CN104786752B - Intelligent tire pressure monitoring system based on structure electrons and implementation method of system - Google Patents
Intelligent tire pressure monitoring system based on structure electrons and implementation method of system Download PDFInfo
- Publication number
- CN104786752B CN104786752B CN201510158076.1A CN201510158076A CN104786752B CN 104786752 B CN104786752 B CN 104786752B CN 201510158076 A CN201510158076 A CN 201510158076A CN 104786752 B CN104786752 B CN 104786752B
- Authority
- CN
- China
- Prior art keywords
- tire
- circuit
- match circuit
- saw resonator
- type sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Measuring Fluid Pressure (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
The invention discloses an intelligent tire pressure monitoring system based on structure electrons and an implementation method of the system. The system comprises a surface acoustic wave resonator and a match circuit and is characterized by further comprising a capacitive sensor connected with the surface acoustic wave resonator and the match circuit respectively through external interconnection leads, the capacitive sensor is embedded in a rubber substrate on the inner surface of a tire and connected with a corresponding circuit on a hub through a lead, and the surface acoustic wave resonator and the match circuit are implanted in a groove of a spoke structure in the hub respectively. The system can realize passive and wireless detection of the tire pressure, related electronic circuits of the monitoring system are implanted in the spoke structure of the hub, therefore, the hub keeps original mechanical properties and has a certain electric function, and the mechanical properties and the electric properties of tires are integrated.
Description
Technical field
The present invention relates to automotive electronic technology, specifically a kind of passive and wireless intelligence integrated with automotive hub self structure
Pressure of tire monitoring system and its implementation can be changed.
Background technology
Automobile tire is one of very important parts of automobile, with vehicle intellectualized development, makes tire intelligent
It is also one of current automotive field target to be completed.So-called " tire is intelligent " is exactly, in tire implanted sensor, to be allowed to
Can real-time monitoring pressure of tire and tyre temperature etc..However, tire is the relatively independent part of relative other parts of automobile.
Tire needs Jing often to dismantle so that tire pressure monitoring system avoids the interconnection of external cable with vehicle body as far as possible.This requires to take turns fetal monitoring
Survey the module site preparation that must be done to be included in the middle of tire construction.Tire is one and closes independent parts, and its volume is very
Limited, this requires that tire monitoring module volume must be limited within the specific limits.At present, observation circuit module is mounted in
On wheel rim, so easily destroyed by external environment, and circuit module volume is larger, and quality is big, occurs in wheel tyre cavity
Problem in terms of many reliabilities.Early in 2008, Ryosuke Matsuzaki et al. were in " Rubber-based strain
With tire rubber in a sensor fabricated using photolithography for intelligent tires " texts
Glue is substrate, and interdigitation capacitance sensor is made on rubber substrate using photoetching technique, then the substrate is attached to into tire
Inner surface.So the change of tire pressure can cause the change of capacitance, then be read out variable quantity by external circuit
Come.Additionally, in terms of reliability, the capacitance sensor has also reached the requirement of service life.But, no elaboration is why in paper
Sample transmits the signal to external reception module.
The entitled of existing passive and wireless tire pressure monitoring method, such as notification number CN201264489 " is based on tire impedance
The patent of automobile tire pressure monitor ".The patent is implanted into SAW resonator and by tire construction in inside tires
External load of the tire impedance of the rubber for tire composition between adjacent wires and steel wire as SAW resonator.Tire
The change of pressure causes the change of the impedance being made up of steel wire and rubber in tire construction, so as to cause SAW resonator resonance
The change of frequency.The frequency is received by vehicle body respective radio-frequency receiver module, so as to realize the monitoring of tire pressure.Disclosed in the patent
Although the automobile tire pressure monitor based on tire impedance realizes the passive and wireless tire pressure monitoring of tire from principle, so
And, SAW resonator is a rigid device, can be to wheel during SAW resonator is implanted in rubber for tire
Tire causes certain destruction;Additionally, automobile is during traveling, tire can produce higher temperature with pavement friction, so
Also SAW resonator can be affected;Rigid SAW device has relatively large quality, implantation wheel
The dynamic equilibrium of tire can be affected behind tire rubber inside;SAW resonator needs the rubber between external bead wire and steel wire
The tire impedance of glue composition, needs to carry out a certain degree of destruction to tire during circuit realiration, or adds in tire
It is accomplished by changing its original processing technique during work, the production cost of such tire also can be increased.Why the patent adopts
Impedance and the pressure of tire monitoring system of SAW resonator composition with inside tires steel wire and rubber composition, is because wheel
The impedance that the steel wire of tire self structure is constituted with rubber can compare the pressure condition for reflecting tire itself directly, exactly, so
And bring certain difficulty to tyre production technique, processing cost.
Structure electrical refers to and electronic device and circuit part is directly made in the middle of object structure, and saves tradition as far as possible
PCB, be allowed to realize its original physics, mechanics or other performances, and can realize because of the implantation of electronic circuit
Certain electrical functions, while also the volume shared by electronic circuitry part can be reduced because of the realization of structural electronics, make
Can in limited volume implantation circuit module.Jing is retrieved, and not yet finds for structure electrical to be applied to pressure of tire at present
The report in monitoring field.
The content of the invention
The purpose of the present invention is, to solve the deficiencies in the prior art, and to provide a kind of passive and wireless that can realize pressure of tire
Monitoring, and by the monitoring system associated electronic circuits implantation wheel hub spoke architecture so that wheel hub is keeping its original mechanics
Outside performance, certain electrical functions are also had concurrently, realize mechanics of tire performance with electric property integrated function based on structure
The intelligent pressure of tire monitoring system of electronics and its implementation.
Realizing the technical scheme of the object of the invention is:
A kind of intelligent pressure of tire monitoring system based on structure electrical, including SAW resonator and matching electricity
Road, unlike the prior art:Also include capacitance type sensor, the sensor by outside interconnecting lead respectively with sound surface
Wave resonator, match circuit are connected, and capacitance type sensor is embedded on the rubber substrate of tire inner surface, and with wheel hub on
Related circuit is connected by wire, and SAW resonator and match circuit are implanted into respectively the groove of the spoke architecture in wheel hub
It is interior.
The material of the capacitance type sensor is copper, and the electric capacity included in it is interdigitated electric capacity.
The SAW resonator is the chip surface acoustic wave wave resonator of mounted type.
The outside interconnecting lead is flexible printed circuit.
The match circuit includes the sheet capacitor and chip inductor of mounted type.
The wire is by the silver wire formed after silver ink sintering curing.
The method for realizing the above-mentioned intelligent pressure of tire monitoring system based on structure electrical, comprises the steps:
(1)Open up certain length and width, deep groove, and the spray insulation paint in groove in spoke architecture in advance so as to light
Degree solidification, polishing forms insulating barrier;
(2)Silver ink is printed by interconnecting lead structure on the insulating barrier of spoke by 3D inkjet technologies,
And by its sintering curing;
(3)The drop coating structure glue in groove, SAW resonator, match circuit are fixed in groove, make structure glue
Solidification;
(4)SAW resonator, match circuit pad pin and nanometer silver wire are carried out with isotropic conductive adhesive
Interconnection, and solidify it;
(5)Respectively whole circuit is encapsulated with silicone rubber, epoxy resin, and solidify it;
(6)The copper facing on rubber for tire substrate, the rotary coating photoresist in layers of copper, slight solidification, by exposure photo-etching glue,
Etching copper layer, removes the photoresist on layers of copper surface, obtains capacitance type sensor;
(7)Flexible circuit is connected with capacitance type sensor by structure glue, and is encapsulated junction with silicone rubber, Gu
Change;And sensor is attached to into tire inner surface;
(8)Tire is assembled with wheel hub, flexible circuit is attached with spoke architecture electronics with structure glue, is used in combination
Silicone rubber is encapsulated junction, solidification.
The sintering curing temperature of the silver ink wire is 130-200 DEG C.
Compared with prior art, the present invention has advantages below:
1. avoid and be implanted into rigid device in rubber for tire, so as to remain the original mechanical property of tire;
2. by the middle of circuit and electronic device implantation wheel hub spoke architecture, it is to avoid the use of traditional PCB such that it is able to
Make tire pressure monitoring module take less volumetric spaces, realize the wheel hub mechanics mentality of designing integrated with electricity.Simultaneous wheels
It is isolated with the external world in fetal monitoring slowdown monitoring circuit implantation spoke architecture, it is to avoid destruction of the external environment to circuit, improve
The reliability and its service life of circuit;
3. traditional Lead-Free Solder Joint is replaced with conducting resinl, so that it improves device with electricity under dynamic load environmental condition
The reliability of road interconnection;
4. metallic ink wire replaces traditional metallic conduction silk so that the overall volume of wire, quality have obtained one
The improvement of step;
5. continue to use photoetching technique capacitance type sensor is made on tire inner surface, capacitance type sensor can tire this
Tire original manufacturing process is not affected while one complex environment accurately measures pressure of tire situation.
Description of the drawings
Fig. 1 is the tire construction schematic diagram with capacitance type sensor;
Fig. 2 is the wheel hub structure schematic diagram for being implanted with matching network circuit and related device;
Fig. 3 is the spoke architecture partial schematic diagram for being implanted into match circuit and related device;
Fig. 4 is A-A line of vision structural representations in Fig. 3;
Fig. 5 a- Fig. 5 f are the spoke sectional view, and it schematically expresses the structural electronic structure of the embodiment of the present invention and sets
Meter and its implementation;
Fig. 6 a- Fig. 6 d-2For rubber for tire capacitance type sensor sectional view, it is schematically expressed based on rubber substrate
Capacitance type sensor implementation method;
To be attached to tire inner surface sensor section figure, it schematically expresses flexible circuit, electric capacity to Fig. 7 a- Fig. 7 b
The assembling process of formula sensor and tire.
In figure:1. the capacitance type sensor 4. of 2. flexible circuit of tire 3. is not implanted into the wheel of match circuit and related device
Spoke structure 5. is implanted into the silver ink wire 8. of 6. silicone rubber of spoke architecture 7. of match circuit and related device respectively to same
The spoke base of 13. epoxy resin layer of property conducting resinl 9. inductance, 10. insulating barrier, 11. SAW resonator, 12. electric capacity 14.
The structure glue of 17. photoresist of plate 15. rubber substrate, 16. layers of copper 18..
Specific embodiment
With reference to the accompanying drawings and examples the invention will be further elaborated, but is not the restriction to present invention.
As Figure 1-4, a kind of intelligent pressure of tire monitoring system based on structure electrical, including insulating barrier 10, receive
Meter Yin Mo water wire 7, isotropic conductive adhesive 8, matching capacitance 12, matching inductance 9, SAW resonator 11, with buffering
The silicone rubber of vibration-damping function and the epoxy resin with waterproof action.Insulating barrier 10 is by each electronic device and wire and metal
Spoke substrate separates, and chip inductor 9 is fixed on pre- with chip surface acoustic wave wave resonator 11 and sheet capacitor 12 by adhesive
In the groove first held successfully, its pin is connected by isotropic conductive adhesive 8 with silver inks water wire 7, constitutes match circuit and in electricity
Silicone rubber 6 and the epoxy resin 13 with waterproof action that last layer has buffer shock-absorbing function, final nanometer silver are applied on road
Ink wire 7 is connected by flexible circuit 2 with the capacitance type sensor 3 in tire 1.
The material of capacitance type sensor 3 is copper, is made on the rubber substrate 15 of tire 1 using photoetching technique, electric capacity
12 can accurately measure pressure of tire in tire 1 this complex environment, and rubber substrate 15 is identical with the material of tire 1, no
Can be because causing both to separate because the thermal coefficient of expansion of material is mismatched.
Flexible circuit 2 is flexible or folds, and will not be destroyed because of tire 1 and the assembling of wheel hub.
Interconnecting lead 7 is silver inks water wire, and the wire ejected using ink-jet printing technology not only has small volume, quality
Light advantage, and arbitrarily can rapidly be connected up on substrate.
Conducting resinl 8 is a kind of solvent with certain fluidity, and it preferably can draw covering device when drop coating
Foot, while conducting resinl also has gluing function, further can fix device after its solidification, improve device and interconnect with wire
Reliability.
Silastic-layer 6 and epoxy resin layer 13 keep apart whole circuit and protective cover plate, it is also possible to stop extraneous miscellaneous
The interference of confrontation circuit, while also playing the effect to circuit vibration damping, fixation.
As shown in Fig. 5 a- Fig. 5 f, a kind of structural Electronic Structure Design of intelligent tire and its implementation, including:
(a)The spoke substrate 14 of pre-processed device trenches is provided, and whole substrate is sprayed into high-temperature insulating paint, and
Solidified, polished, formed insulating barrier 10, as shown in Figure 5 a;
B silver inks water is printed and forms wire 7 by () using 3D inkjet technologies on insulating barrier 10, and sintered solid
Change, sintering temperature is 130 DEG C -200 DEG C, as shown in Figure 5 b;
(c)Drop coating structure glue is simultaneously placed SAW resonator 11 and matching capacitance 12 and matches inductance 9 and by structure
Glue 18 solidifies, as shown in Figure 5 c;
(d) drop coating isotropic conductive adhesive 8 so as to realize the electrical interconnection between silver wire 7 and device, and consolidated
Change, as fig 5d;
(e)Coating silicon rubber layer 6 so as to encapsulated silver wire 7 and device, to whole circuit buffer shock-absorbing is played
Effect, most at last silastic-layer 6 is solidified, as depicted in fig. 5e.
(f)Coating epoxy resin layer 13, to whole circuit anti-water segregation is played a part of, and epoxy resin layer 13 is carried out
Solidification.
As shown in Fig. 6 a- Fig. 6 d, included based on the capacitance type sensor implementation method of rubber substrate:
(a)Rubber for tire substrate 15 is provided, and plates last layer layers of copper 16, as shown in Figure 6 a;
(b)The rotary coating photoresist 17 in layers of copper 16, by its slight solidification so as to be uniformly adhered on the surface of layers of copper 16
On, as shown in Figure 6 b;
(c)Photoresist 17 exposes, and defines capacitance type sensor profile, size, including sensor total length, overall width, phase
Pole span, finger electrode logarithm, width of electrode of adjacent two finger electrodes etc., etching copper layer 16 forms sensor just shape, such as Fig. 6 c
It is shown;
(d)With the method for directly exposure except the photoresist 17 on the surface of layers of copper 16, as shown in Fig. 6 d-1, the base for ultimately forming
In the capacitance type sensor 3 of rubber for tire substrate, as shown in Fig. 6 d-2.
As shown in Fig. 7 a- Fig. 7 b, the tire implementation method that is connected with sensor and flexible circuit includes:
(a)Flexible circuit 2 is provided, is connected with structure glue 18 with the pin of capacitance sensor 3 in flexible circuit 2, and even
The place of connecing is encapsulated with silicone rubber 6, improves its mechanical performance, as shown in Figure 7a;
(b)Tire 1 is provided, by with the structure glue 18 of rubber for tire substrate 15 of capacitance sensor 3 and flexible circuit 2
It is attached on the inner surface of tire 1, and structure glue 18 is solidified, as shown in Figure 7b.
Claims (3)
1. a kind of intelligent pressure of tire monitoring method based on structure electrical, is characterized in that:Comprise the steps:
(1)Open up certain length and width, deep groove, and the spray insulation paint in groove in spoke architecture in advance so as to slight solid
Change, polishing forms insulating barrier;
(2)Silver ink is printed by interconnecting lead structure on the insulating barrier of spoke by inkjet technology, and by its
Sintering curing;
(3)The drop coating structure glue in groove, SAW resonator, match circuit are fixed in groove, make structure adhesive curing;
(4)SAW resonator, match circuit pad pin and nanometer silver wire are interconnected with isotropic conductive adhesive,
And solidify it;
(5)Respectively whole circuit is encapsulated with silicone rubber, epoxy resin, and solidify it;
(6)The copper facing on rubber for tire substrate, the rotary coating photoresist in layers of copper, slight solidification, by exposure photo-etching glue, etching
Layers of copper, removes the photoresist on layers of copper surface, obtains capacitance type sensor;
(7)Flexible circuit is connected with capacitance type sensor by structure glue, and is encapsulated junction with silicone rubber, solidified;And
Sensor is attached to into tire inner surface;
(8)Tire is assembled with wheel hub, flexible circuit is attached with spoke architecture electronics with structure glue, and is used silicon rubber
Glue is encapsulated junction, solidification.
2. method according to claim 1, is characterized in that:The sintering curing temperature of the silver ink wire is 130-
200℃。
3. the system for realizing the intelligent pressure of tire monitoring method described in claim 1 based on structure electrical, including condenser type
Sensor, SAW resonator and its match circuit, is characterized in that:Capacitance type sensor by flexible printed circuit respectively with
SAW resonator, match circuit are connected, and capacitance type sensor is embedded on the rubber substrate of tire inner surface, and with wheel
Related circuit on hub is connected by wire, and SAW resonator and match circuit are implanted into respectively the spoke architecture in wheel hub
Groove in;
The material of the capacitance type sensor is copper, and the electric capacity included in it is interdigitated electric capacity;
The SAW resonator is the chip surface acoustic wave wave resonator of mounted type;
The match circuit includes the sheet capacitor and chip inductor of mounted type;
The wire is by the silver wire formed after silver ink sintering curing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510158076.1A CN104786752B (en) | 2015-04-07 | 2015-04-07 | Intelligent tire pressure monitoring system based on structure electrons and implementation method of system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510158076.1A CN104786752B (en) | 2015-04-07 | 2015-04-07 | Intelligent tire pressure monitoring system based on structure electrons and implementation method of system |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104786752A CN104786752A (en) | 2015-07-22 |
CN104786752B true CN104786752B (en) | 2017-04-26 |
Family
ID=53552103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510158076.1A Active CN104786752B (en) | 2015-04-07 | 2015-04-07 | Intelligent tire pressure monitoring system based on structure electrons and implementation method of system |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104786752B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RS63287B1 (en) * | 2017-05-23 | 2022-06-30 | Shandong linglong tyre co ltd | Intelligent tire |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1619954A (en) * | 2003-11-20 | 2005-05-25 | 米其林技术公司 | SAW transducer interface to pressure sensing diaphragm |
CN201264489Y (en) * | 2008-06-16 | 2009-07-01 | 桂林电子科技大学 | Automotive tire pressure monitoring method based on tyre impedance |
CN203793053U (en) * | 2014-04-23 | 2014-08-27 | 莆田学院 | Tire pressure sensor |
CN204605420U (en) * | 2015-04-07 | 2015-09-02 | 桂林电子科技大学 | A kind of intelligent pressure of tire monitoring system of structure based electronics |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2928007B1 (en) * | 2008-02-22 | 2010-02-19 | Senseor | PIEZOELECTRIC RESONATOR INTERROGATION METHOD AND INTERROGATION DEVICE INTEGRATING THE QUERY METHOD. |
-
2015
- 2015-04-07 CN CN201510158076.1A patent/CN104786752B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1619954A (en) * | 2003-11-20 | 2005-05-25 | 米其林技术公司 | SAW transducer interface to pressure sensing diaphragm |
CN201264489Y (en) * | 2008-06-16 | 2009-07-01 | 桂林电子科技大学 | Automotive tire pressure monitoring method based on tyre impedance |
CN203793053U (en) * | 2014-04-23 | 2014-08-27 | 莆田学院 | Tire pressure sensor |
CN204605420U (en) * | 2015-04-07 | 2015-09-02 | 桂林电子科技大学 | A kind of intelligent pressure of tire monitoring system of structure based electronics |
Also Published As
Publication number | Publication date |
---|---|
CN104786752A (en) | 2015-07-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4724488B2 (en) | Integrated microelectromechanical system | |
KR101708893B1 (en) | Bulk acoustic wave resonator structure and manufacturing method thereof | |
JP5054703B2 (en) | MEMS microphone, method for manufacturing MEMS microphone, and method for incorporating MEMS microphone | |
CN104734658B (en) | Oscillator, electronic equipment and moving body | |
CN112533777B (en) | Tyre comprising a monitoring device | |
JP2004536399A5 (en) | ||
CN105452853A (en) | Temperature/humidity sensor | |
WO2008042603A2 (en) | Energy harvesting device manufactured by print forming processes | |
WO2007061831A1 (en) | Chip level packaging for wireless surface acoustic wave sensor | |
CN106338620A (en) | Physical Quantity Sensor, Physical Quantity Sensor Device, Electronic Apparatus, And Moving Object | |
US20080076249A1 (en) | Method of manufacturing semiconductor device | |
JP5453787B2 (en) | Surface acoustic wave device | |
CN104786752B (en) | Intelligent tire pressure monitoring system based on structure electrons and implementation method of system | |
EP3814152A1 (en) | Structures and methods providing tread sensor integration | |
CN111034376B (en) | Method for manufacturing electronic component and electronic component | |
CN101652647B (en) | Connector unit for a pressure sensor | |
CN204605420U (en) | A kind of intelligent pressure of tire monitoring system of structure based electronics | |
KR102024608B1 (en) | Sensor | |
CN105403732A (en) | Quartz flexible accelerometer capacitance sensor insulator lead wire and mounting structure | |
CN210129510U (en) | Radio frequency packaging structure with antenna externally arranged on surface of packaging body | |
CN104237329A (en) | micromechanical moisture sensor device, corresponding manufacturing method, and micromechanical sensor system | |
JP5529577B2 (en) | Electromechanical transducer and method for manufacturing the same | |
WO2019191246A1 (en) | Structures and methods providing sensor-package integration | |
CN107539040A (en) | A kind of capacitance-type sensing device based on silver conductive adhesive and preparation method thereof | |
KR20060079219A (en) | A method of manufacturing an electronic device and an electronic device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
EXSB | Decision made by sipo to initiate substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |