CN104810233B - three-dimensional plasma source system - Google Patents
three-dimensional plasma source system Download PDFInfo
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- CN104810233B CN104810233B CN201410031296.3A CN201410031296A CN104810233B CN 104810233 B CN104810233 B CN 104810233B CN 201410031296 A CN201410031296 A CN 201410031296A CN 104810233 B CN104810233 B CN 104810233B
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- cover plate
- cooler
- plasma source
- groove
- source system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
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- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
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Abstract
The invention provides a three-dimensional plasma source system, which comprises an electrical insulating material component, an air inlet cover plate, a cavity cover plate, a metal cavity and radio frequency excitation devices, wherein the electrical insulating material component, the air inlet cover plate, the cavity cover plate and the metal cavity form a closable space; the radio frequency excitation devices surround the periphery of the electrical insulating material component; the electrical insulating material component comprises an air inlet end and a cavity end; the air inlet cover plate covers the air inlet end; the cavity cover plate covers the cavity end and a connecting end of the metal cavity, and the connecting end of the metal cavity extends outward to form a second extension end; and the cavity cover plate is provided with at least one second heater used for heating the closable space and a second cooler located at the second extension end. The three-dimensional plasma source system further comprises a second thermocouple which is located at the cavity end covered by the cavity cover plate and used for detecting the temperature of the closable space. The three-dimensional plasma source system is reasonable in design, simple in structure, and capable of improving the temperature uniformity of the electrical insulating material component so as to avoid breakage thereof.
Description
Technical field
The present invention relates to semiconductor device fabrication field, particularly to a kind of solid plasma source system.
Background technology
Lithographic technique is important process technology in the processing of semiconductor device, plasma source system be in etching apparatus extremely
Close an important part, the plasma source of etching apparatus is divided into plane and three-dimensional two big classifications, and three-dimensional plasma source can produce more
Highdensity plasma is such that it is able to obtain faster etch rate.
At present, the etching machines of three-dimensional plasma source are the periphery setting radio-frequency drive device lines of electrically insulating material part
Circle, passes to radio-frequency (RF) energy by radio-frequency drive device, by the coupling of electrically insulating material part, is formed in the within the chamber of etching machines
Plasma, the nearer region of such within the chamber distance setting radio-frequency drive device coil, isoionic density is higher, plasma
The inner surface of electrically insulating material part can be bombarded, in order to avoid isoionic bombardment causes to consume and go out to electrically insulating material part
Existing by-product, electrically insulating material part is using Al203 ceramic material in the prior art.However, when electrically insulating material part is subject to
To ion bom bardment, substantial amounts of heat can be produced, the heat producing in the region being correspondingly arranged radio-frequency drive device coil is maximum, by
Larger in the size of electrically insulating material part, and the heat transfer efficiency deficiency of Al203 ceramic material is it is easy to cause the material that is electrically insulated
The fracture of material part.
Content of the invention
It is an object of the invention to provide one kind is reasonable in design, structure is simple, it is equal to improve electrically insulating material Part temperature
Even property is thus avoid the three-dimensional plasma source system of its fracture.
For achieving the above object, the technical solution adopted in the present invention is：
A kind of solid plasma source system, including forming can the electrically insulating material part of closing space, air inlet cover plate, chamber
Cover plate and metallic cavity；And it is looped around the radio-frequency drive device of electrically insulating material part the week side of boss；
Described electrically insulating material part includes inlet end and chamber end；
Described air inlet cover plate covers described inlet end；
Described chamber cover plate covers the connection end of described chamber end and described metallic cavity, and the connection end by metallic cavity
Stretch out formation the second elongated end；
Be provided with described chamber cover plate for described can closing space heating at least one secondary heater, and
The second cooler positioned at described second elongated end；
Described solid plasma source system also include positioned at described chamber cover plate cover described chamber end at for detecting
Described can closing space temperature the second thermocouple.
Wherein in an embodiment, described air inlet cover plate covers and stretches out described inlet end and forms the first elongated end；
Be provided with described air inlet cover plate for described can closing space heating at least one primary heater, and
The first cooler positioned at described first elongated end；
Described solid plasma source system also include positioned at described air inlet cover plate cover described inlet end at for detecting
Described can closing space temperature temperature the first thermocouple.
Wherein in an embodiment, the part that described air inlet cover plate covers in described inlet end is first thermal treatment zone, surpasses
The part going out described inlet end is the first cooling zone；
The part that described chamber cover plate covers in the connection end of described metallic cavity is second thermal treatment zone, beyond described metal
The part of the connection end of cavity is the second cooling zone；
Described primary heater is arranged on described first thermal treatment zone；
Described first cooler is arranged on described first cooling zone；
Described secondary heater is arranged on described second thermal treatment zone；
Described second cooler is arranged on described second cooling zone.
Wherein in an embodiment, the thickness of described air inlet cover plate and described chamber cover plate is all higher than 15 millimeters.
Wherein in an embodiment, described first thermal treatment zone arranges the first groove；
Described second thermal treatment zone arranges the second groove；
Described primary heater is arranged in described first groove, and is bolted in described first groove；
Described secondary heater is arranged in described second groove, and is bolted in described second groove.
Wherein in an embodiment, described primary heater and described secondary heater are armouring heater strip.
Wherein in an embodiment, also include the first power adjustments controller and the second power adjustments controller；
Described first power adjustments controller is electrically connected with described primary heater, for adding to described primary heater
Thermal power is adjusted；
Described second power adjustments controller is electrically connected with described secondary heater, for adding to described secondary heater
Thermal power is adjusted.
Wherein in an embodiment, described first cooling zone arranges the 3rd groove；
Described second cooling zone arranges the 4th groove；
Described first cooler is arranged in described 3rd groove, and is fixed by screws in described 3rd groove；
Described second cooler is arranged in described 4th groove, and is fixed by screws in described 4th groove.
Wherein in an embodiment, also include cooling system,
Described first cooler is all connected with cooling system by pipeline with described second cooler；
All circulate to have and pass through pipeline by cooling system in the inside of the inside of described first cooler and described second cooler
The coolant providing.
Wherein in an embodiment, described cooling system arranges the first pressure regulator valve and the second pressure regulator valve, for adjusting
State the cold medium flux within the first cooler and the second cooler；
Described cooling system also sets up first flow watch-dog and second flow watch-dog, for described first cooler
It is monitored with the cold medium flux within the second cooler and record.
Wherein in an embodiment, described first cooler and described second cooler are copper pipe.
The invention has the beneficial effects as follows：
By primary heater and the first cooler, the regulation of inlet end temperature and secondary heater and second are cooled down
Device to the regulation of chamber end temperature so that the invention has the advantages that：Reasonable in design, structure is simple, can improve electric insulation
Material parts temperature homogeneity is thus avoid its fracture.
Brief description
Fig. 1 is three-dimensional plasma source system one embodiment schematic diagram of invention；
Wherein：1 radio-frequency drive device；2 electrically insulating material parts；21 inlet ends；22 chamber end；3 air inlet cover plates；31 first
The thermal treatment zone；311 first grooves；32 first cooling zones；321 the 3rd grooves；4 chamber cover plates；41 second thermals treatment zone；411 second is recessed
Groove；42 second cooling zones；421 the 4th grooves；5 metallic cavity；The connection end of 51 metallic cavity；6 primary heaters；61 first work(
Rate adjusts controller；7 first coolers；71 first pressure regulator valves；72 first flow watch-dogs；8 first thermocouples；9 second heating
Device；91 second power adjustments controllers；10 second coolers；101 second pressure regulator valves；102 second flow watch-dogs；11 second heat
Galvanic couple.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, below in conjunction with drawings and Examples pair
The three-dimensional plasma source system of the present invention is further elaborated.It should be appreciated that specific embodiment described herein is only
In order to explain the present invention, it is not intended to limit the present invention.
As shown in figure 1, a kind of solid plasma source system, include form can closing space electrically insulating material part 2, enter
Air cover board 3, chamber cover plate 4 and metallic cavity 5；And it is looped around the radio-frequency drive device 1 of electrically insulating material part 2 the week side of boss；
Electrically insulating material part 2 includes inlet end 21 and chamber end 22；
Air inlet cover plate 3 covers inlet end 21；
Chamber cover plate 4 covers the connection end 51 of chamber end 22 and metallic cavity, and the connection end 51 by metallic cavity is outside
Extend and form the second elongated end；
Be provided with chamber cover plate 4 for can closing space heating at least one secondary heater 9, and be located at the
Second cooler 10 of two elongated ends；
Three-dimensional plasma source system also include positioned at chamber cover plate 4 cover chamber end 22 at for detection can closing space
Second thermocouple 11 of temperature.
Temperature at chamber end 22 can be carried out controlled by the collective effect of secondary heater 9 and the second cooler 10
The regulation of system, and by the second thermocouple 11, the temperature at chamber end 22 can be monitored, so can avoid because of chamber
Temperature change at room end 22 causes that the temperature difference at chamber end 22 and inlet end 21 is excessive to cause electrically insulating material part 2 to break
Split.
Wherein in an embodiment, air inlet cover plate 3 covers and stretches out inlet end 21 and forms the first elongated end；
Be provided with air inlet cover plate 3 for can closing space heating at least one primary heater 6, and be located at the
First cooler 7 of one elongated end；
Three-dimensional plasma source system also include positioned at air inlet cover plate 3 cover inlet end 21 at for detection can closing space
Temperature the first thermocouple 8.
Temperature at inlet end 21 can be carried out controlled by the collective effect of primary heater 6 and the first cooler 7
System is adjusted, and by the first thermocouple 8, the temperature at inlet end 21 can be monitored, and so ensure that inlet end 21
With chamber end 22 forms rational thermograde it is ensured that the temperature difference between inlet end 21 and chamber end 22 controls rational
Scope, more efficiently avoids and causes electrically insulating material part 2 to break because the temperature difference at chamber end 22 and inlet end 21 is excessive
The phenomenon split.
Wherein in an embodiment, air inlet cover plate 3 cover inlet end 21 part be first thermal treatment zone 31, exceed into
The part at gas end 21 is the first cooling zone 32；
The part that chamber cover plate 4 covers in the connection end 51 of metallic cavity is second thermal treatment zone 41, beyond metallic cavity
The part of connection end is the second cooling zone 42；
Primary heater 6 is arranged on first thermal treatment zone 31；
First cooler 7 is arranged on the first cooling zone 32；
Secondary heater 9 is arranged on second thermal treatment zone 41；
Second cooler 10 is arranged on the second cooling zone 42.
Because the heat of three-dimensional plasma source system is initially generated in inside electrically insulating material part 2, therefore according to
Upper described mode arranges primary heater 6, the first cooler 7, secondary heater 9 and the second cooler 10, to inlet end 21
More reliable, the effect is significant with the temperature control at chamber end 22.
Wherein in an embodiment, the thickness of air inlet cover plate 3 and chamber cover plate 4 is all higher than 15 millimeters.So can make
Heating and cooling are delivered to inlet end 21 and the position of chamber end 22, and inlet end 21 and the temperature of chamber end 22 can be made to obtain more again
Good maintenance.So that the first thermocouple 8 and the second thermocouple 11 can more accurately measure at inlet end 21 and chamber end 22
Temperature.
Wherein in an embodiment, first thermal treatment zone 31 arranges the first groove 311；
Second thermal treatment zone 41 arranges the second groove 411；
Primary heater 6 is arranged in the first groove 311, and is bolted in the first groove 311；
Secondary heater 9 is arranged in the second groove 411, and is bolted in the second groove 411.
So can make between primary heater 6 and air inlet cover plate 3 and between secondary heater 9 and chamber cover plate 4
Contact even closer it is ensured that heats.
Wherein in an embodiment, primary heater 6 and secondary heater 9 are armouring heater strip.So can put again
The personnel of putting touch heater strip, are avoided that external force damages to heater strip again, not only using safety, and improve and use the longevity
Life.
Wherein in an embodiment, also include the first power adjustments controller 61 and the second power adjustments controller 91；
First power adjustments controller 61 is electrically connected with primary heater 6, for entering to the heating power of primary heater 6
Row is adjusted；
Second power adjustments controller 91 is electrically connected with secondary heater 9, for entering to the heating power of secondary heater 9
Row is adjusted.
Can be at the inlet end 21 measured by the first thermocouple 8 and the second thermocouple 11 and chamber end 22 during operation
Temperature, adjusts primary heater 6 and second by the first power adjustments controller 61 and the second power adjustments controller 91 and adds
The power of hot device 9, so that the thermograde at inlet end 21 and chamber end 22 is maintained at a suitable scope, not only operates
Simply, and precisely reliable.
Wherein in an embodiment, the first cooling zone 32 arranges the 3rd groove 321；
Second cooling zone 42 arranges the 4th groove 421；
First cooler 7 is arranged in the 3rd groove 321, and is fixed by screws in the 3rd groove 321；
Second cooler 10 is arranged in the 4th groove 421, and is fixed by screws in the 4th groove 421.
So can make between the first cooler 7 and air inlet cover plate 3 and between the second cooler 10 and chamber cover plate 4
Contact even closer it is ensured that cooling effect.
Wherein in an embodiment, also include cooling system,
First cooler 7 is all connected with cooling system by pipeline with the second cooler 10；
All circulated and provided by pipeline by cooling system in the inside of the inside of the first cooler 7 and the second cooler 10
Coolant.
Cooling system can be fridge or the cooling water system of heat exchanger or factory, but not limited to this, and coolant is permissible
It is cold water, but not limited to this.
Wherein in an embodiment, cooling system arranges the first pressure regulator valve 71 and the second pressure regulator valve 101, for adjusting the
Cold medium flux within one cooler 7 and the second cooler 10；
Cold to the inside of the first cooler 7 and the second cooler 10 by the first pressure regulator valve 71 and the second pressure regulator valve 101
The control of matchmaker's flow, can make the first cooler 7 and the cooling capacity of the second cooler 10 be controlled, can avoid the occurrence of cold
But ability is excessive and increase primary heater 6 and the power of secondary heater 9 causes unnecessary loss, is avoided that cooling energy again
The hidden danger that power is too small and causes the temperature at inlet end 21 and chamber end 22, makes to the temperature at inlet end 21 and chamber end 22
Regulation becomes more reliable.
Cooling system also sets up first flow watch-dog 72 and second flow watch-dog 102, for the first cooler 7 He
Cold medium flux within second cooler 10 is monitored and records.
Cold medium flux within first cooler 7 and the second cooler 10 is recorded, can be remembered according to cold medium flux
Record, adjusts primary heater 6 and the second heating by the first power adjustments controller 61 and the second power adjustments controller 91
The power of device 9 is it is ensured that the concordance of equipment.
Wherein in an embodiment, the first cooler 7 and the second cooler are copper pipe 10.
Due to the good heat conductivity of copper pipe, the first cooler 7 and the second cooler 10 adopt copper pipe, can improve first cold
But the cooling effect of device 7 and the second cooler 10.
The present invention is reasonable in design, structure is simple, can improve electrically insulating material Part temperature uniformity thus avoiding it to break
Split.
Embodiment described above only have expressed the several embodiments of the present invention, and its description is more concrete and detailed, but simultaneously
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformation can also be made and improve, these broadly fall into the guarantor of the present invention
Shield scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (11)
1. a kind of solid plasma source system, including forming can the electrically insulating material part of closing space, air inlet cover plate, Pit cover
Plate and metallic cavity；And it is looped around the radio-frequency drive device of electrically insulating material part the week side of boss；
It is characterized in that：
Described electrically insulating material part includes inlet end and chamber end；
Described air inlet cover plate covers described inlet end；
Described chamber cover plate covers the connection end of described chamber end and described metallic cavity, and the connection end by metallic cavity is outside
Extend and form the second elongated end；
Be provided with described chamber cover plate for described can closing space heating at least one secondary heater, and be located at
Second cooler of described second elongated end；
Described solid plasma source system also includes described for detecting at the described chamber cover plate described chamber end of covering
Can closing space temperature the second thermocouple.
2. solid plasma source system according to claim 1 is it is characterised in that described air inlet cover plate covers and stretches out institute
State inlet end and form the first elongated end；
Be provided with described air inlet cover plate for described can closing space heating at least one primary heater, and be located at
First cooler of described first elongated end；
Described solid plasma source system also includes described for detecting at the described air inlet cover plate described inlet end of covering
Can closing space temperature the first thermocouple.
3. according to claim 2 solid plasma source system it is characterised in that：
The part that described air inlet cover plate covers in described inlet end is first thermal treatment zone, and the part beyond described inlet end is first
Cooling zone；
The part that described chamber cover plate covers in the connection end of described metallic cavity is second thermal treatment zone, beyond described metallic cavity
Connection end part be the second cooling zone；
Described primary heater is arranged on described first thermal treatment zone；
Described first cooler is arranged on described first cooling zone；
Described secondary heater is arranged on described second thermal treatment zone；
Described second cooler is arranged on described second cooling zone.
4. according to claim 2 solid plasma source system it is characterised in that：
The thickness of described air inlet cover plate and described chamber cover plate is all higher than 15 millimeters.
5. according to claim 3 solid plasma source system it is characterised in that：
Described first thermal treatment zone arranges the first groove；
Described second thermal treatment zone arranges the second groove；
Described primary heater is arranged in described first groove, and is bolted in described first groove；
Described secondary heater is arranged in described second groove, and is bolted in described second groove.
6. according to claim 5 solid plasma source system it is characterised in that：
Described primary heater and described secondary heater are armouring heater strip.
7. according to claim 2 solid plasma source system it is characterised in that：
Also include the first power adjustments controller and the second power adjustments controller；
Described first power adjustments controller is electrically connected with described primary heater, for the heating work(to described primary heater
Rate is adjusted；
Described second power adjustments controller is electrically connected with described secondary heater, for the heating work(to described secondary heater
Rate is adjusted.
8. according to claim 3 solid plasma source system it is characterised in that：
Described first cooling zone arranges the 3rd groove；
Described second cooling zone arranges the 4th groove；
Described first cooler is arranged in described 3rd groove, and is fixed by screws in described 3rd groove；
Described second cooler is arranged in described 4th groove, and is fixed by screws in described 4th groove.
9. according to claim 7 solid plasma source system it is characterised in that：
Also include cooling system,
Described first cooler is all connected with cooling system by pipeline with described second cooler；
All circulated and provided by pipeline by cooling system in the inside of the inside of described first cooler and described second cooler
Coolant.
10. according to claim 9 solid plasma source system it is characterised in that：
Described cooling system arranges the first pressure regulator valve and the second pressure regulator valve, for adjusting described first cooler and the second cooler
Internal cold medium flux；
Described cooling system also sets up first flow watch-dog and second flow watch-dog, for described first cooler and
Cold medium flux within two coolers is monitored and records.
11. according to claim 9 solid plasma source systems it is characterised in that：
Described first cooler and described second cooler are copper pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410031296.3A CN104810233B (en) | 2014-01-23 | 2014-01-23 | three-dimensional plasma source system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410031296.3A CN104810233B (en) | 2014-01-23 | 2014-01-23 | three-dimensional plasma source system |
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| Publication Number | Publication Date |
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| CN104810233A CN104810233A (en) | 2015-07-29 |
| CN104810233B true CN104810233B (en) | 2017-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410031296.3A Active CN104810233B (en) | 2014-01-23 | 2014-01-23 | three-dimensional plasma source system |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109727838B (en) * | 2017-10-31 | 2021-09-17 | 北京北方华创微电子装备有限公司 | Plasma generating cavity and semiconductor processing equipment |
| CN111769060A (en) * | 2020-07-27 | 2020-10-13 | 上海邦芯半导体设备有限公司 | Inductive coupling reactor and working method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5449410A (en) * | 1993-07-28 | 1995-09-12 | Applied Materials, Inc. | Plasma processing apparatus |
| CN101197249A (en) * | 2006-12-06 | 2008-06-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction cavity lining and reaction cavity including the same |
| CN102027811A (en) * | 2008-05-22 | 2011-04-20 | Emd株式会社 | Plasma generating apparatus and plasma processing apparatus |
| CN102403181A (en) * | 2010-09-14 | 2012-04-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Process chamber and plasma processing equipment applying same |
-
2014
- 2014-01-23 CN CN201410031296.3A patent/CN104810233B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5449410A (en) * | 1993-07-28 | 1995-09-12 | Applied Materials, Inc. | Plasma processing apparatus |
| CN101197249A (en) * | 2006-12-06 | 2008-06-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction cavity lining and reaction cavity including the same |
| CN102027811A (en) * | 2008-05-22 | 2011-04-20 | Emd株式会社 | Plasma generating apparatus and plasma processing apparatus |
| CN102403181A (en) * | 2010-09-14 | 2012-04-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Process chamber and plasma processing equipment applying same |
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| CN104810233A (en) | 2015-07-29 |
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Address after: 100176 Beijing economic and Technological Development Zone, Beijing, Wenchang Road, No. 8, No. Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Beijing, Wenchang Road, No. 8, No. Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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