JP2010238701A - Electronic component and lighting device using the same, and luminaire - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an easily miniaturizable electronic component having a high mounting density. <P>SOLUTION: An electronic component body 1 includes component connections 3a, 3b to which other components 4 can be connected, and the component connections 3a, 3b are connected to an internal circuit (for instance, solid-state light emitting device 2). A zener diode 4a, a diode 4b, a capacitor 4c, a surge absorber 4d or the like are connected to the component connections 3a, 3b as protecting components. Preferably, a chip resistor or the like can be connected to the solid-state light emitting device 2 in parallel or in series to adjust an output amount of light, an applied voltage, or an elements current. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component including a solid-state light emitting element such as a light emitting diode, an illumination device using the electronic component, and an illumination fixture.

  2. Description of the Related Art Conventionally, an electronic device in which electronic components are mounted and arranged on a printed circuit board and electrical conduction between the electronic components is obtained through a wiring pattern formed on the printed circuit board is generally used.

  FIG. 9 shows a configuration example of a conventional electronic component disclosed in Patent Document 1 (Japanese Patent Laid-Open No. Hei 5-152711). An internal circuit 6 is built in the electronic component body 1, and the internal circuit 6 is connected to terminals 5a, 5b, 5c, 5d,. This electronic component is used by being mounted on a printed circuit board. When connecting any protective component, connect each terminal of the protective component to multiple lands separately provided on the printed circuit board on which the electronic component is mounted, and connect the terminal of the electronic component via the wiring pattern on the printed circuit board. Will be connected to.

JP-A-5-152711

  When the electronic component is an LED component, the electrostatic resistance of the component is relatively low, and a protective component such as a Zener diode is often required. In particular, in lighting fixtures, the number of LED components used per unit increases in order to obtain a practically sufficient illuminance, so that the mounting area increases when protective components are connected via a wiring pattern on a printed circuit board. There was a problem.

  This invention is made | formed in view of such a point, and makes it a subject to provide an electronic component with high packaging density and easy size reduction, an illuminating device using the same, and an illuminating device.

  In order to solve the above-described problem, the electronic component of claim 1 includes component connection portions 3a and 3b that can connect other components 4 to the electronic component main body 1, as shown in FIG. Reference numerals 3a and 3b are connected to an internal circuit (solid-state light emitting element 2).

  According to a second aspect of the present invention, in the electronic component according to the first aspect, the internal circuit includes a semiconductor component (solid-state light emitting element 2).

  According to a third aspect of the present invention, in the electronic component according to the first or second aspect, as shown in FIGS. 1A to 1D, the component connecting portions 3a and 3b are provided with protective components 4a to 4d. Is connected.

  According to a fourth aspect of the present invention, in the electronic component according to the first or second aspect, as shown in FIG. 2 or FIG. 3, the internal circuit (solid-state light-emitting element 2) is connected to the component connection portions 3a and 3b. The characteristic correction component 4e or 4f is connected.

  The invention according to claim 5 is characterized in that a component 4e for correcting the voltage applied to the electronic component to be constant as shown in FIG. 2 is mounted as the component for correcting characteristics according to claim 4. .

  According to a sixth aspect of the present invention, as the characteristic correction component according to the fourth aspect, as shown in FIG. 3, a component 4f or 4e for correcting the current flowing through the electronic component to be constant is mounted. .

  As shown in FIGS. 4 to 6, the invention of claim 7 includes component connection portions 3a to 3k that can connect other components JP1 to JP6 to the electronic component body 1, and a plurality of the component connection portions 3a to 3k. It is connected to the internal circuit 2 including the elements 2a to 2c, and the connection form of the plurality of elements 2a to 2c can be selected by connecting the components to the component connecting portions 3a to 3k.

  The invention of claim 8 is an illuminating device comprising the electronic component according to any one of claims 1 to 7 (FIG. 7).

  A ninth aspect of the invention is an illumination device in which the electronic component according to the eighth aspect is a light emitting element (FIG. 7).

  A tenth aspect of the present invention is a luminaire comprising the lighting device according to the eighth or ninth aspect.

  According to the first aspect of the present invention, by mounting other small electronic components in the empty space of the electronic component, the mounting density is increased, and the device on which the electronic component is mounted can be downsized.

  According to the invention of claim 3, the wiring distance to the protection component is shortened, and a more effective protection effect can be obtained.

  According to the seventh aspect of the present invention, the connection mode of a plurality of elements built in the electronic component can be selected by changing the mode of component connection to the component connection unit.

It is a circuit diagram of Embodiment 1 of the present invention. It is a circuit diagram of Embodiment 2 of the present invention. It is a circuit diagram of Embodiment 3 of the present invention. It is a circuit diagram of Embodiment 4 of the present invention. It is a circuit diagram at the time of the serial connection of Embodiment 4 of this invention. It is a circuit diagram at the time of parallel connection of Embodiment 4 of this invention. It is a circuit diagram of the illuminating device of Embodiment 5 of this invention. It is a perspective view which shows the external appearance of Embodiment 6 of this invention. It is a perspective view which shows the external appearance of the prior art example 1. FIG. It is a top view which shows the external appearance of Embodiment 7 of this invention. It is a top view which shows the external appearance of the prior art example 2.

(Embodiment 1)
FIG. 1A is a circuit diagram of an electronic component according to Embodiment 1 of the present invention. The electronic component body 1 includes a solid light emitting element 2 such as a light emitting diode. The solid light emitting element 2 has an anode connected to the terminal A and a cathode connected to the terminal K. The terminals A and K are exposed or protruded outside the electronic component body 1. Terminals A and K are connected to the output of a lighting circuit such as a switching power supply described later.

  In the empty space of the electronic component main body 1, a land 3a electrically connected to the terminal A and a land 3b electrically connected to the terminal K are provided so as to be exposed on the surface of the component. The distance between the lands 3a and 3b is substantially the same as the distance between the terminals of the other components 4 mounted on the surface of the electronic component. Each terminal of the component 4 is connected to the lands 3a and 3b by reflow soldering or conductive adhesive.

  In the example of FIG. 1A, a Zener diode 4a is connected as another component 4 mounted on the surface of the electronic component. The Zener voltage of the Zener diode 4a is set slightly higher than the forward voltage when the solid state light emitting element 2 is normally turned on. For this reason, the Zener diode 4a does not conduct during normal lighting.

  On the other hand, when an overvoltage due to static electricity, an inrush current or a lightning surge voltage is applied between the terminal A and the terminal K, the Zener diode 4a becomes conductive, and the excessive current is bypassed through the Zener diode 4a. Thereby, the solid light emitting element 2 is protected from destruction.

  The protective component connected in parallel with the solid-state light emitting element 2 is not limited to the Zener diode 4a, but as illustrated in FIGS. Either of these is acceptable. When the diode 4b is connected as a protective component, it is possible to prevent an excessive reverse voltage from being applied to the electronic component during reverse mounting.

  In this embodiment, since a protective component according to the application can be connected in parallel with the solid state light emitting device 2, the solid state light emitting device 2 can be protected from destruction due to static electricity, inrush current, lightning surge voltage, or application of reverse voltage. Can do. In particular, with respect to destruction due to static electricity, the wiring interval between the protective component and the solid-state light emitting element 2 can be shortened, so that the protection can be ensured.

(Embodiment 2)
FIG. 2 is a circuit diagram of an electronic component according to Embodiment 2 of the present invention. In the present embodiment, a resistor 4e for correcting the characteristics of the electronic component is connected as the other component 4 mounted on the surface of the electronic component in the configuration of FIG. Other configurations are the same as those in the first embodiment, and thus redundant description is omitted.

  A resistor 4e such as a chip resistor is connected between the lands 3a and 3b as a current adjustment component of the solid state light emitting device 2. When the luminous flux of the solid state light emitting element 2 is lower than a desired value, the resistance value of the resistor 4e is set higher. Further, when the light flux of the solid state light emitting element 2 is higher than a desired value, the resistance value of the resistor 4e is set lower. Thereby, the variation in the luminous flux due to the variation in the characteristics of the solid state light emitting device 2 can be corrected.

  According to this embodiment, when the output characteristic of the lighting circuit connected to the terminal A and the terminal K has a constant current characteristic, the forward voltage applied between the terminal A and the terminal K is adjusted. Can do. When the solid state light emitting device 2 is a blue LED, its forward voltage Vf is approximately in the range of 3 to 4V. Due to variations in individual elements, the resistance value of the resistor 4e connected in parallel with the solid state light emitting element 2 is set high when the forward voltage Vf is low. When the forward voltage Vf is high, the resistance value of the resistor 4e connected in parallel with the solid state light emitting element 2 is set low.

  In this way, by adjusting the resistance value of the resistor 4e connected in parallel with the solid state light emitting element 2, it is possible to correct variations in the VI characteristics (voltage-current characteristics) of the solid state light emitting element 2. That is, even if there is a variation in the VI characteristics of the solid state light emitting device 2, the voltage applied between the terminals AK becomes a predetermined value when a predetermined current is passed between the terminals AK. In addition, it is possible to correct the VI characteristic of the electronic component body 1 as a whole.

  In addition, as shown in FIG.3 (b), you may comprise so that the resistance value of the resistance 4e connected in series with the solid light emitting element 2 may be adjusted. In either case, the resistor 4e can be mounted with high density by using a surface mount component such as a chip resistor. The resistance value may be adjusted by replacing the chip resistance or by trimming.

  In the present embodiment, the example in which the voltage applied to the electronic component main body 1 is made constant has been described, but an example in which the current flowing in the electronic component main body 1 is made constant will be described next.

(Embodiment 3)
FIG. 3 is a circuit diagram of an electronic component according to Embodiment 3 of the present invention. The electronic component body 1 includes a solid light emitting element 2 such as a light emitting diode. The solid light emitting element 2 has an anode connected to the terminal A and a cathode connected to the land 3a.

  In the empty space of the electronic component body 1, a land 3 a electrically connected to the cathode of the solid state light emitting element 2 and a land 3 b electrically connected to the terminal K are provided so as to be exposed on the component surface. The distance between the lands 3 a and 3 b is substantially the same as the distance between the terminals of the other components 4 mounted on the surface of the electronic component main body 1. Each terminal of the component 4 is connected to the lands 3a and 3b by reflow soldering or conductive adhesive.

  The terminals A and K are exposed or protruded outside the electronic component body 1. Terminals A and K are connected to the output of a lighting circuit such as a switching power supply described later. Here, it is assumed that the output characteristic of the lighting circuit has a constant voltage characteristic.

  In the example of FIG. 3A, a constant current diode 4 f is connected as the surface mount component 4. When a predetermined voltage is applied between the terminal A and the terminal K from the lighting circuit, the constant current diode 4f controls the constant current to flow between the terminals AK.

  In the example of FIG. 3B, a resistor 4 e is connected as the surface mount component 4. When a predetermined voltage is applied between the terminal A and the terminal K from the lighting circuit, a current determined by the VI characteristic of the solid state light emitting device 2 and the resistance value of the resistor 4e flows between the terminals AK. The resistance value of the resistor 4e is selected so that this current becomes a constant current regardless of variations in the VI characteristics of the solid state light emitting device 2.

  By connecting appropriate surface mount components 4f and 4e in this way, the current flowing through the electronic component main body 1 can be made constant.

(Embodiment 4)
FIG. 4 is a circuit diagram of an electronic component according to Embodiment 4 of the present invention. The electronic component body 1 includes solid light emitting elements 2a, 2b, 2c such as light emitting diodes. In the empty space of the electronic component main body 1, a plurality of lands 3a to 3k are provided so as to be exposed on the component surface. The terminals A and K are exposed or protruded outside the electronic component body 1. Terminals A and K are connected to the output of a lighting circuit such as a switching power supply described later.

  The solid light emitting elements 2a, 2b, and 2c have anodes connected to the lands 3d, 3f, and 3h and cathodes connected to the lands 3i, 3j, and 3k, respectively. The lands 3d, 3f, and 3h are connected to the lands 3a, 3b, and 3c, respectively. The land 3c is connected to the terminal A, and the land 3i is connected to the terminal K. The lands 3j and 3k are connected to the lands 3e and 3g, respectively.

  The electronic component of FIG. 4 has a configuration in which a plurality of solid state light emitting elements 2a to 2c are connected in series as shown in FIG. 5, or a plurality of solid state light emitting elements 2a to 2c that are connected in parallel as shown in FIG. Used as a configuration.

  In the configuration shown in FIG. 5, in the electronic component of FIG. 4, a jumper resistor JP1 is connected between the lands 3d-3e, and a jumper resistor JP2 is connected between the lands 3f-3g. In this configuration, terminal A → land 3c → land 3h → solid state light emitting device 2c → land 3g → jumper resistor JP2 → land 3f → solid state light emitting device 2b → land 3e → jumper resistor JP1 → land 3d → solid state light emitting device 2a → land 3i. → Element current flows in the path of terminal K. If the device current is If, the resistance value of the jumper resistors JP1 and JP2 is R, and the forward voltage of the solid state light emitting devices 2a to 2c with respect to the device current If is Vf, the voltage between the terminals AK during lighting is 3 × Vf + 2 × R × If. A jumper line may be used in place of the jumper resistors JP1 and JP2.

  In the configuration shown in FIG. 6, in the electronic component of FIG. 4, a jumper resistor JP3 is connected between the lands 3a and 3b, a jumper resistor JP4 is connected between the lands 3b and 3c, and a jumper resistor JP5 is connected between the lands 3i and 3j. A jumper resistor JP6 is connected between the lands 3j-3k. In this configuration, an element current flows through a path of terminal A → land 3c → land 3h → solid state light emitting element 2c → land 3k → jumper resistor JP6 → land 3j → jumper resistor JP5 → land 3i → terminal K. Further, an element current flows through a path of terminal A → land 3c → jumper resistor JP4 → land 3b → land 3f → solid state light emitting element 2b → land 3j → jumper resistor JP5 → land 3i → terminal K. Further, an element current flows through a route of terminal A → land 3c → jumper resistor JP4 → land 3b → jumper resistor JP3 → land 3a → land 3d → solid state light emitting element 2a → land 3i → terminal K.

  The element current of the solid state light emitting element 2a flows through the jumper resistor JP3, and the element current of the solid state light emitting element 2c flows through the jumper resistor JP6. Further, the element currents of the solid light emitting elements 2a and 2b flow through the jumper resistor JP4, and the element currents of the solid light emitting elements 2b and 2c flow through the jumper resistor JP5.

  The resistance values of the jumper resistors JP4 and JP5 are R, the resistance values of the jumper resistors JP3 and JP6 are 2 × R, the device current flowing through each of the solid state light emitting devices 2a to 2c is If, and the order of the solid state light emitting devices 2a to 2c with respect to the device current If When the voltage is Vf, the load voltage between the terminals AK at the time of lighting is Vf + 4 × R × If. Further, the load current between the terminals AK at the time of lighting is 3 × If.

  Even when there are variations in the VI characteristics of the solid light emitting elements 2a to 2c, when the solid light emitting element 2a is brighter than the solid light emitting element 2b, the resistance value of the jumper resistor JP3 is set higher, compared with the solid light emitting element 2b. When the solid state light emitting device 2a is dark, the brightness of the solid state light emitting device 2b and the solid state light emitting device 2a can be made equal by setting the resistance value of the jumper resistor JP3 low. Similarly, when the solid state light emitting device 2c is brighter than the solid state light emitting device 2b, the resistance value of the jumper resistor JP6 is set higher. When the solid state light emitting device 2c is darker than the solid state light emitting device 2b, the resistance value of the jumper resistor JP6 is set. Is set low, the brightness of the solid-state light-emitting element 2b and the solid-state light-emitting element 2c can be made uniform. Therefore, by adjusting the resistance values of the jumper resistors JP3 and JP6, the brightness of each of the solid state light emitting devices 2a to 2c can be adjusted to be uniform.

(Embodiment 5)
FIG. 7 is a circuit diagram of a lighting apparatus according to Embodiment 5 of the present invention. The LED light emitting unit 7 has a configuration in which three LEDs are connected in series (for example, a configuration in which jumper wires are connected instead of the jumper resistors JP1 and JP2 in FIG. 5), and when the forward voltage per LED is Vf, The total forward voltage is 3 × Vf. In the present embodiment, the LED light emitting unit 7 is driven by a switching power source that converts the commercial power source Vs into a DC voltage.

  The AC input terminal of the diode bridge DB is connected to the commercial AC power source Vs via the line filter LF. A parallel circuit of a noise preventing capacitor C1 and a surge absorber ZNR is connected to the power supply side of the line filter LF. A noise prevention capacitor C2 is connected to the output end of the line filter LF. A series circuit of capacitors C11 and C12 is connected in parallel to the noise preventing capacitor C2. The connection point of the capacitors C11 and C12 is connected to the appliance ground FG via the capacitor C13. The instrument ground FG is electrically connected to a metal case that houses this circuit, and the metal case is grounded.

  A smoothing capacitor C3 is connected to the DC output terminal of the diode bridge DB. The smoothing capacitor C3 is a capacitor that smoothes the pulsating voltage at the DC output end of the diode bridge DB. The negative electrode of the smoothing capacitor C3 is connected to the circuit ground G. The positive electrode of the smoothing capacitor C <b> 3 is connected to the anode side of the LED light emitting unit 7. One end of an inductor L1 is connected to the cathode side of the LED light emitting unit 7. The other end of the inductor L1 is connected to the anode of the diode D1. The cathode of the diode D <b> 1 is connected to the anode side of the LED light emitting unit 7. The anode of the diode D1 is connected to the drain electrode of the switching element Q1 made of MOSFET. A current detection resistor R1 is connected between the source electrode of the switching element Q1 and the circuit ground G. The non-ground side terminal of the current detection resistor R1 is connected to the detection terminal of the control unit 8. The gate electrode of the switching element Q1 is connected to the PWM signal output terminal of the control unit 8.

  The control unit 8 is a control IC for the switching power supply, and controls the on-time and off-time of the switching element Q1 while monitoring the current detected by the current detection resistor R1, so that the current flowing through the LED light-emitting unit 7 Is to control. When the switching element Q1 is on, a current flows through a path of the smoothing capacitor C3 → the LED light emitting unit 7 → the inductor L1 → the switching element Q1 → the current detection resistor R1 → the smoothing capacitor C3. At this time, the current flowing through the inductor L1 gradually increases, and electromagnetic energy is accumulated in the inductor L1. When the switching element Q1 is turned off, the electromagnetic energy accumulated in the inductor L1 is released through the path of the inductor L1, the diode D1, the LED light emitting unit 7, and the inductor L1. By repeating this operation at a high frequency, the average current flowing through the LED light emitting unit 7 is controlled to be a desired current.

  If the electronic component of the present invention as described in Embodiments 1 to 4 is used as the LED light emitting unit 7, the mounting density of the electronic components on the printed circuit board can be improved, and the printed circuit board and the lighting device can be downsized. it can.

  The illuminating device of the present embodiment may be used as a light source for a copying machine or a scanner, in addition to being used as a power supply integrated type or a power supply type illuminating device. Or you may use as a backlight apparatus of a transmissive display like a liquid crystal display device.

(Embodiment 6)
FIG. 8 is a perspective view showing an appearance of an electronic component according to Embodiment 6 of the present invention. A plurality of lands 3a, 3b, 3c, 3d, 3e,... Are provided on the surface of the resin-molded electronic component main body 1. The distance between the lands 3a and 3b and the distance between the lands 3c and 3d are substantially the same as the distance between the terminals of the surface mount component such as a chip resistor or a chip capacitor. A plurality of terminals 5a, 5b, 5c, 5d,... Project from the back side of the electronic component body 1. An internal circuit such as a semiconductor integrated circuit is built in the electronic component body 1, and each terminal 5a, 5b, 5c, 5d,... And each land 3a, 3b, 3c, 3d, 3e,. Connected to internal circuit. Specific internal wiring is not particularly limited. For example, the terminal 5a may be connected to the land 3a, the terminal 5b may be connected to the lands 3b and 3c, the terminal 5c may be connected to the land 3d, and the terminal 5d may be connected to the land 3e. .

  A configuration example of a conventional electronic component is illustrated in FIG. An internal circuit 6 such as a relay is built in the case of the electronic component body 1, and its drive terminal and output terminal are connected to terminals 5a, 5b, 5c, 5d,. This electronic component is used by being mounted on a printed circuit board. When connecting any protective component, connect each terminal of the protective component to multiple lands separately provided on the printed circuit board on which the electronic component is mounted, and connect the terminal of the electronic component via the wiring pattern on the printed circuit board. Will be connected to. For this reason, in the conventional example, when some kind of protective component is added to the electronic component, there is a problem that the mounting area increases. In addition, since the wiring distance to the protective component becomes long, there is a problem that the protective effect is lowered.

  On the other hand, in the configuration example of the present invention shown in FIG. 8, for example, by mounting surface-mounted components between the lands 3 a-3 b or between the lands 3 c-3 d provided in the empty space of the electronic component main body 1, Protective components can be connected between the terminals 5a-5b or between the terminals 5b-5c. In this case, since the wiring distance to the protection component is very short, the protection effect is enhanced especially against destruction of the internal circuit due to static electricity. Further, even if protective parts are added, the mounting area does not increase.

(Embodiment 7)
FIG. 10 is a perspective view showing the appearance of an electronic component according to Embodiment 7 of the present invention. A plurality of lands 3 a to 3 h are provided on the surface of the electronic component main body 1. Each of the lands 3a to 3h is connected to an internal circuit (for example, a semiconductor integrated circuit) of the electronic component main body 1, and is used to connect an external CR element or a protective component.

  The appearance of a conventional integrated circuit is illustrated in FIG. Three terminals 5a to 5c; 5d to 5f protrude from both sides of the resin-molded electronic component body 1 to form a so-called DIP type IC package. A mark (indicated by a white circle) indicating the direction of the terminal and a product name (not shown) are displayed on the surface of the electronic component main body 1, but no land is provided. This integrated circuit is used by being mounted on a printed circuit board. When connecting any protective component, connect each terminal of the protective component to multiple lands separately provided on the printed circuit board on which the integrated circuit is mounted, and connect the integrated circuit terminal via the wiring pattern on the printed circuit board. Need to connect to. For this reason, in the conventional example, there is a problem that if some protective parts are added to the integrated circuit, the mounting area increases. In addition, since the wiring distance to the protective component becomes long, there is a problem that the protective effect is lowered.

  On the other hand, in the configuration example of the present invention shown in FIG. 10, for example, a protective component can be connected by mounting a surface-mounted component between a plurality of lands. In this case, since the wiring distance to the protective component is shortened, the protective effect is enhanced. Further, even if protective parts are added, the mounting area does not increase. Furthermore, it is possible to change the function of the integrated circuit by connecting jumper wires between multiple lands, or to change the constant of the integrated circuit by adding external CR elements between the multiple lands. Even in this case, the mounting area does not increase.

  The appearance of the electronic component described in Embodiment 6 or 7 may be applied to the light-emitting component incorporating the solid-state light-emitting element described in Embodiments 1 to 4. In that case, the electronic component main body 1 is preferably composed of a translucent member such as an acrylic resin so that light from the solid light emitting element can be extracted to the outside.

1 Electronic component body 2 Solid state light emitting device 3a Land (component connection part)
3b Land (part connection part)
4 Other parts 4a Zener diode (protection part)

Claims (10)

An electronic component comprising: a component connecting portion capable of connecting another component to the electronic component main body, wherein the component connecting portion is connected to an internal circuit. The electronic component according to claim 1, wherein the internal circuit includes a semiconductor component. The electronic component according to claim 1, wherein a protective component is connected to the component connecting portion. The electronic component according to claim 1, wherein a component for correcting characteristics of the internal circuit is connected to the component connecting portion. An electronic component comprising a component for correcting the voltage applied to the electronic component to be constant as the characteristic correcting component according to claim 4. 5. An electronic component comprising a component for correcting the characteristic correction component according to claim 4 so that a current flowing through the electronic component is constant. The electronic component main body includes a component connecting portion that can connect other components, and the component connecting portion is connected to an internal circuit including a plurality of elements, and the plurality of elements are connected by connecting the components to the component connecting portion. An electronic component characterized in that the form can be selected. A lighting device comprising the electronic component according to claim 1. The lighting device according to claim 8, wherein the electronic component is a light emitting element. A lighting apparatus comprising the lighting device according to claim 8.

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