CN104821314A - OLED and LED combined lamp - Google Patents
OLED and LED combined lamp Download PDFInfo
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- CN104821314A CN104821314A CN201510240775.0A CN201510240775A CN104821314A CN 104821314 A CN104821314 A CN 104821314A CN 201510240775 A CN201510240775 A CN 201510240775A CN 104821314 A CN104821314 A CN 104821314A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Provided is an OLED and LED combined lamp, comprising a substrate, a flexible circuit board, an OLED light source assembly, and an LED light source assembly. The substrate comprises a reflective film, a heat transfer film, and a heat radiation film arranged in an overlapped manner. The OLED light source assembly comprises a plurality of OLED sub-light sources. The OLED sub-light source comprises an anode transparent glass substrate, a conductive anode, a hole transport layer, a luminous layer, an electron transfer layer, a conductive cathode, and a cathode transparent glass substrate arranged in an overlapped manner in sequence. The LED light source assembly comprises a plurality of LED sub-light sources. The plurality of LED sub-light sources are arranged on the reflective film. Through the reflective film, the heat transfer film, and the heat radiation film arranged in an overlapped manner, the substrate of the OLED and LED combined lamp is advantaged that the substrate has good heat dispersion and is flexional. In addition, through combination use of the OLED light source assembly and the LED light source assembly, light rays emitted by the OLED and LED combined lamp is softer.
Description
Technical field
The present invention relates to lighting technical field, particularly relate to a kind of OLED and LED blended lamp.
Background technology
Along with the raising of science and technology constantly progressive and people's aesthetic level, the light fixture of solid shape, namely inflexible light fixture cannot meet people far away in actual life, to higher level aesthetic requirement and artistic experience.And the light fixture that often can bend can be installed better or be fitted on irregular installed surface, the binding face of installed surface and light fixture and exterior object, such as, installed surface is right-angle surface or arc surface, thus the three-dimensional illumination effect more having artistic feeling and aesthetical perception can be built, and then illuminating effect and visual effect better can be obtained.
General, light fixture mainly comprises substrate and is arranged on the emitting components on substrate, and wherein, substrate is for dispelling the heat and providing the installation site needed for emitting components.Actual conditions are, the small volume of emitting components, its impact realizing bending function to light fixture is also less, and so, the parts affecting the bending function of light fixture realization are generally substrate, at present, the material of substrate obtains primarily of plastics, metal or ceramic preparation, and the bending property of existing substrate is poor, is difficult to meet the demand that light fixture can realize bending function, meanwhile, existing substrate heat dispersion is also poor.
In addition, it is soft not also still to there is light in existing light fixture, the defect larger to human eye injury.
Such as, Chinese patent 200910111522.8 discloses a kind of transformable lamp, it comprises one first case and one second case, this first case is fixed with one first rotating unit, this second case is fixed with one second rotating unit, this first rotating unit can rotate relative to this second rotating unit, and this first case rotates relative to this second case with the cooperation of this second rotating unit by this first rotating unit.Compared to the prior art, transformable lamp of the present invention is by the cooperation of the first rotating unit between the first case and the second case and the second rotating unit rotation relation each other, the deformability object realizing light fixture is reached with comparatively simple structure, make light fixture of the present invention be applicable to multiple occasion, meet the individual demand of people.
And for example, Chinese patent 201210586153.X discloses a kind of light fixture, it comprises substrate, multiple light-emitting diode and lamp housing, lamp housing offers light-emitting window, substrate is made up of flexible material, the periphery of substrate is embedded in lamp housing periphery, substrate comprises light-emitting area, light-emitting area is arranged towards light-emitting window, multiple light-emitting diode arrangement is in light-emitting area, when substrate is to direction flexural deformation away from light-emitting window, light-emitting area is concave surface, multiple light-emitting diode is spot mode arrangement, when substrate is to when the direction flexural deformation of light-emitting window, light-emitting area is convex surface, multiple light-emitting diode is flood mode arrangement.Light fixture of the present invention is by selecting flexible material by the substrate of diode installed, under external force can be raised or sunken by light-emitting area, so that floodlight or spot condition can be formed, a lamp for user is dual-purpose provides possibility, also save a large amount of use costs, use more convenient lighter.Simultaneously without the need to carrying two light fixtures, use procedure is more laborsaving.
And for example, Chinese patent 200420117918.6 discloses a kind of light fixture with shape changing lamp base, specifically refers to a kind of lamp stand angle adjustment with light fixture, produces lamp socket composition variation in moulding, presents the light fixture of different visual effect; Described light fixture contains and utilizes a pivot element eccentric pivots to connect first and second lamp socket, makes the lamp socket of its phase fit; One utilizes cover axle unit to be combined in the lamp stand of the second lamp socket; And the positioning unit of adjustment angle, its contain one be arranged on the second lamp socket support shell fragment, and correspondence is molded over the resistance wall in the first lamp socket; The angle adjustment of lamp stand is utilized to operate, synchronous driving second lamp socket with the pivot element of bias for axle center, outwards stretch the composition moulding changed with the first lamp socket, new lamp socket moulding visual sense can be obtained, and by positioning unit between the second lamp socket and the first lamp socket, the elasticity location assistance force of angulation adjustment.
And for example, Chinese patent 201310024855.3 discloses a kind of scalable novel form changeable light fixture, comprise bar group part A, drive part B, power input portion C, bar group part A is connected with the revolute pair that strut (8) is formed by bar (6) with drive part B.Bar (5) on bar group part A bar group (IV), bar (6) are connected with bar (7) respectively, the parallelogram formed is identical with upper all the other parallelogram shape formed of bar group (IV), bar (7) is in vertical direction with an angle, and the profile of whole light fixture adjusts by this angle.Drive part B is connected with shaft coupling (14) by leading screw (13) with power input portion C.The bar group part A of light fixture is a space circular arc curved surface, and this curved surface constitutes the main body of light fixture, and the bulb of light fixture can be placed on each rod member.The convergent-divergent distortion of light fixture is divided into contraction, launches two states, shrink and the degree launched by the time controling of drive motors rotating, the monnolithic case of light fixture is imitative fresh flower shape.
But still there is heat dispersion difference, flexible poor performance and light problem softer in light fixture disclosed in above-mentioned patent.
Summary of the invention
Based on this, be necessary to provide a kind of good heat dispersion performance, OLED and the LED blended lamp that flexible and light is softer.
A kind of OLED and LED blended lamp, comprising:
Substrate, described substrate comprises the reflectance coating, heat-transfer film and the heat dissipation film that superpose setting successively;
Flexible circuit board, described flexible circuit board is arranged in described heat dissipation film;
OLED light source assembly, described OLED light source assembly comprises the OLED sub-light source of multiple sheet, multiple described OLED sub-light source spread configuration is in described reflectance coating, and be provided with interval between often adjacent two described OLED sub-light sources, described OLED sub-light source is electrically connected with described flexible circuit board by wire, and described OLED sub-light source comprises the anode transparent glass substrate, conductive anode, hole transmission layer, luminescent layer, electron transfer layer, conductive cathode and the negative electrode transparent glass substrate that superpose setting successively; And
LED light source component, described LED light source component comprises multiple LED sub-light source, multiple described LED sub-light source is arranged at described reflectance coating, and in the interval of described LED sub-light source between two described OLED sub-light sources, described LED sub-light source is electrically connected with described flexible circuit board by wire.
Wherein in an embodiment, described OLED sub-light source is the flaky texture with rectangle plane.
Wherein in an embodiment, described OLED sub-light source is the flaky texture with rectangle cambered surface.
Wherein in an embodiment, the fluorescence matrix of the described luminescent layer of described OLED sub-light source is NPB.
Wherein in an embodiment, multiple described OLED sub-light source is set in parallel in described reflectance coating.
Wherein in an embodiment, the thickness of described reflectance coating is 2mm ~ 5mm.
Wherein in an embodiment, the thickness of described heat-transfer film is 12mm ~ 15mm.
Wherein in an embodiment, the thickness of described heat dissipation film is 25mm ~ 30mm.
The substrate of above-mentioned OLED and LED blended lamp, by superposing the reflectance coating of setting, heat-transfer film and heat dissipation film successively, has good heat dispersion performance and flexible advantage.In addition, by the compound use of OLED light source assembly and LED light source component, the light that OLED and LED blended lamp can be made to send is softer.
Accompanying drawing explanation
Fig. 1 is the structural representation of OLED and the LED blended lamp of an embodiment of the present invention;
Fig. 2 is the structural representation of another angle of OLED and the LED blended lamp shown in Fig. 1;
Fig. 3 is the structural representation of the OLED sub-light source of an embodiment of the present invention;
Fig. 4 is the structural representation of OLED and the LED blended lamp of another execution mode of the present invention;
Fig. 5 is the structural representation of OLED and the LED blended lamp of another execution mode of the present invention;
Fig. 6 is the structural representation of OLED and the LED blended lamp of another execution mode of the present invention;
Fig. 7 is the structural representation of OLED and the LED blended lamp of another execution mode of the present invention.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Better embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to execution mode described herein.On the contrary, provide the object of these execution modes be make to disclosure of the present invention understand more thorough comprehensively.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique execution mode.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe concrete execution mode, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Such as, a kind of OLED and LED blended lamp, comprising: substrate, and described substrate comprises the reflectance coating, heat-transfer film and the heat dissipation film that superpose setting successively; Flexible circuit board, described flexible circuit board is arranged in described heat dissipation film; OLED light source assembly, described OLED light source assembly comprises the OLED sub-light source of multiple sheet, multiple described OLED sub-light source spread configuration is in described reflectance coating, and be provided with interval between often adjacent two described OLED sub-light sources, described OLED sub-light source is electrically connected with described flexible circuit board by wire, and described OLED sub-light source comprises the anode transparent glass substrate, conductive anode, hole transmission layer, luminescent layer, electron transfer layer, conductive cathode and the negative electrode transparent glass substrate that superpose setting successively; And LED light source component, described LED light source component comprises multiple LED sub-light source, multiple described LED sub-light source is arranged at described reflectance coating, and in the interval of described LED sub-light source between two described OLED sub-light sources, described LED sub-light source is electrically connected with described flexible circuit board by wire.
In order to understand above-mentioned OLED and LED blended lamp further, another example is, a kind of OLED and LED blended lamp, and it comprises OLED and the LED blended lamp described in above-mentioned any embodiment.
See also Fig. 1 and Fig. 2, it is respectively the structural representation of two different angles of OLED and the LED blended lamp 10 of an embodiment of the present invention.
OLED and LED blended lamp 10 comprises: substrate 100, flexible circuit board 200, OLED light source assembly 300 and LED light source component 400.Flexible circuit board 200, OLED light source assembly 300 and LED light source component 400 are all arranged at substrate 100.
Refer to Fig. 2, substrate 100 comprises the reflectance coating 110, heat-transfer film 120 and the heat dissipation film 130 that superpose setting successively.That is, heat-transfer film 120 is attached on reflectance coating 110, and heat dissipation film 130 is attached at the side of heat-transfer film 120 away from reflectance coating 110.Reflectance coating 110 can reflect and/or scattering the light that OLED light source assembly 300 and LED light source component 400 send, thus improve the utilance of the light that OLED light source assembly 300 and LED light source component 400 send better, meanwhile, the diffusion angle of the light that OLED light source assembly 300 and LED light source component 400 send can also be increased.The heat that OLED light source assembly 300 and LED light source component 400 produce when normally working for playing heat transfer effect, thus can be passed to heat dissipation film 130 by heat-transfer film 120 rapidly.Heat dissipation film 130 is for playing thermolysis, and the heat that OLED light source assembly 300 and LED light source component 400 luminescence produce can fall apart by rapidly.
Refer to Fig. 2, flexible circuit board 200 is arranged in heat dissipation film 130, and it provides complete circuit structure for giving the normal work of OLED light source assembly 300 and LED light source component 400.Such as, flexible circuit board 200 adopts flexible circuit board of the prior art to prepare, and it can realize bending function.
Refer to Fig. 1, OLED light source assembly 300 comprises the OLED sub-light source 310 of multiple sheet, multiple OLED sub-light source 310 spread configuration in reflectance coating 110, and is provided with interval 150 between two often adjacent OLED sub-light sources 310, and described interval 150 is for accommodating installation LED light source component 400.
Refer to Fig. 2, OLED sub-light source 310 is electrically connected with flexible circuit board 200 by wire (not shown), like this, can ensure the normal working performance of each OLED sub-light source 310.
In order to make multiple OLED sub-light source 310 can have multiple different glow color respectively, such as, refer to Fig. 3, it is the structural representation of the OLED sub-light source 310 of an embodiment of the present invention.
OLED sub-light source 310 comprises the anode transparent glass substrate 311, ITO conductive anode 312, NPB hole transmission layer 313, the NPB luminescent layer 314 mixing MQA, Alq (Alq3) electron transfer layer 315, Al conductive cathode 316 and the negative electrode transparent glass substrate 317 that superpose setting successively, wherein, the fluorescence matrix of the luminescent layer 314 of OLED sub-light source 310 is NPB.
The voltage difference of 2V ~ 10V is applied between conductive anode and conductive cathode, the hole of anode and the electronics of negative electrode can be made to be transferred to EL respectively by hole and electron transfer layer, produce power exciton when hole and electronics meet in luminescent layer, thus excite the light emitting molecule in EL to send green glow.
Certainly, the glow color of each OLED sub-light source 100 is not limited to green glow, and that is, fluorescent dopants is not limited to MQA, can also adjust fluorescent dopants according to actual needs, only need change the material that luminescent layer 140 adulterates.Such as, fluorescent dopants also comprises pyrene, rubrene DCM or its mixture, and so, the glow color that OLED sub-light source 100 is corresponding is respectively blue light, gold-tinted or orange red light.So, multiple OLED sub-light source 310 can be made to have multiple different glow color respectively.
In order to improve the uniformity of described OLED light source module light, such as, described OLED sub-light source is the flaky texture with rectangle plane; And for example, described OLED sub-light source is the flaky texture with rectangle cambered surface; And for example, multiple described OLED sub-light source is set in parallel in described reflectance coating, so, can improve the uniformity of described OLED light source module light.
Refer to Fig. 1, LED light source component 400 comprises multiple LED sub-light source 410, and multiple LED sub-light source 410 is arranged at reflectance coating 110, and in the interval 150 of LED sub-light source 410 between two OLED sub-light sources 310.Such as, LED sub-light source 410 is hemispherical dome structure; And for example, LED sub-light source 410 is for having the cylindrical-shaped structure of circular cambered surface.
It should be noted that, above-mentioned OLED and LED blended lamp 10 is arranged on the reflectance coating 110 of substrate 100 by OLED sub-light source 310 and LED sub-light source 410 being arranged in order, namely the distribution of OLED sub-light source 310 and LED sub-light source 410 is optimized, simultaneously, again in conjunction with the luminous characteristics that OLED sub-light source 310 is different with LED sub-light source 410, so, the light that above-mentioned OLED and LED blended lamp 10 can be made to send is softer, minimum to the injury of human eye.
Refer to Fig. 2, LED sub-light source 410 is electrically connected with flexible circuit board 200 by described wire, like this, can ensure the normal working performance of each LED sub-light source 410.
In order to improve the uniformity of above-mentioned OLED and LED blended lamp illuminating effect further, and the mildness of the light sent, such as, refer to Fig. 1, two row LED sub-light sources 410 are set in the interval 150 between two often adjacent OLED sub-light sources 310; And for example, the two row LED sub-light sources 410 arranged in the interval 150 between two often adjacent OLED sub-light sources 310 are parallel to each other, the uniformity that so can improve the illumination of above-mentioned OLED and LED blended lamp further and the mildness emitted beam.
Function is bent in order to solve the more difficult realization of existing OLED and LED blended lamp, and the technical problem that heat dispersion is poor.Such as, the described substrate of described OLED and the LED blended lamp of an embodiment of the present invention, it has flexible and advantage that is good heat dispersion performance.
An example is, described OLED and the LED blended lamp of an embodiment of the present invention, and wherein, the described reflectance coating of described substrate comprises each component of following mass parts:
Polyolefin 50 parts ~ 65 parts, Merlon 45 parts ~ 50 parts, PLA 15 parts ~ 25 parts and PETG 10 parts ~ 20 parts.
Above-mentioned reflectance coating is by adding polyolefin 50 parts ~ 65 parts, Merlon 45 parts ~ 50 parts, PLA 15 parts ~ 25 parts and PETG 10 parts ~ 20 parts, described reflectance coating can be made to have preferably mechanical performance, preferably suppleness and firmness, thus described reflectance coating can be made to have flexible advantage.In addition, the light reflectivity of described reflectance coating is also higher, when a part of light of described OLED light source assembly and described LED light source component exposes to described reflectance coating, described reflectance coating can reflect and/or scattering the light that described OLED light source assembly and described LED light source component send, thus the utilance of the light that described OLED light source assembly and described LED light source component send can be improved better, meanwhile, the diffusion angle of the light that described OLED light source assembly and described LED light source component send can also be increased.
Preferably, described OLED and the LED blended lamp of an embodiment of the present invention, wherein, the described reflectance coating of described substrate comprises each component of following mass parts:
Polyolefin 55 parts ~ 60 parts, Merlon 47 parts ~ 48 parts, PLA 15 parts ~ 20 parts and PETG 15 parts ~ 20 parts.
Preferably, described OLED and the LED blended lamp of an embodiment of the present invention, wherein, the described reflectance coating of described substrate comprises each component of following mass parts:
Polyolefin 60 parts, Merlon 47 parts, PLA 20 parts and PETG 20 parts.
Function is bent in order to solve the more difficult realization of existing OLED and LED blended lamp, and the technical problem that heat dispersion is poor.Such as, the described substrate of described OLED and the LED blended lamp of an embodiment of the present invention, it has flexible and advantage that is good heat dispersion performance.
An example is, described OLED and the LED blended lamp of an embodiment of the present invention, and wherein, the described heat-transfer film of described substrate comprises each component of following mass parts:
Ethylene vinyl acetate cross-linking agent 5 parts ~ 8 parts, ethylene vinyl acetate 6 parts ~ 10 parts, polyolefin 10 parts ~ 12 parts, Merlon 9 parts ~ 11 parts, PLA 45 parts ~ 55 parts, PETG 12 parts ~ 15 parts, organic siliconresin 1 part ~ 1.5 parts, methyl-silicone oil 1 part ~ 1.5 parts, two methyl-silicone oil 1 part ~ 1.5 parts, ethyl silicon oil 1 part ~ 1.5 parts, phenyl silicone oil 1 part ~ 1.5 parts, MethylethoxylsiliconFluid Fluid 1 part ~ 1.5 parts, methyl vinyl silicon oil 1 part ~ 1.5 parts, heat filling 25 parts ~ 30 parts and 0.5 part ~ 1 part, curing agent,
Wherein, described heat filling comprises in aluminium powder, zinc powder, copper powder, aluminium oxide, aluminium nitride, boron nitride, carborundum, boron nitride, described needle-like material is ZnOw, a kind of or several arbitrarily mixture in potassium titanate crystal whisker, silicon nitride crystal whisker, β-SiC whisker.
First, above-mentioned heat-transfer film is by adding heat filling 25 parts ~ 30 parts, can at script heat transfer property extreme difference, but form some heat transfer paths in mechanical performance and bending property good rubber-silica gel polymerization system, thus the heat that described OLED light source assembly and described LED light source component transmission can be come carries out heat transfer operations faster, namely pass in the described heat dissipation film of fitting with described heat-transfer film, thus achieve described heat-transfer film can have good heat-transfer simultaneously, flexible ability is strong, firmness is better, resistance to fracture and the good advantage of softness after bending.
Secondly, above-mentioned heat-transfer film by adding ethylene vinyl acetate cross-linking agent 5 parts ~ 8 parts, ethylene vinyl acetate 6 parts ~ 10 parts, polyolefin 10 parts ~ 12 parts, Merlon 9 parts ~ 11 parts, PLA 45 parts ~ 55 parts, PETG 12 parts ~ 15 parts can make described heat-transfer film have preferably mechanical performance, preferably suppleness and firmness, preferably bending rear resistance to fracture property, puncture-resistant performance and decay resistance.
Finally, by adding organic siliconresin 1 part ~ 1.5 parts, methyl-silicone oil 1 part ~ 1.5 parts, two methyl-silicone oil 1 part ~ 1.5 parts, ethyl silicon oil 1 part ~ 1.5 parts, phenyl silicone oil 1 part ~ 1.5 parts, MethylethoxylsiliconFluid Fluid 1 part ~ 1.5 parts and methyl vinyl silicon oil 1 part ~ 1.5 parts, greatly can strengthen the flexibility of described heat-transfer film, and then improve the flexible ability of described laminating layer.
Preferably, described OLED and the LED blended lamp of an embodiment of the present invention, wherein, the described heat-transfer film of described substrate comprises each component of following mass parts:
Ethylene vinyl acetate cross-linking agent 5.5 parts ~ 6.5 parts, ethylene vinyl acetate 8 parts ~ 10 parts, polyolefin 10 parts ~ 10.5 parts, Merlon 9 parts ~ 10 parts, PLA 45 parts ~ 50 parts, PETG 12 parts ~ 13 parts, organic siliconresin 1 part ~ 1.5 parts, methyl-silicone oil 1 part ~ 1.5 parts, two methyl-silicone oil 1 part ~ 1.5 parts, ethyl silicon oil 1 part ~ 1.5 parts, phenyl silicone oil 1 part ~ 1.5 parts, MethylethoxylsiliconFluid Fluid 1 part ~ 1.5 parts, methyl vinyl silicon oil 1 part ~ 1.5 parts, heat filling 18.5 parts ~ 20 parts and 0.5 part ~ 1 part, curing agent, wherein, described heat filling comprises aluminium powder, zinc powder, copper powder, aluminium oxide, aluminium nitride, boron nitride, carborundum, in boron nitride, described needle-like material is ZnOw, potassium titanate crystal whisker, silicon nitride crystal whisker, a kind of or several arbitrarily mixture in β-SiC whisker.
Preferably, described OLED and the LED blended lamp of an embodiment of the present invention, wherein, the described heat-transfer film of described substrate comprises each component of following mass parts:
Ethylene vinyl acetate cross-linking agent 6.5 parts, ethylene vinyl acetate 8.5 parts, polyolefin 10.5 parts, Merlon 9.5 parts, PLA 50 parts, PETG 12.5 parts, organic siliconresin 1.5 parts, methyl-silicone oil 1.5 parts, two methyl-silicone oil 1.5 parts, ethyl silicon oil 1.5 parts, phenyl silicone oil 1.5 parts, MethylethoxylsiliconFluid Fluid 1.5 parts, methyl vinyl silicon oil 1.5 parts, heat filling 20 parts and 1 part, curing agent, wherein, described heat filling is aluminium powder, zinc powder, copper powder, aluminium oxide, aluminium nitride, boron nitride, carborundum, in boron nitride, described needle-like material comprises ZnOw, potassium titanate crystal whisker, silicon nitride crystal whisker, a kind of or several arbitrarily mixture in β-SiC whisker.
Function is bent in order to solve the more difficult realization of existing OLED and LED blended lamp, and the technical problem that heat dispersion is poor.Such as, the described substrate of described OLED and the LED blended lamp of an embodiment of the present invention, it has flexible and advantage that is good heat dispersion performance.
An example is, described OLED and the LED blended lamp of an embodiment of the present invention, and wherein, the described heat dissipation film of described substrate comprises each component of following mass parts:
Graphene nano particle 0.5 part ~ 1.5 parts, carbon nano-tube 0.5 part ~ 1.5 parts, nano-metal particle 0.3 part ~ 0.8 part, polyolefin 20 parts ~ 25 parts, Merlon 15 parts ~ 20 parts, PLA 10 parts ~ 15 parts and PETG 10 parts ~ 15 parts, acrylic resin 5 parts ~ 10 parts, polyether resin 5 parts ~ 10 parts, 5 parts ~ 10 parts, mylar, polyurethane resin 3 parts ~ 5 parts, silicon-Ji resin 1 part ~ 2 parts, organic siliconresin 5 parts ~ 10 parts, fluoro-base resin 1 part ~ 2 parts, polyesteramide resin 5 parts ~ 8 parts, 1 part ~ 2 parts, phenolic resins, epoxy resin 20 parts ~ 25 parts, UV cured resin 5 parts ~ 15 parts and auxiliary agent 1.5 parts ~ 2.5 parts,
Wherein, described nano-metal particle comprises a kind of or several arbitrarily mixture in iron powder, carbon-coated iron powder, nickel powder, carbon nickel coat powder, silver powder, bronze, and described auxiliary agent comprises a kind of or several arbitrarily mixture in curing agent, ultraviolet absorber, light stabilizer, antistatic agent, curing agent, wetting agent, brightening agent and dispersant.
First, above-mentioned heat dissipation film can be formed have irregular cancellated heat radiation system by adding graphene nano particle 0.5 part ~ 1.5 parts and carbon nano-tube 0.5 part ~ 1.5 parts and nano-metal particle 0.3 part ~ 0.8 part in described heat dissipation film, that is, by add graphene nano particle 0.5 part ~ 1.5 parts and carbon nano-tube 0.5 part ~ 1.5 parts and nano-metal particle 0.3 part ~ 0.8 part can be formed in described heat dissipation film some have staggered, distortion, spiral is or/and the heat dissipation channel of branch shape stereochemical structure, so, greatly can improve heat conduction and the heat dispersion of described heat dissipation film, when described OLED light source assembly and described LED light source component heat directly and indirect transfer to described heat dissipation film time, described heat dissipation film can fast and in time by described heat loss in extraneous medium, as, scatter and disappear in atmosphere or be delivered in outside mounting, thus play the effect of quick heat radiating cooling, ensure that the normal working performance of described OLED light source assembly and described LED light source component.
Secondly, by adding by a kind of or any several nano-metal particle mixture formed in iron powder, carbon-coated iron powder, nickel powder, carbon nickel coat powder, silver powder, bronze, the heat dispersion of described heat dissipation film can be strengthened further.
Finally, above-mentioned heat dissipation film is by adding polyolefin 20 parts ~ 25 parts, Merlon 15 parts ~ 20 parts, PLA 10 parts ~ 15 parts and PETG 10 parts ~ 15 parts, acrylic resin 5 parts ~ 10 parts, polyether resin 5 parts ~ 10 parts, 5 parts ~ 10 parts, mylar, polyurethane resin 3 parts ~ 5 parts, silicon-Ji resin 1 part ~ 2 parts, organic siliconresin 5 parts ~ 10 parts, fluoro-base resin 1 part ~ 2 parts, polyesteramide resin 5 parts ~ 8 parts, 1 part ~ 2 parts, phenolic resins, epoxy resin 20 parts ~ 25 parts, UV cured resin 5 parts ~ 15 parts and auxiliary agent 1.5 parts ~ 2.5 parts, can produce synergy after the polymerization of these resin reactions, thus make described heat dissipation film have preferably mechanical performance, flexible performance and bending rear resistance to fracture property, and can overcome owing to adding graphene nano particle 0.5 part ~ 1.5 parts, after carbon nano-tube 0.5 part ~ 1.5 parts and nano-metal particle 0.3 part ~ 0.8 part, the problem that caused described heat dissipation film brittleness increases, thus can better coordinate described reflectance coating to carry out flexural deformation together with described heat-transfer film.In addition, described heat dissipation film also has preferably toughness, thus can be fixedly mounted on better in outside mounting.
Preferably, described OLED and the LED blended lamp of an embodiment of the present invention, wherein, the described heat dissipation film of described substrate comprises each component of following mass parts:
Graphene nano particle 0.5 part ~ 1 part, carbon nano-tube 0.5 part ~ 1 part, nano-metal particle 0.5 part ~ 0.8 part, polyolefin 23 parts ~ 25 parts, Merlon 18 parts ~ 20 parts, PLA 10 parts ~ 12 parts and PETG 10 parts ~ 12 parts, acrylic resin 8 parts ~ 8.5 parts, polyether resin 5 parts ~ 8 parts, 5 parts ~ 8 parts, mylar, polyurethane resin 4.5 parts ~ 5 parts, silicon-Ji resin 1 part ~ 1.5 parts, organic siliconresin 8 parts ~ 10 parts, fluoro-base resin 1 part ~ 1.5 parts, polyesteramide resin 6.5 parts ~ 8 parts, 1 part ~ 1.5 parts, phenolic resins, epoxy resin 23 parts ~ 25 parts, UV cured resin 5 parts ~ 13 parts and auxiliary agent 2 parts ~ 2.5 parts,
Wherein, described nano-metal particle comprises a kind of or several arbitrarily mixture in iron powder, carbon-coated iron powder, nickel powder, carbon nickel coat powder, silver powder, bronze, and described auxiliary agent comprises a kind of or several arbitrarily mixture in curing agent, ultraviolet absorber, light stabilizer, antistatic agent, curing agent, wetting agent, brightening agent and dispersant.
Preferably, described OLED and the LED blended lamp of an embodiment of the present invention, wherein, the described heat dissipation film of described substrate comprises each component of following mass parts:
Graphene nano particle 1 part, carbon nano-tube 1 part, nano-metal particle 0.8 part, polyolefin 24 parts, Merlon 18.5 parts, PLA 10 parts and PETG 10 parts, acrylic resin 8 parts, polyether resin 7 parts, 7 parts, mylar, polyurethane resin 4.5 parts, silicon-Ji resin 1 part, organic siliconresin 8 parts, fluoro-base resin 1.5 parts, polyesteramide resin 8 parts, 1.5 parts, phenolic resins, epoxy resin 25 parts, UV cured resin 5 parts and auxiliary agent 2 parts;
Wherein, described nano-metal particle comprises a kind of or several arbitrarily mixture in iron powder, carbon-coated iron powder, nickel powder, carbon nickel coat powder, silver powder, bronze, and described auxiliary agent comprises a kind of or several arbitrarily mixture in curing agent, ultraviolet absorber, light stabilizer, antistatic agent, curing agent, wetting agent, brightening agent and dispersant.
More uniformly be blended in described heat dissipation film to make graphene nano particle, carbon nano-tube and nano-metal particle, and make described heat dissipation film fit in described heat-transfer film more securely, the problem that described heat dissipation film is separated with described heat-transfer film is there is during to alleviate the bending of described substrate, such as, described OLED and the LED blended lamp of an embodiment of the present invention, wherein, the preparation method of the described heat dissipation film of described substrate, comprises the steps:
Step S210: by polyolefin 20 parts ~ 25 parts, Merlon 15 parts ~ 20 parts, PLA 10 parts ~ 15 parts and PETG 10 parts ~ 15 parts, acrylic resin 5 parts ~ 10 parts, polyether resin 5 parts ~ 10 parts, 5 parts ~ 10 parts, mylar, polyurethane resin 3 parts ~ 5 parts, silicon-Ji resin 1 part ~ 2 parts, organic siliconresin 5 parts ~ 10 parts, fluoro-base resin 1 part ~ 2 parts, polyesteramide resin 5 parts ~ 8 parts, 1 part ~ 2 parts, phenolic resins, epoxy resin 20 parts ~ 25 parts, UV cured resin 5 parts ~ 15 parts and auxiliary agent 1.5 parts ~ 2.5 parts melting mixing, obtain fused solution.
Step S220: while hot graphene nano particle 0.5 part ~ 1.5 parts, carbon nano-tube 0.5 part ~ 1.5 parts and nano-metal particle 0.3 part ~ 0.8 part are added in described fused solution, then, stir, obtain cooling fluid after mixing.
Step S230: while hot described cooling fluid is coated on described heat-transfer film, obtains described heat dissipation film after cooling.
So, graphene nano particle, carbon nano-tube and nano-metal particle can be made more uniformly to be blended in described heat dissipation film by above-mentioned steps S210 to step S230, and make described heat dissipation film fit in described heat-transfer film more securely, there is the problem that described heat dissipation film is separated with described heat-transfer film during to alleviate the bending of described reflectance coating.
In order to optimize the thickness of described reflectance coating, described heat-transfer film and described heat dissipation film better, thus obtain better flexible performance and heat dispersion, such as, the thickness of described reflectance coating is 2mm ~ 5mm; And for example, the thickness of described heat-transfer film is 12mm ~ 15mm; And for example, the thickness of described heat dissipation film is 25mm ~ 30mm, so, can optimize the thickness of described reflectance coating, described heat-transfer film and described heat dissipation film, thus obtains better flexible performance and heat dispersion.
The substrate 100 of above-mentioned OLED and LED blended lamp 10, by superposing the reflectance coating 110 of setting, heat-transfer film 120 and heat dissipation film 130 successively, can obtain good heat dispersion performance and flexible advantage.In addition, by the compound use of OLED light source assembly 300 and LED light source component 400, the light that OLED and LED blended lamp 10 can be made to send is softer.
In order to make described OLED and LED blended lamp can realize the variable easier technique effect of glow color, such as, refer to Fig. 4, it is the structural representation of OLED and the LED blended lamp 20 of another execution mode of the present invention.
OLED and LED blended lamp 20 also comprises multiple guide rail 500, and multiple guide rail 500 spread configuration is in reflectance coating 110, and each OLED sub-light source 310 correspondence is slided and is arranged at a guide rail 500, and multiple OLED sub-light source 310 and reflectance coating 110 are fitted.When needing to realize the variable function of OLED and LED blended lamp 20 glow color, when there is manifold color-emitting based on OLED sub-light source 310, only need can complete color change operation by the OLED sub-light source 310 of the different glow color of guide rail 500 correspondence replacing, the OLED sub-light source 310 by multiple different glow color is alternately arranged on same guide rail 500 respectively.Need additionally to arrange control circuit to realize colour change function relative to existing light fixture, it is more convenient that OLED and LED blended lamp 20 realizes glow color variable operation, and is easier to realize.
In order to make OLED sub-light source 310 better opposite rail 500 slide, thus realize glow color variable operation effect more easily, such as, refer to Fig. 4, multiple guide rail 500 is set in parallel in reflectance coating 110; And for example, guide rail 500 comprise two slide blocks, 510, two slide blocks 510 be relatively arranged on reflectance coating 110, OLED sub-light source 310 slide be arranged between two slide blocks 510; And for example, two slide blocks 510 are set in parallel in reflectance coating; And for example, slide block 510 has the bending structure of 90 degree away from one end of reflectance coating 110, so, can make OLED sub-light source 310 better opposite rail 500 slide, thus realize glow color variable operation effect more easily.
In order to make described OLED and LED blended lamp can realize having maglev technique effect, such as, refer to Fig. 5, it is the structural representation of OLED and the LED blended lamp 30 of another execution mode of the present invention.
OLED and LED blended lamp 30 also comprises soft magnetic bodies 600 and electromagnet 700, soft magnetic bodies 600 fits in the side of heat dissipation film 130 away from heat-transfer film 120, soft magnetic bodies 600 can realize bending function, to guarantee the bending property of OLED and LED blended lamp 30 entirety, such as, soft magnetic bodies 600 adopts the same material of rigidity to prepare in flexible material.
Electromagnet 700 is arranged towards soft magnetic bodies 600, soft magnetic bodies 600 is towards the magnetic pole of the electromagnet 700 after energising, homopolarity is set to towards the magnetic pole of soft magnetic bodies 600 with the electromagnet 700 after energising, so, by the magnetic field effect of electromagnet 700 with soft magnetic bodies 600, described OLED and LED blended lamp can be made can to realize having maglev technique effect.
In order to improve the planarization of described soft magnetic bodies, such as, described soft magnetic bodies is the cuboid structure of sheet; And for example, the thickness of described soft magnetic bodies is 8mm ~ 10mm, so, can improve the planarization of described soft magnetic bodies.
In order to improve the convenience of described OLED and LED blended lamp when carrying and use, such as, refer to Fig. 6, it is the structural representation of OLED and the LED blended lamp 40 of another execution mode of the present invention.
OLED and LED blended lamp 40 also comprises flexible battery 800, and flexible battery 800 fits in the side of heat dissipation film 130 away from heat-transfer film 120, and flexible battery 800 is electrically connected with flexible PCB 200 by described wire.Relative to existing light fixture when normally working, need to be connected with outside power supply, above-mentioned OLED and LED blended lamp 40 provides power supply by flexible battery 800 pairs of OLED and LED blended lamps 40, with guarantee OLED and LED blended lamp 40 can out of doors and exempt from external power source when normally work, and then improve the convenience of OLED and LED blended lamp 40 when carrying and use.
In order to improve the quality of described flexible battery, such as, described flexible battery is flexible lithium ion battery; And for example, described negative electricity pole piece adopts the one in cobalt acid zinc/carbon cloth composite negative pole material, zinc oxide, tin oxide, iron oxide or nickel oxide, and described anode electrode sheet adopts the one in cobalt acid lithium, LiFePO4 or lithium manganate material; And for example, described flexible battery comprises soft shell and is placed in the battery main body in described soft shell, is perfused with electrolyte in described soft shell, and described battery main body comprises the anode electrode sheet, barrier film and the negative electricity pole piece that superpose setting successively; And for example, soft shell is aluminium foil, so, can improve the quality of described flexible battery.
In order to make described flexible battery be arranged at described substrate better, such as, described flexible battery is the cuboid structure of sheet; And for example, the thickness of described flexible battery is 8mm ~ 10mm, so, described flexible battery can be made to be arranged at described substrate better.
In order to improve the convenience of described OLED and LED blended lamp charging, such as, refer to Fig. 7, it is the structural representation of OLED and the LED blended lamp 50 of another execution mode of the present invention.
OLED and LED blended lamp 50 also comprises wireless charging and receives module (not shown) and wireless charging emitting mould train 900.Described wireless charging receives module and is arranged in substrate 100, and described wireless charging receives module and is electrically connected 200 with flexible circuit board.Wireless charging emitting mould train 900 produces inductance coupling high for receiving between module in wireless charging emitting mould train 900 and described wireless charging, namely produces induced current, thus realizes non-contact inductive charging.So, receiving module and wireless charging emitting mould train 900 by arranging described wireless charging, the convenience of described OLED and LED blended lamp charging can be improved.
Receive module to the impact of described OLED and LED blended lamp bending property to reduce wireless charging, such as, described wireless charging receives module and is arranged in described heat dissipation film; And for example, described wireless charging receives the side edge that module is arranged at described heat dissipation film, so, can reduce wireless charging and receive module to the impact of described OLED and LED blended lamp bending property.
Such as, OLED and the LED blended lamp that the mutual combination that other execution modes of OLED and LED blended lamp of the present invention also comprise the respective embodiments described above is formed.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (8)
1. an OLED and LED blended lamp, is characterized in that, comprising:
Substrate, described substrate comprises the reflectance coating, heat-transfer film and the heat dissipation film that superpose setting successively;
Flexible circuit board, described flexible circuit board is arranged in described heat dissipation film;
OLED light source assembly, described OLED light source assembly comprises the OLED sub-light source of multiple sheet, multiple described OLED sub-light source spread configuration is in described reflectance coating, and be provided with interval between often adjacent two described OLED sub-light sources, described OLED sub-light source is electrically connected with described flexible circuit board by wire, and described OLED sub-light source comprises the anode transparent glass substrate, conductive anode, hole transmission layer, luminescent layer, electron transfer layer, conductive cathode and the negative electrode transparent glass substrate that superpose setting successively; And
LED light source component, described LED light source component comprises multiple LED sub-light source, multiple described LED sub-light source is arranged at described reflectance coating, and in the interval of described LED sub-light source between two described OLED sub-light sources, described LED sub-light source is electrically connected with described flexible circuit board by wire.
2. OLED and LED blended lamp according to claim 1, is characterized in that, described OLED sub-light source is the flaky texture with rectangle plane.
3. OLED and LED blended lamp according to claim 1, is characterized in that, described OLED sub-light source is the flaky texture with rectangle cambered surface.
4. OLED and LED blended lamp according to claim 1, is characterized in that, the fluorescence matrix of the described luminescent layer of described OLED sub-light source is NPB.
5. OLED and LED blended lamp according to claim 1, is characterized in that, multiple described OLED sub-light source is set in parallel in described reflectance coating.
6. OLED and LED blended lamp according to claim 1, is characterized in that, the thickness of described reflectance coating is 2mm ~ 5mm.
7. OLED and LED blended lamp according to claim 1, is characterized in that, the thickness of described heat-transfer film is 12mm ~ 15mm.
8. OLED and LED blended lamp according to claim 1, is characterized in that, the thickness of described heat dissipation film is 25mm ~ 30mm.
Priority Applications (1)
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105222100A (en) * | 2015-09-29 | 2016-01-06 | 惠州市加迈电器有限公司 | Radiating lamp |
CN105221957A (en) * | 2015-09-29 | 2016-01-06 | 惠州市加迈电器有限公司 | Flower shape light fixture |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050259423A1 (en) * | 2004-05-24 | 2005-11-24 | Karsten Heuser | Light-emitting electronic component |
CN102305361A (en) * | 2011-07-14 | 2012-01-04 | 南京第壹有机光电有限公司 | Compound OLED (Organic Light Emitting Diode) and LED (Light Emitting Diode) light fitting |
US20140038322A1 (en) * | 2008-04-07 | 2014-02-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electronic Device and Method of Manufacturing an Electronic Device |
CN203842065U (en) * | 2014-05-27 | 2014-09-24 | 厦门丰泓照明有限公司 | Convenient and efficient LED sterilization device |
-
2015
- 2015-05-12 CN CN201510240775.0A patent/CN104821314B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050259423A1 (en) * | 2004-05-24 | 2005-11-24 | Karsten Heuser | Light-emitting electronic component |
US20140038322A1 (en) * | 2008-04-07 | 2014-02-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electronic Device and Method of Manufacturing an Electronic Device |
CN102305361A (en) * | 2011-07-14 | 2012-01-04 | 南京第壹有机光电有限公司 | Compound OLED (Organic Light Emitting Diode) and LED (Light Emitting Diode) light fitting |
CN203842065U (en) * | 2014-05-27 | 2014-09-24 | 厦门丰泓照明有限公司 | Convenient and efficient LED sterilization device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105222100A (en) * | 2015-09-29 | 2016-01-06 | 惠州市加迈电器有限公司 | Radiating lamp |
CN105221957A (en) * | 2015-09-29 | 2016-01-06 | 惠州市加迈电器有限公司 | Flower shape light fixture |
CN105222100B (en) * | 2015-09-29 | 2018-03-09 | 南通江海港建设工程有限公司 | Radiating lamp |
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