CN104819388A - Light emitting module and lighting device - Google Patents
Light emitting module and lighting device Download PDFInfo
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- CN104819388A CN104819388A CN201410629204.1A CN201410629204A CN104819388A CN 104819388 A CN104819388 A CN 104819388A CN 201410629204 A CN201410629204 A CN 201410629204A CN 104819388 A CN104819388 A CN 104819388A
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- 239000000758 substrate Substances 0.000 claims abstract description 152
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- 238000009434 installation Methods 0.000 claims description 87
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000011144 upstream manufacturing Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The implement mode of the invention relates to a light emitting module and a lighting device. The light emitting module (10) has a substrate (15), a plurality of semiconductor light emitting elements (16) and setting portions (65-68). The plurality of semiconductor light emitting elements (16) is arranged on the substrate (15). The setting portions (65-68) enables parallel connection of the semiconductor light emitting elements (16), and the connection number is set to be a first connection number or a second parallel connection number different from the first connection number. No matter the light emitting module (10) is set to have the first parallel connection number or the second parallel connection number, the number of the overall semiconductor light emitting elements which emit light is constant.
Description
Technical field
Embodiments of the present invention relate to a kind of light emitting module and lighting device.
Background technology
In recent years, LED (Light Emitting Diode) is popularized as the lighting device of light source.By multiple LED is configured on elongated substrate, and be contained in the pipe of drum, thus also can use as the Straight LED with straight-pipe fluorescent lamp same shape.Straight LED, compared with straight-pipe fluorescent lamp, due to more superior in power consumption or durability etc., therefore replaces straight-pipe fluorescent lamp by Straight LED gradually.
But there is multiple product according to brightness etc. in straight-pipe fluorescent lamp.If also manufacture the product of same degree kind in Straight LED, then sometimes need according to brightness etc. the kind or the quantity that change LED.In the past, when the number change of LED, sometimes need again to manufacture substrate, cause manufacturing cost to uprise.Further, suppose that the quantity manufacturing minimizing LED is to reduce the product of the kind of light quantity, then the interval being configured at the LED on substrate is elongated, and thus the phenomenon of non-uniform light can become obvious.
Patent document 1: Japanese Unexamined Patent Publication 2012-142165 publication
Summary of the invention
The problem to be solved in the present invention is to provide a kind of and uses identical substrate, suppression produces non-uniform light and the light emitting module that brightness is different.
Light emitting module involved by embodiment possesses: substrate, multiple semiconductor light-emitting elements, configuration part.Described multiple semiconductor light-emitting elements is arranged on described substrate.Described configuration part by described semiconductor light-emitting elements be connected in parallel quantity set be first be connected in parallel quantity or from first be connected in parallel quantity different second be connected in parallel quantity.Described light emitting module when be set as described first be connected in parallel quantity or described second be connected in parallel quantity, the quantity of the described semiconductor light-emitting elements of this light emitting module Integral luminous is all identical.
Can expect to provide a kind of according to the present invention and use identical substrate, suppress to produce non-uniform light and the different light emitting module of brightness.
Detailed description of the invention
Light emitting module involved by the embodiment below illustrated possesses: substrate, multiple semiconductor light-emitting elements and multiple LED, configuration part.Multiple LED is arranged on substrate.Configuration part by LED be connected in parallel quantity set be first be connected in parallel quantity or from first be connected in parallel quantity different second be connected in parallel quantity.Light emitting module when be set to first be connected in parallel quantity or second be connected in parallel quantity, the quantity of the LED of this light emitting module Integral luminous is all identical.According to this kind of structure, can expect to provide a kind of and use identical substrate, suppress to produce non-uniform light and the different light emitting module of brightness.
And, in the light emitting module involved by the embodiment of following explanation, configuration part is arranged on substrate and installs first of wire jumper resistance to install liner and the second installation liner, and when wire jumper resistance being installed on the first installation liner and on the second installation liner, wire jumper resistance not being installed, be first be connected in parallel quantity by the quantity set that is connected in parallel of LED, when the first installation liner not being provided with wire jumper resistance and on the second installation liner, wire jumper resistance being installed, be second be connected in parallel quantity by the quantity set that is connected in parallel of LED.Thereby, it is possible to expect to use identical substrate and easily change LED be connected in parallel quantity.
Further, in the light emitting module involved by the embodiment of following explanation, on substrate, the distance be installed between the wire jumper resistance of the first installation liner or the second installation liner and LED is shorter than the distance between 2 LED of adjacent installation on substrate.Thereby, it is possible to expect to reduce by the ratio of wire jumper resistance absorption in the light sent at LED.
And, in the light emitting module involved by the embodiment of following explanation, the light-emitting area of multiple LED is respectively roughly oblong-shaped, and install along the long side direction arrangement of substrate respectively, multiple LED can be mounted on substrate: the long edge of light-emitting area the LED of the long side direction of substrate and the minor face of light-emitting area and is alternately arranged along the long side direction of substrate along the LED of the long side direction of substrate.Thereby, it is possible to closely configure LED, and can expect to suppress to produce non-uniform light phenomenon on the long side direction of substrate.
Further, in multiple semiconductor light-emitting elements that the light emitting module related at the embodiment of following explanation possesses, the interval of semiconductor light-emitting elements adjacent on substrate can be 0.8 to 1.2 times of the long edge lengths of light-emitting area.Thereby, it is possible to expect to suppress to produce non-uniform light phenomenon.
And, in the light emitting module involved by the embodiment of following explanation, multiple semiconductor light-emitting elements is divided into L the first element group be connected in parallel, M the second element group be connected in series is comprised in each first element group, comprise the N number of semiconductor light-emitting elements be connected in series in each second element group, L and M can meet the relation of M=L+1.Thus, be connected in parallel quantity before changing after, can expect to make the quantity of the second element group comprised in each first element group become identical.
And, in the light emitting module involved by the embodiment of following explanation, the LED of the LED that substrate can be installed the first quantity or the second quantity being less than the first quantity, and the first quantity is the integral multiple of the second quantity, the installation interval being installed on the LED on the situation infrabasal plate on substrate at the LED of the second quantity can be the integral multiple of the installation interval of LED on the LED of the first quantity is installed on substrate situation infrabasal plate.
And, in the light emitting module involved by the embodiment of following explanation, first quantity is 2 times of the second quantity, and the installation interval of the LED that the LED of the second quantity is installed on the situation infrabasal plate on substrate can be 2 times of the installation interval of LED on the LED of the first quantity is installed on substrate situation infrabasal plate.
And, in the light emitting module involved by the embodiment of following explanation, the light-emitting area of multiple LED is respectively roughly oblong-shaped, and install along the long side direction arrangement of substrate respectively, when the LED of the first quantity is installed on substrate, multiple LED is installed on substrate: the LED of long side direction of the long edge substrate of light-emitting area and the minor face of light-emitting area are alternately arranged along the LED of the long side direction of substrate along the long side direction of substrate, when the LED of the second quantity is installed on substrate, multiple LED is installed on substrate: the LED of the long side direction of the long edge substrate of light-emitting area arranges along the long side direction of substrate.
Further, the lighting device involved by the embodiment of following explanation can possess: above-mentioned light emitting module, to this light emitting module supply electric power power circuit.
Hereinafter, with reference to the accompanying drawings of the light emitting module involved by embodiment and lighting device.In addition, in embodiments, identical symbol is marked to the structure with identical function, and omits repeat specification.Further, the light emitting module illustrated in the following embodiments and lighting device only represent an example, are not intended to limit the present invention.
Below, with reference to Fig. 1 ~ Fig. 4, the summary of light emitting module be described and possess the summary of lighting device of light emitting module.
[structure of lighting device 100]
Fig. 1 is the stereogram of the example representing lighting device 100.Lighting device 100 possesses light emitting module 10 and apparatus main body 110.Lighting device 100 is such as to make light emitting module 10 state downward be installed on indoor ceiling etc.Light emitting module 10 has multiple LED, and irradiates light by the luminescence of LED.Lighting device 100 is indoor by the optical illumination irradiated from light emitting module 10.In addition, lighting device 100 is not limited to install on the ceiling, such as, can be installed on wall etc.Apparatus main body 110 is such as installed on ceiling etc. by screw etc.Apparatus main body 110 supports light emitting module 10, and for lighting device 100 is installed on the mounting object things such as ceiling.
Fig. 2 is the stereogram of an example of indication device main body 110.As shown in Figure 2, apparatus main body 110 such as comprises: framework 112, mounting spring 114, power circuit 115, terminal board 116 and terminal board 117.The recess 112a at least partially holding light emitting module 10 is provided with in framework 112.Mounting spring 114 is arranged at recess 112a.Mounting spring 114 engages with the claw of the light emitting module 10 being contained in recess 112a, and restriction light emitting module 10 moves from recess 112a to the direction that comes off.
Framework 112 and mounting spring 114 such as use iron, aluminium or stainless steel and other metal materials to be formed.Mounting spring 114 has elasticity, such as, be leaf spring.In addition, framework 112 and mounting spring 114 such as also can use the formation such as resin material.But, by the durability using metal material formation framework 112 and mounting spring 114 can improve framework 112 and mounting spring 114.
Power circuit 115, terminal board 116 and terminal board 117 are such as installed in recess 112a by screw thread is fixing etc.Terminal board 116 and terminal board 117 such as the electrical connection between lighting device 100 and the power supply of outside, or for the electrical connection etc. between the LED in power circuit 115 and light emitting module 10.
The electric power that outside from lighting device 100 supplies such as is converted to the voltage corresponding with light emitting module 10 or electric current via terminal board 116 and terminal board 117 by power circuit 115, and is supplied to light emitting module 10.Light emitting module 10 makes inner multiple LED luminous according to the electric power supplied from power circuit 115, thus irradiates light.Power circuit 115 such as can be arranged with lighting device 100 split.
Such as be provided with multiple opening in framework 112, the plurality of opening for being used for the utensil (such as screw) lighting device 100 being installed on ceiling etc., or passes to the power cable etc. that power circuit 115 supplies electric power.
[structure of light emitting module 10]
Fig. 3 (a) is the stereogram of the example representing light emitting module 10 when observing from front-surface side, and Fig. 3 (b) is the stereogram of the example representing light emitting module 10 when observing from rear side.Fig. 4 is the exploded perspective view of the example representing light emitting module 10.As shown in Fig. 3 (a), Fig. 3 (b) and Fig. 4, light emitting module 10 such as possesses: supporting mass 11, cover 12, holding member 13 and pair of side plates 17 and side plate 18.
Supporting mass 11 supporting substrates 15.Substrate 15 can be fixed in supporting mass 11 by such as to adhere etc., also can removably be installed on supporting mass 11 by fixing grade of screw thread.Supporting mass 11 also can releasably supporting substrates 15.
As shown in Figure 4, substrate 15 is such as formed as elongated roughly rectangular shape.At the front surface of substrate 15, multiple LED16 and connector 19 are installed.Connector 19 receives and supplies the electric power of coming from the power circuit 115 of apparatus main body 110, and the electric power received is supplied to each LED16 via the Wiring pattern on substrate 15.
Multiple LED16 is configured to 1 row side by side along the long side direction of substrate 15.In addition, the quantity being arranged in the LED16 on substrate 15 is not limited to the illustrative number of Fig. 4, more than number illustrative in Fig. 4, also can be less than illustrative number in Fig. 4.Further, in the example in fig. 4, although multiple LED16 is configured to 1 row on substrate 15 side by side, as other example, multiple LED16 also can be configured to more than 2 row on substrate 15 side by side.
In the present embodiment, each LED16 is an example of semiconductor light-emitting elements.As semiconductor light-emitting elements, in addition to the led, Organic Light Emitting Diode (Organic LightEmitting Diode), the light-emitting component of inorganic EL (Inorganic Electro-Luminescence) type or the light-emitting component etc. of other field emission can such as be used.
Cover 12 is installed on supporting mass 11, and covers the substrate 15 being supported on supporting mass 11.Cover 12 such as protective substrates 15 and each LED16 avoid the impact being subject to external force or dust etc.Cover 12 by having the formation such as the resin material of light transmission, thus makes the light transmission that each LED16 releases.Cover 12 can be such as transparent, also can have light diffusing.
Side plate 17 is installed on one end of the long side direction of supporting mass 11 and cover 12, with one end of covering 12.Side plate 18 is installed on the other end of the long side direction of supporting mass 11 and cover 12, with the other end of covering 12.
Cover 12 is held in supporting mass 11 by holding member 13, in order to avoid cover 12 comes off from supporting mass 11.Holding member 13 is provided with claw, and this claw engages with the mounting spring 114 of the recess 112a being arranged at apparatus main body 110.Engaged with the mounting spring 114 of apparatus main body 110 by the claw of holding member 13, thus light emitting module 10 is installed on apparatus main body 110.
Light emitting module 10 is provided with multiple holding member 13.In the light emitting module 10 of present embodiment, such as, be provided with 3 holding members 13.In addition, the quantity being arranged at the holding member 13 of light emitting module 10 can be 1 or 2, also can be more than 4.
Supporting mass 11 and holding member 13 such as use iron, aluminium or stainless steel and other metal materials, such as, formed by bending machining.In addition, holding member 13 also can use resin material etc., such as, by injection-molded shaping and formed.
[structure of substrate 15]
Fig. 5 is the figure of an example of the parts configuration represented on substrate 15.As shown in Figure 5, substrate 15 is such as formed as elongated roughly rectangular shape, and multiple LED16 is mounted to such as 1 row side by side along the long side direction of substrate 15.In the present embodiment, the light-emitting area of each LED16 is roughly rectangular shape, has minor face 160 and long limit 161.
In multiple LED16, LED16a is mounted on substrate 15, and the long edge of light-emitting area the long side direction of substrate 15 (such as parallel with the long side direction of substrate 15 direction).Further, in multiple LED16, LED16b is mounted on substrate 15, and the minor face of light-emitting area is along the long side direction (such as parallel with the long side direction of substrate 15 direction) of substrate 15.Further, LED16a and LED16b alternately installs on substrate 15 along the long side direction of substrate 15.
At this, if the long edge on substrate 15 all LED16 being mounted to light-emitting area the long side direction of substrate 15, then the quantity being installed on the LED16 on substrate 15 is subject to the constraint of the length of substrate 15, cannot install more LED16.Therefore, the light quantity improving light emitting module 10 is difficult to.
On the other hand, if on substrate 15 all LED16 to be mounted to the long side direction of minor face along substrate 15 of light-emitting area, then the interval between the substrate 15 of adjacent installation on substrate 15 becomes large, can produce the phenomenon of non-uniform light as light emitting module 10 entirety.
Therefore, in the light emitting module 10 of present embodiment, the long edge of light-emitting area the LED16a of the long side direction of substrate 15 and the minor face of light-emitting area and is mounted on substrate 15 to be alternately arranged along long side direction along the LED16b of the long side direction of substrate 15.Thus, in the limited field of the length of the long side direction of substrate 15, more multiple LED16a and LED16b can be configured, and can expect that suppression produces the non-uniform light of light emitting module 10 on the long side direction of substrate 15.
Fig. 6 is the figure of an example at interval for illustration of LED16a and LED16b on substrate 15.As shown in Figure 6, on the long side direction of substrate 15, if the interval between the center line of LED16a and the center line of LED16b is set to L1, the length on the long limit 161 of each LED16 is set to L2, then preferably L1 is about 0.8 ~ 1.2 times of L2.Further, more preferably L1 is about 0.9 ~ 1.1 times of L2.
[annexation of each LED16]
Fig. 7 is the figure of an example of annexation for each LED16a and LED16b is roughly described.As shown in Figure 7, in light emitting module 10, be such as connected in parallel to L the first element group 60, this first element group 60 comprises multiple LED16, and this LED16 comprises LED16a and LED16b.M the second element group 61 be connected in series is comprised in each first element group 60.The N number of LED16 be connected in series is comprised in each second element group 61.
Multiple LED16 is connected with connector 19 via the Wiring pattern on substrate 15, and is connected with the power circuit 115 being arranged on apparatus main body 110 via connector 19.As shown in Figure 7, if interrupteur SW becomes conducting, then AC commercial electric power AC is supplied to power circuit 115.Alternating electromotive force is converted to direct current power by power circuit 115, and the electric power after conversion is supplied to multiple LED16 via connector 19.Each LED16 is luminous by the direct current power supplied from power circuit 115.
Below, for convenience of explanation, to sort from the order of the 1st to L to each first element group 60.Further, sort with second element group 61 of the second element group 61 being connected to the side of the positive electrode power line (+) of connector 19 in each second element group 61 comprised to the order of M each first element group 60 from the 1st to the negative side power line (-) being connected to connector 19.
Fig. 8 to Figure 10 is the figure of an example of detailed annexation for illustration of each LED16.Illustrate the annexation between i-th individual second element group 61 of the second element group 61 to the (i+2) having and comprise in i-th individual second element group 61 of the second element group 61 to the (i+2) and (i+1) individual first element group 60 comprised in i-th the first element group 60 in fig. 8.
In the light emitting module 10 of present embodiment, as shown in Figure 8, i-th the second element group 61 in i-th the first element group 60 and the substrate 15 between (i+1) individual second element group 61 such as, be provided with the installation liner 65 installed for (such as 0 ohm) wire jumper resistance that resistance value is lower.
Liner 65 is installed and comprises the first liner 65a and the second liner 65b.The downstream in that the first liner 65a is connected to i-th the second element group 61 in i-th the first element group 60, that electric current flows through direction (hereinafter referred to as the sense of current).Second liner 65b is connected to the upstream extremity of the sense of current of (i+1) individual second element group 61 in i-th the first element group 60.
And, such as shown in Figure 8, (i+1) individual second element group 61 in (i+1) individual first element group 60 and the substrate 15 between (i+2) individual second element group 61 are also provided with the installation liner 65 installed for wire jumper resistance.The the first liner 65a installing liner 65 is connected to the downstream of the sense of current of (i+1) individual second element group 61 in (i+1) individual first element group 60.The the second liner 65b installing liner 65 is connected to the upstream extremity of the sense of current of (i+2) individual second element group 61 in (i+1) individual first element group 60.
And, such as shown in Figure 8, on i-th the second element group 61 in i-th the first element group 60 and the substrate 15 between (i+2) individual second element group 61 in (i+1) individual first element group 60, be provided with the installation liner 66 installed for wire jumper resistance.
Liner 66 is installed and comprises the first liner 66a and the second liner 66b.First liner 66a is connected with the first liner 65a of the installation liner 65 being arranged at i-th the first element group 60.Further, the second liner 66b is connected with the second liner 65b of the installation liner 65 being arranged at (i+1) individual first element group 60.
Illustrate the annexation between the 1st the second element group 61 to the 3 the second element group 61 having and comprise in the second element group 61 of the 1st the second element group 61 to the 3 comprised in the 1st the first element group 60 and the 2nd the first element group 60 in fig .9.Such as shown in Figure 9, on the substrate 15 between the installation liner 65 being arranged at the 1st the first element group 60 and the side of the positive electrode power line of connector 19, be provided with the installation liner 67 installed for wire jumper resistance.
Liner 67 is installed and comprises the first liner 67a and the second liner 67b.First liner 67a is connected with the side of the positive electrode power line of connector 19.Second liner 67b is connected with the second liner 65b of the installation liner 65 being arranged at the 1st the first element group 60.Connect about other, if be replaced as the 1st by i-th, be replaced as the 2nd by individual to (i+1), then can be suitable for the annexation shown in Fig. 8.
The annexation between (M-2) individual second element group 61 to the M the second element group 61 having and comprise in second element group 61 of (M-2) individual second element group 61 to the M of comprising in (L-1) individual first element group 60 and L the first element group 60 is illustrated in Figure 10.Such as shown in Figure 10, on the substrate 15 between the installation liner 65 being arranged at L the first element group 60 and the negative side power line of connector 19, be provided with the installation liner 68 installed for wire jumper resistance.
Liner 68 is installed and comprises the first liner 68a and the second liner 68b.First liner 68a is connected with the first liner 65a of the installation liner 65 being arranged at L the first element group 60.Second liner 68b is connected with the negative side power line of connector 19.About other connection, if it is individual to be replaced into (L-1) by i-th, is replaced into L by individual to (i+1), then can be suitable for the annexation shown in Fig. 8.
At this, in Fig. 8 to Figure 10 in illustrative annexation, all installation liners 65 are provided with wire jumper resistance, and when wire jumper resistance not all being installed on installation liner 66, installation liner 67 and installation liner 68, first liner 65a and the second liner 65b conducting, the first liner 66a and the second liner 66b, the first liner 67a and the second liner 67b and the first liner 68a and the second liner 68b become non-conduction.Thus, in each first element group 60, M the second element group 61 is connected in series.Further, light emitting module 10 forms the circuit being connected in parallel to L the first element group 60.In such cases, the quantity be connected in parallel of light emitting module 10 is L.
On the other hand, wire jumper resistance all do not installed by installation liner 65, and when wire jumper resistance being all installed on installation liner 66, installation liner 67 and installation liner 68, in the 1st the first element group 60,1st the second element group 61 and the 2nd the second element group 61 become non-conduction, and the side of the positive electrode power line conducting of the upstream extremity of the sense of current of the 2nd the second element group 61 and connector 19 (with reference to Fig. 9).Therefore, it is individual that the quantity of the second element group 61 be connected in series in the 1st the first element group 60 becomes (M-1) that remove after the 1st the second element group 61.
And, in the 2nd the first element group 60,2nd the second element group 61 and the 3rd the second element group 61 become non-conduction, and the downstream of the sense of current of the 1st the second element group 61 comprised in the upstream extremity of the sense of current of the 3rd the second element group 61 and the 1st the first element group 60 is via installation liner 66 conducting (with reference to Fig. 9).Therefore, it is individual that the quantity of the second element group 61 be connected in series in the 2nd the first element group 60 becomes (M-1) that the 3rd later the second element group 61 be added with the 1st the second element group 61 comprised in the 1st the first element group 60.
In the same manner, in (i+1) individual first element group 60, (i+1) individual second element group 61 and (i+2) individual second element group 61 become non-conduction, and the downstream of the sense of current of i-th the second element group 61 comprised in the upstream extremity of the sense of current of (i+2) individual second element group 61 and i-th the first element group 60 is via installation liner 66 conducting (with reference to Fig. 8).Therefore, it is individual that the quantity of the second element group 61 be connected in series in (i+1) individual first element group 60 becomes (M-1) that individual to (i+2) the second later element group 61 be added with the 1st the second element group 61 to the i-th the second element group 61 comprised in i-th the first element group 60.
And, in L the first element group 60, (M-1) individual second element group 61 and M the second element group 61 becomes non-conduction, and the downstream of the sense of current of (M-2) individual second element group 61 comprised in the upstream extremity of the sense of current of M the second element group 61 and (L-1) individual first element group 60 is via installation liner 66 conducting (with reference to Figure 10).Therefore, it is individual that the quantity of the second element group 61 be connected in series in L the first element group 60 becomes (M-1) that M the second element group 61 be added with the 1st individual second element group 61 of the second element group 61 to the (M-2) comprised in (L-1) individual first element group 60.
Now, with regard to the 1st individual second element group 61 of the second element group 61 to the (M-1) comprised in L the first element group 60, the downstream of the sense of current is connected to the negative side power line of connector 19 via installation liner 68.Thus, individual second element group 61 of the 1st the second element group 61 to the (M-1) comprised in L the first element group 60 forms (L+1) individual first element group 60 comprising (M-1) that be connected in series individual second element group 61.In such cases, the quantity be connected in parallel of light emitting module 10 becomes (L+1).
So, wire jumper resistance all do not installed by installation liner 65, and when wire jumper resistance being all installed on installation liner 66, installation liner 67 and installation liner 68, light emitting module 10 formation is connected in parallel to (L+1) individual first element group 60, and in each first element group 60, be connected in series with the circuit of (M-1) individual first element group 60.
So, the light emitting module 10 in present embodiment carries wire jumper resistance by changing, thus is keeping, under the state that the quantity of LED16 is identical, can changing the quantity be connected in parallel of LED16.In addition, liner 65 is installed, liner 66 is installed, liner 67 be installed and the example that liner 68 is configuration part is installed.Further, the example that liner 65 is the first installation liner is installed, liner 66 is installed, liner 67 be installed and the example that liner 68 is the second installation liner is installed.
At this, when reducing the quantity of the LED16 on substrate 15 to reduce the light quantity of light emitting module 10 entirety, wanting to make the range of exposures of light emitting module 10 keep reducing front identical degree with light quantity, then needing LED16 to be distributed on substrate 15.If be distributed by the LED16 of negligible amounts on substrate 15, then the interval of LED16 becomes large, and non-uniform light phenomenon appears in light emitting module 10 on the whole.
To this, in the light emitting module 10 of present embodiment, being connected in parallel quantity by what increase LED16, without the need to reducing the quantity of luminous LED16, the electric current flowing through each LED16 can being reduced.Thereby, it is possible to reduce the luminous quantity of each LED16, thus the luminous quantity of light emitting module 10 entirety can be reduced.Further, the interval due to the LED16 of luminescence remains narrower, therefore in the light emitting module 10 of present embodiment, can expect to suppress light emitting module 10 to produce non-uniform light phenomenon on the whole.
Further, can think and the electric power being supplied to each LED16 be reduced the electric power being supplied to light emitting module 10 by reduction, thus reduces the luminous quantity of each LED16 when not changing the quantity of LED16.But, this point be accomplished, need in apparatus main body 110, arrange the special power circuit 115 that can change the electric power being supplied to light emitting module 10 according to luminous quantity, cause the cost increase of lighting device 100.
To this, in the light emitting module 10 of present embodiment, be connected in parallel quantity by what increase LED16, reduce to flow through the electric current of each LED16, thus without the need to changing the electric power being supplied to light emitting module 10, also can reduce the luminous quantity of light emitting module 10 entirety.Thereby, it is possible to the cost increase of lighting device 100 is suppressed to lower.
Further, in the light emitting module 10 of present embodiment, replaced by the lift-launch carrying out wire jumper resistance, what can change LED16 is connected in parallel quantity.Therefore, as long as install liner 66 ~ 68 if pre-set on substrate 15, then identical substrate 15 can be used to manufacture the different light emitting module of luminous quantity 10.Therefore, without the need to manufacturing substrate 15 respectively according to the size of light quantity, the manufacturing cost of light emitting module 10 can be cut down.
In addition, the summation of the forward voltage of the LED16 that can be connected in series in the first element group 60 is no more than the value of setting M and N arbitrarily the scope of the supply voltage supplied from power circuit 115.Further, if meet the relation of M=L+1, then changing the front and back being connected in parallel quantity, the quantity of the second element group 61 comprised in each first element group 60 can be made to become identical.
Further, increase if be connected in parallel quantity, then the electric current flowing through each LED16 reduces, and the luminous quantity of each LED16 reduces.Further, if the luminous quantity of each LED16 is too small, even if then the installation interval of LED16 is narrower, light emitting module 10 also can produce the phenomenon of non-uniform light on the whole.Therefore, be preferably as follows setting increase after be connected in parallel the quantity i.e. value of (L+1): based on the installation interval of the LED16 on substrate 15, the electric current flowing through each LED16 becomes the scope that light emitting module 10 can not produce the electric current of the degree of non-uniform light phenomenon on the whole.
[embodiment of light emitting module 10]
Figure 11 and Figure 12 is the figure of an example of concrete annexation for illustration of light emitting module 10.In Figure 11 and Figure 12 in illustrative light emitting module 10,3 the first element group 60 are connected in parallel, and in each first element group 60, be connected in series with 4 the second element group 61, are connected in series with 3 LED16 in each second element group 61.Light emitting module 10 when illustrative light emitting module 10 is equivalent to L=3, M=4, N=3 in Fig. 8 ~ structure illustrated in fig. 10 in Figure 11 and Figure 12.
In fig. 11 in illustrative light emitting module 10, whole installation on liner 65, wire jumper resistance 70 is installed, at installation liner 66, liner 67 is installed and installs on liner 68 and wire jumper resistance 70 is not all installed.Thus, be configured with in illustrative light emitting module 10 in fig. 11 and be connected in series with 4 the second element group 61 in each first element group 60, and be connected in parallel to the circuit of 3 the first element group 60.
At this, in the configuration of the wire jumper resistance 70 of Figure 11, when the electric current supplied from connector 19 is such as 200mA, the electric current flowing through each first element group 60 becomes about 66.7mA.
Further, in fig. 12 in illustrative light emitting module 10, wire jumper resistance 70 all do not installed by installation liner 65, and on installation liner 66, installation liner 67 and installation liner 68, wire jumper resistance 70 is all installed.Thus, in the 1st the first element group 60, the 1st the second element group 61 and the 2nd the second element group 61 become non-conduction, and the side of the positive electrode power line conducting of the upstream extremity of the sense of current of the 2nd the second element group 61 and connector 19.Therefore, the quantity of the second element group 61 be connected in series in the 1st the first element group 60 becomes 3 that remove after the 1st the second element group 61.
And, in the 2nd the first element group 60,2nd the second element group 61 and the 3rd the second element group 61 become non-conduction, and the downstream of the sense of current of the 1st the second element group 61 comprised in the upstream extremity of the sense of current of the 3rd the second element group 61 and the 1st the first element group 60 is via the conducting of installation liner 66.Therefore, the quantity of the second element group 61 be connected in series in the 2nd the first element group 60 becomes 3 that the 3rd the second element group 61 and the 4th the second element group 61 add the 1st the second element group 61 comprised in the 1st the first element group 60.
Similarly, in the 3rd the first element group 60,3rd the second element group 61 and the 4th the second element group 61 become non-conduction, and the downstream of the sense of current of the 2nd the second element group 61 comprised in the upstream extremity of the sense of current of the 4th the second element group 61 and the 2nd the first element group 60 is via the conducting of installation liner 66.Therefore, the quantity of the second element group 61 be connected in series in the 3rd the first element group 60 becomes 3 that the 4th the second element group 61 and the 1st the second element group 61 comprised in the 2nd the first element group 60 and the 2nd the second element group 61 be added.
Now, the 1st that comprises in the 3rd the first element group 60 downstream to the sense of current of the 3rd the second element group 61 is connected to the negative side power line of connector 19 via installation liner 68.Thus, the 1st to the 3rd the second element group 61 forms the 4th new the first element group 60.Therefore, light emitting module 10 formation is connected in parallel to 4 the first element group 60, and in each first element group 60, be connected in series with the circuit of 3 the first element group 60.
At this, in the configuration of the wire jumper resistance 70 of Figure 12, when the electric current supplied from connector 19 is such as 200mA, the electric current flowing through each first element group 60 becomes 50mA.Therefore, compared with the electric current (about 66.7mA) flowing through each LED16 when being configured with wire jumper resistance 70 as shown in Figure 11, the electric current flowing through each LED16 diminishes.Thus, with regard to light emitting module 10, with configure the light emitting module 10 of wire jumper resistance 70 as illustrative in Figure 11 compared with, by configuring wire jumper resistance 70 as illustrative in Figure 12, light quantity can be reduced.
In addition, such as when manufacture comprise light emitting module 10 of 96 LED16, can be " 4 " with the quantity M of second element group 61 being connected in parallel that quantity L is " 3 ", comprising in each first element group 60 of the first element group 60, the quantity N of LED16 that comprises in each second element group 61 is the patten's design substrate 15 of " 8 ".In the substrate 15 of so design, if all install on liner 65 and be provided with wire jumper resistance 70, and installation liner 66, installation liner 67 and installation liner 68 are not all provided with wire jumper resistance 70, then 3 32 LED16 be connected in series are connected in parallel and form light emitting module 10.Further, be not all provided with wire jumper resistance 70 if install on liner 65, and installation liner 66, installation liner 67 and installation liner 68 are all provided with wire jumper resistance 70, then 4 24 LED16 be connected in series are connected in parallel and form light emitting module 10.
And, such as when manufacture comprise light emitting module 10 of 48 LED16, can be " 4 " with the quantity M of second element group 61 being connected in parallel that quantity L is " 3 ", comprising in each first element group 60 of the first element group 60, the quantity N of LED16 that comprises in each second element group 61 is the patten's design substrate 15 of " 4 ".In the substrate 15 of so design, if all install on liner 65 and be provided with wire jumper resistance 70, and installation liner 66, installation liner 67 and installation liner 68 are not all provided with wire jumper resistance 70, then 3 16 LED16 be connected in series are connected in parallel and form light emitting module 10.Further, be not all provided with wire jumper resistance 70 if install on liner 65, and install liner 66, install liner 67 and install on liner 68 and be all provided with wire jumper resistance 70, then 4 are connected in series 12 LED16 and are connected in parallel and form light emitting module 10.
[installation site of electric component 50 and wire jumper resistance 70]
Figure 13 is the figure of an example of position relationship for illustration of the LED16 be installed on substrate 15 and electric component.Such as shown in figure 13, substrate 15 is also provided with the electric component such as resistance or capacitor 50 and wire jumper resistance 70 except LED16a and LED16b.Now, electric component 50 and wire jumper resistance 70 are preferably installed near LED16.Further, electric component 50 and wire jumper resistance 70 are not preferably arranged between adjacent LED16a and LED16b installed.
Such as shown in figure 13, distance between LED16a and LED16b installed adjacent on substrate 15 is set to L3, electric component 50 and the distance between wire jumper resistance 70 and LED16a is set to L4, the distance between electric component 50 and LED16b be set to L5, when the distance between wire jumper resistance 70 and LED16b is set to L6, preferred L4, L5 and L6 are all shorter than L3.
At this, the major part of the light radiated from the light-emitting area of LED16 is sidelong towards the light-emitting area of LED16 and is penetrated.Therefore, near LED16, the amount of the light irradiated towards the direction of substrate 15 from LED16 is less.Therefore, by being installed near LED16 by electric component 50 and wire jumper resistance 70, the amount absorbed by electric component 50 or wire jumper resistance 70 from the light of LED16 generation can be reduced.Thereby, it is possible to suppress the reduction of the luminous efficiency of light emitting module 10.
Above, embodiment is illustrated.
As seen from the above description, according to the present embodiment, can expect to provide a kind of and use identical substrate 15, suppress to produce non-uniform light phenomenon and the different light emitting module 10 of brightness.
[variation]
In addition, the present invention is not defined in above-mentioned embodiment, can carry out various distortion in the scope of its aim.
Such as, in the above-described embodiment, when not changing the quantity of LED16, by change LED16 be connected in parallel the light quantity that quantity reduces light emitting module 10 entirety, but as other examples, can not producing on the whole in the scope of non-uniform light phenomenon at light emitting module 10, by reducing the quantity of LED16, reducing the light quantity of light emitting module 10 entirety yet.Thereby, it is possible to reduce the parts number of packages of light emitting module 10, thus the cost of light emitting module 10 can be cut down.
In such cases, such as, the sum of LED16 is preferably set to 1/ integer of the sum of the LED16 before minimizing.That is, the integral multiple ading up to the sum of the LED16 after minimizing of the LED16 before preferably reducing.Further, the installation interval reducing the LED16 on the substrate 15 after the sum of LED16 is preferably the integral multiple of installation interval of the LED16 on the substrate 15 before the sum reducing LED16.Such as, the sum of LED16 can be 1/2 of the sum of LED16 before reducing, and the installation interval reducing the LED16 on the substrate 15 after the sum of LED16 can be 2 times of the installation interval of LED16 on the substrate 15 before the sum reducing LED16.
Such as, such as shown in Fig. 4 ~ Fig. 6, before the sum reducing LED16, the long edge of light-emitting area the LED16a of the long side direction of substrate 15 and the minor face of light-emitting area and is installed on substrate 15 in the mode be alternately arranged along the long side direction of substrate 15 along the LED16b of the long side direction of substrate 15.And, such as shown in figure 14, after reducing the sum of LED16 and subtracting, the LED16a that the long edge of light-emitting area the long side direction of substrate 15 is installed on substrate 15, and the region 16b ' that the minor face of light-emitting area is installed along the LED16b of the long side direction of substrate 15 does not originally install LED16b.So, when reducing LED16 total, by removing the LED16b of minor face along the long side direction of substrate 15 of light-emitting area, thus compared with the situation of the LED16a of the long side direction of substrate 15 with the long edge removing light-emitting area, the non-uniform light more effectively suppressing light emitting module 10 on the long side direction of substrate 15 can be expected.
And, such as in light emitting module 10, when by the first element group 60 be connected in parallel quantity L be set to " 3 ", the quantity M of the second element group 61 comprised in each first element group 60 is set to " 4 ", the quantity N of the LED16 comprised in each second element group 61 is set to " 8 ", 96 LED16 can be installed in this light emitting module 10.In such cases, as aforementioned, liner 66, installation liner 67 are installed by wire jumper resistance 70 being installed on install liner 65 or wire jumper resistance 70 is installed on and liner 68 is installed, thus under the state that the sum of LED16 is remained 96, the quantity (being connected in parallel quantity L) of the first element group 60 can be switched between " 3 " and " 4 ".Thereby, it is possible to switch the electric current flowing through a LED16, thus the light emitting module 10 that overall light quantity is different can be provided.
Further, in the light emitting module 10 using identical substrate 15, if the quantity N of the LED16 comprised in each second element group 61 is reduced to " 8 " 1/2 is " 4 ", then, in this light emitting module 10,48 LED16 can be installed.In such cases, each LED16 2 times of being mounted to that installation interval becomes installation interval when being provided with 96 LED16 on substrate 15.Further, in the light emitting module 10 being provided with 48 LED16, the mode that each LED16 the long side direction of substrate 15 with the long edge of light-emitting area is installed on substrate 15.
And, even if be kept to the light emitting module 10 of 48 in the installation quantity of LED16 from 96, also identical substrate 15 is used, thus liner 66, installation liner 67 are installed by wire jumper resistance 70 being installed on install liner 65 or wire jumper resistance 70 is installed on and liner 68 is installed, thus under the state that the sum of LED16 is remained 48, the quantity (being connected in parallel quantity L) of the first element group 60 can be switched between " 3 " and " 4 ".Thereby, it is possible to switch the electric current flowing through 1 LED16, thus the light emitting module 10 that overall light quantity is different can be provided further.
Further, when reducing the quantity of LED16, preferably remaining LED16 is distributed on substrate 15 equably.Thereby, it is possible to the deviation of the luminous quantity in the light-emitting area of light emitting module 10 is suppressed to lower.Such as, LED16 is removed as follows in the direction that can arrange at multiple LED16: remove 1 LED16 every predetermined quantity, or leave 1 LED16 every predetermined quantity.
When removing 1 LED16 every predetermined quantity, the interval of not installing the installation liner of LED16 in the installation liner of LED16 becomes the integral multiple (more than 2 times) at the interval of the installation liner of LED16.Further, when removing LED16 in the mode leaving 1 LED16 every predetermined quantity, the interval of not installing the installation liner of LED16 in the installation liner of LED16 becomes the integral multiple (more than 2 times) at the interval of the installation liner of LED16.
Above, some embodiments of the present invention are illustrated, but these embodiments just illustrate, do not limit the intention of the scope of the invention.These new embodiments can be implemented in other various modes, without departing from the scope of spirit of the present invention, can carry out various omission, displacement, change.These embodiments or its distortion are all included in scope of invention and aim, and are also contained in the invention and equivalent scope thereof recorded in technical scheme.
Accompanying drawing explanation
Fig. 1 is the stereogram of the example representing lighting device.
Fig. 2 is the stereogram of an example of indication device main body.
Fig. 3 (a) is the stereogram of an example of the light emitting module represented when observing from front-surface side, and Fig. 3 (b) is the stereogram of an example of the light emitting module represented when observing from rear side.
Fig. 4 is the exploded perspective view of the example representing light emitting module.
Fig. 5 is the figure of an example of the parts configuration represented on substrate.
Fig. 6 is the figure of an example at interval for illustration of the LED on substrate.
Fig. 7 is the figure of an example of the annexation roughly representing each LED.
Fig. 8 is the figure of an example of detailed annexation for illustration of each LED.
Fig. 9 is the figure of an example of detailed annexation for illustration of each LED.
Figure 10 is the figure of an example of detailed annexation for illustration of each LED.
Figure 11 is the figure of an example of concrete annexation for illustration of light emitting module.
Figure 12 is the figure of an example of concrete annexation for illustration of light emitting module.
Figure 13 is the figure of the example for illustration of the position relationship between the LED be installed on substrate and electric component.
Figure 14 is the figure of an example of installation interval for illustration of the LED be installed on substrate.
Claims (8)
1. a light emitting module, is characterized in that, possesses:
Substrate;
Multiple semiconductor light-emitting elements, is arranged on described substrate;
Configuration part, by described semiconductor light-emitting elements be connected in parallel quantity set be first be connected in parallel quantity or from described first be connected in parallel quantity different second be connected in parallel quantity,
When be set to described first be connected in parallel quantity or described second be connected in parallel quantity, the quantity of the described semiconductor light-emitting elements of this light emitting module Integral luminous is all identical.
2. light emitting module according to claim 1, is characterized in that,
Described configuration part is arranged on described substrate and installs first of wire jumper resistance to install liner and the second installation liner,
Install on liner described first and wire jumper resistance be installed, and when second install liner is not provided with wire jumper resistance, be first be connected in parallel quantity by the quantity set that is connected in parallel of described semiconductor light-emitting elements,
Install on liner described first and wire jumper resistance be not installed, and when second install liner is provided with wire jumper resistance, be second be connected in parallel quantity by the quantity set that is connected in parallel of described semiconductor light-emitting elements.
3. light emitting module according to claim 2, is characterized in that,
The distance be installed on the substrate between the wire jumper resistance of described first installation liner or described second installation liner and described semiconductor light-emitting elements is shorter than the distance between 2 described semiconductor light-emitting elements of adjacent installation on the substrate.
4. light emitting module according to claim 1, is characterized in that,
The light-emitting area of described multiple semiconductor light-emitting elements is respectively roughly oblong-shaped, and installs along the long side direction arrangement of described substrate respectively,
Described multiple semiconductor light-emitting elements is mounted on the substrate: the long edge of light-emitting area the semiconductor light-emitting elements of the long side direction of described substrate and the minor face of light-emitting area and is alternately arranged along the long side direction of described substrate along the semiconductor light-emitting elements of the long side direction of described substrate.
5. light emitting module according to claim 1, is characterized in that,
The described semiconductor light-emitting elements of the first quantity can be installed on the substrate or the described semiconductor light-emitting elements of the second quantity being less than described first quantity can be installed,
Described first quantity is the integral multiple of described second quantity,
The installation interval when semiconductor light-emitting elements of described second quantity is installed on described substrate on described substrate is the integral multiple of the installation interval of the semiconductor light-emitting elements of described first quantity when being installed on described substrate on described substrate.
6. light emitting module according to claim 5, is characterized in that,
Described first quantity is 2 times of described second quantity,
The installation interval when semiconductor light-emitting elements of described second quantity is installed on described substrate on described substrate is 2 times of the installation interval of the semiconductor light-emitting elements of described first quantity when being installed on described substrate on described substrate.
7. light emitting module according to claim 6, is characterized in that,
The light-emitting area of described multiple semiconductor light-emitting elements is respectively roughly oblong-shaped, and installs along the long side direction arrangement of described substrate respectively,
When the semiconductor light-emitting elements of described first quantity is installed on described substrate, described multiple semiconductor light-emitting elements is installed on the substrate: the semiconductor light-emitting elements of long side direction of substrate described in the long edge of light-emitting area and the minor face of light-emitting area are alternately arranged along the semiconductor light-emitting elements of the long side direction of described substrate along the long side direction of described substrate
When the semiconductor light-emitting elements of described second quantity is installed on described substrate, described multiple semiconductor light-emitting elements is installed on the substrate: the semiconductor light-emitting elements of the long side direction of substrate described in the long edge of light-emitting area arranges along the long side direction of described substrate.
8. a lighting device, is characterized in that, possesses:
Light emitting module according to claim 1;
To the power circuit of described light emitting module supply electric power.
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| JP2014-017975 | 2014-01-31 | ||
| JP2014017975A JP2015146359A (en) | 2014-01-31 | 2014-01-31 | Light-emitting module and illuminating device |
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| JP2017050445A (en) * | 2015-09-03 | 2017-03-09 | パナソニックＩｐマネジメント株式会社 | Light-emitting device and luminaire |
| JP6677797B2 (en) * | 2016-03-07 | 2020-04-08 | アイリスオーヤマ株式会社 | Light emitting unit and lighting device |
| GB2623763A (en) * | 2022-10-24 | 2024-05-01 | Light Science Tech Limited | Controlled environment agriculture lighting assembly, PCB and method |
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| JPS5869966U (en) * | 1981-11-04 | 1983-05-12 | 三洋電機株式会社 | Fixed structure of light emitting diode |
| JPH04104194A (en) * | 1990-08-23 | 1992-04-06 | Matsushita Electric Ind Co Ltd | Display device |
| JP2007173548A (en) * | 2005-12-22 | 2007-07-05 | Rohm Co Ltd | Light-emitting device and luminaire |
| JP5555971B2 (en) * | 2006-07-18 | 2014-07-23 | 日亜化学工業株式会社 | Linear light-emitting device and planar light-emitting device using the same |
| JP5128881B2 (en) * | 2007-08-31 | 2013-01-23 | パナソニック株式会社 | Mounting board and light emitting module |
| JP2009059636A (en) * | 2007-09-03 | 2009-03-19 | Imac Co Ltd | Lighting device, and wiring board structure for lighting device |
| CN102119296B (en) * | 2008-08-11 | 2013-06-19 | 罗姆股份有限公司 | Lighting device |
| JP2010238701A (en) * | 2009-03-30 | 2010-10-21 | Panasonic Electric Works Co Ltd | Electronic component and lighting device using the same, and luminaire |
| JP5853374B2 (en) * | 2010-03-12 | 2016-02-09 | オムロン株式会社 | Lighting device |
| JP5683239B2 (en) * | 2010-04-28 | 2015-03-11 | 東芝情報システム株式会社 | LED drive device |
| JP5283195B2 (en) * | 2010-09-07 | 2013-09-04 | シーシーエス株式会社 | LED wiring board and light irradiation device |
| JP2015126064A (en) * | 2013-12-26 | 2015-07-06 | 東芝ライテック株式会社 | Led module, method of manufacturing led module, and illumination device |
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| CN103000783A (en) * | 2011-09-19 | 2013-03-27 | 展晶科技(深圳)有限公司 | Light emitting diode and manufacturing method thereof |
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