CN104795110B - A kind of test device of memory module - Google Patents
A kind of test device of memory module Download PDFInfo
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- CN104795110B CN104795110B CN201510184399.8A CN201510184399A CN104795110B CN 104795110 B CN104795110 B CN 104795110B CN 201510184399 A CN201510184399 A CN 201510184399A CN 104795110 B CN104795110 B CN 104795110B
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- supporting plate
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Abstract
The present invention provides a kind of test device of memory module, including testing jig body, first supporting plate, second supporting plate, 3rd supporting plate, upper plate lid, lower plate lid and fixing device, testing jig body includes printed circuit board (PCB), connection-peg and connector, first, second supporting plate is stacked and placed on printed circuit board (PCB), first, first is respectively equipped with second supporting plate, two openings, first, second opening is stacked to form the 3rd opening, connector, which is placed in the 3rd opening, forms test mouth, 3rd supporting plate is placed in printed circuit board (PCB) bottom, 3rd supporting plate is provided with the 4th opening for being available for connection-peg to stretch out, upper plate lid is stacked and placed on the second supporting plate, lower plate lid is stacked and placed on the 3rd supporting plate bottom, the material of above-mentioned each plate is the epoxy resin of FR 4；Second opening inner side of the second supporting plate is provided with a block for being used to abut memory module to be tested.The memory module test device of the shape design has high temperature resistant, anti abrasive characteristic and possesses preferable compatibility.
Description
Technical field
The present invention relates to a kind of test device, more particularly to a kind of test device of memory module.
Background technology
(UDP modules are referred to being developed by Shenzhen Jiangbolong Electronic Co., Ltd. oneself and opened for memory module, such as UDP modules
Hair the USB storage dishes based on COB packaging technologies), multi-functional memory module (refer to Application No.：201220371432.X it is public
A kind of multi-functional memory module opened), it will typically carry out testing it ensuring it with the presence or absence of life after the completion of production
Production is bad.
In the prior art, test is generally carried out to the memory module is carried out by special test device, will
Test interface set in advance is carried out in the memory module insertion test device.But, existing test device is generally all deposited
In following drawback：First, the material of test device, such as common plastic cement do not possess resistant to elevated temperatures characteristic, so as to can not meet described
High temperature resistant demand of the memory module when carrying out burn-in test；Second, by same test device needs to be used for multiple institutes
State memory module to be tested, so often test a memory module, be required for that test device is carried out individually once to plug
Operation, i.e., when need to test multiple memory modules, repeatedly plug will be carried out to test interface and is operated, over time, will certainly be easily
To test interface cause damage；3rd, the size of the test interface of test device is all often fixed to be directed to a certain model
Memory module tested, it is impossible to while compatible more memory modules are tested, use dumb.
The content of the invention
It is an object of the invention to provide a kind of test device of memory module, it is desirable to provide a kind of more rational storage mould
Block test device structural design scheme so that memory module test device has high temperature resistant, anti abrasive characteristic and possessed preferably
Compatibility.
A kind of test device for memory module that the present invention is provided, including testing jig body, the first supporting plate, the second support
Plate, the 3rd supporting plate, upper plate lid, lower plate lid and the fixing device by the integration connection of each component, the testing jig body
Including printed circuit board (PCB), the company that is electrically connected to the connection-peg of the printed circuit board (PCB) side and is placed on the printed circuit board (PCB)
Connect device, first supporting plate and second supporting plate are sequentially stacked on the printed circuit board (PCB) from the bottom to top, described the
One supporting plate is with being respectively equipped with the first opening and the second opening, first opening and institute on the second supporting plate correspondence position
State that the second opening is stacked to form the 3rd opening, the connector, which is placed in be formed in the 3rd opening, is available for memory module to be tested
The test mouthful of insertion, the 3rd supporting plate is placed in the printed circuit board (PCB) bottom, and the 3rd supporting plate is provided with and is available for institute
The 4th opening of connection-peg stretching is stated, the upper plate lid is stacked and placed on second supporting plate, and the lower plate lid is stacked and placed on institute
State the 3rd supporting plate bottom, it is characterised in that：First supporting plate, the second supporting plate, the 3rd supporting plate, upper plate lid and under
The material of plate lid is FR-4 epoxy resin；It is to be tested for abutting that second opening inner side of second supporting plate is provided with one
The block of memory module.
Alternatively, first supporting plate is at least two pieces, and each first supporting plate is sequentially stacked, and each described first
First opening correspondence of supporting plate is stacked.
Alternatively, first opening and the described second opening are located at first supporting plate and described second respectively
The edge of fagging, and be in semiclosed shape.
Alternatively, it is additionally provided with solder terminal, first supporting plate and is additionally provided with for housing on the printed circuit board (PCB)
The utensil receiving opening of the solder terminal.
Alternatively, the utensil receiving opening is in closed, its rectangular cross-section, circular or abnormity.
Alternatively, the 3rd supporting plate is at least two pieces, and each 3rd supporting plate is sequentially stacked, and each described 3rd
4th opening correspondence of supporting plate is stacked.
Alternatively, the 4th opening is located at the edge of the 3rd supporting plate, and in semiclosed shape.
Alternatively, metal clips group is provided with the connector, the metal clips group includes meeting standard USB2.0
Metal contact piece group is provided with four metal clips of interface protocol, the connection-peg, the metal contact piece group includes meeting mark
Four metal contact pieces of quasi- USB2.0 interface protocols, four metal clips are corresponded with four metal contact pieces and are electrically connected
Connect.
The first supporting plate, the second supporting plate, the 3rd supporting plate, upper plate lid are made in the present invention using FR-4 epoxy resin
And lower plate lid, using FR-4 epoxy resin higher mechanical performance and dielectric properties, preferable heat resistance and moisture resistivity and good
Good machining property, when making test device need resistant to elevated temperatures property requirements when disclosure satisfy that progress burn-in test；Second
The block that opening inner side is set, makes test device be provided simultaneously with anti abrasive characteristic.
Brief description of the drawings
Fig. 1 is the dimensional structure diagram of memory module test device in present pre-ferred embodiments；
Fig. 2 is the exploded perspective figure of memory module test device in present pre-ferred embodiments；
100- test devices；110- testing jig bodies；111- printed circuit board (PCB)s；112- connection-pegs；
113- connectors；114- metal clips groups；The supporting plates of 120- first；121- first is open；
122- utensil receiving openings；The supporting plates of 130- second；131- second is open；132- blocks；
The supporting plates of 140- the 3rd；141- the 4th is open；150- upper plate lids；160- lower plate lids；
170- fixing devices；171- screws；172- nuts；180- the 3rd is open.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it may be simultaneously present centering elements.When an element is referred to as " being connected to " another element, it can be with
It is directly to another element or may be simultaneously present centering elements.
It should also be noted that, the orientation term such as left and right, upper and lower in the present embodiment, be only each other relative concept or
Using the normal operating condition of product as reference, and it should not be regarded as restrictive.
Reference picture 1, Fig. 2, the test device 100 of memory module provided in an embodiment of the present invention, including testing jig body
110th, the first supporting plate 120, the second supporting plate 130, the 3rd supporting plate 140, upper plate lid 150, lower plate lid 160 and by each group
The fixing device 170 of part integration connection.Testing jig body 110 includes printed circuit board (PCB) 111, is electrically connected to printed circuit board (PCB)
The connection-peg 112 of 111 sides and the connector 113 being placed on printed circuit board (PCB) 111.First supporting plate 120 and the second support
Plate 130 is sequentially stacked on printed circuit board (PCB) 111 from the bottom to top, in the first supporting plate 120 and the correspondence position of the second supporting plate 130
The first opening 121 and the second opening 131, the first opening 121 and the stacked opening of formation the 3rd 180 of the second opening 131 are respectively equipped with,
Connector 113 is placed in the test mouthful for being formed in the 3rd opening 180 and being available for memory module insertion to be tested, and the 3rd supporting plate 140 is put
In the bottom of printed circuit board (PCB) 111, the 3rd supporting plate 140 is provided with the 4th opening 141 for being available for connection-peg 112 to stretch out, upper plate lid
150 are stacked and placed on the second supporting plate 130, and lower plate lid 160 is stacked and placed on the bottom of the 3rd supporting plate 140.In the present embodiment, first
Fagging 120, the second supporting plate 130, the 3rd supporting plate 140, the material of upper plate lid 150 and lower plate lid 160 are FR-4 epoxies
Resin；And the inner side of the second opening 131 of the second supporting plate 130 is provided with a block 132 for being used to abut memory module to be tested.
FR-4 epoxy resin is soaked with plate of the materials such as epoxy phenolics through HTHP hot pressing by special electronic cloth
Shape laminated product, with higher mechanical performance and dielectric properties, preferable heat resistance and moisture resistivity, and there is good machinery to add
Work, use this material make the first supporting plate 120, the second supporting plate 130, the 3rd supporting plate 140, upper plate lid 150 with
And lower plate lid 160, when test device 100 is needed resistant to elevated temperatures property requirements when disclosure satisfy that progress burn-in test；Second
The block 132 that the inner side of opening 131 is set, makes test device 100 be provided simultaneously with anti abrasive characteristic.
Further, in the present embodiment, the first supporting plate 120 is two pieces.The structure of two first supporting plate 120 is identical.Two
One supporting plate 120 is sequentially stacked, and the correspondence of the first opening 121 of each first supporting plate 120 is stacked.In first supporting plate 120
The thickness of first 121 sizes of opening, the quantity of the first supporting plate 120 and the first supporting plate 120 can be made by oneself according to the actual requirements
Justice.
In the present embodiment, it is additionally provided with printed circuit board (PCB) 111 in solder terminal (not shown), the first supporting plate 120
It is additionally provided with the utensil receiving opening 122 for housing the solder terminal.Accordingly, the position of utensil receiving opening 122 in each first supporting plate 120
Correspondence.When two first supporting plates 120 are stacked, two utensil receiving openings 122 correspondence is stacked, and the solder terminal on printed circuit board (PCB) 111 is put
In in stacked utensil receiving opening 122.
In the present embodiment, utensil receiving opening 122 is in closed, and its rectangular cross-section, certainly, utensil receiving opening 122 can also be other
Shape, such as circular or abnormity, as long as it can be used for placing solder terminal all within the scope of the present invention.
In the present embodiment, the profile of the second supporting plate 130 is identical with the size of the first supporting plate 120, profile, the second supporting plate
130 without utensil receiving opening 122, and the first opening 121 in second the 131, first supporting plate 120 of opening in the second supporting plate 130 is distinguished
Positioned at the edge of the second supporting plate 130, the first supporting plate 120, in semiclosed shape.So, opened by the first opening 121, second
The 3rd opening 180 that mouth 131 is formed is in semiclosed shape, for memory module to be tested insertion.Likewise, the second opening 131
Size carry out self-defined setting also according to actual demand.When needing to be tested for polytype memory module
When, because different types of memory module size may be inconsistent, it is necessary to which different sizes go compatibility, therefore second opens
131 sizes of mouth are not limited herein.And block 132 is used for when the insertion of test device 100 memory module is tested
The insertion end of memory module is abutted, so insertion end not only to memory module carries out position-limiting action, while so that memory module
Insertion end it is not easy to wear.
In the present embodiment, the 3rd supporting plate 140 is also equally two pieces, and the structure of two the 3rd supporting plate 140 is identical.Two the 3rd
Fagging 140 is sequentially stacked, and the correspondence of the 4th opening 141 of each 3rd supporting plate 140 is stacked.The 4th in 3rd supporting plate 140
The thickness for 141 sizes, the quantity of the 3rd supporting plate 140 and the 3rd supporting plate 140 of being open can be self-defined according to the actual requirements.
Similarly, the 4th opening 141 also is located at the edge of the 3rd supporting plate 140, and in semiclosed shape, for connection-peg
112 stretch out.
In the present embodiment, connection-peg 112 is USB public access mouthful, and its material can be metal material or plastic cement material, herein not
It is limited.
And metal clips group 114 is set on connector 113, metal clips group 114 (is not marked including four metal clips in figure
Number), four metal clips meet standard USB2.0 interface protocols；It is corresponding, metal contact piece group is provided with connection-peg 112
(not shown), metal contact piece group includes meeting four metal contact pieces of standard USB2.0 interface protocols, four metals
Shell fragment is corresponded with four metal contact pieces and electrically connected.
In the present embodiment, upper plate lid 150 and lower plate lid 160 are ordinary flat, play sealing, protective action.Fixed dress
Putting 170 includes screw 171 and nut 172, upper plate lid 150, the support of the second supporting plate 130, first it can be seen from Fig. 1, Fig. 2
Connecting hole (herein not one by one label) is correspondingly provided with plate 120, the 3rd supporting plate 140 and lower plate lid 160, screw 171 is by right
Penetrate and fixed by nut 172 in the connecting hole answered, i.e., by upper plate lid 150, the second supporting plate 130, the first supporting plate 120,
Three supporting plates 140 and lower plate lid 160 are fixedly connected integral.Because above-mentioned each plate is quadrangular plate, therefore to ensure
Bonding strength, fixing device 170 is screw 171 and the nut 172 of group mutual cooperation of four groups, i.e., four, and four groups of fixing devices 170
Distribution is rectangular.
In summary, the test device 100 of a kind of memory module that the present invention is provided, mainly in the prior art on
The drawbacks of 100 generally existing of test device of memory module, carries out the improvement in material and in structure, in order that test device 100
When needing resistant to elevated temperatures property requirements when disclosure satisfy that progress burn-in test, carried out using FR-4 epoxy resin；In order that test
Device 100 can more flexibly be used for polytype memory module test, there is provided one can customize replacing different openings it is big
Small, dimensional thickness the second supporting plate 130, and the structure of a block 132 is additionally provided with thereon, make its tool standby anti abrasive spy simultaneously
Property.
These are only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Any modifications, equivalent substitutions and improvements made within principle etc., should be included in the scope of the protection.
Claims (8)
1. a kind of test device of memory module, including testing jig body, the first supporting plate, the second supporting plate, the 3rd supporting plate,
Upper plate lid, lower plate lid and by each component integration connection fixing device, the testing jig body include printed circuit board (PCB),
The connector for being electrically connected to the connection-peg of the printed circuit board (PCB) side and being placed on the printed circuit board (PCB), described first
Fagging and second supporting plate are sequentially stacked on the printed circuit board (PCB) from the bottom to top, first supporting plate and described the
The first opening and the second opening, first opening and the stacked shape of the described second opening are respectively equipped with two supporting plate correspondence positions
Into the 3rd opening, the connector is placed in the 3rd opening and forms the test mouthful for being available for memory module insertion to be tested, institute
State the 3rd supporting plate and be placed in the printed circuit board (PCB) bottom, the 3rd supporting plate is provided be available for the connection-peg to stretch out the
Four openings, the upper plate lid is stacked and placed on second supporting plate, and the lower plate lid is stacked and placed on the 3rd supporting plate bottom,
It is characterized in that：First supporting plate, the second supporting plate, the 3rd supporting plate, the material of upper plate lid and lower plate lid are FR-
4 epoxy resin；Second opening inner side of second supporting plate is provided with a block for being used to abut memory module to be tested.
2. the test device of memory module as claimed in claim 1, it is characterised in that：First supporting plate is at least two
Block, each first supporting plate is sequentially stacked, and the first opening correspondence of each first supporting plate is stacked.
3. the test device of memory module as claimed in claim 1 or 2, it is characterised in that：First opening and described the
Two openings are located at the edge of first supporting plate and second supporting plate respectively, and are in semiclosed shape.
4. the test device of memory module as claimed in claim 1 or 2, it is characterised in that：Also set on the printed circuit board (PCB)
There is the utensil receiving opening being additionally provided with solder terminal, first supporting plate for housing the solder terminal.
5. the test device of memory module as claimed in claim 4, it is characterised in that：The utensil receiving opening is in closed, its section
Face is rectangle, circle.
6. the test device of memory module as claimed in claim 1, it is characterised in that：3rd supporting plate is at least two
Block, each 3rd supporting plate is sequentially stacked, and the 4th opening correspondence of each 3rd supporting plate is stacked.
7. the test device of the memory module as described in claim 1 or 6, it is characterised in that：4th opening is located at described
The edge of 3rd supporting plate, and in semiclosed shape.
8. the test device of memory module as claimed in claim 1, it is characterised in that：Metal elastic is provided with the connector
Piece group, the metal clips group, which includes meeting in four metal clips of standard USB2.0 interface protocols, the connection-peg, to be set
There is metal contact piece group, the metal contact piece group includes meeting four metal contact pieces of standard USB2.0 interface protocols, described in four
Metal clips is corresponded with four metal contact pieces and electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510184399.8A CN104795110B (en) | 2015-04-17 | 2015-04-17 | A kind of test device of memory module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510184399.8A CN104795110B (en) | 2015-04-17 | 2015-04-17 | A kind of test device of memory module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104795110A CN104795110A (en) | 2015-07-22 |
| CN104795110B true CN104795110B (en) | 2017-10-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510184399.8A Active CN104795110B (en) | 2015-04-17 | 2015-04-17 | A kind of test device of memory module |
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| Country | Link |
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| CN (1) | CN104795110B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200807427A (en) * | 2006-06-13 | 2008-02-01 | Formfactor Inc | Method of designing an application specific probe card test system |
| CN201251780Y (en) * | 2008-07-18 | 2009-06-03 | 英业达科技有限公司 | Internal memory test tool |
| CN201436662U (en) * | 2009-04-03 | 2010-04-07 | 英业达科技有限公司 | Memory test device |
| US8035408B1 (en) * | 2010-12-10 | 2011-10-11 | Kingston Technology Corp. | Socket fixture for testing warped memory modules on a PC motherboard |
| CN202930044U (en) * | 2012-10-19 | 2013-05-08 | 深圳市江波龙电子有限公司 | U disk module |
-
2015
- 2015-04-17 CN CN201510184399.8A patent/CN104795110B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200807427A (en) * | 2006-06-13 | 2008-02-01 | Formfactor Inc | Method of designing an application specific probe card test system |
| CN201251780Y (en) * | 2008-07-18 | 2009-06-03 | 英业达科技有限公司 | Internal memory test tool |
| CN201436662U (en) * | 2009-04-03 | 2010-04-07 | 英业达科技有限公司 | Memory test device |
| US8035408B1 (en) * | 2010-12-10 | 2011-10-11 | Kingston Technology Corp. | Socket fixture for testing warped memory modules on a PC motherboard |
| CN202930044U (en) * | 2012-10-19 | 2013-05-08 | 深圳市江波龙电子有限公司 | U disk module |
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| Publication number | Publication date |
|---|---|
| CN104795110A (en) | 2015-07-22 |
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Address after: 518057 A, B, C, D, E, F1, 8 Building, Financial Services Technology Innovation Base, No. 8 Kefa Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen jiangbolong electronic Limited by Share Ltd Address before: 518057 A, B, C, D, E, F1, 8 Building, Financial Services Technology Innovation Base, No. 8 Kefa Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen jiangbolong Electronic Co., Ltd. |