CN104882396A - Transparent cover plate structure of wafer transfer chamber of semiconductor film equipment - Google Patents
Transparent cover plate structure of wafer transfer chamber of semiconductor film equipment Download PDFInfo
- Publication number
- CN104882396A CN104882396A CN201510212398.XA CN201510212398A CN104882396A CN 104882396 A CN104882396 A CN 104882396A CN 201510212398 A CN201510212398 A CN 201510212398A CN 104882396 A CN104882396 A CN 104882396A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- transparent cover
- wafer transfer
- transfer chamber
- semiconductor film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A transparent cover plate structure of a wafer transfer chamber of semiconductor film equipment includes a lifting mechanism connecting plate, a wafer transfer chamber cover plate, a circular transparent cover plate and a sealing ring. According to an interval between a left hand and a right hand of a mechanical hand and the position of a wafer transfer channel, and taking the position of points of intersection of a substrate position trace in X and Y directions for reference, an inner side intersection position is selected. A plurality of small transparent cover plates are arranged on the wafer transfer chamber cover plate; and an observation position where the circular transparent cover plate is located in symmetrical in structure, and when the mechanical hand transfers and takes a wafer in any one of the X and Y directions, existence and the state of a wafer can be observed. The circular transparent cover plate and the chamber cover plate are sealed through the sealing ring and are connected through screws B, the lifting mechanism connecting plate is connected to the wafer transfer chamber cover plate through screws A, the whole structure is of an integrated type, and on-off operation can be performed through a cylinder at a rear end of the lifting mechanism connecting plate. The transparent cover plate structure of the wafer transfer chamber of the semiconductor film equipment uses distribution of the plurality of small transparent cover plates to replace a large and relatively thick transparent cover plate, the total cost of the equipment is reduced and the overall attractiveness of the equipment is improved.
Description
Technical field
The present invention relates to the transparent cover plate structure that a kind of semiconductor film film device passes sheet chamber, this structure is mainly used in the observation that semiconductor coated film equipment passes the state that has that it's too late of double-deck mechanical arm upper substrate in sheet chamber, belongs to the applications and preparation technical field of semiconductive thin film deposition.
Background technology
Double-deck mechanical arm biography sheet is have employed for improving production capacity in the biography sheet chamber of existing semiconductor coated film equipment, pass in the process of sheet at manipulator, slide plate may be there is, hit the phenomenon such as sheet, fragment, in order to the biography sheet state of double-deck mechanical arm can be observed, generally have employed thicker large transparent plastic sheet, material cost and the processing charges of this transparent cover plate are high, and surface is vulnerable to scratch.
Summary of the invention
The present invention, for the purpose of solving the problem, devises the transparent cover plate structure that a kind of semiconductor film film device passes sheet chamber, achieves the observation of the state that has that it's too late of substrate when passing sheet to double-deck mechanical arm, and reduces cost.This structure be former large transparent cover plate is transformed to multiple little transparent cover plate be distributed in pass sheet chamber cover plate partially in the middle of position, the determination of this position and size of substrate and mechanical arm spacing have relation.The state that has that it's too late of mechanical arm upper substrate can be observed by the little transparent cover plate of this position.
For achieving the above object, the present invention adopts following technical proposals: semiconductor film film device passes the transparent cover plate structure of sheet chamber, mainly comprises elevating mechanism connecting plate (1), passes sheet chamber cover plate (2), circular non-opaque cover plate (4) and sealing ring (6).The present invention is according to the spacing between manipulator right-hand man and passes sheet channel position, with reference to manipulator upper substrate position trace (7) position of intersecting point in X and Y-direction, chooses inner side cross-point locations.
Described biography sheet chamber cover plate (2) is provided with multiple little transparent cover plate (4);
Described circular non-opaque cover plate (4) residing observation place symmetrical configuration, manipulator X or Y any direction pass get sheet time, all can be observed the state that has that it's too late of wafer.
Described circular non-opaque cover plate (4) is connected with being sealed by sealing ring (6) and pass through screw B (5) between chamber cover plate (2), elevating mechanism connecting plate (1) is connected to by screw A (3) and passes on sheet chamber cover plate (2), total is integral type, and the cylinder by elevating mechanism connecting plate (1) rear end carries out switching manipulation.
Beneficial effect of the present invention and feature are:
1, present invention achieves a kind of observable to pass double-deck mechanical arm in sheet chamber and pass the mechanism of sheet, observation place symmetrical configuration everywhere, manipulator X or Y any direction pass get sheet time, all can be observed the state that has that it's too late of wafer;
2, depend on the basis of 1, the distribution of multiple little transparent cover plate instead of thicker large transparent cover plate, greatly reduces the total cost of equipment and improves the overall aesthetics of equipment.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Embodiment
With reference to Fig. 1, a kind of semiconductor film film device passes the transparent cover plate structure of sheet chamber, comprising: elevating mechanism connecting plate 1, biography sheet chamber cover plate 2, screw A3, circular non-opaque cover plate 4, screw B5 and sealing ring 6.
The present invention is according to the spacing between manipulator right-hand man and pass sheet channel position, with reference to the position of intersecting point of manipulator upper substrate position trace 7 in X and Y-direction, chooses inner side cross-point locations, devises the biography sheet chamber cover plate 2 be made up of multiple little transparent cover plate 4.Manipulator is when X or Y any direction biography gets sheet, all can be observed the state that has that it's too late of wafer, sealed by sealing ring 6 between circular non-opaque cover plate 4 and chamber cover plate 2, and connected by screw B5, elevating mechanism connecting plate 1 is connected to by screw A3 and passes on sheet chamber cover plate 2, total is integral type, and the cylinder by elevating mechanism connecting plate 1 rear end carries out switching manipulation.
Described biography sheet chamber cover plate 2 is at least provided with two pieces of circular non-opaque cover plates 4;
Described circular non-opaque cover plate 4 optimal selection four pieces;
Described circular non-opaque cover plate 4 is in observation place, its symmetrical configuration;
Described screw A3 adopts M8 soket head cap screw;
Described screw B5 adopts M6 soket head cap screw.
The present invention can be widely used in the applications and preparation technical field of semiconductive thin film deposition.
Claims (3)
1. the transparent cover plate structure of a semiconductor film film device biography sheet chamber, it is characterized in that: it comprises elevating mechanism connecting plate, passes sheet chamber cover plate, circular non-opaque cover plate and sealing ring, described biography sheet chamber cover plate is provided with multiple little circular non-opaque cover plate, sealed by sealing ring between circular non-opaque cover plate with chamber cover plate and be connected by screw B, elevating mechanism connecting plate is connected to by screw A and passes on sheet chamber cover plate, total is integral type, and the cylinder by elevating mechanism connecting plate rear end carries out switching manipulation.
2. semiconductor film film device as claimed in claim 1 passes the transparent cover plate structure of sheet chamber, it is characterized in that: observation place symmetrical configuration residing for described circular non-opaque cover plate.
3. semiconductor film film device as claimed in claim 1 passes the transparent cover plate structure of sheet chamber, it is characterized in that: described biography sheet chamber cover plate 2 is at least provided with two pieces of circular non-opaque cover plates 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510212398.XA CN104882396A (en) | 2015-04-29 | 2015-04-29 | Transparent cover plate structure of wafer transfer chamber of semiconductor film equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510212398.XA CN104882396A (en) | 2015-04-29 | 2015-04-29 | Transparent cover plate structure of wafer transfer chamber of semiconductor film equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104882396A true CN104882396A (en) | 2015-09-02 |
Family
ID=53949837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510212398.XA Pending CN104882396A (en) | 2015-04-29 | 2015-04-29 | Transparent cover plate structure of wafer transfer chamber of semiconductor film equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104882396A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060123929A (en) * | 2005-05-30 | 2006-12-05 | 삼성전자주식회사 | Method of checking equipment for manufacturing semiconductor |
| CN101642909A (en) * | 2009-06-26 | 2010-02-10 | 东莞宏威数码机械有限公司 | Cavity body for multistage mechanical transmission module |
| KR20100078618A (en) * | 2008-12-30 | 2010-07-08 | 주식회사 동부하이텍 | Chamber dome of deposition apparatus |
-
2015
- 2015-04-29 CN CN201510212398.XA patent/CN104882396A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060123929A (en) * | 2005-05-30 | 2006-12-05 | 삼성전자주식회사 | Method of checking equipment for manufacturing semiconductor |
| KR20100078618A (en) * | 2008-12-30 | 2010-07-08 | 주식회사 동부하이텍 | Chamber dome of deposition apparatus |
| CN101642909A (en) * | 2009-06-26 | 2010-02-10 | 东莞宏威数码机械有限公司 | Cavity body for multistage mechanical transmission module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12022679B2 (en) | Display apparatus and method of manufacturing the display apparatus | |
| US11430860B2 (en) | Organic light-emitting diode display and method of manufacturing the same | |
| CN106611770B (en) | Method of manufacturing organic light emitting display apparatus and organic light emitting display apparatus | |
| CN109301051B (en) | Display panel and preparation method thereof | |
| CN103700774B (en) | A kind of Organic Light Emitting Diode OLED and display unit | |
| EP4250895A3 (en) | Display device | |
| KR20150003567A (en) | Organic light emitting display device and method for manufacturing the same | |
| CN102916051A (en) | Thin-film transistor, manufacturing method of thin-film transistor, array substrate and display device | |
| US10161030B2 (en) | Deposition mask and deposition apparatus having the same | |
| CN102723445A (en) | OLED (organic light-emitting diode) display unit and OLED spliced display screen with same | |
| CN109378326A (en) | Display panel and preparation method thereof | |
| CN108292179B (en) | Conductive structure, method for manufacturing the same, and electrode including the same | |
| CN204302634U (en) | A kind of array base palte and display device | |
| CN104821329A (en) | Oled display device | |
| CN103854723A (en) | Device with orderly-conductive film | |
| CN104952879A (en) | Dual-gate TFT (thin-film transistor) substrate structure using COA (color filter on array) technique | |
| CN104538421A (en) | OLED display substrate and manufacturing method of OLED display substrate | |
| CN103107286A (en) | Method of producing imaged indium tin oxides (ITO) electrode with non-photoetching technology | |
| CN203999787U (en) | A kind of evaporation mask | |
| CN203825337U (en) | Color film substrate, display panel and display device | |
| CN104882396A (en) | Transparent cover plate structure of wafer transfer chamber of semiconductor film equipment | |
| CN104952777A (en) | Observable wafer conveying cavity structure of semiconductor thin film equipment | |
| CN104894528A (en) | Bilayer manipulator arm wafer conveying structure in observable wafer conveying chamber | |
| CN102368131A (en) | Liquid crystal substrate and manufacturing method and liquid crystal display device thereof | |
| KR101492240B1 (en) | A transparency conductive board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150902 |
|
| WD01 | Invention patent application deemed withdrawn after publication |