CN104845000A - Preparation process of insulating resin for completely sealed bus duct - Google Patents
Preparation process of insulating resin for completely sealed bus duct Download PDFInfo
- Publication number
- CN104845000A CN104845000A CN201510294508.1A CN201510294508A CN104845000A CN 104845000 A CN104845000 A CN 104845000A CN 201510294508 A CN201510294508 A CN 201510294508A CN 104845000 A CN104845000 A CN 104845000A
- Authority
- CN
- China
- Prior art keywords
- parts
- mineral filler
- resin
- stirring
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a preparation process of insulating resin for a completely sealed bus duct. The process comprises the following steps: (1) putting 5-15 parts of acrylic resin into a container, adding 10-20 parts of a mixed solvent, and stirring and dispersing for 30-40 minutes at the rotation speed of 4000-6000r/minute, thereby obtaining primary emulsion; (2) adding 2-8 parts of zinc chromate, 1-5 parts of zinc chloride, 2-6 parts of mica powder and 1-5 parts of pigment into the primary emulsion, and stirring and dispersing for 20-30 minutes at the rotation speed of 3600-4200r/minute, thereby obtaining a sizing agent; (3) mixing epoxy powder with benzophenone tricarboxylic acid anhydride, further adding 10-20 parts of the mixed solvent to mix with first inorganic packing, second inorganic packing, third inorganic packing and the sizing agent, and stirring and dispersing for 10-20 minutes at the rotation speed of 0-1200r/minute; and (4) adding 5-10 parts of organosilicone polyether polyol, 1-5 parts of ethylidene bioctadecanamide, 5-10 parts of crylic acid resin and 10-15 parts of polyamide resin into the mixed liquid, and stirring and dispersing for 10-20 minutes at the rotation speed of 600-1100r/minute, thereby obtaining the insulating resin for the completely sealed bus duct.
Description
Technical field
The present invention relates to the manufacture manufacture field of Totally-enclosed-type bus duct, particularly a kind of preparation technology of totally-enclosed bus duct insulating resin.
Background technology
Insulation compound is a kind of coating with excellent electrical insulating property, can be used as the protective coating of product or parts in electric industry.Along with scientific and technological industrial expansion, we are more and more higher to the performance requriements of insulation compound, the H level of exploitation excellent performance, C level, open air, and the High-Voltage Insulation coating of the harsh environmental conditions such as high temperature, humidity, severe cold, the large temperature difference, strong irradiation, corrodibility, greasy dirt, salt fog can be applied to, be a world subject of the electric field of new of electrician.
When insulation compound is applied in the equipment relevant to power system, its performance is mainly not only insulating effect, and comprise high temperature resistant, corrosion-resistant, shock-resistant energy performance, and at present, traditional insulation compound, there are some defects, as paint adhesion not, easily aliquation, come off, solid content is too low, and film forming is thin, environmental pollution is serious, and insulation life is short.
Summary of the invention
Technical problem to be solved by this invention is, overcomes the shortcoming of prior art, provides a kind of preparation technology of totally-enclosed bus duct insulating resin.
In order to solve above technical problem, the invention provides a kind of preparation technology of totally-enclosed bus duct insulating resin, comprising following concrete steps:
get 5-15 part acrylic resin and be placed in container, add the mixed solvent of 10-20 part, with the rotating speed dispersed with stirring 30-40 minute of 4000-6000r/min, obtain colostric fluid;
zinc chromate 2-8 part, zinc chloride 1-5 part, mica powder 2-6 part, pigment 1-5 part is added in above-mentioned colostric fluid, with the rotating speed dispersed with stirring 20-30 minute of 3600-4200r/min, Dry Sack slurry;
by epoxy powder and the mixing of benzophenone tricarboxylic acid anhydride, then add the mixed solvent of 10-20 part, mix with the first mineral filler, the second mineral filler, the 3rd mineral filler and above-mentioned mill base material, with the rotating speed dispersed with stirring 10-20 minute of 800-1200r/min;
by step
organic silicon polyether polyol 5-10 part, ethylenebis stearic amide 1-5 part, acrylic resin 5-10 part, polyamide resin 10-15 part is added in obtained mixed solution, with the rotating speed dispersed with stirring 10-20 minute of 600-1100r/min, namely obtain totally-enclosed bus duct insulating resin;
This epoxy powder is joined by epoxy resin, epoxy curing agent, pigment and inorganic material powders filler and is made; Between each component, formula is by weight: epoxy resin 50 parts, epoxy resin fixing agent 50 parts, pigment 8-10 part, inorganic material powders filler 60 parts; Epoxy resin is bisphenol A type epoxy resin, and it is the bis-phenol A glycidyl ether resin generated by dihydroxyphenyl propane and epichlorohydrin reaction;
At least one in the group that epoxy curing agent is amino curing agent, form in anhydride group solidifying agent, polyamine solidifying agent, polysulphide solidifying agent, linear phenolic resin type solidifying agent, bisphenol A-type solidifying agent and dicy-curing agent; Inorganic material powders filler is aluminum oxide, silicon oxide, magnesium oxide, calcium carbonate, carbon black, titanium dioxide, talcum powder or its combination;
First mineral filler has the heat-conduction coefficient of more than 20W/mK and the median size of 1-200 μm, second mineral filler has and is less than the relative permittivity of 10 and the median size of 0.01-1 μm, and the first mineral filler is at least one in the group that is selected from aluminum oxide (Al2O3), boron nitride (BN), aluminium nitride (AlN), silicon carbide (SiC), beryllium oxide (BeO), beryllium hydroxide (Be (OH) 2), beryllium carbide (Be2C) and magnesium oxide (MgO) and forms;
Second mineral filler is at least one in the group that is selected from silicon oxide (SiO2), boron nitride (BN), aluminium nitride (AlN), aluminum bromide (AlBr3) and aluminum fluoride (AlF3) and forms; 3rd mineral filler is talcum powder, glass powder, diatomite, perlite or agalmatolite; Mixed solvent is two or more in acetone, ethanol, butanols, dimethylbenzene, toluene, ethyl acetate or butylacetate.
Technique effect: the insulating resin coating obtained by the present invention, cost is low, technique is simple, not only excellent insulation performance, and long service life, have shock-resistant and heat-resisting excellent properties simultaneously, the present invention is by adding machine silicon polyether glycol, ethylenebis stearic amide, acrylic resin, polyamide resin, make the insulating property of dielectric resin material obtain the lifting of matter, create beyond thought technique effect, and effectively can reduce environmental pollution.
The technical scheme that the present invention limits further is:
Further, the preparation technology of aforesaid totally-enclosed bus duct insulating resin, comprises following concrete steps:
get 11 parts of acrylic resins and be placed in container, add the mixed solvent of 16 parts, with the rotating speed dispersed with stirring 36 minutes of 5500r/min, obtain colostric fluid;
zinc chromate 6 parts, zinc chloride 3 parts, mica powder 4 parts, pigment 6 parts is added in above-mentioned colostric fluid, with the rotating speed dispersed with stirring 25 minutes of 3800r/min, Dry Sack slurry;
by epoxy powder and the mixing of benzophenone tricarboxylic acid anhydride, then add the mixed solvent of 16 parts, mix with the first mineral filler, the second mineral filler, the 3rd mineral filler and above-mentioned mill base material, with the rotating speed dispersed with stirring 16 minutes of 950r/min;
by step
add Organic silicon polyether polyol 6 parts, ethylenebis stearic amide 3 parts, acrylic resin 8 parts, polyamide resin 11 parts in obtained mixed solution, with the rotating speed dispersed with stirring 15 minutes of 850r/min, namely obtain totally-enclosed bus duct insulating resin;
This epoxy powder is joined by epoxy resin, epoxy curing agent, pigment and inorganic material powders filler and is made; Between each component, formula is by weight: epoxy resin 50 parts, epoxy resin fixing agent 50 parts, pigment 9 parts, inorganic material powders filler 60 parts; Epoxy resin is bisphenol A type epoxy resin, and it is the bis-phenol A glycidyl ether resin generated by dihydroxyphenyl propane and epichlorohydrin reaction;
At least one in the group that epoxy curing agent is amino curing agent, form in anhydride group solidifying agent, polyamine solidifying agent, polysulphide solidifying agent, linear phenolic resin type solidifying agent, bisphenol A-type solidifying agent and dicy-curing agent; Inorganic material powders filler is aluminum oxide, silicon oxide, magnesium oxide, calcium carbonate, carbon black, titanium dioxide, talcum powder or its combination;
First mineral filler has the heat-conduction coefficient of more than 20W/mK and the median size of 1-200 μm, second mineral filler has and is less than the relative permittivity of 10 and the median size of 0.01-1 μm, and the first mineral filler is at least one in the group that is selected from aluminum oxide (Al2O3), boron nitride (BN), aluminium nitride (AlN), silicon carbide (SiC), beryllium oxide (BeO), beryllium hydroxide (Be (OH) 2), beryllium carbide (Be2C) and magnesium oxide (MgO) and forms;
Second mineral filler is at least one in the group that is selected from silicon oxide (SiO2), boron nitride (BN), aluminium nitride (AlN), aluminum bromide (AlBr3) and aluminum fluoride (AlF3) and forms; 3rd mineral filler is talcum powder, glass powder, diatomite, perlite or agalmatolite; Mixed solvent is two or more in acetone, ethanol, butanols, dimethylbenzene, toluene, ethyl acetate or butylacetate.
The preparation technology of aforesaid totally-enclosed bus duct insulating resin, the first mineral filler has the median size that the median size of 1-70 μm and the second mineral filler have 0.05-1 μm.
Embodiment
embodiment 1
The preparation technology of a kind of totally-enclosed bus duct insulating resin that the present embodiment provides, comprises following concrete steps:
get 5-15 part acrylic resin and be placed in container, add the mixed solvent of 15 parts, with the rotating speed dispersed with stirring 30-40 minute of 4500r/min, obtain colostric fluid;
zinc chromate 2 parts, zinc chloride 5 parts, mica powder 2 parts, pigment 5 parts is added in above-mentioned colostric fluid, with the rotating speed dispersed with stirring 25 minutes of 3800r/min, Dry Sack slurry;
by epoxy powder and the mixing of benzophenone tricarboxylic acid anhydride, then add the mixed solvent of 16 parts, mix with the first mineral filler, the second mineral filler, the 3rd mineral filler and above-mentioned mill base material, with the rotating speed dispersed with stirring 15 minutes of 1100r/min;
by step
add Organic silicon polyether polyol 6 parts, ethylenebis stearic amide 3 parts, acrylic resin 6 parts, polyamide resin 11 parts in obtained mixed solution, with the rotating speed dispersed with stirring 15 minutes of 950r/min, namely obtain totally-enclosed bus duct insulating resin;
This epoxy powder is joined by epoxy resin, epoxy curing agent, pigment and inorganic material powders filler and is made; Between each component, formula is by weight: epoxy resin 50 parts, epoxy resin fixing agent 50 parts, pigment 9 parts, inorganic material powders filler 60 parts; Epoxy resin is bisphenol A type epoxy resin, and it is the bis-phenol A glycidyl ether resin generated by dihydroxyphenyl propane and epichlorohydrin reaction;
At least one in the group that epoxy curing agent is amino curing agent, form in anhydride group solidifying agent, polyamine solidifying agent, polysulphide solidifying agent, linear phenolic resin type solidifying agent, bisphenol A-type solidifying agent and dicy-curing agent; Inorganic material powders filler is aluminum oxide, silicon oxide, magnesium oxide, calcium carbonate, carbon black, titanium dioxide, talcum powder or its combination;
First mineral filler has the heat-conduction coefficient of more than 20W/mK and the median size of 1-200 μm, second mineral filler has and is less than the relative permittivity of 10 and the median size of 0.01-1 μm, and the first mineral filler is at least one in the group that is selected from aluminum oxide (Al2O3), boron nitride (BN), aluminium nitride (AlN), silicon carbide (SiC), beryllium oxide (BeO), beryllium hydroxide (Be (OH) 2), beryllium carbide (Be2C) and magnesium oxide (MgO) and forms;
Second mineral filler is at least one in the group that is selected from silicon oxide (SiO2), boron nitride (BN), aluminium nitride (AlN), aluminum bromide (AlBr3) and aluminum fluoride (AlF3) and forms; 3rd mineral filler is talcum powder, glass powder, diatomite, perlite or agalmatolite; Mixed solvent is two or more in acetone, ethanol, butanols, dimethylbenzene, toluene, ethyl acetate or butylacetate.
embodiment 2
The preparation technology of a kind of aforesaid totally-enclosed bus duct insulating resin that the present embodiment provides, comprises following concrete steps:
get 11 parts of acrylic resins and be placed in container, add the mixed solvent of 16 parts, with the rotating speed dispersed with stirring 36 minutes of 5500r/min, obtain colostric fluid;
zinc chromate 6 parts, zinc chloride 3 parts, mica powder 4 parts, pigment 6 parts is added in above-mentioned colostric fluid, with the rotating speed dispersed with stirring 25 minutes of 3800r/min, Dry Sack slurry;
by epoxy powder and the mixing of benzophenone tricarboxylic acid anhydride, then add the mixed solvent of 16 parts, mix with the first mineral filler, the second mineral filler, the 3rd mineral filler and above-mentioned mill base material, with the rotating speed dispersed with stirring 16 minutes of 950r/min;
by step
add Organic silicon polyether polyol 6 parts, ethylenebis stearic amide 3 parts, acrylic resin 8 parts, polyamide resin 11 parts in obtained mixed solution, with the rotating speed dispersed with stirring 15 minutes of 850r/min, namely obtain totally-enclosed bus duct insulating resin;
This epoxy powder is joined by epoxy resin, epoxy curing agent, pigment and inorganic material powders filler and is made; Between each component, formula is by weight: epoxy resin 50 parts, epoxy resin fixing agent 50 parts, pigment 9 parts, inorganic material powders filler 60 parts; Epoxy resin is bisphenol A type epoxy resin, and it is the bis-phenol A glycidyl ether resin generated by dihydroxyphenyl propane and epichlorohydrin reaction;
At least one in the group that epoxy curing agent is amino curing agent, form in anhydride group solidifying agent, polyamine solidifying agent, polysulphide solidifying agent, linear phenolic resin type solidifying agent, bisphenol A-type solidifying agent and dicy-curing agent; Inorganic material powders filler is aluminum oxide, silicon oxide, magnesium oxide, calcium carbonate, carbon black, titanium dioxide, talcum powder or its combination;
First mineral filler has the heat-conduction coefficient of more than 20W/mK and the median size of 1-70 μm, second mineral filler has and is less than the relative permittivity of 10 and the median size of 0.05-1 μm, and the first mineral filler is at least one in the group that is selected from aluminum oxide (Al2O3), boron nitride (BN), aluminium nitride (AlN), silicon carbide (SiC), beryllium oxide (BeO), beryllium hydroxide (Be (OH) 2), beryllium carbide (Be2C) and magnesium oxide (MgO) and forms;
Second mineral filler is at least one in the group that is selected from silicon oxide (SiO2), boron nitride (BN), aluminium nitride (AlN), aluminum bromide (AlBr3) and aluminum fluoride (AlF3) and forms; 3rd mineral filler is talcum powder, glass powder, diatomite, perlite or agalmatolite; Mixed solvent is two or more in acetone, ethanol, butanols, dimethylbenzene, toluene, ethyl acetate or butylacetate.
Above embodiment is only and technological thought of the present invention is described, can not limit protection scope of the present invention with this, and every technological thought proposed according to the present invention, any change that technical scheme basis is done, all falls within scope.
Claims (3)
1. a preparation technology for totally-enclosed bus duct insulating resin, is characterized in that, comprises following concrete steps:
get 5-15 part acrylic resin and be placed in container, add the mixed solvent of 10-20 part, with the rotating speed dispersed with stirring 30-40 minute of 4000-6000r/min, obtain colostric fluid;
zinc chromate 2-8 part, zinc chloride 1-5 part, mica powder 2-6 part, pigment 1-5 part is added in above-mentioned colostric fluid, with the rotating speed dispersed with stirring 20-30 minute of 3600-4200r/min, Dry Sack slurry;
by epoxy powder and the mixing of benzophenone tricarboxylic acid anhydride, then add the mixed solvent of 10-20 part, mix with the first mineral filler, the second mineral filler, the 3rd mineral filler and above-mentioned mill base material, with the rotating speed dispersed with stirring 10-20 minute of 800-1200r/min;
by step
organic silicon polyether polyol 5-10 part, ethylenebis stearic amide 1-5 part, acrylic resin 5-10 part, polyamide resin 10-15 part is added in obtained mixed solution, with the rotating speed dispersed with stirring 10-20 minute of 600-1100r/min, namely obtain totally-enclosed bus duct insulating resin;
This epoxy powder described is joined by epoxy resin, epoxy curing agent, pigment and inorganic material powders filler and is made; Between each component, formula is by weight: epoxy resin 50 parts, epoxy resin fixing agent 50 parts, pigment 8-10 part, inorganic material powders filler 60 parts; Described epoxy resin is bisphenol A type epoxy resin, and it is the bis-phenol A glycidyl ether resin generated by dihydroxyphenyl propane and epichlorohydrin reaction;
At least one in the group that described epoxy curing agent is amino curing agent, form in anhydride group solidifying agent, polyamine solidifying agent, polysulphide solidifying agent, linear phenolic resin type solidifying agent, bisphenol A-type solidifying agent and dicy-curing agent; Described inorganic material powders filler is aluminum oxide, silicon oxide, magnesium oxide, calcium carbonate, carbon black, titanium dioxide, talcum powder or its combination;
Described first mineral filler has the heat-conduction coefficient of more than 20W/mK and the median size of 1-200 μm, described second mineral filler has and is less than the relative permittivity of 10 and the median size of 0.01-1 μm, and described first mineral filler is at least one in the group that is selected from aluminum oxide (Al2O3), boron nitride (BN), aluminium nitride (AlN), silicon carbide (SiC), beryllium oxide (BeO), beryllium hydroxide (Be (OH) 2), beryllium carbide (Be2C) and magnesium oxide (MgO) and forms;
Described second mineral filler is at least one in the group that is selected from silicon oxide (SiO2), boron nitride (BN), aluminium nitride (AlN), aluminum bromide (AlBr3) and aluminum fluoride (AlF3) and forms; Described 3rd mineral filler is talcum powder, glass powder, diatomite, perlite or agalmatolite; Described mixed solvent is two or more in acetone, ethanol, butanols, dimethylbenzene, toluene, ethyl acetate or butylacetate.
2. the preparation technology of totally-enclosed bus duct insulating resin according to claim 1, is characterized in that, comprise following concrete steps:
get 11 parts of acrylic resins and be placed in container, add the mixed solvent of 16 parts, with the rotating speed dispersed with stirring 36 minutes of 5500r/min, obtain colostric fluid;
zinc chromate 6 parts, zinc chloride 3 parts, mica powder 4 parts, pigment 6 parts is added in above-mentioned colostric fluid, with the rotating speed dispersed with stirring 25 minutes of 3800r/min, Dry Sack slurry;
by epoxy powder and the mixing of benzophenone tricarboxylic acid anhydride, then add the mixed solvent of 16 parts, mix with the first mineral filler, the second mineral filler, the 3rd mineral filler and above-mentioned mill base material, with the rotating speed dispersed with stirring 16 minutes of 950r/min;
by step
add Organic silicon polyether polyol 6 parts, ethylenebis stearic amide 3 parts, acrylic resin 8 parts, polyamide resin 11 parts in obtained mixed solution, with the rotating speed dispersed with stirring 15 minutes of 850r/min, namely obtain totally-enclosed bus duct insulating resin;
This epoxy powder described is joined by epoxy resin, epoxy curing agent, pigment and inorganic material powders filler and is made; Between each component, formula is by weight: epoxy resin 50 parts, epoxy resin fixing agent 50 parts, pigment 9 parts, inorganic material powders filler 60 parts; Described epoxy resin is bisphenol A type epoxy resin, and it is the bis-phenol A glycidyl ether resin generated by dihydroxyphenyl propane and epichlorohydrin reaction;
At least one in the group that described epoxy curing agent is amino curing agent, form in anhydride group solidifying agent, polyamine solidifying agent, polysulphide solidifying agent, linear phenolic resin type solidifying agent, bisphenol A-type solidifying agent and dicy-curing agent; Described inorganic material powders filler is aluminum oxide, silicon oxide, magnesium oxide, calcium carbonate, carbon black, titanium dioxide, talcum powder or its combination;
Described first mineral filler has the heat-conduction coefficient of more than 20W/mK and the median size of 1-200 μm, described second mineral filler has and is less than the relative permittivity of 10 and the median size of 0.01-1 μm, and described first mineral filler is at least one in the group that is selected from aluminum oxide (Al2O3), boron nitride (BN), aluminium nitride (AlN), silicon carbide (SiC), beryllium oxide (BeO), beryllium hydroxide (Be (OH) 2), beryllium carbide (Be2C) and magnesium oxide (MgO) and forms;
Described second mineral filler is at least one in the group that is selected from silicon oxide (SiO2), boron nitride (BN), aluminium nitride (AlN), aluminum bromide (AlBr3) and aluminum fluoride (AlF3) and forms; Described 3rd mineral filler is talcum powder, glass powder, diatomite, perlite or agalmatolite; Described mixed solvent is two or more in acetone, ethanol, butanols, dimethylbenzene, toluene, ethyl acetate or butylacetate.
3. the preparation technology of totally-enclosed bus duct insulating resin according to claim 1, is characterized in that, described first mineral filler has the median size that the median size of 1-70 μm and described second mineral filler have 0.05-1 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510294508.1A CN104845000A (en) | 2015-06-02 | 2015-06-02 | Preparation process of insulating resin for completely sealed bus duct |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510294508.1A CN104845000A (en) | 2015-06-02 | 2015-06-02 | Preparation process of insulating resin for completely sealed bus duct |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104845000A true CN104845000A (en) | 2015-08-19 |
Family
ID=53845014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510294508.1A Pending CN104845000A (en) | 2015-06-02 | 2015-06-02 | Preparation process of insulating resin for completely sealed bus duct |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104845000A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108299797A (en) * | 2018-01-24 | 2018-07-20 | 合肥同佑电子科技有限公司 | A kind of preparation method of electronic integrated circuit encapsulation material |
| CN110016205A (en) * | 2019-03-07 | 2019-07-16 | 全球能源互联网研究院有限公司 | A kind of epoxy resin heat-conducting insulation material and preparation method thereof |
| CN110317523A (en) * | 2019-07-25 | 2019-10-11 | 吉林嘉科米尼科技有限公司 | Epoxy resin vulcanizes energy-saving insulated bus duct preparation method |
| CN115232422A (en) * | 2022-07-15 | 2022-10-25 | 湖南万祺科技有限公司 | Insulating protective film for power battery |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1462783A (en) * | 2003-06-02 | 2003-12-24 | 四川大学 | Antibiotic type coating material of epoxy powder modified by inorganic nano composite antimicrobial, and its prepn. method |
| CN102755955A (en) * | 2012-07-31 | 2012-10-31 | 东莞市晶磁科技有限公司 | Amorphous magnetic core surface coating process |
| CN103525008A (en) * | 2013-09-24 | 2014-01-22 | 广州市半径电力铜材有限公司 | Composite insulating material, casting busway and preparation method of composite insulating material |
| CN104212130A (en) * | 2013-05-30 | 2014-12-17 | 三星电机株式会社 | Insulation resin composition for printed circuit board having improved thermal conductivity and electrical properties, insulating film, prepreg and printed circuit board |
| CN104263190A (en) * | 2014-08-27 | 2015-01-07 | 南京市荣达树脂有限公司 | Insulating resin coating and preparation method thereof |
| CN104292722A (en) * | 2014-09-19 | 2015-01-21 | 葛沈香 | Organic insulating resin film |
-
2015
- 2015-06-02 CN CN201510294508.1A patent/CN104845000A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1462783A (en) * | 2003-06-02 | 2003-12-24 | 四川大学 | Antibiotic type coating material of epoxy powder modified by inorganic nano composite antimicrobial, and its prepn. method |
| CN102755955A (en) * | 2012-07-31 | 2012-10-31 | 东莞市晶磁科技有限公司 | Amorphous magnetic core surface coating process |
| CN104212130A (en) * | 2013-05-30 | 2014-12-17 | 三星电机株式会社 | Insulation resin composition for printed circuit board having improved thermal conductivity and electrical properties, insulating film, prepreg and printed circuit board |
| CN103525008A (en) * | 2013-09-24 | 2014-01-22 | 广州市半径电力铜材有限公司 | Composite insulating material, casting busway and preparation method of composite insulating material |
| CN104263190A (en) * | 2014-08-27 | 2015-01-07 | 南京市荣达树脂有限公司 | Insulating resin coating and preparation method thereof |
| CN104292722A (en) * | 2014-09-19 | 2015-01-21 | 葛沈香 | Organic insulating resin film |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108299797A (en) * | 2018-01-24 | 2018-07-20 | 合肥同佑电子科技有限公司 | A kind of preparation method of electronic integrated circuit encapsulation material |
| CN110016205A (en) * | 2019-03-07 | 2019-07-16 | 全球能源互联网研究院有限公司 | A kind of epoxy resin heat-conducting insulation material and preparation method thereof |
| CN110016205B (en) * | 2019-03-07 | 2021-10-15 | 全球能源互联网研究院有限公司 | Epoxy resin heat-conducting insulating material and preparation method thereof |
| CN110317523A (en) * | 2019-07-25 | 2019-10-11 | 吉林嘉科米尼科技有限公司 | Epoxy resin vulcanizes energy-saving insulated bus duct preparation method |
| CN115232422A (en) * | 2022-07-15 | 2022-10-25 | 湖南万祺科技有限公司 | Insulating protective film for power battery |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104845000A (en) | Preparation process of insulating resin for completely sealed bus duct | |
| CA2988827C (en) | Epoxy resin composition | |
| CN104152093A (en) | Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof | |
| US9340661B2 (en) | Coated magnesium oxide particles, method for the production thereof, heat-releasing filler, and resin composition | |
| CN106752763A (en) | Nano graphene oxide modified epoxy type powdery paints and preparation method thereof | |
| CN102746766A (en) | Water -borne anticorrosion paint and method for preparing same | |
| Ramu et al. | Alumina and silica based epoxy nano-composites for electrical insulation | |
| CN106497330A (en) | A kind of Graphene modified epoxy resin paint and preparation method thereof | |
| CN104387917A (en) | Insulating paint | |
| CN108300136A (en) | A kind of preparation method and product of graphene heat radiation coating | |
| CN103059692B (en) | Epoxy powder coating for coating magnet ring and preparation method of epoxy powder coating | |
| CN105969277A (en) | Heat-dissipating pouring sealant for packaging electronic devices | |
| KR101681020B1 (en) | Excellent radiant heat coating composition and method of radiant heat device for led lamp using the same | |
| CN106700817A (en) | Preparation method of insulating powder coating with high adhesion strength for electronic parts and components | |
| WO2019031285A1 (en) | Powder paint composition | |
| CN105925012A (en) | Preparation method of modified ultrafine heavy calcium carbonate | |
| US9090796B2 (en) | Organic-inorganic composite materials containing triazine rings and electrical devices using the same | |
| CN105679503A (en) | High-performance distribution transformer | |
| CN106893459A (en) | A kind of capacitor aluminum housing coating paint and its production and coating method | |
| CN106700750A (en) | Preparation method of anticorrosive static conducting powder coating for inner wall of oil tank | |
| WO2016056263A1 (en) | Electric insulation resin | |
| JP2017222527A (en) | Composite particle, varnish, organic-inorganic composite material, semiconductor device and stator coil for rotating machine | |
| JP2005320479A (en) | Liquid epoxy resin composition | |
| CN105754455A (en) | Method for preparing electric insulation anticorrosion powder coating | |
| JP2020121895A (en) | ZIRCONIUM β-PHOSPHATE SULFATE PARTICLES AND METHOD FOR PRODUCING THE SAME |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150819 |