CN104862749A - High-temperature-resistant bright tin and matte tin electroplating technique - Google Patents
High-temperature-resistant bright tin and matte tin electroplating technique Download PDFInfo
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- CN104862749A CN104862749A CN201510241577.6A CN201510241577A CN104862749A CN 104862749 A CN104862749 A CN 104862749A CN 201510241577 A CN201510241577 A CN 201510241577A CN 104862749 A CN104862749 A CN 104862749A
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Abstract
The invention discloses a high-temperature-resistant bright tin and matte tin electroplating technique and belongs to the technical field of electroplating. By the adoption of the technique, the surface of stainless steel, the surface of a copper material, the surface of an iron material, the surface of aluminum and the surface of aluminum alloy can be plated with tin. High solderability can be achieved, and reflow soldering resistance at the temperature ranging from 245 DEG C to 270 DEG C can be achieved. The color of bright tin and the color of matte tin do not change, and tin gathering is avoided. A coating with the suboptical appearance can still be kept for the matte tin. The high-temperature-resistant bright tin and matte tin electroplating technique is characterized in that the special nickel preplating treatment is conducted on the surface of a metal material, and the thickness of the preplated nickel layer and the thickness of a surface tin-plated layer are strictly controlled.
Description
Technical field
The invention belongs to the electroplating surface field of metalwork, is a kind of method solving molten tin that metalwork tin coating occurs after high temperature, discoloration problem.
Background technology
Metalwork electroplating surfaces with tin is normally in order to realize the object of corrosion-resistant, scolding tin and outward appearance.In workpiece attachment process (SMT), process temperatures 245 ~ 270 DEG C, now all can there is melting in solder paster and workpiece surface tin coating, thus realize the welding between element.For junctor, the application that parts have at the bottom of nickel plating usually or the not nickel plating end is directly zinc-plated.Bottom layer nickel and top layer tin thickness and processing method, now use industry standard based on AIAE American institute of automobile engineers standard SAE-AMS-QQ-N-290, ASTM B 689-97, and according to the parts that these type of thickness specification standards and electroplating process are processed, through high temperature during pasting board assembling, metal casing surface there will be molten tin and gathers tin, variable color or gloomy etc. abnormal.
Summary of the invention
The technical issues that need to address of the present invention are the defects overcoming Current standards and technique, provide resistant to elevated temperatures tin plating technique method, thus molten tin gathers tin to avoid zinc-plated element to occur in the surface mount process (SMT), variable color and the phenomenon such as surface is gloomy.
According to the present invention as accompanying drawing, method for electroplating nickel needs to adopt highly acid nickelous chloride system plating solution, hydrochloric acid volumetric concentration 10 ~ 20%, and controls end nickel thickness between 0.05 ~ 0.3um.Can reach and prevent variable color after the Xi Gaowen of top layer, the phenomenon such as gloomy.If top layer plating is mist tin, then after high temperature reflow brightens, can automatically restore to the matte appearance before remelting, this result meets the appearance requirement after the assembling of port.
Eleetrotinplate adopts the current conventional alkylsulphonic acid tin bath system of connector industry, control the specification of tin thickness between 1.0 ~ 2.5um, with ASTM B 545-97 Class F-1.5um for basis of reference, tin melting in pyroprocess can be avoided to be gathered into stippled appearance.Use technique plating bottom nickle of the present invention and top layer tin, the sub-light outward appearance of equal display white after high temperature reflow, do not occur that common molten tin gathers tin, turn to be yellow, turn blue, blue or gloomy problem.
Accompanying drawing explanation
Accompanying drawing is electroplated coating combination schematic diagram of the present invention.
The processing parameter that table 1 effect sample of the present invention adopts
Embodiment
Technical process: oil removing → washing → pickling → washing →
plating bottom nickle→ washing →
zinc-plated→ washing → dry.
The pre-nickel of embodiment 1 copper material plated surface, plates bright tin.
Oil removing: sodium hydroxide 20 g/l
Sodium carbonate 15g/l
Water glass 5g/l
Tensio-active agent 3g/l
Temperature 60 C
Cathode current density 15 A/dm
2
Time 1min
Washing: process water time 30s
Pickling: sulfuric acid 20ml/l
Temperature room temperature
Time 30 s
Washing: deionized water time 30s
Plating bottom nickle: nickelous chloride 240g/l
Hydrochloric acid or nitration mixture 150ml/l
Temperature room temperature
Cathode current density 12A/dm
2
Thickness 0.12um
Washing: deionized water time 30s
Plate bright tin: alkylsulphonic acid tin, Theil indices 40 ~ 80g/l
Alkylsulphonic acid 100 ~ 160 ml/l
Additive 30 ~ 50 ml/l
Brightening agent 5 ~ 10 ml/l
Temperature 20 DEG C
Cathode current density 15A/dm
2
Thickness 1.8um
Washing: deionized water time 50s
Dry: temperature 105 DEG C
Time 1min.
Embodiment 2 surface of stainless steel plates pre-nickel, plating mist tin.
Oil removing: sodium hydroxide 25 g/l
Sodium carbonate 15g/l
Water glass 5g/l
Tensio-active agent 3g/l
Temperature 60 C
Cathode current density 15 A/dm
2
Time 1min
Washing: process water time 30s
Pickling: hydrochloric acid 30ml/l
Temperature room temperature
Time 30 s
Washing: deionized water time 30s
Plating bottom nickle: nickelous chloride 240g/l
Hydrochloric acid or nitration mixture 150ml/l
Temperature room temperature
Cathode current density 12A/dm
2
Thickness 0.12um
Washing: deionized water time 30s
Plating mist tin: alkylsulphonic acid tin, Theil indices 40 ~ 80g/l
Alkylsulphonic acid 100 ~ 160ml/l
Additive 30 ~ 50ml/l
Grain-refining agent 5 ~ 10ml/l
Temperature 35 DEG C
Cathode current density 12A/dm
2
Thickness 1.6um
Washing: deionized water time 50s
Dry: temperature 105 DEG C
Time 1min.
Claims (3)
1. one kind can the eleetrotinplate technique of reflux-resisting welded temperature, it is characterized in that by carrying out special nickel preplating process to metal material surface, electroplate liquid employs nickelous chloride component, obtain the end nickel coating of thickness 0.05 ~ 0.20um under strongly acidic conditions, top layer tin gauge control is at 1.0 ~ 2.5um, thus the look that still can remain unchanged after 245 ~ 270 DEG C of Reflow Soldering processing procedures, not poly-tin and sub-light outward appearance.
2. metal material surface nickel preplating according to claim 1 and tin plating technique method, the plating processing of metal terminal, metal scolding tin pin and metal casing contained by the junctor involved by it.
3. metal material surface nickel preplating according to claim 1 and tin plating technique method, the plating processing of the printed-wiring board (PWB) attachment components and parts hard goods used involved by it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510241577.6A CN104862749A (en) | 2015-05-13 | 2015-05-13 | High-temperature-resistant bright tin and matte tin electroplating technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510241577.6A CN104862749A (en) | 2015-05-13 | 2015-05-13 | High-temperature-resistant bright tin and matte tin electroplating technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104862749A true CN104862749A (en) | 2015-08-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510241577.6A Pending CN104862749A (en) | 2015-05-13 | 2015-05-13 | High-temperature-resistant bright tin and matte tin electroplating technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104862749A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108193241A (en) * | 2017-12-18 | 2018-06-22 | 厦门金越电器有限公司 | A kind of tin plating method of copper or copper alloy parts |
| CN110965093A (en) * | 2019-12-13 | 2020-04-07 | 上海晶澳太阳能科技有限公司 | Bus bar for solar module, preparation method thereof and solar module |
| CN111647917A (en) * | 2020-05-22 | 2020-09-11 | 成都宏明双新科技股份有限公司 | Process for preventing tin-plated product from discoloring in high-temperature test |
| US11383315B2 (en) * | 2019-02-01 | 2022-07-12 | Vacuumschmelze Gmbh & Co. Kg | Method for pre-treating stainless steel substrates before soldering using nanocrystalline solder foils |
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| US20030129441A1 (en) * | 2001-07-31 | 2003-07-10 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Plated copper alloy material and process for production thereof |
| CN101842523A (en) * | 2007-10-31 | 2010-09-22 | 日矿金属株式会社 | Sn-plated material for electronic parts |
| CN101845647A (en) * | 2009-03-26 | 2010-09-29 | 株式会社神户制钢所 | Copper or the copper alloy and the manufacture method thereof of the band Sn coating of excellent heat resistance |
| CN103660426A (en) * | 2012-08-29 | 2014-03-26 | 株式会社神户制钢所 | Sn-coated copper alloy strip having excellent heat resistance |
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2015
- 2015-05-13 CN CN201510241577.6A patent/CN104862749A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030129441A1 (en) * | 2001-07-31 | 2003-07-10 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Plated copper alloy material and process for production thereof |
| CN101842523A (en) * | 2007-10-31 | 2010-09-22 | 日矿金属株式会社 | Sn-plated material for electronic parts |
| CN101845647A (en) * | 2009-03-26 | 2010-09-29 | 株式会社神户制钢所 | Copper or the copper alloy and the manufacture method thereof of the band Sn coating of excellent heat resistance |
| CN103660426A (en) * | 2012-08-29 | 2014-03-26 | 株式会社神户制钢所 | Sn-coated copper alloy strip having excellent heat resistance |
Non-Patent Citations (2)
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| 刘异军等: "防止锡回流变色的连接器电镀工艺", 《电镀与涂饰》 * |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108193241A (en) * | 2017-12-18 | 2018-06-22 | 厦门金越电器有限公司 | A kind of tin plating method of copper or copper alloy parts |
| CN108193241B (en) * | 2017-12-18 | 2019-08-23 | 厦门金越电器有限公司 | A kind of tin plating method of copper or copper alloy parts |
| US11383315B2 (en) * | 2019-02-01 | 2022-07-12 | Vacuumschmelze Gmbh & Co. Kg | Method for pre-treating stainless steel substrates before soldering using nanocrystalline solder foils |
| CN110965093A (en) * | 2019-12-13 | 2020-04-07 | 上海晶澳太阳能科技有限公司 | Bus bar for solar module, preparation method thereof and solar module |
| CN111647917A (en) * | 2020-05-22 | 2020-09-11 | 成都宏明双新科技股份有限公司 | Process for preventing tin-plated product from discoloring in high-temperature test |
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Address after: Liuhe District of Nanjing City, Jiangsu province 210048 geguan Road No. 625 Applicant after: Nanjing Scientific Professional School Address before: Liuhe District of Nanjing City, Jiangsu province 210048 geguan Road No. 625 Applicant before: Nanjing College of Chemical Technology |
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Application publication date: 20150826 |
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