CN104767105A - Indium seal method for tight connection between laser crystal and red copper heat sink - Google Patents
Indium seal method for tight connection between laser crystal and red copper heat sink Download PDFInfo
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- CN104767105A CN104767105A CN201510189271.0A CN201510189271A CN104767105A CN 104767105 A CN104767105 A CN 104767105A CN 201510189271 A CN201510189271 A CN 201510189271A CN 104767105 A CN104767105 A CN 104767105A
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- heat sink
- red copper
- laser crystal
- indium
- heating furnace
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Abstract
The invention discloses an indium seal method for tight connection between a laser crystal and a red copper heat sink. The method comprises the steps that 1, oxidation layers on the surfaces of indium foil and the red copper heat sink are cleaned away; 2, the side face of the laser crystal is wrapped by the indium foil and then placed into a groove in the red copper heat sink; 3, the red copper heat sink is placed into a heating furnace, and the heating furnace is vacuumized; 4, the heating furnace is heated to be at the temperature ranging from 160 DEG C to 170 DEG C, the heating time is controlled to range from 1 h to 2 h, and the molten indium foil is used for welding the laser crystal to the red copper heat sink; 5, the heating furnace is closed, and the red copper heat sink is taken out after being cooled. According to the indium seal method, the laser crystal and the red copper heat sink are tightly connected in a seamless mode through the indium foil welding technology, the radiating efficiency of a whole laser radiating device is greatly improved, and the problem that the radiating efficiency is affected due to the fact that a traditional indium foil wrapping way is high in heat resistance is solved to a certain degree.
Description
Technical field
The present invention relates to a kind of laser crystal radiator based on indium envelope welding procedure and utilize it to realize laser crystal and the heat sink close-connected method of red copper.
Background technology
In the solid state laser of LD pumping, to the heat dissipating method of end pumping laser crystal, normally adopt indium foil to wrap up and to be placed in red copper heat sink, utilize heat transfer the used heat in laser crystal is transmitted to red copper heat sink on, and to be taken away by extraneous water-cooled or air-cooled mode.But the mode of indium foil parcel is difficult to fill to greatest extent the fine gap between the heat sink and laser crystal of red copper, causes thermal resistance comparatively large, thus is difficult to realize high efficiency and heat radiation to greatest extent.
Summary of the invention
In order to the red copper realizing laser crystal and heat radiation heat sink between compact siro spinning technology, and then reduce thermal resistance raising radiating efficiency, the invention provides a kind of for laser crystal and the heat sink close-connected indium encapsulation method of red copper, by indium envelope welding procedure make laser crystal heat sink with red copper between closed seamless be connected, whole laser radiating device radiating efficiency is greatly improved, solves the problem of traditional indium foil parcel mode thermal resistance considerable influence radiating efficiency to a certain extent.
The object of the invention is to be achieved through the following technical solutions:
A kind of laser crystal radiator based on indium envelope welding procedure, form by laser crystal, indium foil and red copper are heat sink, described red copper is heat sink to be made up of upper red copper heat sink 3 and lower red copper heat sink 5, upper red copper is heat sink has through hole on 3, lower red copper heat sink 5 is provided with the screwed hole mated with the lead to the hole site in upper red copper heat sink 3, upper red copper is heat sink 3 to be connected by screw fastening with lower red copper heat sink 5, and its joint face is provided with groove, and laser crystal side wrap indium foil also puts into the heat sink groove of red copper.
One utilizes above-mentioned laser crystal radiator to realize laser crystal and the heat sink close-connected method of red copper, and utilize indium seal technique to realize laser crystal and the heat sink compact siro spinning technology of red copper, concrete steps are as follows:
Step one, wash the oxide layer of indium foil and red copper heat sink surface;
Step 2, laser crystal side wrap indium foil put into the heat sink groove of red copper;
Step 3, put into heating furnace by heat sink for red copper, in order to prevent indium to be oxidized in the process of heating, thus affect the firmness that the effect of indium envelope and indium weld, heating furnace being evacuated to vacuum degree and being about 0 holder;
Step 4, heating furnace are heated to 160 ~ 170 DEG C, and to control heating time be 1 ~ 2 hour, and laser crystal and red copper heat sink welding get up by the indium foil of fusing;
Step 5, closedown heating furnace, take out after the heat sink cooling of red copper.
Tool of the present invention has the following advantages:
The present invention utilizes the feature that the ductility of indium is good, quality is soft, fusing point is low, thermal conductivity is higher, the laser crystal wrapping up indium foil is put into red copper heat sink and be placed in vacuum furnace, by laser crystal and red copper heat sink welding after heating makes indium foil melt, the indium foil comparing tradition employing directly wraps up the method for laser crystal, fill the fine gap between the heat sink and laser crystal of red copper to greatest extent, increase red copper is heat sink and the contact area of laser crystal, thus improves radiating efficiency.This method is for holding in the heat radiation of pumping luminescent crystal.
Accompanying drawing explanation
Fig. 1 is the laser crystal heat spreader structures schematic diagram based on indium envelope welding procedure.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is further described; but be not limited thereto; everyly technical solution of the present invention modified or equivalent to replace, and not departing from the spirit and scope of technical solution of the present invention, all should be encompassed in protection scope of the present invention.
Embodiment one: as shown in Figure 1, present embodiments provide for a kind of laser crystal radiator based on indium envelope welding procedure, this heat abstractor forms primarily of laser crystal 1, indium foil 2, red copper is heat sink and fixing red copper is heat sink screw 4.
In present embodiment, described red copper is heat sink to be made up of upper red copper heat sink 3 and lower red copper heat sink 5, upper red copper is heat sink has four through holes on 3, lower red copper heat sink 5 is provided with four screwed holes mated with the lead to the hole site in upper red copper heat sink 3, upper red copper is heat sink 3 and lower red copper heat sink 5 be fastenedly connected by four screws 4, its joint face is provided with groove.
In present embodiment, described indium foil thickness is 0.5mm.
In present embodiment, described laser crystal side wrap indium foil also puts into the heat sink groove of red copper.
In present embodiment, the size between described laser crystal 1, indium foil 2 and red copper are heat sink mutually should be mated and agreed with.
In present embodiment, the outer surface of described upper red copper heat sink 3 and lower red copper heat sink 5 is processed with the radiated rib for expanding red copper area of dissipation, the thick 2mm of radiated rib, spacing of fins 2mm, places the dark 5mm of groove of laser crystal,
In present embodiment, described laser crystal 1 can be club shaped structure, also can be block structure.
Embodiment two: a kind of for laser crystal and the heat sink close-connected indium encapsulation method of red copper, is realized by following steps:
Step one, wash the oxide layer of indium foil and red copper heat sink surface.
Step 2, laser crystal side wrap indium foil put into the heat sink groove of red copper, upper and lower two pieces of red coppers are heat sink be connected by screw fixing.
Step 3, put into heating furnace by heat sink for the red copper after being connected and fixed, heating furnace is evacuated to vacuum degree and is about 0 holder.
Step 4, heating furnace are heated to 160 DEG C, and control about 1 hour heating time, and due to thermal inertia effect, after 1 hour, temperature is about 170 DEG C, and indium foil melts laser crystal and red copper heat sink welding to get up.
Step 5, closedown heating furnace, take out after the heat sink cooling of red copper.
Claims (8)
1., for laser crystal and the heat sink close-connected indium encapsulation method of red copper, it is characterized in that described method concrete steps are as follows:
Step one, wash the oxide layer of indium foil and red copper heat sink surface;
Step 2, laser crystal side wrap indium foil put into the heat sink groove of red copper;
Step 3, put into heating furnace by heat sink for red copper, heating furnace is vacuumized;
Step 4, heating furnace are heated to 160 ~ 170 DEG C, and to control heating time be 1 ~ 2 hour, and laser crystal and red copper heat sink welding get up by the indium foil of fusing;
Step 5, closedown heating furnace, take out after the heat sink cooling of red copper.
2. according to claim 1 for laser crystal and the heat sink close-connected indium encapsulation method of red copper, it is characterized in that described indium foil thickness is 0.5mm.
3. according to claim 1 for laser crystal and the heat sink close-connected indium encapsulation method of red copper, it is characterized in that the heat sink outer surface of described red copper is processed with radiated rib.
4. according to claim 3 for laser crystal and the heat sink close-connected indium encapsulation method of red copper, it is characterized in that the thick 2mm of described radiated rib, spacing of fins 2mm.
5. according to claim 1 for laser crystal and the heat sink close-connected indium encapsulation method of red copper, it is characterized in that the dark 5mm of described groove.
6. according to claim 1 or 3 for laser crystal and the heat sink close-connected indium encapsulation method of red copper, it is characterized in that described red copper, heat sink by upper red copper, heat sink and lower red copper is heat sink forms, four through holes are had on upper red copper is heat sink, lower red copper is heat sink be provided with heat sink with upper red copper on four screwed holes mating of lead to the hole site, upper red copper is heat sink heat sinkly with lower red copper to be connected by four screw fastenings, and its joint face is provided with groove.
7. according to claim 1 for laser crystal and the heat sink close-connected indium encapsulation method of red copper, it is characterized in that described laser crystal is club shaped structure or block structure.
8. according to claim 1 for laser crystal and the heat sink close-connected indium encapsulation method of red copper, it is characterized in that described vacuum degree is 0 holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510189271.0A CN104767105A (en) | 2015-04-21 | 2015-04-21 | Indium seal method for tight connection between laser crystal and red copper heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510189271.0A CN104767105A (en) | 2015-04-21 | 2015-04-21 | Indium seal method for tight connection between laser crystal and red copper heat sink |
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| CN104767105A true CN104767105A (en) | 2015-07-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510189271.0A Pending CN104767105A (en) | 2015-04-21 | 2015-04-21 | Indium seal method for tight connection between laser crystal and red copper heat sink |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106238849A (en) * | 2016-08-22 | 2016-12-21 | 中国电子科技集团公司第十研究所 | A kind of laser slab and the welding method of heat sink two-sided joint |
| CN110429457A (en) * | 2019-08-19 | 2019-11-08 | 北京东方锐镭科技有限公司 | A kind of hot and cold water sink component for laser crystal |
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| US20080008217A1 (en) * | 2006-07-07 | 2008-01-10 | Newport Corporation | Laser device including heat sink with a tailored coefficient of thermal expansion |
| CN101431207A (en) * | 2008-12-03 | 2009-05-13 | 中国科学院上海光学精密机械研究所 | Method for welding laser crystal strip and heat sink |
| CN101958506A (en) * | 2009-08-07 | 2011-01-26 | 西安电子科技大学 | Method for modularizing crystal and heat sink in laser diode pumped solid laser |
| CN103022868A (en) * | 2012-12-25 | 2013-04-03 | 中国电子科技集团公司第十一研究所 | Pulse optical fiber laser |
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2015
- 2015-04-21 CN CN201510189271.0A patent/CN104767105A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080008217A1 (en) * | 2006-07-07 | 2008-01-10 | Newport Corporation | Laser device including heat sink with a tailored coefficient of thermal expansion |
| CN101431207A (en) * | 2008-12-03 | 2009-05-13 | 中国科学院上海光学精密机械研究所 | Method for welding laser crystal strip and heat sink |
| CN101958506A (en) * | 2009-08-07 | 2011-01-26 | 西安电子科技大学 | Method for modularizing crystal and heat sink in laser diode pumped solid laser |
| CN103022868A (en) * | 2012-12-25 | 2013-04-03 | 中国电子科技集团公司第十一研究所 | Pulse optical fiber laser |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106238849A (en) * | 2016-08-22 | 2016-12-21 | 中国电子科技集团公司第十研究所 | A kind of laser slab and the welding method of heat sink two-sided joint |
| CN110429457A (en) * | 2019-08-19 | 2019-11-08 | 北京东方锐镭科技有限公司 | A kind of hot and cold water sink component for laser crystal |
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Application publication date: 20150708 |