooking, and configure with being connected in such a way between described center pole parts 2 with described vertical permanent magnet 4a, that is: direction of magnetization is parallel with target material surface 7a, the magnetic pole (being S pole in the drawings) of the homopolarity of one side is opposed with center pole parts 2, and the magnetic pole (being N pole in the drawings) of the homopolarity of the opposing party is opposed with described vertical permanent magnet 4a, and (e) multiple second horizontal permanent magnet 4c, they are rectangle when overlooking, and arrange with being connected in such a way between described periphery pole piece 3 with described vertical permanent magnet 4a, that is: direction of magnetization is parallel with target material surface 7a, the magnetic pole (being S pole in the drawings) of the homopolarity of one side is opposed with described periphery pole piece 3, the magnetic pole (being N pole in the drawings) of the homopolarity of the opposing party is opposed with described vertical permanent magnet 4a, the pole (being N pole in the drawings) of the side opposed with described vertical permanent magnet 4a of described first horizontal permanent magnet 4b and the second horizontal permanent magnet 4c is identical with the pole (being N pole in the drawings) of the side opposed with described target material surface of described vertical permanent magnet 4a.
On line part 20, the permanent magnet unit 4 that described vertical permanent magnet 4a, the first horizontal permanent magnet 4b and the second horizontal permanent magnet 4c are formed by connecting fills described center pole parts 2 to configure with the mode in the gap of described periphery pole piece 3.The mode that described permanent magnet unit 4 preferably becomes 50 ~ 95% of the total length L (length of closure) of described permanent magnet unit 4 with the direction of magnetization of the first horizontal permanent magnet 4b (direction that each permanent magnet connects) length Lb with the total (Lb+Lc) of direction of magnetization (direction that each permanent magnet is connected) the length Lc of the second horizontal permanent magnet 4c is formed, and the mode more preferably becoming 80 ~ 90% of described total length L is formed.Therefore, the mode preferably becoming 5 ~ 50% of described total length L with the described closure length La of described vertical permanent magnet 4a (being equivalent to the interval of described first horizontal permanent magnet 4b and the second horizontal permanent magnet 4c) is formed, and is more preferably formed in the mode of become described total length L 10 ~ 20%.The direction of magnetization length Lb of described first horizontal permanent magnet 4b and the direction of magnetization length Lc of the second horizontal permanent magnet 4c can be different, but are preferably roughly the same length.
Preferably the thickness Ltb in the direction vertical with target material surface 7a of the first horizontal permanent magnet 4b is equal to each other with the thickness Ltc in the direction vertical with target material surface 7a of the second horizontal permanent magnet 4c, the thickness Lta in the direction vertical with target material surface 7a of vertical permanent magnet 4a both can be identical with thickness Ltb and thickness Ltc, also can be different.By changing the thickness Lta in the direction vertical with target material surface 7a of this vertical permanent magnet 4a, intensity and the distribution in generated magnetic field can be regulated.The thickness Lta in the direction vertical with target material surface 7a of preferred described vertical permanent magnet 4a is 50 ~ 150% of described thickness Ltb and thickness Ltc, is more preferably 80 ~ 120%.Described thickness Lta is identical without the need to all vertical permanent magnet 4a being formation line part, also can partly change thickness Lta according to the difference of object.
Respective permanent magnet both can utilize binding agent etc. to paste and be configured in described substrate 6, also can be configured in advance the permanent magnet unit 4 that described vertical permanent magnet 4a, the first horizontal permanent magnet 4b and the second horizontal permanent magnet 4c paste and be integrally formed being pasted in described substrate 6 by described vertical permanent magnet 4a, the first horizontal permanent magnet 4b and the second horizontal permanent magnet 4c.In addition, each vertical permanent magnet 4a, the first horizontal permanent magnet 4b and the second horizontal permanent magnet 4c also can be made up of plural permanent magnet.
In Fig. 1 (a), although between described center pole parts 2 and described periphery pole piece 3, the permanent magnet unit more than 4 be made up of vertical permanent magnet 4a, the first horizontal permanent magnet 4b and the second horizontal permanent magnet 4c is connected the magnetic loop forming line part 20, but substituting as these multiple permanent magnet unit 4, also can use the permanent magnet unit 4 be integrally formed to form the magnetic loop of line part 20.In addition, according to the material of required magneticstrength or magnet, also multiple permanent magnet unit 4 can be arranged the magnetic loop forming line part 20 at intervals.When configuring separately, permanent magnet unit 4 both can be filled with nonmagnetic pad with the gap of permanent magnet unit 4, also can what not arrange.Quantity and the size of permanent magnet unit 4 are provided with particular determination, consider, can be divided into arbitrary size from the viewpoint manufactured or be easy to assemble, and in addition, respective size can be different.
(ii) formation of corner part
Such as, as shown in Fig. 1 (a) and Fig. 1 (c), corner part 30 is formed by with lower part, that is: the end 2a of (a) center pole parts 2, (b) corner part periphery pole piece 3c, it is arranged to half polygon centered by the end 2a of described center pole parts 2, (c) multiple vertical permanent magnet 5a, they are trapezoidal when overlooking, and arrange with being connected in such a way with between described corner part periphery pole piece 3c at the end 2a of described center pole parts 2, that is: parallel with described corner part periphery pole piece 3c, direction of magnetization is perpendicular to described target material surface 7a, and the magnetic pole (being N pole in the drawings) of the homopolarity of a side is opposed with described target material surface 7a, (d) multiple first horizontal permanent magnet 5b, they are trapezoidal when overlooking, and arrange with being connected in such a way with between described vertical permanent magnet 5a at the end 2a of described center pole parts 2, that is: direction of magnetization is parallel to target material surface 7a, the magnetic pole (being S pole in the drawings) of the homopolarity of one side is opposed with the end 2a of center pole parts 2, and the magnetic pole (being N pole in the drawings) of the homopolarity of the opposing party is opposed with described vertical permanent magnet 5a, and (e) multiple second horizontal permanent magnet 5c, they are trapezoidal when overlooking, and arrange with being connected in such a way between described corner part periphery pole piece 3c with described vertical permanent magnet 5a, that is: direction of magnetization is parallel to target material surface 7a, the magnetic pole (being S pole in the drawings) of the homopolarity of one side is opposed with described corner part periphery pole piece 3c, the magnetic pole (being N pole in the drawings) of the homopolarity of the opposing party is opposed with described vertical permanent magnet 5a, the pole (being N pole in the drawings) of the side opposed with described vertical permanent magnet 5a of described first horizontal permanent magnet 5b and the second horizontal permanent magnet 5c is identical with the pole (being N pole in the drawings) of the side opposed with described target material surface of described vertical permanent magnet 5a.End 2a and the described corner part periphery pole piece 3c of described center pole parts 2 are half polygon in Fig. 1 (a), but also can be semicircle.In addition, be trapezoidal when described vertical permanent magnet 5a, the first horizontal permanent magnet 5b and the second horizontal permanent magnet 5c overlook in Fig. 1 (a), but can be also rectangle when overlooking.
At corner part 30, the permanent magnet unit 5 that described vertical permanent magnet 5a, the first horizontal permanent magnet 5b and the second horizontal permanent magnet 5c are formed by connecting is that the mode of filling the end 2a of described center pole parts 2 and the gap of described corner part periphery pole piece 3c configures.The formation of described permanent magnet unit 5 is identical with the formation of the permanent magnet unit 4 of described line part.That is: the mode that described permanent magnet unit 5 preferably becomes 50 ~ 95% of the total length L ' (length of closure) of described permanent magnet unit 5 with the direction of magnetization of the first horizontal permanent magnet 5b (direction that each permanent magnet connects) length Lb ' with the total (Lb '+Lc ') of direction of magnetization (direction that each permanent magnet is connected) the length Lc ' of the second horizontal permanent magnet 5c is formed, and is more preferably formed in the mode of become total length L ' 80 ~ 90%.Therefore, the mode preferably becoming 5 ~ 50% of described total length L ' with the described closure length La ' of described vertical permanent magnet 5a (being equivalent to the interval of described first horizontal permanent magnet 5b and the second horizontal permanent magnet 5c) is formed, and is more preferably formed in the mode of become described total length L ' 10 ~ 20%.Although the direction of magnetization length Lb ' of described first horizontal permanent magnet 5b and the direction of magnetization length Lc ' of the second horizontal permanent magnet 5c can be different, be preferably roughly the same length.
The length Lc ' of the described total length L ' of described permanent magnet unit 5, the vertical length La ' of permanent magnet 5a, the length Lb ' of the first horizontal permanent magnet 5b and the second horizontal permanent magnet 5c, can be formed in the mode becoming equal length with the length (total length L, length La, length Lb and length Lc) of the part corresponding to described permanent magnet unit 4, but the difference of the object such as erosion areas according to the target of expansion corner part, also can be formed by the length different from the length of the part corresponding to described permanent magnet unit 4.In this case, also preferably the closure length La ' of vertical permanent magnet 5a of corner part is identical with the closure length of the vertical permanent magnet 4a of line part.
Preferably the thickness Ltb ' in the direction vertical with target material surface 7a of the first horizontal permanent magnet 5b is equal to each other with the thickness Ltc ' in the direction vertical with target material surface 7a of the second horizontal permanent magnet 5c, the thickness Lta ' in the direction vertical with target material surface 7a of vertical permanent magnet 5a both can be identical with thickness Ltb ' and thickness Ltc ', also can be different.By changing the thickness Lta ' in the direction vertical with target material surface 7a of this vertical permanent magnet 5a, intensity and the distribution in generated magnetic field can be regulated.The thickness Lta ' in the direction vertical with target material surface 7a of preferred described vertical permanent magnet 5a is 50 ~ 150% of described thickness Ltb ' and thickness Ltc ', is more preferably 80 ~ 120%.Described thickness Lta ' is identical without the need to all vertical permanent magnet 5a being formation corner part, also can partly change thickness Lta ' according to the difference of object.
As shown in Fig. 1 (a), the permanent magnet unit 5 of corner part both can configure in the mode of the end 2a of center pole parts 2 and the gap of corner part periphery pole piece 3c that arranges in half polygon centered by the end 2a of center pole parts 2 all being filled, also can as shown in Figure 7, configure in the mode vacating gap 5e between corner part permanent magnet unit 5 and corner part permanent magnet unit 5.Configuring corner part permanent magnet unit 5 by vacating gap 5e like this, the magneticflux-density on target material surface can be regulated.The pad of nonmagnetic material can be filled in the 5e of gap.The corner part occupation rate of permanent magnet unit 5 relative to the total area in the end 2a of center pole parts 2 and the gap of corner part periphery pole piece 3c, is particularly limited to although be provided with, is preferably more than 30%.
Shape during the overlooking of preferred corner part permanent magnet unit 5 sets according to the shape of corner part periphery pole piece 3c.As shown in Figure 7, corner part permanent magnet unit 5, when corner part periphery pole piece 3c is half polygon, for roughly trapezoidal when preferably overlooking; As shown in Figure 8, when corner part periphery pole piece 3c is semicircle shape, for roughly fan-shaped when preferably overlooking.In addition, as shown in Figure 9, also can be rectangle when overlooking.Quantity and the size of corner part permanent magnet unit 5 are provided with particular determination, from manufacturing or easy-to-install viewpoint, can be divided into arbitrary size, and in addition, respective size also can be different.
Respective permanent magnet both can utilize binding agent etc. to paste configuration by described vertical permanent magnet 5a, the first horizontal permanent magnet 5b and the second horizontal permanent magnet 5c in described substrate 6, also can be configured in advance the corner part permanent magnet unit 5 that described vertical permanent magnet 5a, the first horizontal permanent magnet 5b and the second horizontal permanent magnet 5c paste and be integrally formed being pasted in described substrate 6.In addition, each vertical permanent magnet 5a, the first horizontal permanent magnet 5b and the second horizontal permanent magnet 5c can be made up of plural permanent magnet.
The thickness Lta ' in the direction vertical with target material surface 7a of described vertical permanent magnet 5a, the thickness Ltc ' in the thickness Ltb ' in the direction vertical with target material surface 7a of described first horizontal permanent magnet 5b and the direction vertical with target material surface 7a of described second horizontal permanent magnet 5c, both can (be Lta respectively with the thickness with the part corresponding to the permanent magnet unit 4 being formed described line part, Ltb and Ltc) mode that becomes same thickness forms, also can according to the object of the erosion areas of the target of expansion corner part etc., formed with the thickness different from the thickness of the part corresponding to the permanent magnet unit 4 being formed described line part.
Such as, as shown in Fig. 2 (a), Fig. 2 (b) and Fig. 2 (c), also can become the mode thinner than the thickness Lt in the direction vertical with target material surface 7a of line part permanent magnet unit 4 with the thickness Lt ' in the direction vertical with target material surface 7a of corner part permanent magnet unit 5 and be formed.At this, when making corner part permanent magnet unit 5 thinning, preferably make the substrate 6 of corner part 30 thickening, and the distance of corner part permanent magnet unit 5 and target material surface 7a is not changed.By being arranged to this structure, the magneticflux-density on the target material surface of the part corresponding with corner part can be regulated.The described thickness Lt ' of corner part permanent magnet unit 5 can suitably set as required, but the described thickness Lt of line part permanent magnet unit 4 is preferably 30 ~ 100%.
And, in order to regulate the magneticflux-density on target material surface, such as, as shown in Fig. 3 (a), Fig. 3 (b) and Fig. 3 (c), also can remove the end 2a of the center pole parts forming described corner part, periphery pole piece 3c and vertical permanent magnet 5a.Although the end 2a of the center pole parts of described corner part, periphery pole piece 3c and vertical permanent magnet 5a all can be removed, in order to the magneticflux-density on target material surface is adjusted to suitable size, also can by part removing wherein.When removing a part, preferred employing becomes symmetrical at two corner parts 30,30, additionally by center pole parts 2 major axis and become the structure of symmetrical (symmetrical becoming up and down of Fig. 3 (a)) with the face being orthogonal to target material surface.
(2) second structures
As shown in Fig. 4 (a), Fig. 4 (b) and Fig. 4 (c), in described first structure, also can will form the vertical permanent magnet 4a of described line part 20 and form the vertical permanent magnet 5a of corner part 30 and be replaced as the consequent pole parts 8 that formed by magnetic substance (soft-magnetic body) to form magnetron sputtering magnetic field generating arrangement.Both the vertical permanent magnet 5a of the vertical permanent magnet 4a of described for all formations line part 20 and formation corner part 30 can be replaced as consequent pole parts 8, also only a part can be replaced as consequent pole parts 8.Second structure is except being replaced as except consequent pole parts 8 by vertical permanent magnet 4a, 5a, all identical with described first structure, therefore, is only described in detail to middle pole piece 8 below.
The structure of (i) line part
The width of described consequent pole parts 8 preferably forms the length of 10 ~ 75% of the thickness in the first horizontal permanent magnet 4b of described line part 20 and the direction vertical with target material surface 7a of the second horizontal permanent magnet 4c, is more preferably the length of 20 ~ 60%.
The thickness Ltc in the thickness Lta in the direction vertical with target material surface 7a of described consequent pole parts 8, the thickness Ltb in the direction vertical with target material surface 7a of the first horizontal permanent magnet 4b and the direction vertical with target material surface 7a of the second horizontal permanent magnet 4c, can be the same or different.Changed by the thickness Lta in the direction vertical with target material surface 7a making these consequent pole parts 8, intensity and the distribution in generated magnetic field can be regulated.The thickness Lta in the direction vertical with target material surface 7a of described consequent pole parts 8 is preferably 50 ~ 150% of described thickness Ltb and thickness Ltc, is more preferably 80 ~ 120%.
(ii) structure of corner part
The width of described consequent pole parts 8 is preferably the length of 10 ~ 75% of the thickness in the direction vertical with target material surface 7a of described first horizontal permanent magnet 5b and the second horizontal permanent magnet 5c, is more preferably the length of 20 ~ 60%.
The thickness Ltc ' in the thickness Lta ' in the direction vertical with target material surface 7a of described consequent pole parts 8, the thickness Ltb ' in the direction vertical with target material surface 7a of the first horizontal permanent magnet 5b and the direction vertical with target material surface 7a of the second horizontal permanent magnet 5c, can be the same or different.By making the thickness Lta ' change in the direction vertical with target material surface 7a of these consequent pole parts 8, intensity and the distribution in generated magnetic field can be regulated.The thickness Lta ' in the direction vertical with target material surface 7a of described consequent pole parts 8 is preferably 50 ~ 150% of described thickness Ltb ' and thickness Ltc ', is more preferably 80 ~ 120%.
And, in order to regulate the magneticflux-density on target material surface, such as, as shown in Fig. 5 (a), Fig. 5 (b) and Fig. 5 (c), also can remove the end 2a of the center pole parts forming described corner part, periphery pole piece 3c and consequent pole parts 8.Although the end 2a of the center pole parts of described corner part, periphery pole piece 3c and consequent pole parts 8 all can be removed, in order to the magneticflux-density on target material surface is adjusted to suitable size, also can by part removing wherein.When removing a part, preferred employing becomes symmetrical at two corner parts 30,30, additionally by center pole parts 2 major axis and become the structure of symmetrical (symmetrical becoming up and down of Fig. 5 (a)) with the face being orthogonal to target material surface.
(3) the 3rd structures
In described first structure, all can remove forming the center pole parts 2 of described line part 20, periphery pole piece 3 and vertical permanent magnet 4a with end 2a, the periphery pole piece 3c of center pole parts and vertical permanent magnet 5a forming described corner part 30, formation magnetron sputtering magnetic field generating arrangement as Suo Shi Fig. 6 (a), Fig. 6 (b) and Fig. 6 (c).
(B) permanent magnet
The permanent magnet forming line part and corner part can utilize well-known permanent magnet material to be formed.The material of permanent magnet material suitably can set according to the formation of equipment (magnetic field generating arrangement is to the distance of target) or required magneticstrength.In the present invention, the parallel component preferably selecting the magneticflux-density vertical component in the magnetic field of target material surface 7a to become the magneticflux-density of the position of zero becomes the permanent magnet of more than 10mT.
When hope obtains high magnetic flux density, the rare earth element magnet that use is the R-T-B system anisotropy sintered magnet of neccessary composition etc. with R (at least one in the rare earth element of Nd etc.), T (Fe or Fe and Co) and B (is considered from the viewpoint of erosion resistance, implement various surface-treated material), when required magneticflux-density is so not high, ferrite magnet is also passable.In addition, when hope changes the magneticflux-density of line part and corner part, respectively according to required magneticflux-density, the material of setting line part permanent magnet and corner part permanent magnet or size.
(C) pole piece
In pole piece, preferably use well-known magnetic substance (soft-magnetic body), particularly preferably use the magnetic steel of tool.
[2] other embodiment
By configuring multiple stage magnetic field generating arrangement of the present invention in parallel at predetermined intervals, target film forming on large-scale substrate of integration can be used.In addition, the component regulating the upper surface of magnetic field generating arrangement and the distance of target surface also can be set in magnetic field generating arrangement.
Embodiment
Although by embodiment to invention has been more detailed description, the present invention is not limited thereto.
Embodiment 1
As shown in Figure 10 (a) and Figure 10 (b), the substrate 6 that Al-Mg system alloy (A5052) makes configures the center pole parts 2 be made up of ferrite system stainless steel (SUS430), periphery pole piece 3 and the ferrite sintered magnet (NMF-12F that Hitachi Metals manufactures, relict flux density: approximately 450mT) line part permanent magnet unit 4 (the vertical permanent magnet 4a that formed, first horizontal permanent magnet 4b and the second horizontal permanent magnet 4c) and corner part permanent magnet unit 5 (vertical permanent magnet 5a, first horizontal permanent magnet 5b and the second horizontal permanent magnet 5c), manufacture magnetic field generating arrangement 1 (W=160mm thus, L=70mm, La=10mm, Lb=30mm, Lc=30mm, a=10mm, b=5mm and c=25mm).
Comparative example 1
As shown in Figure 11 (a) and Figure 11 (b), line part permanent magnet unit 4 and corner part permanent magnet unit 5 are replaced as line part permanent magnet 40 and corner part permanent magnet 50 respectively, in addition, manufactured magnetic field generating arrangement 1 (W=170mm, L=75mm, a=10mm, b=5mm and c=25mm) identically with embodiment 1.
Utilize magnetic field to resolve and obtain the magneticflux-density of magnetic field generating arrangement 1 surface (face opposed with target) at a distance of position (being equivalent to the position of the target material surface) place of 25mm with embodiment 1 and comparative example 1, as shown in Figure 12 (a) and Figure 12 (b), along A line (line part central authorities), B line (corner part), C line (corner part) and D line (corner part) obtain the component (magneticflux-density parallel component) parallel with the target material surface of described magneticflux-density and vertical component (magneticflux-density vertical component), and draw out Figure 13 (embodiment 1) and Figure 14 (comparative example 1).
In Figure 13 and Figure 14, due to line part permanent magnet 40 and corner part permanent magnet 50 are replaced as line part permanent magnet unit 4 and corner part permanent magnet unit 5, therefore, the magneticflux-density vertical component of the part opposed with center pole parts 2 (be near one side of 0mm with center distance apart) reduces, and the point that magneticflux-density vertical component becomes zero moves to center position.Can be predicted by these results: magnetic field generating arrangement of the present invention (embodiment 1) is compared with device (comparative example 1) in the past, the erosion of particularly opposed with the center pole parts 2 of target part is relatively promoted, and the utilising efficiency of target improves.
Claims (14)
1. a magnetron sputtering magnetic field generating arrangement, opposed with target and for producing magnetic field at target material surface, run-track shaped in what be made up of line part and corner part, it is characterized in that,
Have by the substrate that nonmagnetic material is formed:
The center pole parts of (a) linearity;
(b) periphery pole piece, it is set to described center pole parts enclose;
C () multiple vertical permanent magnet, is set between described center pole parts and described periphery pole piece: by described center pole parts enclose, and direction of magnetization is perpendicular to described target material surface;
D () multiple first horizontal permanent magnet, is set between described center pole parts with described vertical permanent magnet: the magnetic pole of a side is opposed with described center pole parts, and the magnetic pole of the opposing party is opposed with described vertical permanent magnet; And
E () multiple second horizontal permanent magnet, is set between described periphery pole piece with described vertical permanent magnet: the magnetic pole of a side is opposed with described periphery pole piece, and the magnetic pole of the opposing party is opposed with described vertical permanent magnet,
The pole of the side opposed with described vertical permanent magnet of described first horizontal permanent magnet and the second horizontal permanent magnet and the extremely identical of the side opposed with described target material surface of described vertical permanent magnet.
2. magnetron sputtering magnetic field generating arrangement according to claim 1, is characterized in that,
The total of the direction of magnetization length of described first horizontal permanent magnet and the second horizontal permanent magnet is 50 ~ 95% of the interval of described center pole parts and described periphery pole piece.
3. magnetron sputtering magnetic field generating arrangement according to claim 1 and 2, is characterized in that,
The thickness in the direction vertical with described target material surface of described first horizontal permanent magnet and the second horizontal permanent magnet is equal, when their described thickness is set to 100, the thickness in the direction vertical with described target material surface of described vertical permanent magnet is 0 ~ 150.
4. the magnetron sputtering magnetic field generating arrangement according to any one of claims 1 to 3, is characterized in that,
Forming the thickness in the direction vertical with described target material surface of the vertical permanent magnet of described corner part, the first horizontal permanent magnet and the second horizontal permanent magnet, is 30 ~ 100% of the thickness in the direction vertical with described target material surface of the vertical permanent magnet of the described line part of formation, the first horizontal permanent magnet and the second horizontal permanent magnet respectively.
5. magnetron sputtering magnetic field generating arrangement according to claim 4, is characterized in that,
Form the thickness in the direction vertical with described target material surface of the second horizontal permanent magnet of described corner part, thinner than the thickness in the direction vertical with described target material surface of the first horizontal permanent magnet of the described corner part of formation.
6. the magnetron sputtering magnetic field generating arrangement according to any one of Claims 1 to 5, is characterized in that,
Forming the vertical permanent magnet of described corner part, the first horizontal permanent magnet and the second horizontal permanent magnet, accounting for more than 30% of the area in the gap of described center pole parts and described periphery pole piece when overlooking.
7. magnetron sputtering magnetic field generating arrangement according to claim 6, is characterized in that,
The described center pole parts of described corner part are made up of described vertical permanent magnet, the first horizontal permanent magnet and the second horizontal permanent magnet pad with the nonmagnetic material of filling the part beyond described vertical permanent magnet, the first horizontal permanent magnet and the second horizontal permanent magnet with the gap of described periphery pole piece.
8. the magnetron sputtering magnetic field generating arrangement according to any one of claim 1 ~ 7, is characterized in that,
There is the structure of part or all removing in the end of the center pole parts by forming described corner part, periphery pole piece and vertical permanent magnet.
9. a magnetron sputtering magnetic field generating arrangement, opposed with target and for producing magnetic field at target material surface, run-track shaped in what be made up of line part and corner part, it is characterized in that,
Have by the substrate that nonmagnetic material is formed:
The center pole parts of (a) linearity;
(b) periphery pole piece, it is set to described center pole parts enclose;
(c) consequent pole parts, it is set to described center pole parts enclose between described center pole parts and described periphery pole piece;
D () multiple first horizontal permanent magnet, is set between described center pole parts with described consequent pole parts: the magnetic pole of a side is opposed with described center pole parts, and the magnetic pole of the opposing party is opposed with described consequent pole parts; And
E () multiple second horizontal permanent magnet, is set between described periphery pole piece with described consequent pole parts: the magnetic pole of a side is opposed with described periphery pole piece, and the magnetic pole of the opposing party is opposed with described consequent pole parts,
The side opposed with described consequent pole parts of described first horizontal permanent magnet and the second horizontal permanent magnet extremely identical.
10. magnetron sputtering magnetic field generating arrangement according to claim 9, is characterized in that,
The width of described consequent pole parts is the length of 10 ~ 75% of the thickness in the direction vertical with described target material surface of described first horizontal permanent magnet and the second horizontal permanent magnet.
11. magnetron sputtering magnetic field generating arrangement according to claim 9 or 10, is characterized in that,
The thickness in the direction vertical with described target material surface of described first horizontal permanent magnet and the second horizontal permanent magnet is equal, when their described thickness is set to 100, the thickness in the direction vertical with described target material surface of described consequent pole parts is 0 ~ 150.
12. magnetron sputtering magnetic field generating arrangement according to any one of claim 9 ~ 11, is characterized in that,
There is the structure of part or all removing in the end of the center pole parts by forming described corner part, periphery pole piece and consequent pole parts.
13. magnetron sputtering magnetic field generating arrangement according to any one of claim 1 ~ 12, is characterized in that,
When putting on the magnetic field of described target material surface for the direction detection orthogonal with direction of principal axis on described line part, the maximum value of the magneticflux-density in the direction parallel with described target material surface is larger than the magneticflux-density in the direction vertical with described target material surface of the part opposed with described center pole parts.
14. magnetron sputtering magnetic field generating arrangement according to any one of claim 1 ~ 13, is characterized in that,
Become the position of zero in the magneticflux-density in the direction vertical with described target material surface in the magnetic field putting on described target material surface, the magneticflux-density in the direction parallel with described target material surface is more than 10mT.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-027970 | 2013-02-15 | ||
| JP2013027970 | 2013-02-15 | ||
| PCT/JP2014/051380 WO2014125889A1 (en) | 2013-02-15 | 2014-01-23 | Magnetron sputtering magnetic field-generating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104919082A true CN104919082A (en) | 2015-09-16 |
| CN104919082B CN104919082B (en) | 2017-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480004542.4A Expired - Fee Related CN104919082B (en) | 2013-02-15 | 2014-01-23 | Magnetron sputtering magnetic field-generating device |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20150340211A1 (en) |
| JP (1) | JP6090422B2 (en) |
| KR (1) | KR20150117640A (en) |
| CN (1) | CN104919082B (en) |
| DE (1) | DE112014000416T5 (en) |
| WO (1) | WO2014125889A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022083677A1 (en) * | 2020-10-23 | 2022-04-28 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment, and process chamber therefor |
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| JPH04187766A (en) * | 1990-11-22 | 1992-07-06 | Tdk Corp | Magnetic circuit device for magnetron sputtering system |
| JPH08232063A (en) * | 1996-03-08 | 1996-09-10 | Aneruba Kk | Sputtering device |
| JP2008156735A (en) * | 2006-12-26 | 2008-07-10 | Hitachi Metals Ltd | Magnetic circuit for magnetron sputtering |
| CN102453882A (en) * | 2010-11-05 | 2012-05-16 | 信越化学工业株式会社 | Magnetic circuit for sputtering apparatus |
| WO2012165385A1 (en) * | 2011-05-30 | 2012-12-06 | 日立金属株式会社 | Racetrack-shape magnetic field generator for magnetron sputtering |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH02118750U (en) * | 1989-03-08 | 1990-09-25 | ||
| KR20140003570A (en) * | 2011-01-24 | 2014-01-09 | 히타치 긴조쿠 가부시키가이샤 | Magnetic field generation device for magnetron sputtering |
-
2014
- 2014-01-23 KR KR1020157017344A patent/KR20150117640A/en not_active Application Discontinuation
- 2014-01-23 WO PCT/JP2014/051380 patent/WO2014125889A1/en active Application Filing
- 2014-01-23 JP JP2015500169A patent/JP6090422B2/en active Active
- 2014-01-23 DE DE112014000416.2T patent/DE112014000416T5/en not_active Withdrawn
- 2014-01-23 CN CN201480004542.4A patent/CN104919082B/en not_active Expired - Fee Related
- 2014-01-23 US US14/758,624 patent/US20150340211A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04187766A (en) * | 1990-11-22 | 1992-07-06 | Tdk Corp | Magnetic circuit device for magnetron sputtering system |
| JPH08232063A (en) * | 1996-03-08 | 1996-09-10 | Aneruba Kk | Sputtering device |
| JP2008156735A (en) * | 2006-12-26 | 2008-07-10 | Hitachi Metals Ltd | Magnetic circuit for magnetron sputtering |
| JP4509097B2 (en) * | 2006-12-26 | 2010-07-21 | 日立金属株式会社 | Magnetic circuit for magnetron sputtering |
| CN102453882A (en) * | 2010-11-05 | 2012-05-16 | 信越化学工业株式会社 | Magnetic circuit for sputtering apparatus |
| WO2012165385A1 (en) * | 2011-05-30 | 2012-12-06 | 日立金属株式会社 | Racetrack-shape magnetic field generator for magnetron sputtering |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022083677A1 (en) * | 2020-10-23 | 2022-04-28 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment, and process chamber therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014125889A1 (en) | 2014-08-21 |
| JP6090422B2 (en) | 2017-03-08 |
| DE112014000416T5 (en) | 2015-10-15 |
| CN104919082B (en) | 2017-05-10 |
| US20150340211A1 (en) | 2015-11-26 |
| KR20150117640A (en) | 2015-10-20 |
| JPWO2014125889A1 (en) | 2017-02-02 |
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