CN104882526A - Integrated LED packaging light source fluorescent tube - Google Patents
Integrated LED packaging light source fluorescent tube Download PDFInfo
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- CN104882526A CN104882526A CN201510335796.0A CN201510335796A CN104882526A CN 104882526 A CN104882526 A CN 104882526A CN 201510335796 A CN201510335796 A CN 201510335796A CN 104882526 A CN104882526 A CN 104882526A
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- 238000004806 packaging method and process Methods 0.000 title description 4
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000012790 adhesive layer Substances 0.000 claims description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 14
- 241000218202 Coptis Species 0.000 claims 5
- 235000002991 Coptis groenlandica Nutrition 0.000 claims 5
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 10
- 239000007787 solid Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
一体式LED封装光源日光灯管,包括LED模板、驱动模块(4)、灯头固定架、灯头和灯罩,LED模块包括LED基板和PCB板,LED基板包括固晶平台和扣合平台,PCB板安装在扣合平台上,通过固定片同时卡扣在卡位槽A和卡位槽B上而固定;LED裸芯片通过键合金线连接到对应的金线键合区,LED裸芯片和金线键合区上覆盖有荧光胶层,下基架上设有卡槽,驱动模块卡在卡槽内;下基架底部设有凸起,LED模块安装在下基架底部,凸起扣在配位孔A和配位孔B内;螺丝穿过圆孔和螺孔将灯头与固定柱紧固;上弧架的顶面和下基架两侧面粘于灯罩内壁。灯头连接驱动模块,驱动模块连接PCB板。实现一体化封装,并且提高结构紧凑型,便于安装和拆卸,降低材料成本,延长日光灯寿命。
Integrated LED packaged light source fluorescent tube, including LED template, driver module (4), lamp cap holder, lamp cap and lampshade, LED module includes LED substrate and PCB board, LED substrate includes solid crystal platform and buckle platform, PCB board is installed on On the fastening platform, the fixed piece is fastened on the slot A and the slot B at the same time; the LED bare chip is connected to the corresponding gold wire bonding area through the bonding gold wire, and the LED bare chip and the gold wire are bonded The area is covered with a fluorescent glue layer, and the lower base frame is provided with a card slot, and the drive module is stuck in the card slot; there is a protrusion at the bottom of the lower base frame, and the LED module is installed at the bottom of the lower base frame, and the protrusion is buckled in the coordination hole A and in the coordination hole B; the screw passes through the round hole and the screw hole to fasten the lamp cap and the fixing column; the top surface of the upper arc frame and the two sides of the lower base frame are glued to the inner wall of the lampshade. The lamp head is connected to the driving module, and the driving module is connected to the PCB board. The integrated package is realized, and the compact structure is improved, the installation and disassembly are convenient, the material cost is reduced, and the service life of the fluorescent lamp is prolonged.
Description
技术领域 technical field
本发明属于LED日光灯,尤其与一体式LED封装光源日光灯管结构有关。 The invention belongs to LED fluorescent lamps, and in particular relates to the fluorescent tube structure of an integrated LED packaged light source.
背景技术 Background technique
现阶段LED光源封装和LED灯管来源方式是:将LED芯片用胶水表贴于带有杯状电极金属或其他基板表面,然后用极细的金属导线将LED芯片电极连接至基板电极,利用高折射率胶体填充整个基板,起到保护作用,在此基础上便得到一个可以发光的LED元件,然后将单颗的LED元件利用串并联的方式通过回流焊或其他焊接方式固定在PCB板上,再利用开关电源或阻容降压方式提供正常稳定的工作条件,装入管状外壳内,两头分别固定G13灯头,便得到了LED灯管;现阶段封装与LED灯管应用技术,当光线照度集中或小角度照射范围时,就需要在灯管外部灯架之上加装反光罩来控制光线的照射方向;虽然该方法也能实现光线小角度照射使光线照射范围聚中,同时也大量的损失了LED亮度,也增加了灯具成本;而且现目前技术存在着设备投入多,加工工序繁琐便造成了成本居高不下的重要原因。同时将封装好的LED元件通过再次焊接的工艺表贴于PCB基板之上,此工序又增加了LED基板和PCB板之间的热阻,大大降低了LED正常使用寿命。因此,需要开发一种节省工艺成本,降低LED日光灯热阻,可延长LED日光灯使用寿命,且可控制光线照射角度的新型日光灯结构。 At this stage, the LED light source package and the source of the LED lamp tube are as follows: the LED chip is glued to the surface of the metal or other substrate with the cup-shaped electrode, and then the LED chip electrode is connected to the substrate electrode with a very thin metal wire. The refractive index colloid fills the entire substrate to play a protective role. On this basis, a LED element that can emit light is obtained, and then a single LED element is fixed on the PCB board by reflow soldering or other soldering methods in series and parallel. Then use the switching power supply or the resistance-capacitance step-down method to provide normal and stable working conditions, put it into the tubular shell, fix the G13 lamp caps at both ends, and then get the LED lamp; at the current stage of packaging and LED lamp application technology, when the light intensity is concentrated Or small-angle irradiation range, it is necessary to install a reflector on the lamp frame outside the lamp tube to control the direction of light irradiation; although this method can also achieve light irradiation at small angles to focus the light irradiation range, but also a lot of loss The brightness of the LED is increased, and the cost of the lamp is also increased; and the current technology has a large investment in equipment and cumbersome processing procedures, which have caused an important reason for the high cost. At the same time, the packaged LED components are surface-attached on the PCB substrate through the re-welding process. This process increases the thermal resistance between the LED substrate and the PCB board, greatly reducing the normal service life of the LED. Therefore, it is necessary to develop a novel fluorescent lamp structure that saves process costs, reduces the thermal resistance of the LED fluorescent lamp, prolongs the service life of the LED fluorescent lamp, and can control the angle of light irradiation.
另一方面,现有的LED日光灯结构不够紧凑,且内部各部件的固定多采用螺丝,虽然起到了稳定结构的作用,但是成本增加、且装配繁琐、拆卸不便。因此,需要减少螺丝使用,降低制作成本,提高灯管内部结构的紧凑性和合理性,实现方便组装,拆卸方便。 On the other hand, the structure of the existing LED fluorescent lamp is not compact enough, and screws are often used to fix the internal components. Although it plays a role in stabilizing the structure, the cost increases, and the assembly is cumbersome and inconvenient to disassemble. Therefore, it is necessary to reduce the use of screws, reduce the production cost, improve the compactness and rationality of the internal structure of the lamp tube, and realize convenient assembly and disassembly.
发明内容 Contents of the invention
本发明提供一体式LED封装光源日光灯管,以解决上述现有技术的不足,实现节省工艺成本,降低LED日光灯热阻,可延长LED日光灯使用寿命,且可控制光线照射角度的效果,同时实现不采用螺丝就可使驱动模块、LED模板与灯头固定架卡合或扣合形成一体,且易于与灯罩固定,方便与灯头连接。 The present invention provides an integrated LED packaged light source fluorescent tube to solve the above-mentioned deficiencies in the prior art, realize process cost saving, reduce the thermal resistance of LED fluorescent lamps, prolong the service life of LED fluorescent lamps, and control the light irradiation angle. The drive module, the LED template and the lamp holder fixing frame can be snapped together or fastened together by using screws, and can be easily fixed with the lampshade and conveniently connected with the lamp holder.
为了实现本发明的目的,拟采用以下技术: In order to realize the purpose of the present invention, it is proposed to adopt the following technologies:
一体式LED封装光源日光灯管,包括LED模板、驱动模块(4)、灯头固定架(3)、灯头(6)和灯罩(5),其特征在于,LED模块包括LED基板(1)和PCB板(2),LED基板(1)包括固晶平台(101)和扣合平台(102),固晶平台(101)的台面高于扣合平台(102)的台面,其中:扣合平台(102)沿长度方向均匀设有卡位槽A(103),PCB板(2)沿长度方向也均匀设有相同间隔的卡位槽B(201),卡位槽A(103)与卡位槽B(201)匹配,PCB板(2)安装在扣合平台(102)上,通过固定片(104)同时卡扣在卡位槽A(103)和卡位槽B(201)上而固定;固晶平台(101)上均匀设有固晶杯(106),LED裸芯片(105)设置在固晶杯(106)内,PCB板(2)上均匀设置有金线键合区(202),LED裸芯片(105)通过键合金线连接到对应的金线键合区(202),LED裸芯片(105)和金线键合区(202)上覆盖有荧光胶层,荧光胶层同时还覆盖键合金线;固晶平台(101)的两端头设有配位孔A(107),扣合平台(102)的两端头设有配位孔B(108),PCB板(2)的两端头设有配位孔C(203),配位孔B(108)和配位孔C(203)匹配。灯头固定架(3)由竖直支架(301)和设置在竖直支架(301)上的上弧架(302)和下基架(303)构成;下基架(303)上设有卡槽(304),驱动模块(4)卡在卡槽(304)内;下基架(303)底部设有凸起(308),LED模块安装在下基架(303)底部,凸起(308)扣在配位孔A(107)和配位孔B(108)内; 竖直支架(301)背面设有固定柱(307),固定柱(307)上有螺孔(309),灯头(6)上有与螺孔(309)匹配的圆孔(601),螺丝穿过圆孔(601)和螺孔(309)将灯头(6)与固定柱(307)紧固;上弧架(302)的顶面和下基架(303)两侧面粘于灯罩(5)内壁。灯头(6)连接驱动模块(4),驱动模块(4)连接PCB板(2)。 An integrated LED packaged light source fluorescent tube, including an LED template, a drive module (4), a lamp holder fixing frame (3), a lamp holder (6) and a lampshade (5), characterized in that the LED module includes an LED substrate (1) and a PCB board (2), the LED substrate (1) includes a solid crystal platform (101) and a fastening platform (102), and the table top of the solid crystal platform (101) is higher than that of the fastening platform (102), wherein: the fastening platform (102 ) along the length direction is evenly provided with the card slot A (103), the PCB board (2) is also uniformly provided with the same interval of the card slot B (201) along the length direction, the card slot A (103) and the card slot B (201) matching, the PCB board (2) is installed on the fastening platform (102), and is fixed on the snap slot A (103) and the snap slot B (201) by the fixed piece (104) at the same time; A crystal-bonding cup (106) is evenly arranged on the crystal platform (101), an LED bare chip (105) is arranged in the crystal-bonding cup (106), and a gold wire bonding area (202) is evenly arranged on the PCB board (2), The bare LED chip (105) is connected to the corresponding gold wire bonding area (202) by bonding gold wires, and the LED bare chip (105) and the gold wire bonding area (202) are covered with a fluorescent adhesive layer, and the fluorescent adhesive layer is also Covering the bonding gold wire; the two ends of the solid crystal platform (101) are provided with coordination holes A (107), the two ends of the fastening platform (102) are provided with coordination holes B (108), and the PCB board (2) Coordination holes C (203) are provided at the two ends of each, and coordination holes B (108) and coordination holes C (203) match. The lamp holder fixing frame (3) is composed of a vertical support (301), an upper arc frame (302) and a lower base frame (303) arranged on the vertical support (301); the lower base frame (303) is provided with a card slot (304), the drive module (4) is stuck in the card slot (304); the bottom of the lower base frame (303) is provided with a protrusion (308), the LED module is installed on the bottom of the lower base frame (303), and the protrusion (308) buckles In the coordination hole A (107) and the coordination hole B (108); the back of the vertical support (301) is provided with a fixing column (307), and there is a screw hole (309) on the fixing column (307), and the lamp holder (6) There is a round hole (601) matching the screw hole (309), and the screw passes through the round hole (601) and the screw hole (309) to fasten the lamp holder (6) and the fixing column (307); the upper arc frame (302) The top surface and the lower base frame (303) both sides are glued to the lampshade (5) inner wall. The lamp holder (6) is connected to the driving module (4), and the driving module (4) is connected to the PCB board (2).
进一步,所述PCB板(2)安装在扣合平台(102)上后,PCB板(2)上表面略低于固晶平台(101)的表面。 Further, after the PCB board (2) is installed on the fastening platform (102), the upper surface of the PCB board (2) is slightly lower than the surface of the die-bonding platform (101).
进一步,所述卡位槽A(103)和卡位槽B(201)为锯齿状,固定片(104)为锯齿状。 Further, the locking groove A (103) and the locking groove B (201) are saw-toothed, and the fixing piece (104) is saw-toothed.
进一步,所述固晶杯(106)的杯壁与杯底夹角为90~180°。 Further, the angle between the wall of the crystal-bonding cup (106) and the bottom of the cup is 90° to 180°.
进一步,在所述卡槽(304)的位置有支撑平台(305),支撑平台(305)上有卡扣(306),驱动模块(4)的基板上设有卡孔(401),卡扣(306)扣合在卡孔(401)内。 Further, there is a supporting platform (305) at the position of the card slot (304), a buckle (306) is arranged on the supporting platform (305), and a locking hole (401) is arranged on the base plate of the driving module (4), and the buckle (306) is fastened in the card hole (401).
进一步,所述下基架(303)底部表面为平面,所述凸起(308)为圆锥台形。 Further, the bottom surface of the lower base frame (303) is plane, and the protrusion (308) is in the shape of a truncated cone.
进一步,所述上弧架(302)为圆弧形,下基架(303)的两侧面也为圆弧形。 Further, the upper arc frame (302) is arc-shaped, and the two sides of the lower base frame (303) are also arc-shaped.
进一步,所述LED模板上还固定有反光器(7)。反光器(7)包括一个底面和两个反光面,底面上设有等间距的通孔(701),通孔(701)尺寸与固晶杯(106)尺寸匹配。反光器(7)的底面和反光面之间的角度为0-180°,反光器(7)两反光面之间的最大距离等于灯罩(5)内径的最大尺寸,这样有利于固定LED模板。 Further, a light reflector (7) is also fixed on the LED template. The reflector (7) includes a bottom surface and two reflective surfaces, and the bottom surface is provided with through holes (701) at equal intervals, and the size of the through holes (701) matches the size of the crystal bonding cup (106). The angle between the bottom surface of the reflector (7) and the reflective surface is 0-180 °, and the maximum distance between the two reflective surfaces of the reflector (7) is equal to the maximum size of the inner diameter of the lampshade (5), which is conducive to fixing the LED template.
本发明的有益效果是: The beneficial effects of the present invention are:
1、LED裸芯片直接设置在LED基板上,代替了传统的“芯片+支架+散热基板”的装配方式,减少了从LED裸芯片到散热板上的热阻,从而降低了整个LED日光灯的热阻,提高了散热性能;并通过固定片和卡位槽A、卡位槽B,实现PCB板与LED基板的固定,PCB板的表面略低于固晶平台(101)的表面,可减少PCB板对LED裸芯片发出光线的吸收;PCB板上均匀设置有金线键合区,LED裸芯片通过键合金线连接到对应的金线键合区,LED裸芯片和金线键合区上覆盖有荧光胶层,荧光胶层同时还覆盖键合金线,实现了一体式封装; 1. The LED bare chip is directly set on the LED substrate, replacing the traditional assembly method of "chip + bracket + heat dissipation substrate", reducing the thermal resistance from the LED bare chip to the heat dissipation plate, thereby reducing the heat of the entire LED fluorescent lamp The heat dissipation performance is improved; and the fixing of the PCB board and the LED substrate is realized through the fixing sheet, the slot A and the slot B, and the surface of the PCB board is slightly lower than the surface of the die-bonding platform (101), which can reduce the PCB The board absorbs the light emitted by the bare LED chip; the gold wire bonding area is uniformly arranged on the PCB, and the LED bare chip is connected to the corresponding gold wire bonding area through the bonding gold wire, and the LED bare chip and the gold wire bonding area are covered There is a fluorescent adhesive layer, and the fluorescent adhesive layer also covers the bonding gold wire, realizing an integrated package;
2、固晶杯的杯壁与杯底夹角为90~180°,可更多的将LED裸芯片侧发光反射出来,提高整个LED模块的出光效率,进而可提高LED日光灯的出光效率; 2. The angle between the cup wall and the cup bottom of the solid crystal cup is 90~180°, which can reflect more light from the side of the LED bare chip, improve the light output efficiency of the entire LED module, and then improve the light output efficiency of the LED fluorescent lamp;
3、卡位槽A、卡位槽B和固定片均为锯齿状,增强卡扣的稳固性; 3. The card slot A, card slot B and the fixed piece are all serrated to enhance the stability of the buckle;
4、创新设计灯头固定架,通过卡槽固定驱动模块,通过设计凸起来安装LED模块,不用螺丝就使驱动模块、LED模板与灯头固定架卡合或扣合形成一体,降低了材料成本,且便于装配和拆卸;灯头固定架同时可通过粘接方式与灯罩固定,上弧架设计为圆弧形,下基架两侧面也设计为圆弧形,可提高灯头固定架与灯罩固定时的匹配性;另外,灯头固定架还可方便与灯头固定;通过灯头固定架可实现内部结构的一体化,仅在与灯头固定时使用螺丝,降低了制作成本,提高灯管内部结构的紧凑性和合理性,实现方便组装,拆卸方便; 4. Innovative design of the lamp holder fixing frame, fixing the drive module through the card slot, and installing the LED module through the design protrusion, so that the driver module, the LED template and the lamp holder fixing frame are snapped or snapped into one body without screws, which reduces the cost of materials, and Easy to assemble and disassemble; the lamp holder can be fixed with the lampshade by bonding at the same time, the upper arc frame is designed as an arc shape, and the two sides of the lower base frame are also designed as an arc shape, which can improve the matching between the lamp holder and the lampshade when fixing In addition, the lamp cap fixing frame can also be conveniently fixed with the lamp cap; the integration of the internal structure can be realized through the lamp cap fixing frame, and only screws are used when fixing the lamp cap, which reduces the production cost and improves the compactness and rationality of the internal structure of the lamp tube. High performance, easy to assemble and disassemble;
5、设有反光器,可将光线聚中于主要被照射区域,提高被照射面亮度。 5. Equipped with a reflector, which can focus the light on the main irradiated area and improve the brightness of the irradiated surface.
附图说明 Description of drawings
图1示出了本发明的整体分解结构示意图。 Fig. 1 shows a schematic diagram of an overall exploded structure of the present invention.
图2示出了本发明LED模块的分解结构示意图。 Fig. 2 shows a schematic diagram of an exploded structure of the LED module of the present invention.
图3示出了本发明LED固晶区局部图。 Fig. 3 shows a partial view of the LED die-bonding area of the present invention.
图4示出了本发明LED模块的装配结构示意图。 Fig. 4 shows a schematic diagram of the assembly structure of the LED module of the present invention.
图5示出了本发明灯头固定架结构示意图一。 Fig. 5 shows a first schematic diagram of the structure of the lamp cap fixing frame of the present invention.
图6示出了本发明灯头固定架结构示意图二。 Fig. 6 shows the second schematic diagram of the structure of the lamp cap fixing frame of the present invention.
图7示出了本发明灯头固定架结构示意图三。 Fig. 7 shows the structure schematic diagram III of the lamp cap fixing frame of the present invention.
图8示出了本发明灯头固定架与驱动模块的装配示意图。 Fig. 8 shows a schematic diagram of the assembly of the lamp holder fixing frame and the driving module of the present invention.
图9示出了本发明灯头固定架与灯头的装配示意图。 Fig. 9 shows a schematic diagram of the assembly of the lamp cap fixing frame and the lamp cap of the present invention.
图10示出了本发明灯头固定架与灯罩的装配示意图。 Fig. 10 shows a schematic diagram of the assembly of the lamp cap fixing frame and the lampshade of the present invention.
图11示出了本发明灯头固定架与LED模块的装配示意图一。 FIG. 11 shows the first assembly schematic diagram of the lamp holder fixing frame and the LED module of the present invention.
图12示出了本发明灯头固定架与LED模块的装配示意图二。 Fig. 12 shows the second schematic diagram of the assembly of the lamp holder fixing frame and the LED module of the present invention.
图13示出了本发明反光器端面视图。 Figure 13 shows an end view of the reflector of the present invention.
具体实施方式 Detailed ways
如图1~13所示,一体式LED封装光源日光灯管,包括LED模板、驱动模块(4)、灯头固定架(3)、灯头(6)和灯罩(5), LED模块包括LED基板(1)和PCB板(2),LED基板(1)包括固晶平台(101)和扣合平台(102),固晶平台(101)的台面高于扣合平台(102)的台面,其中:扣合平台(102)沿长度方向均匀设有卡位槽A(103),PCB板(2)沿长度方向也均匀设有相同间隔的卡位槽B(201),卡位槽A(103)与卡位槽B(201)匹配,PCB板(2)安装在扣合平台(102)上,通过固定片(104)同时卡扣在卡位槽A(103)和卡位槽B(201)上而固定;固晶平台(101)上均匀设有固晶杯(106),LED裸芯片(105)设置在固晶杯(106)内,PCB板(2)上均匀设置有金线键合区(202),LED裸芯片(105)通过键合金线连接到对应的金线键合区(202),LED裸芯片(105)和金线键合区(202)上覆盖有荧光胶层,荧光胶层同时还覆盖键合金线;固晶平台(101)的两端头设有配位孔A(107),扣合平台(102)的两端头设有配位孔B(108),PCB板(2)的两端头设有配位孔C(203),配位孔B(108)和配位孔C(203)匹配。灯头固定架(3)由竖直支架(301)和设置在竖直支架(301)上的上弧架(302)和下基架(303)构成;下基架(303)上设有卡槽(304),驱动模块(4)卡在卡槽(304)内;下基架(303)底部设有凸起(308),LED模块安装在下基架(303)底部,凸起(308)扣在配位孔A(107)和配位孔B(108)内; 竖直支架(301)背面设有固定柱(307),固定柱(307)上有螺孔(309),灯头(6)上有与螺孔(309)匹配的圆孔(601),螺丝穿过圆孔(601)和螺孔(309)将灯头(6)与固定柱(307)紧固;上弧架(302)的顶面和下基架(303)两侧面粘于灯罩(5)内壁。灯头(6)连接驱动模块(4),驱动模块(4)连接PCB板(2)。 As shown in Figures 1 to 13, the integrated LED packaged light source fluorescent tube includes an LED template, a driver module (4), a lamp holder fixing frame (3), a lamp holder (6) and a lampshade (5), and the LED module includes an LED substrate (1 ) and PCB board (2), the LED substrate (1) includes a solid crystal platform (101) and a fastening platform (102), and the table top of the solid crystal platform (101) is higher than the table top of the fastening platform (102), wherein: the buckle The closing platform (102) is evenly provided with the slot A (103) along the length direction, and the PCB board (2) is also uniformly provided with the slot B (201) at the same interval along the length direction, and the slot A (103) and The card slot B (201) is matched, the PCB board (2) is installed on the fastening platform (102), and is locked on the card slot A (103) and the card slot B (201) at the same time through the fixing piece (104) and fixed; the crystal-bonding platform (101) is evenly provided with a crystal-bonding cup (106), the LED bare chip (105) is arranged in the crystal-bonding cup (106), and the PCB board (2) is uniformly provided with a gold wire bonding area (202), the LED bare chip (105) is connected to the corresponding gold wire bonding area (202) by bonding gold wires, and the LED bare chip (105) and the gold wire bonding area (202) are covered with a fluorescent adhesive layer, and the fluorescent The adhesive layer also covers the bonding gold wire; the two ends of the solid crystal platform (101) are provided with coordination holes A (107), and the two ends of the fastening platform (102) are provided with coordination holes B (108). Both ends of the plate (2) are provided with coordination holes C (203), and the coordination holes B (108) and the coordination holes C (203) are matched. The lamp holder fixing frame (3) is composed of a vertical support (301), an upper arc frame (302) and a lower base frame (303) arranged on the vertical support (301); the lower base frame (303) is provided with a card slot (304), the drive module (4) is stuck in the card slot (304); the bottom of the lower base frame (303) is provided with a protrusion (308), the LED module is installed on the bottom of the lower base frame (303), and the protrusion (308) buckles In the coordination hole A (107) and the coordination hole B (108); the back of the vertical support (301) is provided with a fixing column (307), and there is a screw hole (309) on the fixing column (307), and the lamp holder (6) There is a round hole (601) matching the screw hole (309), and the screw passes through the round hole (601) and the screw hole (309) to fasten the lamp holder (6) and the fixing column (307); the upper arc frame (302) The top surface and the lower base frame (303) both sides are glued to the lampshade (5) inner wall. The lamp holder (6) is connected to the driving module (4), and the driving module (4) is connected to the PCB board (2).
作为优选实施,所述PCB板(2)安装在扣合平台(102)上后,PCB板(2)上表面与固晶平台(101)的台面在同一平面。 As a preferred implementation, after the PCB board (2) is installed on the fastening platform (102), the upper surface of the PCB board (2) is on the same plane as the table top of the die-bonding platform (101).
作为优选实施,所述卡位槽A(103)和卡位槽B(201)为锯齿状,固定片(104)为锯齿状。 As a preferred implementation, the locking groove A (103) and the locking groove B (201) are saw-toothed, and the fixing piece (104) is saw-toothed.
作为优选实施,所述固晶杯(106)的杯壁与杯底夹角为90~180°。 As a preferred implementation, the angle between the wall of the crystal bonding cup (106) and the bottom of the cup is 90° to 180°.
作为优选实施,在所述卡槽(304)的位置有支撑平台(305),支撑平台(305)上有卡扣(306),驱动模块(4)的基板上设有卡孔(401),卡扣(306)扣合在卡孔(401)内。 As a preferred implementation, there is a support platform (305) at the position of the card slot (304), a buckle (306) is provided on the support platform (305), and a card hole (401) is provided on the base plate of the drive module (4), The clasp (306) is fastened in the clasp hole (401).
作为优选实施,所述下基架(303)底部表面为平面,所述凸起(308)为圆锥台形。 As a preferred implementation, the bottom surface of the lower base frame (303) is flat, and the protrusion (308) is in the shape of a truncated cone.
作为优选实施,所述上弧架(302)为圆弧形,下基架(303)的两侧面也为圆弧形,便于与灯罩(5)内壁配合粘结。 As a preferred implementation, the upper arc frame (302) is arc-shaped, and the two sides of the lower base frame (303) are also arc-shaped, which is convenient for bonding with the inner wall of the lampshade (5).
作为优选实施,所述LED模板上还固定有反光器(7)。反光器(7)包括一个底面和两个反光面,底面上设有等间距的通孔(701),通孔(701)尺寸与固晶杯(106)尺寸匹配。反光器(7)的底面和反光面之间的角度为0-180°,反光器(7)两反光面之间的最大尺寸等于灯罩(5)内径的最大尺寸,这样有利于固定LED模板。 As a preferred implementation, a light reflector (7) is also fixed on the LED template. The reflector (7) includes a bottom surface and two reflective surfaces, and the bottom surface is provided with through holes (701) at equal intervals, and the size of the through holes (701) matches the size of the crystal bonding cup (106). The angle between the bottom surface of the reflector (7) and the reflective surface is 0-180 °, and the maximum size between the two reflective surfaces of the reflector (7) is equal to the maximum size of the inner diameter of the lampshade (5), which is conducive to fixing the LED template.
LED裸芯片(105)直接设置在LED基板(1)上,代替了传统的“芯片+支架+散热基板”的封装方式,减少了从LED裸芯片(105)到LED基板(1)的热阻,从而降低了整个LED日光灯的热阻,提高了散热性能;并通过固定片(104)和卡位槽A(103)、卡位槽B(201),实现PCB板(2)与LED基板(1)的固定,且PCB板(2)安装在扣合平台(102)上后, PCB板(2)的表面略低于固晶平台(101)的表面,可减少PCB板(2)对LED裸芯片(105)发出光线的吸收;PCB板(2)上均匀设置有金线键合区(202),LED裸芯片(105)通过键合金线连接到对应的金线键合区(202),LED裸芯片(105)和金线键合区(202)上覆盖有荧光胶层,荧光胶层同时还覆盖键合金线;实现了一体式封装光源。 The LED bare chip (105) is directly arranged on the LED substrate (1), replacing the traditional packaging method of "chip + bracket + heat dissipation substrate", reducing the thermal resistance from the LED bare chip (105) to the LED substrate (1) , thereby reducing the thermal resistance of the entire LED fluorescent lamp and improving the heat dissipation performance; and through the fixing piece (104), the locking groove A (103), and the locking groove B (201), the PCB board (2) and the LED substrate ( 1) is fixed, and after the PCB board (2) is installed on the fastening platform (102), the surface of the PCB board (2) is slightly lower than the surface of the die-bonding platform (101), which can reduce the impact of the PCB board (2) on the LED Absorption of light emitted by the bare chip (105); a gold wire bonding area (202) is uniformly arranged on the PCB board (2), and the LED bare chip (105) is connected to the corresponding gold wire bonding area (202) by bonding the gold wire , the LED bare chip (105) and the gold wire bonding area (202) are covered with a fluorescent adhesive layer, and the fluorescent adhesive layer also covers the bonding gold wire; an integrated packaging light source is realized.
通过卡槽(304)固定驱动模块(4),通过设计凸起(308)来安装LED模块,不用螺丝就使驱动模块(4)、LED模板与灯头固定架(3)装配为一体,降低了材料成本,且便于装配和拆卸;灯头固定架(3)同时可通过粘结方式与灯罩(5)固定,上弧架(302)设计为圆弧形,下基架(303)两侧面也设计为圆弧形,可提高灯头固定架(3)与灯罩(5)固定时的匹配性;另外,灯头固定架(3)还可方便与灯头(6)固定;通过灯头固定架(3)可实现内部结构的一体化,仅在与灯头(6)固定时使用螺丝,降低了制作成本,提高灯管内部结构的紧凑性和合理性,实现方便组装,拆卸方便。 The drive module (4) is fixed through the card slot (304), and the LED module is installed by designing the protrusion (308). The drive module (4), the LED template and the lamp holder fixing frame (3) are assembled into one body without screws, reducing the The material cost is low, and it is easy to assemble and disassemble; the lamp cap fixing frame (3) can be fixed with the lampshade (5) by bonding at the same time, the upper arc frame (302) is designed as a circular arc, and the two sides of the lower base frame (303) are also designed It is arc-shaped, which can improve the compatibility between the lamp holder (3) and the lampshade (5) when it is fixed; in addition, the lamp holder (3) can also be conveniently fixed with the lamp holder (6); through the lamp holder (3) can be The integration of the internal structure is realized, and only screws are used when fixing the lamp holder (6), which reduces the production cost, improves the compactness and rationality of the internal structure of the lamp tube, and realizes convenient assembly and disassembly.
Claims (10)
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