CN104788935A - Heat-resisting resin composition - Google Patents
Heat-resisting resin composition Download PDFInfo
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- CN104788935A CN104788935A CN201510183335.6A CN201510183335A CN104788935A CN 104788935 A CN104788935 A CN 104788935A CN 201510183335 A CN201510183335 A CN 201510183335A CN 104788935 A CN104788935 A CN 104788935A
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Abstract
The invention discloses a heat-resisting resin composition, and belongs to the field of resins. The heat-resisting resin composition is prepared from the following constituents in parts by weight: 100 parts of heat-resisting resin, 5-8 parts of epoxy resin fiber, 1-5 parts of cyanate ester, 15-25 parts of bismaleimide, 5-20 parts of hindered phenol, 10-30 parts of zinc oxide, and 1-3 parts of liquid paraffin. According to the heat-resisting resin composition disclosed by the invention, based on the original heat-resisting resin, the epoxy resin fiber, cyanate ester, bismaleimide, hindered phenol and zinc oxide are added, so that the high heat resistance of the original heat-resisting resin can be maintained well, and further the good mobility can be achieved.
Description
Technical field
The invention belongs to resin art, particularly relate to a kind of heat resistant resin composition.
Background technology
Resin, according to the difference of its function, characteristic, can be divided into a variety of, and heat stable resin is one of them.The advantage of heat stable resin is that thermotolerance is high, but there is the shortcoming of poor fluidity also.Ameliorative way more is at present on the basis of original heat stable resin, add the additives such as various softening agent, fire retardant, but although adding of these additives can improve its mobility to a certain extent, but also can have influence on its thermotolerance simultaneously, cause the reduction of its resistance toheat.Therefore, good mobility can be endowed while people wish not only can well to keep the high heat resistance of original heat stable resin always.
Summary of the invention
The invention provides a kind of heat resistant resin composition, this heat resistant resin composition has high heat resistance and good mobility simultaneously.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is:
It is made up of the component of following parts by weight:
Heat stable resin 100 parts, epoxy resin fiber 5 parts ~ 8 parts, cyanate 1 part ~ 5 parts, bismaleimides 15 parts ~ 25 parts, hindered phenol 5 parts ~ 20 parts, 10 parts ~ 30 parts, zinc oxide and whiteruss 1 part ~ 3 parts;
Wherein, described heat stable resin is a kind of resin of Polyphony Ether resin, polycarbonate resin, polyethersulfone resin, polyarylate resin and polyamide-imide resin.
In technique scheme, technical scheme is more specifically: heat stable resin 100 parts, epoxy resin fiber 5 parts, cyanate 3 parts, bismaleimides 15 parts, hindered phenol 20 parts, 10 parts, zinc oxide and whiteruss 2 parts;
Further, heat stable resin 100 parts, epoxy resin fiber 8 parts, cyanate 1 part, bismaleimides 20 parts, hindered phenol 5 parts, 30 parts, zinc oxide and whiteruss 1 part;
Further, heat stable resin 100 parts, epoxy resin fiber 6 parts, cyanate 5 parts, bismaleimides 25 parts, hindered phenol 10 parts, 20 parts, zinc oxide and whiteruss 3 parts.
Owing to adopting technique scheme, the present invention has following beneficial effect:
The present invention is by the basis of original heat stable resin, add epoxy resin fiber, cyanate, bismaleimides, hindered phenol and zinc oxide, thus good mobility can be endowed while not only can well having kept the high heat resistance of original heat stable resin.
Embodiment
Below in conjunction with specific examples, the invention will be further described:
Embodiment 1
This heat resistant resin composition is made up of following component:
Polyphony Ether resin 1000g, epoxy resin fiber 50g, cyanate 30g, bismaleimides 150g, hindered phenol 200g, zinc oxide 100g and whiteruss 20g.
Its preparation method is: said components stirred.
Embodiment 2
This heat resistant resin composition is made up of following component:
Polycarbonate resin 1000g, epoxy resin fiber 80g, cyanate 10g, bismaleimides 200g, hindered phenol 50g, zinc oxide 300g and whiteruss 10g.
Its preparation method is: said components stirred.
Embodiment 3
This heat resistant resin composition is made up of following component:
Polyethersulfone resin 1000g, epoxy resin fiber 60g, cyanate 50g, bismaleimides 250g, hindered phenol 100g, zinc oxide 200g and whiteruss 30g.
Its preparation method is: said components stirred.
Embodiment 4
This heat resistant resin composition is made up of following component:
Polyarylate resin 1000g, epoxy resin fiber 60g, cyanate 50g, bismaleimides 250g, hindered phenol 100g, zinc oxide 200g and whiteruss 30g.
Its preparation method is: said components stirred.
Embodiment 5
This heat resistant resin composition is made up of following component:
Polyamide-imide resin 1000g, epoxy resin fiber 80g, cyanate 10g, bismaleimides 200g, hindered phenol 50g, zinc oxide 300g and whiteruss 10g.
Its preparation method is: said components stirred.
Detect the thermotolerance of the obtained heat resistant resin composition of above-described embodiment 1 ~ embodiment 5 and mobility, its result is as shown in table 1 below.
Table 1
。
Claims (4)
1. a heat resistant resin composition, is characterized in that being made up of the component of following parts by weight:
Heat stable resin 100 parts, epoxy resin fiber 5 parts ~ 8 parts, cyanate 1 part ~ 5 parts, bismaleimides 15 parts ~ 25 parts, hindered phenol 5 parts ~ 20 parts, 10 parts ~ 30 parts, zinc oxide and whiteruss 1 part ~ 3 parts;
Wherein, described heat stable resin is a kind of resin of Polyphony Ether resin, polycarbonate resin, polyethersulfone resin, polyarylate resin and polyamide-imide resin.
2. heat resistant resin composition according to claim 1, is characterized in that: heat stable resin 100 parts, epoxy resin fiber 5 parts, cyanate 3 parts, bismaleimides 15 parts, hindered phenol 20 parts, 10 parts, zinc oxide and whiteruss 2 parts.
3. heat resistant resin composition according to claim 1, is characterized in that: heat stable resin 100 parts, epoxy resin fiber 8 parts, cyanate 1 part, bismaleimides 20 parts, hindered phenol 5 parts, 30 parts, zinc oxide and whiteruss 1 part.
4. heat resistant resin composition according to claim 1, is characterized in that: heat stable resin 100 parts, epoxy resin fiber 6 parts, cyanate 5 parts, bismaleimides 25 parts, hindered phenol 10 parts, 20 parts, zinc oxide and whiteruss 3 parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510183335.6A CN104788935A (en) | 2015-04-17 | 2015-04-17 | Heat-resisting resin composition |
Applications Claiming Priority (1)
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CN201510183335.6A CN104788935A (en) | 2015-04-17 | 2015-04-17 | Heat-resisting resin composition |
Publications (1)
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CN104788935A true CN104788935A (en) | 2015-07-22 |
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CN201510183335.6A Pending CN104788935A (en) | 2015-04-17 | 2015-04-17 | Heat-resisting resin composition |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106366607A (en) * | 2016-08-30 | 2017-02-01 | 广西梧州通轩林产化学有限公司 | Heat-resistant resin composition |
CN110054985A (en) * | 2019-04-25 | 2019-07-26 | 住井工业(湖南)有限公司 | Self-lubricating polyamide acid imide varnish, insulating coating, insulated electric conductor, coil and motor |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101784703A (en) * | 2007-07-20 | 2010-07-21 | 高级复合材料集团有限公司 | thermoset resin fibres |
JP2011202175A (en) * | 2011-05-27 | 2011-10-13 | Hitachi Chem Co Ltd | Siloxane-modified cyanate resin composition, adhesive film using the same, resin coated metal foil and multilayered printed wiring board |
CN102250349A (en) * | 2011-04-10 | 2011-11-23 | 苏州大学 | Modified bimaleimide/cyanate ester resin and its preparation method |
CN103937156A (en) * | 2014-03-05 | 2014-07-23 | 浙江华正新材料股份有限公司 | Thermosetting resin composition and method for manufacturing prepreg and laminated board by using thermosetting resin composition |
-
2015
- 2015-04-17 CN CN201510183335.6A patent/CN104788935A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101784703A (en) * | 2007-07-20 | 2010-07-21 | 高级复合材料集团有限公司 | thermoset resin fibres |
CN102250349A (en) * | 2011-04-10 | 2011-11-23 | 苏州大学 | Modified bimaleimide/cyanate ester resin and its preparation method |
JP2011202175A (en) * | 2011-05-27 | 2011-10-13 | Hitachi Chem Co Ltd | Siloxane-modified cyanate resin composition, adhesive film using the same, resin coated metal foil and multilayered printed wiring board |
CN103937156A (en) * | 2014-03-05 | 2014-07-23 | 浙江华正新材料股份有限公司 | Thermosetting resin composition and method for manufacturing prepreg and laminated board by using thermosetting resin composition |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106366607A (en) * | 2016-08-30 | 2017-02-01 | 广西梧州通轩林产化学有限公司 | Heat-resistant resin composition |
CN110054985A (en) * | 2019-04-25 | 2019-07-26 | 住井工业(湖南)有限公司 | Self-lubricating polyamide acid imide varnish, insulating coating, insulated electric conductor, coil and motor |
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Application publication date: 20150722 |