CN104850174A - Electronic equipment - Google Patents
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- CN104850174A CN104850174A CN201410054115.9A CN201410054115A CN104850174A CN 104850174 A CN104850174 A CN 104850174A CN 201410054115 A CN201410054115 A CN 201410054115A CN 104850174 A CN104850174 A CN 104850174A
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Abstract
An electronic equipment is provided and comprises an input unit for receiving an input from a user; a processing unit for performing various processing operations in response to the input of the user; and a heat dissipation unit which is used for cooling the processing unit; wherein the heat dissipation unit comprises an air outlet for exhausting air; an air inlet for absorbing air; a fan component which is placed opposite to the processing unit and which is used for blowing cold air towards the processing unit with the air absorbed by the air inlet, and the cold air is converted into hot air after absorbing heat and is exhausted via the air outlet; and the fan component, the processing unit and the input unit are respectively located at different areas of a substrate of the electronic equipment.
Description
Technical field
The present invention relates to electronic equipment.More particularly, the present invention relates to the radiating layout of ultra-thin electronic equipment.
Background technology
In recent years, the development of electronic equipment is maked rapid progress.In order to meet the demand that user constantly promotes equipment profile, electronic equipment also does more and more frivolous.Along with the development trend of electronics miniaturization, the cooling system of electronic equipment is issues that need special attention.The cooling system of electronic equipment is the key factor being related to system stability, has the deadlock of a lot of unknown cause in fact to cause because heat dissipation problem cannot well solve.For more and more frivolous electronic equipment, due to the reduction of body volume, certainly will require that it is equipped with better cooling system, the stability of guarantee machine performance.
But in today that user is more and more higher to the thickness requirement of product, cooling system becomes the thinning bottleneck of system sometimes.Specifically, fan is the significant components of cooling system.And be subject to the impact of system space and height, in use, there is considerable restraint in fan.If need the frivolous size of guarantee equipment, so just can only the total power consumption of limiting device, select the chipset of smaller power, thus limit the further lifting of equipment performance.
In addition, along with the continuous lifting of electronic equipment performance, the power consumption of equipment is also in continuous increase.If efficient cooling system can not be adopted, then the temperature of equipment surface may be caused more and more higher.Along with user requires more and more higher to the experience of product, the important element that the use sense that the surface temperature of equipment has become affects user is subject to.
For this reason, in the prior art, there is solution possible as follows:
The first, radiating efficiency and the performance of cooling system can be improved by the quantity increasing fan.Such as, two fans can be utilized to dispel the heat.But the quantity increasing fan must bring the increase of volume.Therefore, in view of the development trend of electronics miniaturization, the application prospect of this scheme is little.
The second, heat dissipation capacity can be reduced by reducing the otherwise performance of electronic equipment.Such as, reduce charging current or change low performance chip etc.But although meet the requirement of user to equipment size in this way, the decline of electronic equipment performance can affect the experience of user equally.
Visible, above two schemes is all the scheme selecting one among the game of volume and performance, can not the two take into account.
Summary of the invention
In view of above problem, expect to provide a kind of electronic equipment, it can take into account heat dispersion and apparent volume.
According to an aspect of the present invention, provide a kind of electronic equipment, comprising: input block, for receiving the input from user; Processing unit, carries out various process operation for the input in response to user; And heat-sink unit, for dispelling the heat to described processing unit; Wherein said heat-sink unit comprises: air outlet, for discharging air; Air inlet, for sucking air; And fan part, just described processing unit is placed, air for being sucked by air inlet is blown a cold wind over to described processing unit, described cold wind changes hot blast into after absorbing heat and discharges via described air outlet, and wherein said fan part, described processing unit and described input block lay respectively in the zones of different in the base of described electronic equipment.
According in the electronic equipment of the embodiment of the present invention, air channel is directly blown facing to thermal source, by controlling the runner of cold wind, system is heated gradually.Because cold wind blows whole system, therefore system can have extraordinary surface temperature.Compared with the scheme that directly nonthermal source blows facing to radiating fin of air channel in prior art, can lower the temperature to system more quickly.
In addition, processing unit is separated with input block with fan part, thus effectively can reduce device thickness.In addition, fan part is separated with radiating fin, placed side by side in non-longitudinal in the horizontal, thus can reduce front end forehead width, the appearance looks elegant degree of lifting means.
In addition, system air inlet is immediately below fan part.Air intake spacing can be reduced, and then contribute to reducing complete machine thickness.Further, because air inlet is immediately below fan part, the performance of fan part can be played to greatest extent.
Accompanying drawing explanation
Fig. 1 shows the functional block diagram of the configuration of the electronic equipment according to the embodiment of the present invention.
Fig. 2 shows the schematic diagram of the layout of processing unit, fan part and input block according to prior art.
Fig. 3 A and Fig. 3 B shows the schematic diagram of the layout of processing unit, fan part and input block according to the embodiment of the present invention.
Fig. 4 shows the schematic layout pattern of the configuration of the electronic equipment according to the embodiment of the present invention.
Fig. 5 shows the schematic diagram according to the fan part of prior art and the layout of radiating fin.
Fig. 6 shows the schematic diagram according to the fan part of the embodiment of the present invention and the layout of radiating fin.
Fig. 7 shows the schematic diagram according to the fan part of the embodiment of the present invention and the layout of radiating fin.
Embodiment
Below with reference to accompanying drawings of the present invention each is preferred embodiment described.There is provided the description referring to accompanying drawing, to help the understanding to the example embodiment of the present invention limited by claim and equivalent thereof.It comprises the various details helping to understand, but they can only be counted as exemplary.Therefore, those skilled in the art will recognize that, can make various changes and modifications embodiment described herein, and do not depart from the scope of the present invention and spirit.And, in order to make instructions clearly succinct, will the detailed description to well known function and structure be omitted.
Hereinafter, a kind of example using notebook computer as electronic equipment is described.But it should be appreciated by those skilled in the art, the present invention is not limited to this.Any other electronic equipment all can be applied to the present invention similarly.
Before embodiments of the present invention are described, first explanation is provided to the radiating principle of traditional notebook computer.
In traditional notebook computer, CPU and display card chip there is one deck heat sink.In general, heat sink area is larger, and heat conduction efficiency is higher, more can effective distribute heat.
The heat that CPU and display card chip are distributed can move on radiating fin along with the heat pipe being connected heat sink.Being dispelled the heat by heat pipe is that a kind of character that will absorb/dispel the heat heat in phase transition process that utilizes carries out the technology cooled.Its principle of work is, under vacuum conditions, the boiling point of water is very low.If at the heating one end of pipe, water will evaporate, by the torrid zone to the other end.Flow back to again after water cooling.So repeatedly, heat is just constantly mobile, and the principle of work of air conditioner is similar.Typical heat pipe is made up of shell, liquid-sucking core and end cap, after being extracted into negative pressure in pipe, fills with appropriate hydraulic fluid, make to be close to be full of liquid in the liquid-sucking core capillary-porous material of inside pipe wall after sealed.One end of pipe is evaporator section (bringing-up section), and the other end is condensation segment (cooling section).As required can two sections of intermediate arrangement adiabatic sections.When one end of heat pipe is heated, the liquid carburation by evaporation in capillary wick, steam flows to other end releasing heat and condenses into liquid under small pressure reduction, and liquid flows back to evaporator section along the effect of porosint capillary force again.Endlessly, heat reaches the other end by one end of heat pipe in circulation like this.On the notebook computer type of different model, heat pipe different.They are all finally be connected to " heat sink " and host computer " heat radiation outlet ", play the effect of the heat that main function components (e.g., CPU) produces when conduct electricity brain server works.
Go in order to the heat of heat pipe is promptly diffused in air, can increasing heat radiation area be considered.Therefore, at the end of heat pipe, adopt intensive radiating fin.The effect of these radiating fins is exactly that heat is derived from heat pipe, relies on larger area of dissipation and air exchange heat.In theory, these fins are more intensive better naturally, and like this, its overall heat dissipation area is larger, and radiating effect is also outstanding.
For most of notebook computer, above cooling measure not enough.Only rely on heat radiation and heat transfer, the air of heating, the heat of discharge is effective.The thermal convection that only reliable effect is best, could meet the cooling requirements of high hot chip.Therefore, finally, rely on the radiator fan cold air that delivery temperature is lower continuously, and taken away on radiating fin by the air heated, could to greatest extent the heat on fin be taken away like this.That is, radiator fan plays a part forced convertion, and its object is exactly the heat produced when being run by host computer, the mode flowed by air, outside the main frame being dispersed into machine.
Next, with reference to Fig. 1, the functional block diagram according to the concrete configuration of the electronic equipment of the embodiment of the present invention is described.As described in Figure 1, electronic equipment 100 comprises input block 102, processing unit 104 and heat-sink unit 106.
Input block 102 receives the input from user.When electronic equipment 100 is notebook computer, input block 102 is keyboard.Processing unit 104 carries out various process operation in response to the input of user.When electronic equipment 100 is notebook computer, processing unit 104 can comprise CPU(Central Processing Unit), video card unit, South Bridge chip, sound card chip, network card chip etc.Heat-sink unit 106 dispels the heat to described processing unit 104.
Specifically, heat-sink unit 106 comprises: air outlet 1062, air inlet 1064, fan part 1066.Air outlet 1062 is for discharging air.Air outlet can be positioned at the side of notebook computer, also can be positioned at after notebook computer.Air inlet 1064 is for sucking air.Fan part 1066 is just placed described processing unit 104, blows a cold wind over to described processing unit 104 for the air sucked by air inlet, and described cold wind changes hot blast into after absorbing heat and discharges via described air outlet.
It is important to note that fan part, processing unit and input block here lay respectively in the zones of different in the base of described electronic equipment.In other words, fan part, processing unit are not overlapping with the region at input block place.
Fig. 2 schematically shows the layout of notebook computer fan parts, processing unit and input block according to prior art.Wherein, for clarity and conciseness, other the parts not directly related with the present invention are eliminated in notebook computer.As shown in Figure 2, outmost frame 200 represents the base area of notebook computer, identical with Fig. 1, and inner frame 102 shows input block, that is: keyboard.Two dashed region 1066 and 104 of frame 102 inside represent fan part and processing unit respectively, and wherein, the Regional Gravity being represented by dotted lines fan part and processing unit place is stacked under the keyboard area represented by frame 202.Fig. 2 illustrate only the region overlapping situation complete in keyboard region at fan part and processing unit place, certainly, also may be partly overlapping relation between them.Due to position relationship overlapping up and down, therefore, the Thickness Ratio of equipment is larger.By contrast, design always of the present invention is the quantity reducing parts stacked in the thickness direction of electronic equipment, thus reduces device thickness.
As a kind of possible embodiment, described input block is positioned at first area, and described processing unit and described fan part are positioned at second area, and described first area and described second area are two regions side by side up and down.The first area that input block is positioned at can upper, and the second area that is positioned at of processing unit and fan part can under, as shown in Figure 3A, the dashed region wherein indicated by a is first area, and the dashed region indicated by b is second area.In addition, alternately, the first area that is positioned at of input block can under, and the second area that processing unit and fan part are positioned at can upper, as shown in Figure 3 B, the dashed region wherein indicated by a is first area, and the dashed region indicated by b is second area.
Described processing unit is arranged in the 3rd region of second area further, and described fan part is arranged in the 4th region of described second area further, and described 3rd region and described 4th region are two regions side by side, left and right in second area.3rd region can on the right side, and the 4th region can on a left side.Fig. 3 A and Fig. 3 B all illustrates this situation.Or alternately, the 3rd region can on a left side, and the 4th region can on the right side.
By the layout shown in Fig. 3 A and Fig. 3 B, fan part and processing unit are positioned at shelf region or the front end area of notebook computer, be separated with input block, that is: fan part, processing unit are not overlapping on the thickness direction of the base of notebook computer with the region at input block place, thus compared with prior art, efficiently reduce the thickness of equipment.
In addition, in the radiating layout of existing notebook computer, as noted before, radiator fan is just placed radiating fin, by the forced convertion of radiator fan, the heat on radiating fin is rejected in the air outside electronic equipment.And in this application, radiator fan is just placed processing unit.Like this, the heat that processing unit distributes is except by except heat sink and heat pipe conduction, can also conducting by the mode of forced convertion.Thus, increase heat conduction efficiency.
In electronic equipment according to the present invention, described heat-sink unit may further include heat-conduction component 1068 and radiating fin 1070.
Fig. 4 shows the schematic layout pattern of the concrete configuration of the electronic equipment according to the embodiment of the present invention.As shown in Figure 4, fan part 1066, just to processing unit 104, can take away by the mode of forced convertion a part of heat given out when processing unit 104 works.In addition, the heat distributed when processing unit 104 works can also be taken away by other means.Such as, the heat that distributes for conducting described processing unit 104 of heat-conduction component 1068.Here heat-conduction component is similar with the heat-conduction principle of above described heat pipe.Such as, its utilize in phase transition process to absorb/character of distribute heat cools.
Heat for absorbing the heat of described heat-conduction component 1068 conduction, and is discharged via air outlet 1062 by radiating fin 1070.For the ease of being discharged by heat, radiating fin 1070 is placed on air outlet position.
More preferably, in order to take into account the forced convertion of radiator fan 1066 for radiating fin 1070, can processing unit 104 be placed near radiating fin 1070, that is: in the present case, shorten the distance of radiator fan 1066 and radiating fin 1070 as much as possible.
According in the notebook computer of prior art, under the rear air-out mode that air outlet is positioned at below, because fan part is just to radiating fin blowing, therefore fan part and radiating fin are placed side by side in the vertical, as shown in Figure 5.For clarity and conciseness, illustrating of miscellaneous part is eliminated in Fig. 5.Such problem is, because fan part and radiating fin are arranged in front end and placed side by side in the vertical, therefore causes the front end forehead of notebook computer excessive.This is attractive in appearance not in appearance, thus affects the experience of user.
Different from the notebook computer of prior art, in electronic equipment according to the present invention, described fan part and described radiating fin can be placed side by side in the horizontal, as shown in Figure 6.For clarity and conciseness, illustrating of miscellaneous part is eliminated in Fig. 6.When fan part and processing element are positioned at front end area, because fan part is separated with radiating fin, thus effectively can reduce front end forehead width.
In addition, air inlet 1064 is placed on immediately below fan part 1066.By such configuration, the situation just not right with fan part with air inlet is compared, and can greatly reduce air intake spacing.That is, even if by fan part and air inlet near placing, also good intake can be obtained.Further, the efficiency comparison of fan is high.Thus the situation just not right with fan part with air inlet is compared, can contribute to reducing complete machine thickness.
Only blow a cold wind over different to radiating fin from prior art fan parts, in the present invention, fan part can be blown a cold wind over to whole system, thus makes whole system have extraordinary surface temperature.As noted before, fan part is just placed processing unit, thus the heat that can be distributed by processing unit is in time taken away in the mode of forced convertion.Except processing unit, described fan part is blown a cold wind over to described heat-conduction component further.
In electronic equipment according to the present invention, in described processing unit, the placement location of each assembly is different according to the difference of power consumption.Basic principle is, by thermal source away from fan part, assembly low in energy consumption is placed on the position that cold wind is come in.Such as, the parts (e.g., network interface card parts, hard disk devices etc.) that in described processing unit, power consumption is little are placed near described fan part, and the parts that power consumption is large (e.g., CPU, internal memory etc.) are placed away from described fan part.
Hereinbefore, be described to comprise a fan part in electronic equipment.Certainly, the present invention is not limited thereto.The quantity of fan part can be more than or equal to 1.Such as, two fan parts can be comprised in electronic equipment.Fig. 7 shows the schematic layout pattern of the electronic equipment comprising two fan parts.For clarity and conciseness, illustrating of miscellaneous part is eliminated in Fig. 7.As shown in Figure 7, two fan part 1066-1 and 1066-2 are placed on two angles of plant bottom case front end.First, two fan parts are all not overlapping with the first area a at input block place, thus reduce device thickness.In addition, two fan parts are separated with radiating fin, heat-conduction component, and in the horizontal side by side, thus reduce front end forehead width.Finally, the increase of fan part quantity can heat radiation performance further.
Hereinbefore, the electronic equipment according to the embodiment of the present invention is described in detail referring to figs. 1 through Fig. 7.Sum up, according in the electronic equipment of the embodiment of the present invention, air channel is directly blown facing to thermal source, by controlling the runner of cold wind, system is heated gradually.Because cold wind blows whole system, therefore system can have extraordinary surface temperature.Compared with the scheme that directly nonthermal source blows facing to radiating fin of air channel in prior art, can lower the temperature to system more quickly.
In addition, processing unit is separated with input block with fan part, thus effectively can reduce device thickness.In addition, fan part is separated with radiating fin, placed side by side in non-longitudinal in the horizontal, thus can reduce front end forehead width, the appearance looks elegant degree of lifting means.
In addition, system air inlet is immediately below fan part.Air intake spacing can be reduced, and then contribute to reducing complete machine thickness.Further, because air inlet is immediately below fan part, the performance of fan part can be played to greatest extent.
It should be noted that, in this manual, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
Above to invention has been detailed introduction, applying specific case herein and setting forth principle of the present invention and embodiment, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (9)
1. an electronic equipment, comprises
Input block, for receiving the input from user;
Processing unit, carries out various process operation for the input in response to user; And
Heat-sink unit, for dispelling the heat to described processing unit;
Wherein said heat-sink unit comprises
Air outlet, for discharging air;
Air inlet, for sucking air; And
Fan part, just places described processing unit, blows a cold wind over to described processing unit for the air sucked by air inlet, and described cold wind changes hot blast into after absorbing heat and discharges via described air outlet, and
Wherein said fan part, described processing unit and described input block lay respectively in the zones of different in the base of described electronic equipment.
2. electronic equipment according to claim 1, wherein said input block is positioned at first area, and described processing unit and described fan part are positioned at second area, and described first area and described second area are two regions side by side up and down,
And described processing unit is arranged in the 3rd region of second area further, and described fan part is arranged in the 4th region of described second area further, described 3rd region and described 4th region are two regions side by side, left and right in second area.
3. electronic equipment according to claim 1, wherein said heat-sink unit comprises further:
Heat-conduction component, for conducting the heat that described processing unit distributes;
Radiating fin, for absorbing the heat of described heat-conduction component conduction, and discharges heat via air outlet.
4. electronic equipment according to claim 3, wherein said fan part, described heat-conduction component and described radiating fin are separated from one another, and placed side by side in the horizontal.
5. electronic equipment according to claim 1, wherein said air inlet is positioned at immediately below described fan part.
6. electronic equipment according to claim 3, wherein said fan part is blown a cold wind over to described heat-conduction component further.
7. electronic equipment according to claim 1, the parts that in wherein said processing unit, power consumption is little are placed near described fan part, and the large parts of power consumption are placed away from described fan part.
8. electronic equipment according to claim 1, wherein said air outlet be positioned at described electronic equipment below or side.
9. electronic equipment according to claim 1, the quantity of wherein said fan part is more than or equal to 1.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410054115.9A CN104850174A (en) | 2014-02-18 | 2014-02-18 | Electronic equipment |
| CN201910636853.7A CN110347229A (en) | 2014-02-18 | 2014-02-18 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410054115.9A CN104850174A (en) | 2014-02-18 | 2014-02-18 | Electronic equipment |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910636853.7A Division CN110347229A (en) | 2014-02-18 | 2014-02-18 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
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| CN104850174A true CN104850174A (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910636853.7A Pending CN110347229A (en) | 2014-02-18 | 2014-02-18 | Electronic equipment |
| CN201410054115.9A Pending CN104850174A (en) | 2014-02-18 | 2014-02-18 | Electronic equipment |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910636853.7A Pending CN110347229A (en) | 2014-02-18 | 2014-02-18 | Electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2398665Y (en) * | 1999-10-31 | 2000-09-27 | 富金精密工业(深圳)有限公司 | Holder for fan of computer |
| CN1448824A (en) * | 2002-04-04 | 2003-10-15 | 广达电脑股份有限公司 | Heat radiating component of notebook computer |
| CN1494371A (en) * | 2002-09-25 | 2004-05-05 | ������������ʽ���� | Heat transfer element, cooler with the element and electronic apparatus |
| CN101373393A (en) * | 2007-08-24 | 2009-02-25 | 株式会社东芝 | Electronic apparatus |
| JP2009117493A (en) * | 2007-11-02 | 2009-05-28 | Ricoh Co Ltd | Electrical equipment unit and image processor |
| US20120243179A1 (en) * | 2010-04-09 | 2012-09-27 | Kabushiki Kaisha Toshiba | Electronic apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201035489Y (en) * | 2007-03-20 | 2008-03-12 | 纬创资通股份有限公司 | Electronic equipment and heat radiator thereof |
| TWI505073B (en) * | 2012-03-22 | 2015-10-21 | Compal Electronics Inc | Electronic device |
| CN103576809B (en) * | 2012-07-24 | 2017-09-29 | 联想(北京)有限公司 | Electronic equipment and its first and second electronic equipment and the first electronic equipment switching method |
-
2014
- 2014-02-18 CN CN201910636853.7A patent/CN110347229A/en active Pending
- 2014-02-18 CN CN201410054115.9A patent/CN104850174A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2398665Y (en) * | 1999-10-31 | 2000-09-27 | 富金精密工业(深圳)有限公司 | Holder for fan of computer |
| CN1448824A (en) * | 2002-04-04 | 2003-10-15 | 广达电脑股份有限公司 | Heat radiating component of notebook computer |
| CN1494371A (en) * | 2002-09-25 | 2004-05-05 | ������������ʽ���� | Heat transfer element, cooler with the element and electronic apparatus |
| CN101373393A (en) * | 2007-08-24 | 2009-02-25 | 株式会社东芝 | Electronic apparatus |
| JP2009117493A (en) * | 2007-11-02 | 2009-05-28 | Ricoh Co Ltd | Electrical equipment unit and image processor |
| US20120243179A1 (en) * | 2010-04-09 | 2012-09-27 | Kabushiki Kaisha Toshiba | Electronic apparatus |
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| CN110347229A (en) | 2019-10-18 |
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Application publication date: 20150819 |
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