CN104808438A - Photosensitive resin composition, electronic component and method for producing same - Google Patents
Photosensitive resin composition, electronic component and method for producing same Download PDFInfo
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- CN104808438A CN104808438A CN201510031709.2A CN201510031709A CN104808438A CN 104808438 A CN104808438 A CN 104808438A CN 201510031709 A CN201510031709 A CN 201510031709A CN 104808438 A CN104808438 A CN 104808438A
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- photosensitive polymer
- polymer combination
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000011342 resin composition Substances 0.000 title abstract description 4
- -1 silane compound Chemical class 0.000 claims abstract description 44
- 229910000077 silane Inorganic materials 0.000 claims abstract description 25
- 239000000178 monomer Substances 0.000 claims abstract description 20
- 150000002905 orthoesters Chemical class 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000002904 solvent Substances 0.000 claims abstract description 15
- 229920000642 polymer Polymers 0.000 claims description 63
- 239000000758 substrate Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- 239000003999 initiator Substances 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 239000003513 alkali Substances 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 9
- 150000003254 radicals Chemical class 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 6
- 238000006884 silylation reaction Methods 0.000 claims description 6
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- LTOKKZDSYQQAHL-UHFFFAOYSA-N trimethoxy-[4-(oxiran-2-yl)butyl]silane Chemical compound CO[Si](OC)(OC)CCCCC1CO1 LTOKKZDSYQQAHL-UHFFFAOYSA-N 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 239000002318 adhesion promoter Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 8
- PYOKUURKVVELLB-UHFFFAOYSA-N trimethyl orthoformate Chemical compound COC(OC)OC PYOKUURKVVELLB-UHFFFAOYSA-N 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- SGJBIFUEFLWXJY-UHFFFAOYSA-N 1-(dibutoxymethoxy)butane Chemical compound CCCCOC(OCCCC)OCCCC SGJBIFUEFLWXJY-UHFFFAOYSA-N 0.000 description 4
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 4
- BNCADMBVWNPPIZ-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCN(COC)C1=NC(N(COC)COC)=NC(N(COC)COC)=N1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 4
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 4
- 239000005058 Isophorone diisocyanate Substances 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 4
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 4
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 3
- ZGMNAIODRDOMEK-UHFFFAOYSA-N 1,1,1-trimethoxypropane Chemical compound CCC(OC)(OC)OC ZGMNAIODRDOMEK-UHFFFAOYSA-N 0.000 description 2
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 2
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 2
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 2
- JDBDDNFATWXGQZ-UHFFFAOYSA-N 5-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1=CC(C)CC2C(=O)OC(=O)C12 JDBDDNFATWXGQZ-UHFFFAOYSA-N 0.000 description 2
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- VPBZZPOGZPKYKX-UHFFFAOYSA-N 1,2-diethoxypropane Chemical compound CCOCC(C)OCC VPBZZPOGZPKYKX-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- UBNPTJSGEYBDCQ-UHFFFAOYSA-N 1-phenylethanone Chemical class CC(=O)C1=CC=CC=C1.CC(=O)C1=CC=CC=C1 UBNPTJSGEYBDCQ-UHFFFAOYSA-N 0.000 description 1
- XOAKHODFHUHKSO-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C(C)C1=CC=2C(C3=CC=CC=C3SC2C(=C1)CC)=O.C(C)C1=CC=2C(C3=CC=CC=C3SC2C(=C1)CC)=O XOAKHODFHUHKSO-UHFFFAOYSA-N 0.000 description 1
- LJRSZGKUUZPHEB-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxypropoxy)propoxy]propyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COC(C)COC(=O)C=C LJRSZGKUUZPHEB-UHFFFAOYSA-N 0.000 description 1
- ZKCCKKDTLQTPKF-UHFFFAOYSA-N 2-ethoxy-1-methoxypropane Chemical compound CCOC(C)COC ZKCCKKDTLQTPKF-UHFFFAOYSA-N 0.000 description 1
- DEDUBNVYPMOFDR-UHFFFAOYSA-N 2-ethoxypropan-1-ol Chemical compound CCOC(C)CO DEDUBNVYPMOFDR-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- FGOXSQKQCRSCDG-UHFFFAOYSA-N 3-methoxybutan-1-ol Chemical compound COC(CCO)C.COC(CCO)C FGOXSQKQCRSCDG-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VSVWWEAYCLOPRJ-UHFFFAOYSA-N 5-methoxyhexanoic acid Chemical class COC(C)CCCC(O)=O VSVWWEAYCLOPRJ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XGVGAWMCWBXTMJ-UHFFFAOYSA-N CC(CC(OC)(OC)OC)(C)C.C(CC)(=O)O Chemical compound CC(CC(OC)(OC)OC)(C)C.C(CC)(=O)O XGVGAWMCWBXTMJ-UHFFFAOYSA-N 0.000 description 1
- DCAQYLULVWEFMY-UHFFFAOYSA-N COC(CCO)(C)C.COC(CCO)(C)C Chemical compound COC(CCO)(C)C.COC(CCO)(C)C DCAQYLULVWEFMY-UHFFFAOYSA-N 0.000 description 1
- DAXVZGLURHKDDB-UHFFFAOYSA-N COC(CO)C.COC(CO)C Chemical compound COC(CO)C.COC(CO)C DAXVZGLURHKDDB-UHFFFAOYSA-N 0.000 description 1
- PQMOXTJVIYEOQL-UHFFFAOYSA-N Cumarin Natural products CC(C)=CCC1=C(O)C(C(=O)C(C)CC)=C(O)C2=C1OC(=O)C=C2CCC PQMOXTJVIYEOQL-UHFFFAOYSA-N 0.000 description 1
- FSOGIJPGPZWNGO-UHFFFAOYSA-N Meomammein Natural products CCC(C)C(=O)C1=C(O)C(CC=C(C)C)=C(O)C2=C1OC(=O)C=C2CCC FSOGIJPGPZWNGO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- SEEVRZDUPHZSOX-WPWMEQJKSA-N [(e)-1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(\C)=N\OC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-WPWMEQJKSA-N 0.000 description 1
- SSOONFBDIYMPEU-UHFFFAOYSA-N [3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COCC(CO)(CO)COC(=O)C=C SSOONFBDIYMPEU-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229940024874 benzophenone Drugs 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BRDOFYPYQFDHOQ-UHFFFAOYSA-N butyl acetate;hexanoic acid Chemical compound CCCCCC(O)=O.CCCCOC(C)=O BRDOFYPYQFDHOQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000009514 concussion Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 1
- 150000004775 coumarins Chemical class 0.000 description 1
- 238000012940 design transfer Methods 0.000 description 1
- 229960004132 diethyl ether Drugs 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N n-propyl alcohol Natural products CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
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- Materials For Photolithography (AREA)
Abstract
A photosensitive resin composition comprises a photoinitiator, an alkali-soluble resin, a polymerizable monomer, an adhesion promoter, an orthoester and a solvent, wherein the adhesion promoter is a silane compound with the molecular weight of 100 to 30000.
Description
Technical field
The invention relates to a kind of photosensitive polymer combination, and relate to a kind of photosensitive polymer combination containing silane compound and ortho esters especially, use this photosensitive polymer combination to make the method for electronic component, and the electronic component obtained by the method.
Prior art
In general, the processing procedure of semiconductor integrated circuit is undertaken by following steps substantially: in substrate, form material layer; Photosensitive polymer combination is coated on this material layer; Optionally photosensitive polymer combination exposed and develop, to form mask pattern; Under the existence of mask pattern, this material layer is etched, and then by design transfer to this material layer; Finally, use stripper, unnecessary photosensitive polymer combination is removed.
Except exposure and the necessary smooth initiator of development effect, polymerisable monomer and alkali soluble resin, photosensitive polymer combination also can containing other compositions with its character of modulation, such as adherence promoter (adhesion promoter), surfactant, antioxidant, plasticiser or dyestuff etc.Adherence promoter can promotion feeling photosensitive resin composition to the adhesive ability of underlying material layer, but taken out from sealed environment by photosensitive polymer combination, when bringing into use, the effect of adherence promoter may be deteriorated gradually along with the time.To this problem, still need further to be studied and improvement.
Summary of the invention
The invention provides a kind of photosensitive polymer combination, there is excellent stability.
Photosensitive polymer combination of the present invention comprises light initiator, alkali soluble resin, polymerisable monomer, adherence promoter, ortho esters (orthoester) and solvent, and wherein adherence promoter is the silane compound of molecular weight 100 to 30000.
In one embodiment of the invention, adherence promoter is by R
1si (OR
2)
3-nr
3 nthe silane compound represented, wherein R
1for alkyl or the alkyl group with vinyl, epoxy radicals, amino (amino), (methyl) acryloxy ((meth) acryloxy), sulfydryl (mercapto), silylation or isobutenyl, R
2be respectively C
1-C
3alkyl, R
3be respectively C
1-C
3alkyl, and n is 0,1 or 2.
In one embodiment of the invention, n is 0.
In one embodiment of the invention, adherence promoter is γ-(methacryloxypropyl) propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane or γ-glycidylpropyl trimethoxy silane.
In one embodiment of the invention, ortho esters is by R
4c (OR
5)
3the compound represented, wherein R
4for hydrogen or C
1-C
3alkyl, and R
5respective is independently C
1-C
4alkyl.
In one embodiment of the invention, with the total amount of photosensitive polymer combination, the content of adherence promoter is 0.1 % by weight to 10 % by weight.
In one embodiment of the invention, with the total amount of photosensitive polymer combination, the content of ortho esters is 0.1 % by weight to 35 % by weight.
In one embodiment of the invention, with the total amount of photosensitive polymer combination, the content of light initiator is 1 % by weight to 10 % by weight, the content of alkali soluble resin is 1 % by weight to 40 % by weight, the content of polymerisable monomer is 1 % by weight to 40 % by weight, and the content of solvent is 20 % by weight to 80 % by weight.
The manufacture method of electronic component of the present invention comprises the following steps.First substrate is provided.Then in substrate, aforesaid photosensitive polymer combination is coated with.Then make to be coated on suprabasil photosensitive polymer combination light irradiate and harden.
Electronic component of the present invention is made up of the manufacture method of aforesaid electronic component.
In sum, the present invention proposes a kind of photosensitive polymer combination, uses the manufacture method of the electronic component of this photosensitive polymer combination, and by electronic component that the method obtains.Owing to containing silane compound in photosensitive polymer combination, it is promoted the adhesion of substrate, again due to further containing ortho esters, therefore can be stored in a period of time in general environment and maintain the adhesion to substrate.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below is described in detail below.
Embodiment
In this article, the scope represented by " numerical value is to another numerical value " is a kind of summary representation avoiding all numerical value enumerated in the description in this scope.Therefore, describe a certain special value scope, be equal to any number disclosed in this numerical range and the comparatively fractional value scope defined by any number in this numerical range, as expressly write out this any number in the description, comparatively fractional value scope is the same with this.Such as, record the scope of " content is 10 ~ 80% ", be just equal to the scope disclosing " content is 20% ~ 50% ", no matter whether enumerate other numerical value in instructions.
In this article, if whether do not specialize a certain group through replacing, then this group can represent the group being substituted or being unsubstituted.Such as, " alkyl " can represent the alkyl being substituted or being unsubstituted.In addition, to a certain group titled with " C
x" when describing, represent that this group has X carbon atom.
First embodiment of the present invention proposes a kind of photosensitive polymer combination, it comprises light initiator, alkali soluble resin, polymerisable monomer, adherence promoter, ortho esters (orthoester) and solvent, and wherein adherence promoter is the silane compound of molecular weight 100 to 30000.During irradiation, the light initiator in photosensitive polymer combination is stimulated and impels polymerisable monomer to start to carry out polyreaction; For example, during light initiator irradiation, may free radical be produced, and then impel polymerisable monomer to carry out Raolical polymerizable.By this, make photosensitive polymer combination be insoluble to basic solvent by the part of illumination, and be partially soluble in basic solvent by illumination, thus be able to use as photoresistance.
Light initiator can be any one optimization compound known in the art.With the total amount of photosensitive polymer combination, the content of light initiator can be 1 % by weight to 10 % by weight, be preferably 1 % by weight to 5 % by weight, the example can comprise: as 2, the compound in triazine class of 4-trichloromethyl-(4'-methoxyphenyl)-6-triazine (2,4-trichloromethyl-(4'-methoxyphenyl)-6-triazine); As acetophenone (acetophenone) compounds of 2-hydroxy-2-methyl-1-phenylpropyl alcohol alkane-1-ketone (2-hydroxy-2-methyl-1-phenylpropane-1-on); As the benzophenone compound of 4,4'-bis-(dimethylamino) benzophenone (4,4'-bis (dimethylamino) benzo-phenone); As the thioxanthones compounds of 2,4-diethyl thioxanthone (2,4-diethyl thioxanthone); As the phosphine oxide compounds of 2,4,6-trimethylbenzoyldiphenyl oxide (2,4,6-trimethylbenzoyl diphenylphosphine oxide); As 3; 3'-carbonyl vinyl-7-(diethylamide) (3; 3'-carbovinyl-7-(diethylamino)) cumarin (coumarin) compounds, and O-acyl group oxime (O-acyloxime) compounds of Irgacure OXE-01 and OXE-02 as buied from BASF AG.Can be used alone a kind of light initiator, or by used in combination for two or more smooth initiator.
Alkali soluble resin can be the binding resin containing acidic group, its structure is not particularly limited, every alkali-soluble binding resin known in the technical field of the invention all can use, its content is with the total amount of photosensitive polymer combination, between 1 % by weight to 40 % by weight, 2 % by weight to 20 % by weight can be preferably.In addition, can be used alone a kind of alkali soluble resin, also can combinationally use two or more alkali soluble resin.For example, binding resin can be acrylic resin (acrylic resin) or epoxy resin.
Polymerisable monomer can be can light initiator catalysis and start the monomer of polyreaction, its structure is not particularly limited, every polymerisable monomer known in the technical field of the invention all can use, its content is with the total amount of photosensitive polymer combination, can between 1 % by weight to 40 % by weight, and the example can comprise tri (propylene glycol) diacrylate (tripropylene glycol diacrylate, TPGDA), trimethylolpropane triacrylate (trimethylolpropane triacrylate, TMPTA), pentaerythritol triacrylate (pentaerythritol triacrylate, PETA), dipentaerythritol acrylate (dipentaerythritol hexaacrylate, DPHA), 4-methyl tetrahydro phthalic anhydride, 3, 4-epoxycyclohexyl-methyl 3, 4-epoxycyclohexyl formic ether (3, 4-epoxycyclohexylmethyl3, 4-epoxycyclohexane carboxylate), the compounds such as HMMM (hexamethoxymethylmelamine) and isophorone diisocyanate (isophoronediisocyanate).Can be used alone a kind of polymerisable monomer, also can combinationally use two or more polymerisable monomers.
Solvent can be that known any one is suitable for the solvent of the various compositions dissolving photosensitive polymer combination in the technical field of the invention, and its content, with the total amount of photosensitive polymer combination, is 20 % by weight to 80 % by weight.The example of solvent can comprise MEK (methylethylketone), methyl Cellosolve (methylcellosolve), ethyl Cellosolve (ethylcellosolve), propyl group Cellosolve (propylcellosolve), glycol dimethyl ether (ethylene glycol dimethylether), ethylene glycol diethyl ether (ethylene glycol diethylether), ethylene glycol methyl ether (ethylene glycolmethylethylether), Propylene Glycol Dimethyl Ether (propylene glycol dimethylether), propylene glycol diethyl ether (propylglycol diethylether), propylene glycol methyl ethyl ether (propylene glycolmethylethylether), 2-ethoxy propyl alcohol (2-ethoxypropanol), 2-methoxypropanol (2-methoxypropanol), 3-methoxybutanol (3-methoxybutanol), cyclopentanone (cyclopentanone), cyclohexanone (cyclohexanone), 1-Methoxy-2-propyl acetate (propyleneglycol methylether acetate, PGMEA), propylene-glycol ethyl ether acetate (propyleneglycol ethylether acetate), 3-methoxybutyl acetic acid esters (3-methoxybutylacetate), 3-ethoxyl ethyl propionate (ethoxyethylpropionate, EEP), ethyl 3-ethoxy-c acid esters (ethyl 3-ethoxy propionate), ethyl Cellosolve acetate (ethyl cellosolveacetate), methyl Cellosolve acetate (methyl cellosolve acetate), butyl acetate (butylacetate) or dipropylene glycol monomethyl ether (dipropylene glycol monomethylether).Can be used alone a kind of solvent, or combinationally use two or more solvents.
In order to strengthen the adhesive strength between photosensitive polymer combination and thing to be coated (such as, inorganic material substrate), the photosensitive polymer combination of the first embodiment is also containing the silane compound as adherence promoter.The molecular weight of silane compound is between 100 to 30000.But the adherence promoter that molecular weight is little can allow development effect better, thus silane compound preferably molecular weight be 100 ~ 1000.
Specifically, adherence promoter can be by R
1si (OR
2)
3-nr
3 nthe silane compound represented, wherein R
1for alkyl or the alkyl group with vinyl, epoxy radicals, amino, (methyl) acryloxy, sulfydryl, silylation or isobutenyl.R
2be respectively C
1-C
3alkyl, R
3be respectively C
1-C
3alkyl, and n is 0,1 or 2, that is, have-an OR in the silane compound of a part at least
2group.
In one embodiment, n is 0, that is adherence promoter is trialkoxy silane.
In one embodiment, adherence promoter is γ-(methacryloxypropyl) propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane or γ-glycidylpropyl trimethoxy silane.
If R
1have silylation, then adherence promoter is the silane compound containing plural silylation in a part.Thus, R
1can by formula-R
1' Si (OR
2)
3-nr
3 nrepresent, wherein R
1' for divalence alkyl or there is the alkyl group of vinyl, epoxy radicals, amino, (methyl) acryloxy, sulfydryl or isobutenyl, R
2, R
3with the definition of n with mentioned above.
In addition, only can use a kind of adherence promoter, also can use multiple adherence promoter in mixed mode.Such as, can R used in combination
1silane compound and the R of the alkyl be unsubstituted
1it is the silane compound of the alkyl group with vinyl, epoxy radicals, amino, (methyl) acryloxy, sulfydryl, silylation or isobutenyl.With the total amount of photosensitive polymer combination, the content of adherence promoter can be 0.1 % by weight to 10 % by weight.
In the present embodiment, adherence promoter a kind of mechanism of having an effect in photosensitive polymer combination is as follows.Be coated to after in inorganic material substrate at photosensitive polymer combination, alkoxy on part silane compound may form silanol base with the reaction of moisture in environment, and alkoxy or silanol base can react formation covalently bonded with the functional group of substrate surface and/or other silane compounds; The functional group of silane compound opposite side then forms chemical bonded refractory with other compositions (such as the composition such as binding resin or polymerisable monomer) in resin combination.Therefore, silane compound as the bridge between substrate and resin combination, can strengthen photosensitive polymer combination to the tack of inorganic material substrate.
But, inventor finds, the micro-moisture that photosensitive polymer combination can absorb the micro-moisture in air or originally be present in solvent, allow the alkoxy of silane compound be hydrolyzed and to form silanol base, the increase of silanol groups can make carry out condensation reaction between silane compound and be transformed into polymkeric substance.The polyreaction occurred during this period can consume the alkoxy on silane compound, the ability of its promotion adherence that detracts.
For this reason, inventor finds, if add ortho esters in photosensitive polymer combination, contributes to the reaction suppressing silane compound and steam, make to be coated on suprabasil photosensitive polymer combination to put for a long time and still can maintain tack, therefore the stability of promotion feeling photosensitive resin composition greatly; Or, re-use even if photosensitive polymer combination is put for a long time behind Kaifeng, also can possess preferably tack, extend the term of life of photosensitive polymer combination.
Ortho esters can be by R
4c (OR
5)
3the compound represented, wherein R
4for hydrogen or C
1-C
3alkyl, and R
5respective is independently C
1-C
4alkyl.Specifically, ortho esters can be trimethyl orthoformate (trimethylorthoformate), former propionic acid trimethyl (trimethyl orthopropionate) or tributyl orthoformate (tributyl orthoformate), and its content is with the total amount of photosensitive polymer combination, be 0.1 % by weight to 35 % by weight.
It should be noted that ortho esters is the one of deicer, but, be not in photosensitive polymer combination, add the effect that any deicer can reach improving stability.About this point, below will to test proof.
The electronic component that other embodiments of the present invention also provide a kind of manufacture method of electronic component and utilize preceding method to obtain.Previous building methods comprises the micro-shadow step using photosensitive resin combination.Specifically, first provide substrate, then in substrate, be coated with aforesaid photosensitive polymer combination, then make to be coated on suprabasil photosensitive polymer combination light and irradiate and harden.Then, development step can be carried out further photosensitive polymer combination is not removed by the part of illumination.Aforementioned substrates can comprise any materials that can use in general semiconductor element processing procedure, such as ITO substrate or molybdenum (Mo) substrate.
< tests >
Hereafter with reference to embodiment, more specifically the present invention is described.Although describe following experiment, in the situation of insurmountability scope, suitably can change material therefor, its amount and ratio, process details and treatment scheme etc.Therefore, should according to the explanation of experiment hereinafter described to restricting property of the present invention.
The photosensitive polymer combination of embodiment 1 ~ 7 and comparative example 1 ~ 3 is made, being wherein described as follows of each composition according to the ratio (percentage by weight) shown by table 1:
Alkali soluble resin: reach the acrylic acid series binding resin that emerging material manufactures, it is the polymkeric substance comprising more than three altogether blocks, and those common blocks are the structures derived from following monomer: (A-1) is containing ethylene unsaturated monomer except (A-1) of the ethylene unsaturated monomer of acidic group, (A-2) and (A-3) unsaturated monomer containing epoxy radicals;
Polymerisable monomer: the 4-methyl tetrahydro phthalic anhydride, 3 that the product UN-904 of Gen Shang company, the product Dipentaerythritol Pentaacrylate (DPHA) of Changxing chemical industry, Waterstone company produce, 4-epoxycyclohexyl-methyl 3,4-epoxycyclohexyl formic ether (3,4-epoxycyclohexylmethyl3,4-epoxycyclohexane carboxylate), HMMM (hexamethoxymethylmelamine) and isophorone diisocyanate (isophoronediisocyanate);
Levelling agent: the product F-479 of DIC company;
Light initiator: the product of BASF AG
907;
Adherence promoter: γ-(methacryloxypropyl) propyl trimethoxy silicane (gamma-methacryloxypropyltrimethoxysilane) or gamma-aminopropyl-triethoxy-silane (gamma-aminopropyltriethoxysilane) or γ-glycidylpropyl trimethoxy silane;
Solvent: the 1-Methoxy-2-propyl acetate (PGMEA) that three good fortune chemical companies produce and 3-ethoxyl ethyl propionate (ethoxyethylpropionate, EEP);
Ortho esters: trimethoxy-methane (trimethyl orthoformate), trimethoxypropane gave (trimethylorthopropionate), tributyl orthoformate (tributyl orthoformate);
Other deicers: butyl Cellosolve (butyl cellosolve) and 3-methyl-3-methoxybutanol (3-methyl-3-methoxybutanol).
Table 1
Table 2
The photosensitive polymer combination of each embodiment and each comparative example is coated in ITO substrate and Mo substrate at following three time points respectively, then carries out the test of adhesive strength:
(1) at once carry out after being coated with testing (" initially " namely in table 2);
(2) three days are left standstill, then through ultrasonic vibrating process at 25 DEG C after being coated with;
(3) 12 hours are left standstill, then through ultrasonic vibrating process at 45 DEG C after being coated with.
Described ultrasonic vibrating process uses Transonic 300H sonicator, with the frequency of 37kHz, carries out concussion 60 minutes at 50 DEG C, to test the adhesive ability of each sample under the condition comparatively worsened.
The test of adhesive strength is by grid test method(s) (cross-cut method).This is the simplest method of testing coating adhesion.With standard multi-disc cutter head (ZCC 2087 cross-cut tester that ZEHNTNER company produces), coating surface is carried out to the cross-cut of 90 degree, observe the situation of disbonding, the adhesion of coating can be learnt.Test result is also presented on table 2, and wherein " 5B ", " 4B ", " 2B ", " 1B " and " 0B " represent respectively:
5B: cut edge is smoothly complete, and coating is not peeled off completely;
4B: cuts intersect point has little chip, peels off region and is less than the total area 5%;
2B: line of cut edge, lattice have and partly or entirely peel off, and account for the total area 15 ~ 35%;
1B: line of cut edge, lattice have and partly or entirely peel off, and account for the total area 35 ~ 65%;
0B: line of cut edge, lattice have and partly or entirely peel off, and account for the total area more than 65%.
With reference to table 2, comparative example 1 does not add any deicer, and therefore its photosensitive polymer combination to be coated in substrate and again after general environment puts a period of time, will become non-constant to the tack of substrate.Comparative example 2 and comparative example 3 with the addition of other deicers, and therefore its tack does not have comparative example 1 so serious with the degree that standby time is deteriorated, and but, are still degenerated to poor " 2B " and " 1B " from just having prepared later " 5B " or " 4B ".As for the experimental example 1 ~ 7 that with the addition of ortho esters, even if its photosensitive composite is put under more severe condition within 12 hours, still possess splendid substrate adhesion, even and if the content of ortho esters significantly change, effect does not also change.
In sum, the present invention proposes a kind of photosensitive polymer combination, and uses the manufacture method of electronic component of this photosensitive polymer combination, the electronic component obtained by the method in addition.Owing to containing silane compound in photosensitive polymer combination, therefore it promotes to some extent to the adhesion of substrate, again owing to containing ortho esters further, therefore photosensitive polymer combination can be stored in general environment a period of time, and maintains the adhesion to substrate.So, elasticity during application can be increased.
Although explain as above the present invention with embodiment, but it is also not used to limit the present invention.Have in any art and usually know the knowledgeable, not departing from the prerequisite of the spirit and scope of the present invention, when doing a little change and retouching.Therefore the protection domain of subject application is when being as the criterion with the claim person of defining.
Claims (10)
1. a photosensitive polymer combination, comprising:
Light initiator;
Alkali soluble resin;
Polymerisable monomer;
Adherence promoter, it is the silane compound of molecular weight 100 to 30000;
Ortho esters; And
Solvent.
2. photosensitive polymer combination as claimed in claim 1, this adherence promoter is by R
1si (OR
2)
3-nr
3 nthe silane compound represented, wherein
R
1for alkyl or the alkyl group with vinyl, epoxy radicals, amino, (methyl) acryloxy, sulfydryl, silylation or isobutenyl,
R
2be respectively C
1-C
3alkyl,
R
3be respectively C
1-C
3alkyl, and
N is 0,1 or 2.
3. photosensitive polymer combination as claimed in claim 2, wherein n is 0.
4. photosensitive polymer combination as claimed in claim 1, wherein this adherence promoter is γ-(methacryloxypropyl) propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane or γ-glycidylpropyl trimethoxy silane.
5. photosensitive polymer combination as claimed in claim 1, wherein this ortho esters is by R
4c (OR
5)
3the compound represented, wherein R
4for hydrogen or C
1-C
3alkyl, and R
5respective is independently C
1-C
4alkyl.
6. photosensitive polymer combination as claimed in claim 1, wherein with the total amount of this photosensitive polymer combination, the content of this adherence promoter is 0.1 % by weight to 10 % by weight.
7. photosensitive polymer combination as claimed in claim 1, wherein with the total amount of this photosensitive polymer combination, the content of this ortho esters is 0.1 % by weight to 35 % by weight.
8. photosensitive polymer combination as claimed in claim 1, wherein with the total amount of this photosensitive polymer combination, the content of this light initiator is 1 % by weight to 10 % by weight, the content of this alkali soluble resin is 1 % by weight to 40 % by weight, the content of this polymerisable monomer is 1 % by weight to 40 % by weight, and the content of this solvent is 20 % by weight to 80 % by weight.
9. a manufacture method for electronic component, comprising:
Substrate is provided;
The photosensitive polymer combination of coating according to any one of claim 1 to 8 on this substrate; And
Make to be coated on this this photosensitive polymer combination light suprabasil irradiate and harden.
10. an electronic component, is made up of the manufacture method of electronic component according to claim 9.
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|---|---|---|---|
| TW103103288A TWI495956B (en) | 2014-01-28 | 2014-01-28 | Photosensitive resin composition, electronic element and method of fabricating the same |
| TW103103288 | 2014-01-28 |
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| JP6495214B2 (en) * | 2016-09-23 | 2019-04-03 | 株式会社タムラ製作所 | Photosensitive resin composition |
| JP7330719B2 (en) * | 2019-03-01 | 2023-08-22 | 太陽ホールディングス株式会社 | Alkali developable photocurable thermosetting resin composition |
| KR20210131244A (en) * | 2020-04-23 | 2021-11-02 | 제이에스알 가부시끼가이샤 | Radiation-sensitive composition, cured film and method for forming the same, semiconductor device, display device and polymer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1825144A (en) * | 2005-02-24 | 2006-08-30 | 奇美实业股份有限公司 | Photosensitive resin composition for colour absorter |
| JP2009102505A (en) * | 2007-10-23 | 2009-05-14 | Jsr Corp | Resin composition and photosensitive resin composition containing the same |
| CN102103327A (en) * | 2009-12-22 | 2011-06-22 | 株式会社Lg化学 | Black matrix composition with high light-shielding and improved adhesion properties |
| CN102428406A (en) * | 2009-05-20 | 2012-04-25 | 旭化成电子材料株式会社 | Photosensitive resin composition |
| CN102650827A (en) * | 2011-06-08 | 2012-08-29 | 京东方科技集团股份有限公司 | Photosensitive resin composition and liquid crystal display applying same |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04368949A (en) * | 1991-06-18 | 1992-12-21 | Sumitomo Chem Co Ltd | Positive resist composition |
| JP2001083710A (en) * | 1999-09-09 | 2001-03-30 | Jsr Corp | Material for electronic parts and electronic parts obtained by curing the material |
| JP4892790B2 (en) * | 2001-03-30 | 2012-03-07 | Ｊｓｒ株式会社 | Laminated body |
| JP3752687B2 (en) * | 2002-01-24 | 2006-03-08 | Ｊｓｒ株式会社 | Radiation-sensitive composition for forming insulating film of organic EL display element, insulating film formed therefrom, and organic EL display element |
| WO2008038460A1 (en) * | 2006-09-25 | 2008-04-03 | Jsr Corporation | Photosensitive resin composition |
| JP2008185683A (en) * | 2007-01-29 | 2008-08-14 | Jsr Corp | Composition for solid state imager and method for producing microlens array |
| US7399576B1 (en) * | 2007-02-28 | 2008-07-15 | Eastman Kodak Company | Positive-working radiation-sensitive composition and elements |
| WO2008149966A1 (en) * | 2007-06-08 | 2008-12-11 | Kyowa Hakko Chemical Co., Ltd. | Positive radiation-sensitive resin composition |
| JP5315754B2 (en) * | 2008-03-31 | 2013-10-16 | Ｊｓｒ株式会社 | Radiation sensitive resin composition |
| JP5285376B2 (en) * | 2008-09-30 | 2013-09-11 | 太平洋マテリアル株式会社 | High-flowing mortar whitening inhibitor and high-flowing mortar |
| TWI521300B (en) * | 2008-11-18 | 2016-02-11 | Sumitomo Chemical Co | Photosensitive resin composition and display device |
| JP6048670B2 (en) * | 2013-03-27 | 2016-12-21 | Jsr株式会社 | Radiation sensitive resin composition |
| JP6248561B2 (en) * | 2013-11-14 | 2017-12-20 | 日本ゼオン株式会社 | Radiation sensitive resin composition and laminate |
-
2014
- 2014-01-28 TW TW103103288A patent/TWI495956B/en not_active IP Right Cessation
-
2015
- 2015-01-20 JP JP2015008591A patent/JP2015141414A/en active Pending
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1825144A (en) * | 2005-02-24 | 2006-08-30 | 奇美实业股份有限公司 | Photosensitive resin composition for colour absorter |
| JP2009102505A (en) * | 2007-10-23 | 2009-05-14 | Jsr Corp | Resin composition and photosensitive resin composition containing the same |
| CN102428406A (en) * | 2009-05-20 | 2012-04-25 | 旭化成电子材料株式会社 | Photosensitive resin composition |
| CN102103327A (en) * | 2009-12-22 | 2011-06-22 | 株式会社Lg化学 | Black matrix composition with high light-shielding and improved adhesion properties |
| CN102650827A (en) * | 2011-06-08 | 2012-08-29 | 京东方科技集团股份有限公司 | Photosensitive resin composition and liquid crystal display applying same |
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