CN104850692B - 一种用于芯片设计的智能布线系统设计方法 - Google Patents
一种用于芯片设计的智能布线系统设计方法 Download PDFInfo
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CN108268679A (zh) * | 2016-12-30 | 2018-07-10 | 无锡天芯互联科技有限公司 | 一种ate测试板快速布局系统和方法 |
CN107451370B (zh) * | 2017-08-11 | 2020-07-07 | 哈尔滨工业大学 | 一种鲁棒性对称引脚型芯片的绘制方法 |
CN110213892B (zh) * | 2019-05-29 | 2020-12-29 | 芯和半导体科技(上海)有限公司 | 一种pcb连线的方法 |
CN112487751B (zh) * | 2020-11-18 | 2024-01-26 | 江苏科大亨芯半导体技术有限公司 | 带自检查功能的io pad自动化布局的方法 |
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CN103413796A (zh) * | 2013-07-16 | 2013-11-27 | 中国科学院计算技术研究所 | 一种基板多芯片集成的大端口互连类芯片及实现方法 |
CN104445046A (zh) * | 2014-06-24 | 2015-03-25 | 华天科技(昆山)电子有限公司 | 新型晶圆级mems芯片封装结构及其封装方法 |
CN104538378A (zh) * | 2014-12-26 | 2015-04-22 | 江苏长电科技股份有限公司 | 一种圆片级封装结构及其工艺方法 |
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JP3819901B2 (ja) * | 2003-12-25 | 2006-09-13 | 松下電器産業株式会社 | 半導体装置及びそれを用いた電子機器 |
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CN103413796A (zh) * | 2013-07-16 | 2013-11-27 | 中国科学院计算技术研究所 | 一种基板多芯片集成的大端口互连类芯片及实现方法 |
CN104445046A (zh) * | 2014-06-24 | 2015-03-25 | 华天科技(昆山)电子有限公司 | 新型晶圆级mems芯片封装结构及其封装方法 |
CN104538378A (zh) * | 2014-12-26 | 2015-04-22 | 江苏长电科技股份有限公司 | 一种圆片级封装结构及其工艺方法 |
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