CN104900787A - Assembly type quantum dot light emitting device - Google Patents

Assembly type quantum dot light emitting device Download PDF

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Publication number
CN104900787A
CN104900787A CN201510178979.6A CN201510178979A CN104900787A CN 104900787 A CN104900787 A CN 104900787A CN 201510178979 A CN201510178979 A CN 201510178979A CN 104900787 A CN104900787 A CN 104900787A
Authority
CN
China
Prior art keywords
light
conversion sheet
quantum dot
light emitting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510178979.6A
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Chinese (zh)
Inventor
曹进
张雪
周洁
谢婧薇
陈赟汉
陈安平
魏翔
张建华
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University of Shanghai for Science and Technology
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University of Shanghai for Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Shanghai for Science and Technology filed Critical University of Shanghai for Science and Technology
Priority to CN201510178979.6A priority Critical patent/CN104900787A/en
Publication of CN104900787A publication Critical patent/CN104900787A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to an assembly type quantum dot light emitting device which comprises a substrate, a light emitting chip and a light conversion piece, wherein the light emitting chip is packaged on the substrate, the light conversion piece contains a quantum dot material and is detachably assembled on the substrate, and light emitted by the light emitting chip passes the light conversion piece. The quantum dot light emitting device of the detachable structure can add quantum dots into the single-layer light conversion piece, different light conversion pieces can be detached and replaced according to requirements to emit light of different colors, different single-layer light conversion pieces can be combined to realize photoinduced light emission and further to obtain required color, the single device can realize conversion among different colors, and resource is saved.

Description

Assembly type quantum dot light emitting device
Technical field
The present invention relates to semiconductor light emitting display field, particularly relate to a kind of modular color light emitting device.
Background technology
Light emitting diode with quantum dots is the new technique between liquid crystal and OLED, and principle is the light being excited other colors by blue lED light source irradiation quantum dot, and it has, and cost is low, the advantage such as high brightness and low-power consumption and cause the concern of people.
The luminescence generated by light quantum dot device of current making, mixes Homogeneous phase mixing by different quantum dot with ratio certain accordingly and silica gel according to the different demand of light, is coated on LED chip and makes.Make the photic device obtained, color is certain, then needing to change another device, causing the waste of resource, causing the rising of operation cost in the place that the lighting needs amounts such as stage are large as needed other colors.
Summary of the invention
Based on this, be necessary the problem for the wasting of resources, a kind of modular quantum luminescent device is provided.
A kind of assembly type quantum dot light emitting device, comprising: substrate; Luminescence chip, luminescence chip is encapsulated on substrate; Light conversion sheet, comprises quanta point material in described smooth conversion sheet, removably assembles on the substrate; The light that described luminescence chip sends is by described smooth conversion sheet.
Wherein in an embodiment, light conversion sheet is multi-disc, is layered on described luminescence chip.
Wherein in an embodiment, light conversion sheet is made up of silica gel, and described quanta point material is entrained in described silica gel.
Wherein in an embodiment, light conversion sheet is laminated structure, and described smooth conversion sheet both sides are provided with retention mechanism, and described smooth conversion sheet is installed on the substrate by described retention mechanism.
Wherein in an embodiment, retention mechanism is screw, and described smooth conversion sheet both sides are provided with coaxial screw with described substrate, and described screw is inserted in described screw, and described smooth conversion sheet is sleeved on described screw and also fixes on the substrate.
Wherein in an embodiment, luminescence chip is blue-light LED chip.
Above-mentioned quantum luminescent device, different quantum dots is added to respectively the light conversion sheet of individual layer, and manufacture demountable structure, dismantle according to demand and change the light that different light conversion sheet sends different colours, also may be combined with various individual layer light conversion sheet in addition, luminescence generated by light obtains the color needed, and same device can realize multicoloured conversion, economizes on resources.
Accompanying drawing explanation
Fig. 1 is the assembly type quantum dot light emitting device architecture schematic diagram that the present invention proposes;
Fig. 2 is the structural representation of light conversion sheet 300 in Fig. 1;
Fig. 3 is assembly type quantum dot light emitting device architecture vertical view in the 3rd embodiment;
Fig. 4 is assembly type quantum dot light emitting device architecture vertical view in the 4th embodiment;
Fig. 5 is the structural representation of securing member in Fig. 1.
Embodiment
For enabling object of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar improvement when intension of the present invention, therefore the present invention is by the restriction of following public concrete enforcement.
See Fig. 1.The assembly type quantum dot light emitting device that the present invention proposes comprises substrate 100, chip 200, light conversion sheet 300.
Chip 200 is emitting LED chip, and encapsulation on the substrate 100.Substrate 100 digs fluted, groove holds chip 200 just, chip 200 encapsulates layer of transparent lid, and transparent cover body can be the material such as glass, silica gel, in the groove that chip 200 is encapsulated on the substrate 100.
See Fig. 2.Light conversion sheet 300 is layer structure, and entirety is lengthy motion picture shape, and material of main part is silica gel, is wherein mixed with quanta point material in silica gel, and light inspires the light of designated color after getting to quanta point material.Light conversion sheet 300 monolithic or multi-disc pile up on chip 200 stackedly, and the light of chip 200 changes photochromic, colour temperature etc. through light conversion sheet 300.
Assembly type quantum dot light emitting devices use luminescence generated by light principle of the present invention, the light of chip 200 is penetrated by the light conversion sheet 300 containing quanta point material, change the color of light, change different quanta point material light conversion sheet 300, utilize equally same luminescence chip 200 and without the need to changing whole lamp, saving resource.One deck light conversion sheet 300 can be installed separately, realize different monochrome and send, also can combine multi-disc light conversion sheet 300, send white light.
Embodiment one
Base plate for packaging 100 encapsulates blue-light LED chip 200 in advance, and the light conversion sheet 300 of a slice doping green quantum dot is installed on blue-light LED chip 200, the blue light that blue-light LED chip 200 sends, by after this light conversion sheet 300, sends green glow, with original blue-light excited, finally send gold-tinted.
Embodiment two
Base plate for packaging 100 encapsulates blue-light LED chip 200 in advance, and two panels light conversion sheet 300 is installed on blue-light LED chip 200, two panels light conversion sheet 300 is respectively the adulterate light conversion sheet of green quantum dot and a slice of a slice and adulterates the light conversion sheet of red quantum point, wherein green quantum dot light conversion sheet is arranged on blue-light LED chip 200, and red quantum point light conversion sheet is superimposed upon in green quantum dot light conversion sheet.The blue light that blue-light LED chip 200 sends is first by green quantum dot light conversion sheet, inspire green glow and blue light, green glow and blue light are through red quantum point light conversion sheet, blue light illumination inspires ruddiness on red quantum point, and part green glow and blue light penetrate through the gap red quantum point, last red, green, blue three kinds of colors finally form white light.
In one preferably synthesize white light embodiment, blue-light LED chip is adopted to be luminescence chip 200, red quantum point, green quantum dot light conversion sheet are stacked on blue-ray LED from top to down, and various quantum dot is distributed in the specific region of corresponding light conversion sheet 300, the proportional relation of area size.Be 1 unit with the light-emitting area of blue-ray LED, then light-emitting area ratio is: blue 1: green 0.5 ~ 0.6: red 0.07 ~ 0.1, can send the white light with higher colour developing coefficient with the configuration of this area.
Embodiment three
See Fig. 3.Luminescence chip 200 and light conversion sheet 300 are rectangle, red quantum point and green quantum dot are distributed in one jiao of light conversion sheet, wherein red quantum point is distributed in the upper left corner of light conversion sheet, green quantum dot is distributed in the lower right corner of light conversion sheet, and all the other regions of light conversion sheet are transparent silica gel material.Under vertical view, the part light-emitting area of red quantum point region and green quantum dot region overlay blue-ray LED.
Embodiment four
See Fig. 4.Luminescence chip 200 and light conversion sheet 300 are circle, wherein red quantum point and green quantum dot are that donut is arranged, the part light-emitting area of red quantum point region and green quantum dot region overlay blue-ray LED, under vertical view, be blue-light-emitting face, green quantum null circle ring and red quantum point annulus from outside to inside respectively, wherein the radius scale of three is: blue 1: green 0.5 ~ 0.6: red 0.07 ~ 0.1.
In addition, red quantum point and green quantum dot can be distributed in same a slice light conversion sheet 300 simultaneously, identical with upper embodiment three, upper embodiment four under vertical view.
Blue light can directly emit through transparent silica gel, and has the region of red quantum point or green quantum dot by blue-light excited ruddiness or the green glow of being formed, and namely finally red, blue, green three kinds of color of light mixing forms white light.This kind of configuration can be applicable in the place had higher requirements to white light, adopt blue quantum dot, green quantum dot and red quantum point that quantity reduces successively, the consumption of the blue light that light that blue quantum dot sends is partially absorbed by red quantum point and green quantum dot and causes can be offset, light that green quantum dot sends can also be offset absorbed by red quantum point and the consumption of green light that causes simultaneously, mix the light that the blue quantum dot of formation, red quantum point and green quantum dot send therefrom and just can send soft white light, the white light that namely index access is good.
The both sides of light conversion sheet 300 are provided with retention mechanism 310.Light conversion sheet 300 is installed on the substrate 100 by retention mechanism 310, and realizes the stacked fixing of light conversion sheet 300.
See Fig. 5.In one embodiment, retention mechanism 310 specifically comprises screw 311 and screw 312, wherein every sheet light conversion plate 300 homonymy has coaxial screw 311, substrate 100 also offers the screw 311 of coupling, when multi-disc light conversion sheet 300 is stacked, screw 311 is coaxial, and screw 312 inserts screw 311, end fixedly mounts on the substrate 100, the common fixed light conversion sheet 300 of both sides screw.
In addition, retention mechanism 310 can also be the snap-in structure of other non-screw-type, such as buckle, card column etc., both can be inserted on the substrate 100 of lower one deck or the retention mechanism 310 of light conversion sheet 300, also can allow last layer retention mechanism 310 plug-in mounting thereon.Each light conversion sheet 300 except the quantum dot kind of centre or distributed areas different, all the other structures are identical.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.

Claims (6)

1. an assembly type quantum dot light emitting device, is characterized in that, comprising:
Substrate;
Luminescence chip, described luminescence chip encapsulation is on the substrate;
Light conversion sheet, comprises quanta point material in described smooth conversion sheet, removably assembles on the substrate;
The light that described luminescence chip sends is by described smooth conversion sheet.
2. assembly type quantum dot light emitting device according to claim 1, is characterized in that, described smooth conversion sheet is multi-disc, is layered on described luminescence chip.
3. assembly type quantum dot light emitting device according to claim 2, is characterized in that, described smooth conversion sheet is made up of silica gel, and described quanta point material is entrained in described silica gel.
4. the assembly type quantum dot light emitting device according to Claims 2 or 3, is characterized in that, described smooth conversion sheet is laminated structure, and described smooth conversion sheet both sides are provided with retention mechanism, and described smooth conversion sheet is installed on the substrate by described retention mechanism.
5. assembly type quantum dot light emitting device according to claim 4, it is characterized in that, described retention mechanism is screw, described smooth conversion sheet both sides are provided with coaxial screw with described substrate, described screw is inserted in described screw, and described smooth conversion sheet is sleeved on described screw and also fixes on the substrate.
6. assembly type quantum dot light emitting device according to claim 5, is characterized in that, described luminescence chip is blue-light LED chip.
CN201510178979.6A 2015-04-15 2015-04-15 Assembly type quantum dot light emitting device Pending CN104900787A (en)

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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106918941A (en) * 2015-11-26 2017-07-04 三星显示有限公司 Quantum dot colour filter and the display device including the quantum dot colour filter
CN111095581A (en) * 2017-06-30 2020-05-01 康宁公司 Quantum dot LED backlight module for LED display

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201166320Y (en) * 2007-10-18 2008-12-17 冯雪元 White light LED
CN104253205A (en) * 2013-06-28 2014-12-31 三星电子株式会社 Semiconductor light emitting device and method for manufacturing light source module
CN204204899U (en) * 2014-11-05 2015-03-11 创维液晶器件(深圳)有限公司 A kind of high-color rendering white-light exempts from packaged LED
US20150077970A1 (en) * 2013-09-13 2015-03-19 Samsung Display Co., Ltd. Light source, a method of manufacturing the same, and a backlight unit having the same
TW201513391A (en) * 2013-09-29 2015-04-01 Advanced Optoelectronic Tech Light emitting diode

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201166320Y (en) * 2007-10-18 2008-12-17 冯雪元 White light LED
CN104253205A (en) * 2013-06-28 2014-12-31 三星电子株式会社 Semiconductor light emitting device and method for manufacturing light source module
US20150077970A1 (en) * 2013-09-13 2015-03-19 Samsung Display Co., Ltd. Light source, a method of manufacturing the same, and a backlight unit having the same
TW201513391A (en) * 2013-09-29 2015-04-01 Advanced Optoelectronic Tech Light emitting diode
CN204204899U (en) * 2014-11-05 2015-03-11 创维液晶器件(深圳)有限公司 A kind of high-color rendering white-light exempts from packaged LED

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106918941A (en) * 2015-11-26 2017-07-04 三星显示有限公司 Quantum dot colour filter and the display device including the quantum dot colour filter
CN111095581A (en) * 2017-06-30 2020-05-01 康宁公司 Quantum dot LED backlight module for LED display

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Application publication date: 20150909