CN104896908B - Semiconductor oven nitrogen gas adjusting device - Google Patents
Semiconductor oven nitrogen gas adjusting device Download PDFInfo
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- CN104896908B CN104896908B CN201510237039.XA CN201510237039A CN104896908B CN 104896908 B CN104896908 B CN 104896908B CN 201510237039 A CN201510237039 A CN 201510237039A CN 104896908 B CN104896908 B CN 104896908B
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Abstract
The invention discloses a nitrogen adjusting device of a semiconductor oven, which comprises a box body, a front door, a support, an inner container, an air inlet interface, a nitrogen adjusting valve, an air inlet pipe, an air outlet interface, an air outlet pipe, a fan and a tray. The device simple structure adjusts linear electric motor turned angle and can transfer the agent nitrogen gas input to realize that the nitrogen gas input is adjusted, evenly distributed blows in the hole at the nitrogen gas of inner bag inner wall left and right sides and makes nitrogen gas evenly distributed in the inner bag, effectively protects the semiconductor, improves the finished product qualification rate greatly, improves economic benefits.
Description
Technical Field
The invention relates to a semiconductor oven device, in particular to a nitrogen adjusting device of a semiconductor oven.
Background
At present, when a semiconductor is produced, a semi-finished semiconductor product needs to be dried, and the semi-finished semiconductor product is very easy to oxidize when being dried in the air, so that when the semi-finished semiconductor product is industrially produced, nitrogen is added into an oven to prevent the semi-finished semiconductor product from being oxidized, the nitrogen air inflow of the traditional oven cannot be adjusted, and the nitrogen is not uniformly distributed in the oven, so that the semi-finished semiconductor product cannot be effectively protected. In view of the above-mentioned drawbacks, it is actually necessary to design a nitrogen gas regulating device for a semiconductor oven.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the utility model provides a semiconductor oven nitrogen gas adjusting device to solve traditional oven nitrogen gas air input and can't adjust, and nitrogen gas distributes inhomogeneous problem in the oven.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a nitrogen adjusting device of a semiconductor oven comprises a box body, a front door, a support, a liner, an air inlet interface, a nitrogen adjusting valve, an air inlet pipe, an air outlet interface, an air outlet pipe, a fan and a tray, wherein the front door is positioned at the front end of the box body and is connected with a hinge of the box body, the support is positioned at the bottom of the outer wall of the box body, the support is connected with the box body in a welding way, the liner is positioned inside the box body, the liner is connected with the box body in a welding way, the air inlet interface is positioned at the center of the bottom of the outer wall of the box body and is connected with the box body in a welding way, the nitrogen adjusting valve is positioned at the lower end of the air inlet interface, the nitrogen adjusting valve is connected with the air inlet interface in a threaded way, the air inlet pipe is positioned at the lower end of the nitrogen adjusting valve, the air outlet pipe is positioned at the upper end of the air outlet connector, the air outlet pipe is in threaded connection with the air outlet connector, the fan is positioned at the tail end of the air outlet pipe, the fan is in threaded connection with the air outlet pipe, the tray is positioned inside the inner container, and the tray is in sliding connection with the inner container.
The invention is further improved as follows:
further, the inner bag inner wall left and right sides still be equipped with the nitrogen and blow the hole, the nitrogen blow the hole and be a plurality of, equipartition and inner bag inner wall, evenly distributed blows in the hole at the nitrogen gas of inner bag inner wall for the inside nitrogen gas evenly distributed of inner bag.
Furthermore, the number of the trays is preferably 3, the trays are uniformly distributed on the inner wall of the inner container, and the trays are used for placing semiconductors.
Further, the tray still be equipped with the semiconductor standing groove, the semiconductor standing groove runs through the tray main part, the semiconductor standing groove is a plurality of, and the equipartition is on the tray surface, and the semiconductor is placed in the semiconductor standing groove, and nitrogen gas can be with the whole parcels of semiconductor, effectively protects the semiconductor.
Furthermore, the nitrogen regulating valve further comprises a first valve body, a second valve body, a linear motor, a lead screw and a valve core, wherein the second valve body is positioned at the upper end of the first valve body, the second valve body is in threaded connection with the first valve body, the linear motor is positioned at the upper end of the first valve body and is positioned at the lower end of the second valve body, the linear motor is in threaded connection with the first valve body and is in threaded connection with the second valve body, the lead screw penetrates through the linear motor, the lead screw is in threaded connection with the linear motor, the valve core is positioned at one end of the lead screw, and the valve core is tightly matched and connected with the lead screw.
Furthermore, the first valve body is also provided with a groove, a sealing ring is bonded in the groove of the first valve body, and the sealing ring effectively seals the contact surface of the valve core and the first valve body.
Compared with the prior art, this semiconductor oven nitrogen gas adjusting device, during operation, linear electric motor passes through the lead screw and drives the case and be linear motion for in nitrogen gas gets into the cavity between inner bag and the box through nitrogen gas governing valve, because the inner bag is provided with the nitrogen gas and blows the hand-hole, inside nitrogen gas gets into the inner bag through nitrogen gas insufflation hole, fan work simultaneously, make nitrogen gas inside the inner bag from bottom to top through the box that is discharged behind every semiconductor. The device simple structure adjusts linear electric motor turned angle and can transfer the agent nitrogen gas input to realize that the nitrogen gas input is adjusted, evenly distributed blows in the hole at the nitrogen gas of inner bag inner wall left and right sides and makes nitrogen gas evenly distributed in the inner bag, effectively protects the semiconductor, improves the finished product qualification rate greatly, improves economic benefits.
Drawings
FIG. 1 shows a front view of the invention
FIG. 2 shows an isometric view of the case of the present invention
FIG. 3 shows an exploded view of a nitrogen control valve of the present invention
Front door 2 of box 1
Tray 11 nitrogen gas blowing hole 401
Detailed Description
As shown in fig. 1, 2 and 3, the nitrogen adjusting device for the semiconductor oven comprises a box body 1, a front door 2, a support 3, a liner 4, an air inlet connector 5, a nitrogen adjusting valve 6, an air inlet pipe 7, an air outlet connector 8, an air outlet pipe 9, a fan 10 and a tray 11, wherein the front door 2 is positioned at the front end of the box body 1, the front door 2 is hinged with the box body 1, the support 3 is positioned at the bottom of the outer wall of the box body 1, the support 3 is welded with the box body 1, the liner 4 is positioned inside the box body 1, the liner 4 is welded with the box body 1, the air inlet connector 5 is positioned at the center of the bottom of the outer wall of the box body 1, the air inlet connector 5 is welded with the box body 1, the nitrogen adjusting valve 6 is positioned at the lower end of the air inlet connector 5, the nitrogen adjusting valve 6 is in threaded connection with the air inlet connector 5, the air, the gas inlet pipe 7 is in threaded connection with the nitrogen regulating valve 6, the gas outlet port 8 is positioned at the center of the outer wall of the liner 4, the gas outlet port 8 is in welded connection with the liner 4, the gas outlet pipe 9 is positioned at the upper end of the gas outlet port 8, the gas outlet pipe 9 is in threaded connection with the gas outlet port 8, the fan 10 is positioned at the tail end of the gas outlet pipe, the fan 10 is in threaded connection with the gas outlet pipe 9, the tray 11 is positioned inside the liner 4, the tray 11 is in sliding connection with the liner 4, nitrogen blowing holes 401 are further arranged on the left side and the right side of the inner wall of the liner 4, the nitrogen blowing holes 401 are a plurality of pieces, are uniformly distributed on the inner wall of the liner 4, nitrogen inside the liner 4 is uniformly distributed, the number of the trays 11 is a plurality of pieces, the number of the trays 11 is preferably 3, and are uniformly distributed on the inner wall of the liner 4, the tray 11 is used for placing semiconductors, the tray 11 is further provided with a semiconductor placing groove 1101, the semiconductor placing groove 1101 penetrates through the tray main body, the semiconductor placing groove 1101 is a plurality of pieces and is uniformly distributed on the surface of the tray 11, the semiconductors are placed in the semiconductor placing groove 1101, nitrogen can completely wrap the semiconductors to effectively protect the semiconductors, the nitrogen regulating valve 6 further comprises a first valve body 601, a second valve body 602, a linear motor 603, a lead screw 604 and a valve core 605, the second valve body 602 is positioned at the upper end of the first valve body 601, the second valve body 602 is in threaded connection with the first valve body 601, the linear motor 603 is positioned at the upper end of the first valve body 601 and is positioned at the lower end of the second valve body 602, the linear motor 603 is in threaded connection with the first valve body 601 and is in threaded connection with the second valve body 602, the lead screw 604 penetrates through the linear motor 603, and the lead screw 604 is in threaded connection with the linear motor 603, the valve core 605 is located at one end of the screw 604, the valve core 605 is tightly matched and connected with the screw 604, the first valve body 601 is further provided with a groove, a sealing ring 606 is bonded in the groove of the first valve body 601, the sealing ring 606 effectively seals the contact surface of the valve core 605 and the first valve body 601, and when the semiconductor oven nitrogen adjusting device works, the linear motor 603 drives the valve core 605 to do linear motion through the screw 604, so that nitrogen enters a cavity between the inner container 4 and the box body 1 through the nitrogen adjusting valve 6, and because the inner container 4 is provided with the nitrogen blowing hole 401, the nitrogen enters the inner container 4 through the nitrogen blowing hole 401, and meanwhile, the fan 10 works, so that the nitrogen is discharged out of the box body 1 from bottom to top through each semiconductor in the inner container 4. The device simple structure adjusts linear electric motor 603 turned angle and can transfer the agent nitrogen gas input to realize that the nitrogen gas input is adjusted, evenly distributed blows in hole 401 at the nitrogen gas of the 4 inner walls left and right sides of inner bag and makes nitrogen gas evenly distributed in inner bag 4, effectively protects the semiconductor, improves the finished product qualification rate greatly, improves economic benefits.
The present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make various modifications without creative efforts from the above-described conception, and fall within the scope of the present invention.
Claims (1)
1. A nitrogen adjusting device of a semiconductor oven comprises a box body, a front door and a support, and is characterized by further comprising a liner, an air inlet interface, a nitrogen adjusting valve, an air inlet pipe, an air outlet interface, an air outlet pipe, a draught fan and a tray, wherein the front door is positioned at the front end of the box body, the front door is connected with a hinge of the box body, the support is positioned at the bottom of the outer wall of the box body, the support is connected with the box body in a welding manner, the liner is positioned inside the box body, the liner is connected with the box body in a welding manner, the air inlet interface is positioned at the center of the bottom of the outer wall of the box body, the air inlet interface is connected with the box body in a welding manner, the nitrogen adjusting valve is positioned at the lower end of the air inlet interface, the nitrogen adjusting valve is connected with the air inlet interface in, the air outlet connector is connected with the inner container in a welding mode, the air outlet pipe is located at the upper end of the air outlet connector and is in threaded connection with the air outlet connector, the draught fan is located at the tail end of the air outlet pipe and is in threaded connection with the air outlet pipe, the tray is located inside the inner container and is in sliding connection with the inner container; the left side and the right side of the inner wall of the inner container are also provided with a plurality of nitrogen blowing holes which are uniformly distributed on the inner wall of the inner container; the tray is also provided with a semiconductor placing groove, the semiconductor placing groove penetrates through the tray main body, and the semiconductor placing grooves are uniformly distributed on the surface of the tray; the nitrogen regulating valve also comprises a first valve body, a second valve body, a linear motor, a screw rod and a valve core, wherein the second valve body is positioned at the upper end of the first valve body, the second valve body is in threaded connection with the first valve body, the linear motor is positioned at the upper end of the first valve body and is positioned at the lower end of the second valve body, the linear motor is in threaded connection with the first valve body and is in threaded connection with the second valve body, the screw rod penetrates through the linear motor, the screw rod is in threaded connection with the linear motor, the valve core is positioned at one end of the screw rod, and the valve core is in tight fit connection with the screw rod; the first valve body is also provided with a groove, and a sealing ring is bonded in the groove of the first valve body;
when the nitrogen-nitrogen gas injection device works, the linear motor drives the valve core to do linear motion through the lead screw, so that nitrogen enters a cavity between the inner container and the box body through the nitrogen adjusting valve, the inner container is provided with a nitrogen blowing hole, the nitrogen enters the inner container through the nitrogen blowing hole, and meanwhile, the fan works, so that the nitrogen passes through each semiconductor from bottom to top in the inner container and is discharged out of the box body; the device simple structure adjusts linear electric motor turned angle and can transfers the agent nitrogen gas input to realize that the nitrogen gas input is adjusted, evenly distributed makes nitrogen gas evenly distributed in the inner bag in the nitrogen gas blowin hole of the inner bag inner wall left and right sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510237039.XA CN104896908B (en) | 2015-05-11 | 2015-05-11 | Semiconductor oven nitrogen gas adjusting device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510237039.XA CN104896908B (en) | 2015-05-11 | 2015-05-11 | Semiconductor oven nitrogen gas adjusting device |
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| CN104896908A CN104896908A (en) | 2015-09-09 |
| CN104896908B true CN104896908B (en) | 2020-03-06 |
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| CN105977189A (en) * | 2016-06-20 | 2016-09-28 | 刘玉忠 | Diode chip baking device |
| CN107435743A (en) * | 2017-07-13 | 2017-12-05 | 河南桔景林农业科技发展有限公司 | A kind of bin outlet gate valve structure |
| CN111947446A (en) * | 2020-08-21 | 2020-11-17 | 吉林农业大学 | Semiconductor oven nitrogen gas adjusting device |
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| CN2325739Y (en) * | 1996-12-26 | 1999-06-23 | 合肥工业大学 | High temp. sinter box with protective atmosphere |
| KR100413517B1 (en) * | 2001-03-02 | 2003-12-31 | 황홍철 | Dehumidifying drier controlled nitrogen |
| CN2863733Y (en) * | 2005-12-14 | 2007-01-31 | 天津市纽普兰环保发展有限公司 | Special ratio control valve for powdery material conveying system |
| CN200989463Y (en) * | 2006-11-20 | 2007-12-12 | 李建忠 | Flow regulating valve |
| CN203083331U (en) * | 2013-02-05 | 2013-07-24 | 浙江美诺华药物化学有限公司 | Steam heating drying box with inside airflow evenly distributed |
| CN204757629U (en) * | 2015-05-11 | 2015-11-11 | 池州华钛半导体有限公司 | Semiconductor oven nitrogen gas adjusting device |
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Effective date of registration: 20200122 Address after: 247099 Electronic Information Industry Park No. 10, Chizhou economic and Technological Development Zone, Anhui Applicant after: CHIZHOU HISEMI ELECTRONIC TECHNOLOGY CO.,LTD. Address before: 247000 Anhui city of Chizhou Province Economic and Technological Development Zone Jinan Industrial Park Electronic Information Industrial Park No. 8 standard workshop Applicant before: NATIONT SEMICONDUCTOR Co.,Ltd. |
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Address after: 247099 Electronic Information Industrial Park 10, Chizhou economic and Technological Development Zone, Anhui Patentee after: Chizhou Huayu Electronic Technology Co.,Ltd. Address before: 247099 Electronic Information Industrial Park 10, Chizhou economic and Technological Development Zone, Anhui Patentee before: CHIZHOU HISEMI ELECTRONIC TECHNOLOGY Co.,Ltd. |
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Denomination of invention: A kind of semiconductor oven nitrogen regulating device Effective date of registration: 20220916 Granted publication date: 20200306 Pledgee: China Co. truction Bank Corp Chizhou branch Pledgor: Chizhou Huayu Electronic Technology Co.,Ltd. Registration number: Y2022980015312 |