CN104952777A - Observable wafer conveying cavity structure of semiconductor thin film equipment - Google Patents
Observable wafer conveying cavity structure of semiconductor thin film equipment Download PDFInfo
- Publication number
- CN104952777A CN104952777A CN201510212088.8A CN201510212088A CN104952777A CN 104952777 A CN104952777 A CN 104952777A CN 201510212088 A CN201510212088 A CN 201510212088A CN 104952777 A CN104952777 A CN 104952777A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- observable
- conveying cavity
- wafer conveying
- sheet chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Physical Vapour Deposition (AREA)
Abstract
An observable wafer conveying cavity structure of semiconductor thin film equipment comprises a lifting mechanism connection plate, a wafer conveying cavity cover plate and a sealing ring. A plurality of round transparent units are arranged on the wafer conveying cavity cover plate and connected with the same to form an integral structure through the sealing ring and screws A; the lifting mechanism connection plate is fixedly connected with the wafer conveying cavity cover plate through screws B; observation positions where the round transparent units are arranged are structurally symmetrical. The structure has the advantages that a conception is reasonable, the observation positions all around are structurally symmetrical, existence and states of wafers can be observed when mechanical arms convey or fetch the wafer in any of an X direction and a Y direction; since a plurality of small transparent cover plates are adopted to substitute for a thick large cover plate, total cost of the equipment is reduced greatly, and overall attractive appearance of the equipment is improved.
Description
Technical field
The present invention relates to a kind of observable semiconductor film film device and pass sheet chamber structure, this structure is mainly used in the observation that semiconductor coated film equipment passes the state that has that it's too late of substrate in sheet chamber, belongs to the applications and preparation technical field of semiconductive thin film deposition.
Background technology
Existing semiconductor coated film equipment, for improving production capacity, adopts double-deck mechanical arm to pass sheet, passes in the process of sheet, slide plate may occur, hit the phenomenon such as sheet, fragment at manipulator in biography sheet chamber.In order to observe the biography sheet state of double-deck mechanical arm, generally have employed thicker large transparent plastic sheet, material cost and the processing charges of this transparent cover plate are high, and surface is vulnerable to scratch.
Summary of the invention
The present invention, for the purpose of solving the problem, devises a kind of novel observable semiconductor film film device and passes sheet chamber structure.Large transparent cover plate is transformed to multiple little transparent cover plate by this structure, and is integrated, and achieves the observation of the state that has that it's too late of substrate when passing sheet to double-deck mechanical arm, and reduces cost.
For achieving the above object, the present invention adopts following technical proposals: a kind of observable semiconductor film film device passes sheet chamber structure, mainly comprises elevating mechanism connecting plate (1), passes sheet chamber cover plate (2) and sealing ring (3).Described biography sheet chamber cover plate (2) is provided with multiple circular non-opaque unit (5).Described circular non-opaque unit (5) is tightly connected with biography sheet chamber cover plate (2) by sealing ring (3) and screw A (4), total is in one, and the cylinder by elevating mechanism connecting plate (1) rear end carries out switching manipulation.
Above-mentioned elevating mechanism connecting plate (1) is fixedly connected with biography sheet chamber cover plate (2) by screw B (6).
According to the spacing between manipulator right-hand man and biography sheet channel position, with reference to manipulator upper substrate position trace (7) position of intersecting point in X and Y-direction, choose intersect outside point position, the symmetrical configuration position, circular non-opaque unit (5) observation place, place of design, manipulator X or Y any direction pass get sheet time, all can be observed the state that has that it's too late of wafer.
Beneficial effect of the present invention and feature are:
1, present invention achieves a kind of observable semiconductor film film device and pass sheet chamber structure, observation place symmetrical configuration everywhere, manipulator X or Y any direction pass get sheet time, all can be observed the state that has that it's too late of wafer;
2, depend on the basis of 1, the distribution of the little transparent cover plate in many places instead of thicker large transparent cover plate, greatly reduces the total cost of equipment and improves the overall aesthetics of equipment.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
Embodiment
With reference to Fig. 1, a kind of observable semiconductor film film device passes sheet chamber structure, mainly comprises elevating mechanism connecting plate 1, passes sheet chamber cover plate 2 and sealing ring 3.Described biography sheet chamber cover plate 2 is provided with multiple circular non-opaque unit 5, and circular non-opaque unit 5 is distributed in and passes four angles of sheet chamber cover plate 2 or the position of centre.Described circular non-opaque unit 5 is tightly connected with biography sheet chamber cover plate 2 by sealing ring 3 and screw A4, and total is in one, and the cylinder by elevating mechanism connecting plate 1 rear end carries out switching manipulation.
Above-mentioned elevating mechanism connecting plate 1 is fixedly connected with biography sheet chamber cover plate 2 by screw B6.
Above-mentioned screw A4 adopts M6 soket head cap screw;
Above-mentioned screw 6 adopts M8 soket head cap screw.
According to the spacing between manipulator right-hand man and biography sheet channel position, with reference to the position of intersecting point of manipulator upper substrate position trace 7 in X and Y-direction, choose intersect outside point position, the symmetrical configuration position, observation place, circular non-opaque unit 5 place of design, manipulator X or Y any direction pass get sheet time, all can be observed the state that has that it's too late of wafer.
Claims (3)
1. observable semiconductor film film device passes a sheet chamber structure, it is characterized in that: it comprises elevating mechanism connecting plate, passes sheet chamber cover plate and sealing ring, and described biography sheet chamber cover plate is provided with multiple circular non-opaque unit; Described circular non-opaque unit is tightly connected with biography sheet chamber cover plate by sealing ring and screw A, and total is in one.
2. observable semiconductor film film device as claimed in claim 1 passes sheet chamber structure, it is characterized in that: described elevating mechanism connecting plate is fixedly connected with biography sheet chamber cover plate by screw B.
3. observable semiconductor film film device as claimed in claim 1 passes sheet chamber structure, it is characterized in that: described symmetrical configuration position, observation place, circular non-opaque unit place.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510212088.8A CN104952777A (en) | 2015-04-29 | 2015-04-29 | Observable wafer conveying cavity structure of semiconductor thin film equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510212088.8A CN104952777A (en) | 2015-04-29 | 2015-04-29 | Observable wafer conveying cavity structure of semiconductor thin film equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104952777A true CN104952777A (en) | 2015-09-30 |
Family
ID=54167341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510212088.8A Pending CN104952777A (en) | 2015-04-29 | 2015-04-29 | Observable wafer conveying cavity structure of semiconductor thin film equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104952777A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060123929A (en) * | 2005-05-30 | 2006-12-05 | 삼성전자주식회사 | Method of checking equipment for manufacturing semiconductor |
| CN101642909A (en) * | 2009-06-26 | 2010-02-10 | 东莞宏威数码机械有限公司 | Cavity body for multistage mechanical transmission module |
| KR20100078618A (en) * | 2008-12-30 | 2010-07-08 | 주식회사 동부하이텍 | Chamber dome of deposition apparatus |
-
2015
- 2015-04-29 CN CN201510212088.8A patent/CN104952777A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060123929A (en) * | 2005-05-30 | 2006-12-05 | 삼성전자주식회사 | Method of checking equipment for manufacturing semiconductor |
| KR20100078618A (en) * | 2008-12-30 | 2010-07-08 | 주식회사 동부하이텍 | Chamber dome of deposition apparatus |
| CN101642909A (en) * | 2009-06-26 | 2010-02-10 | 东莞宏威数码机械有限公司 | Cavity body for multistage mechanical transmission module |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150930 |
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| WD01 | Invention patent application deemed withdrawn after publication |