CN104777884A - Notebook cooler - Google Patents

Notebook cooler Download PDF

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Publication number
CN104777884A
CN104777884A CN201510135556.6A CN201510135556A CN104777884A CN 104777884 A CN104777884 A CN 104777884A CN 201510135556 A CN201510135556 A CN 201510135556A CN 104777884 A CN104777884 A CN 104777884A
Authority
CN
China
Prior art keywords
heat
notebook
heat pipe
water tank
housing water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510135556.6A
Other languages
Chinese (zh)
Inventor
尹传喜
陈东海
陈明明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUI GUANDONG ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
ANHUI GUANDONG ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANHUI GUANDONG ELECTRONIC TECHNOLOGY Co Ltd filed Critical ANHUI GUANDONG ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201510135556.6A priority Critical patent/CN104777884A/en
Publication of CN104777884A publication Critical patent/CN104777884A/en
Pending legal-status Critical Current

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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to the field of the electronics technology, in particular to a notebook cooler. The invention provides an external cooler; the notebook cooler has a rapid cooling function, has an obvious cooling effect, and is free of noise; dust can be effectively prevented from entering a notebook; the notebook can also be greatly and effectively cooled, and the dust cannot be generated in the notebook; the notebook cooler is free of energy consumption.

Description

A kind of notebook radiator
Technical field
The present invention relates to electronics technology field, be specially a kind of notebook radiator.
Background technology
Along with the development of electronic information technology, huge numbers of families come into by notebook computer, have been dissolved in the life of people, become that people obtain information, the important tool of amusement.But heat dispersion deficiency is that one of notebook computer denounces greatly.
Although market has occurred a series of external radiator, be all be that wind wheel carries out exhausting with turbine part, increase air mass flow, carry out dispelling the heat.
This radiating mode has significant limitation, not only dispels the heat not greatly, has noise, but also can produce a large amount of dust because air quantity increases in notebook computer, causes notebook computer part aging, causes notebook computer to run slowly.
Summary of the invention
The invention provides a kind of circumscribed heating radiator, this heating radiator has quick heat radiating function, and cooling-down effect is obvious, and noiselessness, can effectively stop dust to enter notebook computer inside.
To achieve these goals, the present invention by the following technical solutions
A kind of notebook radiator, it comprises, heat pipe 1, heat-dissipating frame 2, housing water tank 3.
Described heat pipe 1 is downward-sloping to be embedded in described heat-dissipating frame 2, wherein one end composition heat-dissipating frame 2 upper surface of heat pipe 1, and the other end embeds in housing water tank 3.
Described heat pipe 1 is heat transfer component, is tubular structure, and one end is embedded in above heat-dissipating frame 2, and form a heat absorption plane, the other end embeds in housing water tank 3.
Described heat-dissipating frame 2 is a space frame structure, and heat pipe 1 is embedded in its two ends, forms its upper surface.
Described housing water tank 3, for holding water heat sink, is connected to heat radiation each two of frame two ends by heat pipe.
Beneficial effect of the present invention
1, can be effectively significantly notebook cooling, and dust can not be produced in notebook computer.
2, can not noise be produced.
3, Non-energy-consumption.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
The invention provides a kind of circumscribed heating radiator, this heating radiator has quick heat radiating function, and cooling-down effect is obvious, and noiselessness, can effectively stop dust to enter notebook computer inside.
To achieve these goals, the present invention by the following technical solutions
A kind of notebook radiator, it comprises, heat pipe 1, heat-dissipating frame 2, housing water tank 3.
Described heat pipe 1 is downward-sloping to be embedded in described heat-dissipating frame 2, wherein one end composition heat-dissipating frame 2 upper surface of heat pipe 1, and the other end embeds in housing water tank 3.
Described heat pipe 1 is heat transfer component, and one end is embedded in above heat-dissipating frame 2, and form a heat absorption plane, the other end embeds in housing water tank 3, and it is tubular structure.
Described heat-dissipating frame 2 is a space frame structure, and heat pipe 1 is embedded in its two ends, forms its upper surface.
Described housing water tank 3, for holding water heat sink, is connected to heat radiation each two of frame two ends by heat pipe.
Below in conjunction with drawings and Examples, the present invention will be further described
In Fig. 1,1-heat pipe, 2-heat-dissipating frame, 3-housing water tank.
As shown in Figure 1, described heat-dissipating frame 2 is preferably a solid and props framework, and to be that heat pipe 1 is downward-sloping be embedded in its two ends to its upper surface, and heat pipe 1 other end tilts upward and embeds in housing water tank 3, and wherein degree of tilt is preferably 10 degree.
Described heat pipe 1 one end tilts upward and is embedded in housing water tank 3, fully contact with water source in housing water tank 3, in housing water tank 3, water source can be discharged by housing water tank 3 lower curtate tubule, and let slip a remark in the top new water of loading or frozen water, described housing water tank 3 is each two of heat-dissipating frame 2 both sides, and heat pipe 1 one end respectively embeds in both sides housing water tank 3.
Described heat pipe 1 is preferably semiconductor heat absorption material, is tubulose.
Be a bracing frame bottom described heat radiation outside framework 2, for metal material is made, it act as the whole frame shape of support and becomes solid space.
Radiating principle of the present invention is, notebook computer heat source heat pipe 1 one end, LMP liquid heat vaporization in heat pipe 1 one end, hot gas pours into heat pipe 1 other end, and because heat pipe 1 other end temperature is lower than heat pipe 1 one end, hot gas meets rapidly cold liquefaction, release heat, again because heat pipe 1 other end is embedded in 3 li, housing water tank, thus heat absorb by water in housing water tank 3, thus reach the object of quick heat radiating.
Above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, other amendments that those of ordinary skill in the art make technical scheme of the present invention or equivalently to replace, only otherwise depart from the spirit and scope of technical solution of the present invention, all should be encompassed in the middle of right of the present invention.

Claims (3)

1. a notebook radiator, it is characterized in that, it comprises, heat pipe (1), heat-dissipating frame (2), housing water tank (3), described heat pipe (1) is downward-sloping to be embedded in described heat-dissipating frame (2), wherein one end composition heat-dissipating frame (2) upper surface of heat pipe (1), the other end embeds in housing water tank (3).
2. a kind of notebook radiator according to claim 1, is characterized in that, heat pipe (1) is tubular structure.
3. a kind of notebook radiator according to claim 1, is characterized in that, heat-dissipating frame (2) is a space frame structure, and its upper surface is heat pipe (1) composition.
CN201510135556.6A 2015-03-26 2015-03-26 Notebook cooler Pending CN104777884A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510135556.6A CN104777884A (en) 2015-03-26 2015-03-26 Notebook cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510135556.6A CN104777884A (en) 2015-03-26 2015-03-26 Notebook cooler

Publications (1)

Publication Number Publication Date
CN104777884A true CN104777884A (en) 2015-07-15

Family

ID=53619408

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510135556.6A Pending CN104777884A (en) 2015-03-26 2015-03-26 Notebook cooler

Country Status (1)

Country Link
CN (1) CN104777884A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070268668A1 (en) * 2006-05-19 2007-11-22 I-Ming Lin Kind of superconductive heat cooler package of vacuum used in computer CPU (Central Processing Unit)
US20110132001A1 (en) * 2007-03-19 2011-06-09 I-Ming Lin Enhanced thermoelectric cooler with superconductive heat-dissipative device for use in air-conditioners
CN202533862U (en) * 2012-02-23 2012-11-14 周哲明 Low-noise computer radiating device
CN203366213U (en) * 2013-07-12 2013-12-25 内蒙古科技大学 Notebook computer radiator
CN104460893A (en) * 2013-09-21 2015-03-25 天津市滨海新区大港第五中学 Laptop radiator
CN204631749U (en) * 2015-03-26 2015-09-09 安徽冠东电子科技有限公司 A kind of notebook radiator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070268668A1 (en) * 2006-05-19 2007-11-22 I-Ming Lin Kind of superconductive heat cooler package of vacuum used in computer CPU (Central Processing Unit)
US20110132001A1 (en) * 2007-03-19 2011-06-09 I-Ming Lin Enhanced thermoelectric cooler with superconductive heat-dissipative device for use in air-conditioners
CN202533862U (en) * 2012-02-23 2012-11-14 周哲明 Low-noise computer radiating device
CN203366213U (en) * 2013-07-12 2013-12-25 内蒙古科技大学 Notebook computer radiator
CN104460893A (en) * 2013-09-21 2015-03-25 天津市滨海新区大港第五中学 Laptop radiator
CN204631749U (en) * 2015-03-26 2015-09-09 安徽冠东电子科技有限公司 A kind of notebook radiator

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EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150715