CN104795365B - Fingerprint recognition module package structure and fingerprint identification device - Google Patents
Fingerprint recognition module package structure and fingerprint identification device Download PDFInfo
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- CN104795365B CN104795365B CN201510190402.7A CN201510190402A CN104795365B CN 104795365 B CN104795365 B CN 104795365B CN 201510190402 A CN201510190402 A CN 201510190402A CN 104795365 B CN104795365 B CN 104795365B
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Abstract
A kind of fingerprint recognition module package structure and fingerprint identification device, including：Including chip, substrate and basic ring；Chip includes the first mating surface of top surface, bottom surface and connection top surface and bottom surface；The bottom surface of chip is connected with substrate by conductive material；The face that substrate is connected with chip includes the second mating surface；First mating surface or/and the second mating surface have multiple faces；Basic ring has the multiple faces being engaged with the first mating surface and the second mating surface；Second mating surface of the first mating surface and substrate that basic ring passes through glue and chip coordinates.The first mating surface or/and the second mating surface of above-mentioned fingerprint recognition module package structure have multiple faces, basic ring has multiple faces for being engaged with the first mating surface and the second mating surface, and the second mating surface of basic ring the first mating surface and substrate that pass through glue and chip coordinates.Therefore, when by glue by basic ring and chip and substrate connection, the risk of glue spilling can effectively be reduced, it is to avoid because glue overflows and influences outward appearance.
Description
Technical field
The present invention relates to fingerprint recognition module packaging field, more particularly to a kind of fingerprint recognition module package structure and comprising
The fingerprint identification device of fingerprint recognition module.
Background technology
Fingerprint recognition system is a typical PRS, including fingerprint image is obtained, processing, feature extraction and
Compare peer modules.The technology of fingerprint recognition is widely used, such as gate inhibition, attendance checking system, notebook computer, mobile phone, automobile, bank's branch
Pay all can employing fingerprint identification technology.Fig. 1 is refer to, traditional fingerprint recognition module package structure includes chip 110, substrate
120 and basic ring 130.Chip 110 is connected with substrate 120, and basic ring 130 is connected by glue 140 with substrate 120；Basic ring 130 has
The first plane 131 being connected with substrate 120 and the second plane 133 being connected with the side of chip 110；Such fingerprint recognition mould
There is following technical problem in group encapsulating structure：
Basic ring is smaller by glue and substrate bonding area, under external force, and basic ring and substrate bonding power are inadequate and easy
Relatively come off；
Glue 140 is easily between the first plane 131 and the side of chip 110 and between the second plane 133 and substrate 120
Overflow, influence fingerprint recognition module outward appearance.
The content of the invention
Based on this, it is necessary to which providing the problem of for influence fingerprint recognition module outward appearance a kind of can effectively prevent excessive glue
Fingerprint recognition module package structure and fingerprint identification device.
A kind of fingerprint recognition module package structure, including：Chip, substrate and basic ring；The chip is arranged at the substrate
On, and the chip includes top surface, bottom surface and the first mating surface for connecting the top surface and the bottom surface；The bottom surface is towards simultaneously
Fit the substrate；The substrate includes the joint face connected with the bottom surface of the chip and adjacent with the joint face
Second mating surface；First mating surface or/and second mating surface have multiple faces；The basic ring has and described first
Multiple faces that mating surface or/and second mating surface are engaged；The basic ring passes through glue and described the first of the chip
Mating surface or/and the bonding of second mating surface of the substrate.
In one of the embodiments, the chip is fingerprint Identification sensor；The substrate is FPC circuit boards or PCB
Circuit board；The chip is connected with the substrate by conductive material.
In one of the embodiments, the glue is arranged on the first mating surface or/and the second mating surface and top surface not phase
Adjacent position.
In one of the embodiments, first mating surface includes the first face being connected with the top surface and the bottom
Second face of face connection and the 3rd face being connected with first face of first mating surface；The top surface, described first are matched somebody with somebody
Conjunction face and the bottom surface form multistage stairstepping；The basic ring be in and first mating surface or/and second mating surface
What is be engaged is multistage stepped.
In one of the embodiments, the glue is arranged at the first mating surface of chip and the second mating surface of substrate connects
The junction connect；Or the junction in second face and the 3rd face.
In one of the embodiments, first mating surface also include the fourth face that is connected with second face and with institute
State the 5th face of the 3rd face connection.
In one of the embodiments, the glue is arranged at the first mating surface of chip and the second mating surface of substrate connects
The junction connect；Or/and second face and the junction of the fourth face；Or/and the fourth face and the 5th face
Junction；Or/and the junction in the 3rd face and the 5th face.
In one of the embodiments, the substrate is also including the basal plane relative with the joint face and connection described second
Mating surface and the side of the basal plane；Second mating surface includes the first face being connected with the joint face and the side
Second face of connection and the 3rd face being connected with first face of second mating surface；The joint face, described second are matched somebody with somebody
Conjunction face and the side form multistage stairstepping.
In one of the embodiments, the glue is arranged on the junction in first face and second face；Or/and
The joint face and the junction in second face.
In one of the embodiments, one end that the basic ring and first mating surface coordinate protrude from the top surface or
One end that basic ring described in person coordinates with first mating surface is flushed with the top surface.
A kind of fingerprint identification device, including：Display element, chip, substrate and basic ring；The chip is arranged at the substrate
On, and the chip includes top surface, bottom surface and the first mating surface for connecting the top surface and the bottom surface；The bottom surface is towards simultaneously
Fit the substrate；The substrate includes the joint face connected with the bottom surface of the chip and adjacent with the joint face
Second mating surface；First mating surface or/and second mating surface have multiple faces；The basic ring has and described first
Multiple faces that mating surface or/and second mating surface are engaged；The basic ring passes through glue and described the first of the chip
Mating surface or/and the bonding of second mating surface of the substrate.
The first mating surface or/and the second mating surface of above-mentioned fingerprint recognition module package structure and fingerprint identification device have
Multiple faces, basic ring has multiple faces for being engaged with the first mating surface and the second mating surface, and basic ring passes through glue and chip
First mating surface and the second mating surface of substrate coordinate.Therefore, by glue by basic ring and when chip and substrate connection, can be with
The risk that effectively reduction glue overflows, it is to avoid because glue overflows and influences outward appearance.It is also possible to avoid the top surface of chip from meeting with
Polluted by glue is overflowed.
Brief description of the drawings
Fig. 1 is the structural representation of traditional fingerprint recognition module package structure；
Fig. 2 is a kind of structural representation of the fingerprint identification device of embodiment in the present invention；
Fig. 3 for Fig. 2 fingerprint identification device fingerprint recognition module package structure first embodiment a-a to section
Structural representation；
Fig. 4 for Fig. 2 fingerprint identification device fingerprint recognition module package structure second embodiment a-a to section
The partial enlarged drawing of structural representation；
Fig. 5 for Fig. 2 fingerprint identification device fingerprint recognition module package structure 3rd embodiment a-a to section
The partial enlarged drawing of structural representation.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the preferred embodiment of the present invention.But, the present invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more saturating
It is thorough comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
As shown in Fig. 2 the present invention provides a kind of fingerprint identification device of embodiment, including display element 500 and fingerprint
Recognize module package structure.
Specifically, please refer to Fig. 3, fingerprint identification device, including display element 500, chip 210, substrate 220, base
Ring 230.Chip 210 is arranged on substrate 220, and chip 210 includes top surface 211, the bottom surface 213 relative with top surface 211 and connected
It is connected to the first mating surface 215 of top surface 211 and bottom surface 213.Bottom surface 213 towards and adhesive substrates 220.Substrate 220 includes and core
Joint face 223 and second mating surface 225 adjacent with joint face 223 that the bottom surface 213 of piece 210 is connected.First mating surface 215
Or/and second mating surface 225 have multiple faces.Basic ring 230 has to match with the first mating surface 215 or/and the second mating surface 225
The multiple faces closed.The first mating surface 215 or/and the second mating surface of substrate 220 that basic ring 230 passes through glue 240 and chip 210
225 bondings.
In other embodiments, the structure of fingerprint identification device is corresponding with following fingerprint recognition module package structures.
As shown in figure 3, the fingerprint recognition module package structure of first embodiment of the invention, including chip 210, substrate
220th, basic ring 230.Chip 210 is arranged on substrate 220, and chip 210 includes top surface 211, the bottom surface relative with top surface 211
213 and it is connected to the first mating surface 215 of top surface 211 and bottom surface 213.Bottom surface 213 towards and adhesive substrates 220.Substrate 220 is wrapped
Include the joint face 223 being connected with the bottom surface 213 of chip 210 and second mating surface 225 adjacent with joint face 223.First coordinates
The mating surface 225 of face 215 or/and second has multiple faces.Basic ring 230 has and the first mating surface 215 or/and the second mating surface
The 225 multiple faces being engaged.Basic ring 230 pass through glue 240 and chip 210 the first mating surface 215 or/and substrate 220 the
Two mating surfaces 225 are bonded.
Because the first mating surface 215 or/and the second mating surface 225 have multiple faces, basic ring 230 has and the first mating surface
215 or/and the second multiple face that is engaged of mating surface 225, basic ring 230 is connected with chip 210 or substrate 220 with glue 240
When together, glue 240 can be arranged on to the first mating surface 215 or/and the second mating surface 225 and top surface 211 is non-conterminous
Position, glue 240 will not flow to the top surface 211 of chip 210, so that the risk that effectively reduction glue 240 overflows, it is to avoid due to glue
Water 240 overflows and influences outward appearance.It is also possible to avoid the top surface 211 of chip 210 from being polluted by glue 240 is overflowed.
Specifically, chip 210 is specially fingerprint Identification sensor.Fingerprint Identification sensor is used to catch fingerprint signal.Top
Face 11 is the one side that fingerprint Identification sensor senses fingerprint.
Substrate 220 is circuit board, and the circuit of the circuit of chip 210 and equipment (such as mobile phone) mainboard is connected.Specifically
Can be FPC circuit boards or PCB.
Chip 210 is connected with substrate 220 by conductive material (such as tin cream, conductive adhesive film conductive material).Further,
Fingerprint Identification sensor is connected by tin cream or conductive adhesive film (ACF) with circuit board.
One end that the mating surface 215 of basic ring 230 and first coordinates protrudes from top surface 211.In this way, basic ring 230 can also be used to determine
The placement location of position finger.When carrying out fingerprint collecting, because basic ring 230 protrudes from top surface 211, therefore can be according to basic ring 230
Salient position, place finger, play a part of positioning.
It is to be appreciated that basic ring 230 could be arranged to flush with top surface 211 with one end that the first mating surface 215 coordinates.Such as
This, makes basic ring 230 appear more like an entirety with chip 210.
In the present embodiment, the first mating surface 215 includes being connected with top surface 211 the first face 215a, it is connected with bottom surface 213
The second face 215b and the first face 215a and the second face 215b of the first mating surface 215 with the first mating surface 215 be connected
Three face 215c.Specifically, top surface 211, the first mating surface 215 and bottom surface 213 form second order stairstepping.Second mating surface 225
For plane.Basic ring 230 is multistage stepped in what is be engaged with the first mating surface 215 or/and the second mating surface 225.Glue 240 is set
It is placed in the junction that the first mating surface 215 of chip 210 is connected with the second mating surface 225 of substrate 220.In this way, due to chip
210 the first mating surface 215 has certain altitude and provided with second order ladder, can effectively prevent from being arranged at chip 210 in substrate
The glue 240 of 220 junction overflows at top surface 211 and influences outward appearance；Meanwhile, the top surface 211 of chip 210 can be avoided to meet with
Polluted by glue 240 is overflowed.
In other embodiments, the first mating surface 215 or/and the second mating surface 225 can be arranged as required into different
Multiple faces, such as curved surface, S faces, sawtooth wavy surface.Glue 240 may also be disposed on the second face 215b and the 3rd face 215c handing-over
Place.Glue 240 is preferably disposed on the junction that chip 210 is connected with substrate 220, in this way, glue 240 is bonded basic ring 230 simultaneously
With substrate 220 and chip 210, the steadiness of basic ring 230 can be increased, it is difficult for drop-off.
As shown in figure 4, there is provided a kind of fingerprint recognition module package structure for the second embodiment of the present invention.The fingerprint recognition
Module package structure is roughly the same with above-mentioned fingerprint recognition module package structure, including chip 310, substrate 320, basic ring 330.Core
Piece 310 is arranged on substrate 320, and chip 310 includes the first of top surface 311, bottom surface 313 and connection top surface 311 and bottom surface 313
Mating surface 315.Bottom surface 313 towards and adhesive substrates 320.Substrate 320 includes the joint face being connected with the bottom surface 313 of chip 310
323 and second mating surface 325 adjacent with joint face 323.The first mating surface that basic ring 330 passes through glue 340 and chip 310
315 or/and the second mating surface 325 of substrate 320 bond.
The difference of the present embodiment and first embodiment is, the first mating surface 315 include being connected with top surface 311 the
Simultaneously 315a, the second face 315b being connected with bottom surface 313.First mating surface 315 also includes the first face with the first mating surface 315
3rd face 315c of 315a connections, with the second face 315b of the first mating surface 315 fourth face 315d being connected and with first coordinate
The 3rd face 315c in face 315 and the 5th face e of the fourth face 315d connections of the first mating surface 315.Second mating surface 325 is in plane
Shape.Specifically, top surface 311, the first mating surface 315 and bottom surface 313 form three rank stairsteppings.Basic ring 330 is in coordinate with first
It is multistage stepped that the mating surface 325 of face 315 or/and second is engaged.Glue 340 is arranged at the first mating surface 315 of chip 210
The junction being connected with the second mating surface 325 of substrate 220.In this way, glue 340 will spill into the of top surface 311 or substrate 320
Outside two mating surfaces 325, it is required for by two turnings, therefore can effectively prevents excessive glue, while influences attractive in appearance, it is to avoid excessive glue
Pollute top surface 311.
In the present embodiment, the height of each rank ladder of three rank ladders of the first mating surface 315 may be configured as identical height,
To increase aesthetic feeling.It is to be appreciated that in other embodiments, the height of ladder could be arranged to different height.Glue 340 can be with
Be arranged on the second face 315b and fourth face 315d junction, or/and fourth face 315d and the 5th face 315e junction, or/
With the 3rd face 315c and the 5th face 315e junction, as long as glue 340 with the non-conterminous position of top surface 311.Certainly,
Glue is preferably disposed on the junction that the first mating surface 315 of chip 310 is connected with the second mating surface 325 of substrate 320, i.e., originally
Fourth face 315d and the 5th face 315e junction in embodiment.In this way, glue 340 be bonded simultaneously basic ring 330 and substrate 320 and
Chip 310, can increase the steadiness of basic ring 330, make its difficult for drop-off.
As shown in figure 5, there is provided a kind of fingerprint recognition module package structure for the third embodiment of the present invention.The fingerprint recognition
Module package structure is roughly the same with above-mentioned fingerprint recognition module package structure, including chip 410, substrate 420, basic ring 430.Core
Piece 410 is arranged on substrate 420, and chip 410 includes the first of top surface 411, bottom surface 413 and connection top surface 411 and bottom surface 413
Mating surface 415.Substrate 420 includes the joint face 423 and adjacent with joint face 423 second being connected with the bottom surface 413 of chip 410
Mating surface 425.The first mating surface 415 or/and the second mating surface of substrate 420 that basic ring 430 passes through glue 440 and chip 410
425 bondings.Wherein, substrate 420 also including the basal plane 427 relative with joint face 423 and is connected the second mating surface 425 and basal plane
427 side 429.
The difference of the present embodiment and first embodiment is that the first mating surface 415 is in plane.Second mating surface
425 the first face 425a for including be connected with joint face 423, with 429 the second face 425b for being connected sideways and with the second mating surface 425
The first face 425a and the second mating surface 425 the second face 425b connections the 3rd face 425c.Specifically, joint face 423, second
Mating surface 425 and side 429 form second order stairstepping.Basic ring 430 be in and the first mating surface 415 or/and the second mating surface 425
What is be engaged is multistage stepped.Glue 440 is arranged at the corner away from the two ends of basic ring 430, i.e., first in the second mating surface 425
Face 425a and the second face 415b junction.In this way, glue 440 will spill into the second mating surface of top surface 411 or substrate 420
Outside 425, it is required for by a turning, therefore can effectively prevents excessive glue, while influences attractive in appearance, it is to avoid excessive glue pollution top surface
411.It is appreciated that glue 440 can also be provided at the face 415b of joint face 423 and second junction.
Further, in the present embodiment, the second order ladder height of the second mating surface 425 is different.Further, it is close
The single order height of the end points of basic ring 430 is higher, makes glue 440 too near close to the end points of substrate 420 apart from basic ring 430, and makes
Glue easily overflows from the end of substrate 420.
It is to be appreciated that in other embodiments, can form multistage in top surface 411, the first mating surface 415 and bottom surface 413
While stairstepping, joint face 423, the second mating surface 425 and side 429 also form multistage stairstepping.
Above example only expresses the several embodiments of the present invention, and it describes more specific and detailed, but can not
Therefore it is interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art,
Without departing from the inventive concept of the premise, multiple modification and improvement can also be made, these belong to the protection model of the present invention
Enclose.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
1. a kind of fingerprint recognition module package structure, it is characterised in that including：
Chip, substrate and basic ring；The chip is arranged on the substrate, and the chip includes top surface, bottom surface and connection institute
State the first mating surface of top surface and the bottom surface；The bottom surface direction and the substrate of fitting；The substrate includes and the core
The joint face and second mating surface adjacent with the joint face of the bottom surface connection of piece；First mating surface or/and institute
Stating the second mating surface has multiple faces；The basic ring is more with what is be engaged with first mating surface and second mating surface
Individual face；First mating surface or/and second mating surface of the substrate that the basic ring passes through glue and the chip
Bonding；The glue is arranged at the corner away from the basic ring two ends, described away from be at least to pass through a turning ability
Reach；The turning be first mating surface or/and the second mating surface multiple faces in face and face junction.
2. fingerprint recognition module package structure according to claim 1, it is characterised in that first mating surface include with
First face of top surface connection, the second face being connected with the bottom surface and it is connected with first face of first mating surface
The 3rd face；The top surface, first mating surface and the bottom surface form multistage stairstepping；The basic ring is in and described the
It is multistage stepped that one mating surface or/and second mating surface are engaged.
3. fingerprint recognition module package structure according to claim 2, it is characterised in that the glue is arranged at chip
First mating surface and the junction of the second mating surface of substrate connection；Or the junction in second face and the 3rd face.
4. fingerprint recognition module package structure according to claim 2, it is characterised in that first mating surface also includes
The fourth face being connected with second face and the 5th face being connected with the 3rd face.
5. fingerprint recognition module package structure according to claim 4, it is characterised in that the glue is arranged at chip
First mating surface and the junction of the second mating surface of substrate connection；Or/and second face and the junction of the fourth face；
Or/and the junction in the fourth face and the 5th face；Or/and the junction in the 3rd face and the 5th face.
6. fingerprint recognition module package structure according to claim 1, it is characterised in that the substrate also include with it is described
The relative basal plane of joint face and connection second mating surface and the side of the basal plane；Second mating surface include with it is described
First face of joint face connection, the second face for being connected with the side and it is connected with first face of second mating surface
3rd face；The joint face, second mating surface and the side form multistage stairstepping.
7. fingerprint recognition module package structure according to claim 6, it is characterised in that the glue is arranged on described
Simultaneously with the junction in second face；Or/and the joint face and the junction in second face.
8. fingerprint recognition module package structure according to claim 1, it is characterised in that the basic ring is matched somebody with somebody with described first
One end that conjunction face coordinates protrudes from one end and the top surface that the top surface or the basic ring coordinate with first mating surface
Flush.
9. a kind of fingerprint identification device, it is characterised in that including：Display element, chip, substrate and basic ring；The chip is set
In on the substrate, and the chip includes top surface, bottom surface and the first mating surface for connecting the top surface and the bottom surface；It is described
Bottom surface direction and the substrate of fitting；The substrate include the joint face that is connected with the bottom surface of the chip and with the company
The second adjacent mating surface of junction；First mating surface or/and second mating surface have multiple faces；The basic ring has
The multiple faces being engaged with first mating surface and second mating surface；The institute that the basic ring passes through glue and the chip
State second mating surface bonding of the first mating surface or/and the substrate；The glue is arranged at away from the basic ring two ends
Corner, it is described away from being at least to be got to by a turning；The turning is first mating surface or/and the
The junction in face and face in multiple faces of two mating surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510190402.7A CN104795365B (en) | 2015-04-21 | 2015-04-21 | Fingerprint recognition module package structure and fingerprint identification device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510190402.7A CN104795365B (en) | 2015-04-21 | 2015-04-21 | Fingerprint recognition module package structure and fingerprint identification device |
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| Publication Number | Publication Date |
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| CN104795365A CN104795365A (en) | 2015-07-22 |
| CN104795365B true CN104795365B (en) | 2017-10-27 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105262860B (en) * | 2015-09-02 | 2018-06-29 | 广东欧珀移动通信有限公司 | The manufacturing method and mobile phone of a kind of glass assembly |
| CN105867547A (en) * | 2016-04-21 | 2016-08-17 | 南昌欧菲生物识别技术有限公司 | Fingerprint module and electronic device |
| CN108156278B (en) * | 2016-08-16 | 2019-10-15 | Oppo广东移动通信有限公司 | Fingerprint chip packaging device and terminal |
| US10565426B2 (en) | 2016-08-16 | 2020-02-18 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint chip package structure, input assembly and terminal |
| CN106650702A (en) * | 2017-01-05 | 2017-05-10 | 深圳市深越光电技术有限公司 | Processing method for fingerprint identification apparatus, and fingerprint identification apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201563113U (en) * | 2009-07-27 | 2010-08-25 | 天马微电子股份有限公司 | Touch device |
| CN103246038A (en) * | 2012-02-01 | 2013-08-14 | 信利光电(汕尾)有限公司 | Camera lens base and camera module |
| CN103345035A (en) * | 2013-07-12 | 2013-10-09 | 南昌欧菲光电技术有限公司 | Image module |
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2015
- 2015-04-21 CN CN201510190402.7A patent/CN104795365B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201563113U (en) * | 2009-07-27 | 2010-08-25 | 天马微电子股份有限公司 | Touch device |
| CN103246038A (en) * | 2012-02-01 | 2013-08-14 | 信利光电(汕尾)有限公司 | Camera lens base and camera module |
| CN103345035A (en) * | 2013-07-12 | 2013-10-09 | 南昌欧菲光电技术有限公司 | Image module |
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