CN104766721A - Multi-layered ceramic capacitor and method for same - Google Patents
Multi-layered ceramic capacitor and method for same Download PDFInfo
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- CN104766721A CN104766721A CN201410853834.7A CN201410853834A CN104766721A CN 104766721 A CN104766721 A CN 104766721A CN 201410853834 A CN201410853834 A CN 201410853834A CN 104766721 A CN104766721 A CN 104766721A
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000000919 ceramic Substances 0.000 claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 claims description 34
- 239000011575 calcium Substances 0.000 claims description 28
- 239000011572 manganese Substances 0.000 claims description 28
- 239000010936 titanium Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 15
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 14
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 14
- 239000004411 aluminium Substances 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 229910052788 barium Inorganic materials 0.000 claims description 14
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052791 calcium Inorganic materials 0.000 claims description 14
- 229910052746 lanthanum Inorganic materials 0.000 claims description 14
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 14
- 229910052748 manganese Inorganic materials 0.000 claims description 14
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 229910052712 strontium Inorganic materials 0.000 claims description 14
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 14
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052719 titanium Inorganic materials 0.000 claims description 14
- 239000011267 electrode slurry Substances 0.000 claims description 9
- 239000011268 mixed slurry Substances 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 abstract description 3
- 230000003068 static effect Effects 0.000 abstract 3
- 230000000694 effects Effects 0.000 abstract 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 238000005266 casting Methods 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 6
- 229910010271 silicon carbide Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/22—Electrostatic or magnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
Some embodiments of the invention provide a multi-layered ceramic capacitor and a method for the same. The multi-layered ceramic capacitor comprises a ceramic body, a plurality of internal electrodes, an external electrode and a static discharging protection layer. A plurality of dielectric layers are laminated in the ceramic body; the plurality of internal electrodes are formed on the upper surface of the dielectric layers in a way of enabling the internal electrodes and the dielectric layers are alternatively laminated; the external electrode is formed on the surface of the ceramic body to be electrically connected wtih the internal electrodes; and the static discharging protection layer is placed between the plurality of dielectric layers to protect the internal electrodes from effects of static of the external electrode.
Description
The cross reference of related application
This application claims and submit to the rights and interests of No. 10-2014-0002478th, the korean patent application of Korean Intellectual Property Office on January 8th, 2014, the full content of this korean patent application is incorporated into this by quoting mode as proof.
Technical field
The present invention relates to multilayer ceramic capacitor and manufacture method thereof.
Background technology
Multilayer ceramic capacitor (MLCC) is the capacitor of chip type, usually be arranged in the printed circuit board (PCB) as the various electronic products of mobile communication terminal, notebook computer, PC and personal digital assistant (PDA), to play the important function of charging and discharging.According to purposes and capacity, MLCC adopts the form of various sizes and stratiform.
Along with electronic product becomes more and more less, require laminated ceramic electronic component to become less and there is larger capacity.Therefore, carried out various trial to make dielectric medium and internal electrode thinner and have more multi-layered.In addition, recently along with dielectric layer becomes thinner, the laminated ceramic electronic component manufactured recently has the quantity of the layer of the increase be laminated to wherein.
Correlation technique of the present invention discloses No. 10-2012-0045373 (AMULTI-LAYERED CERAMIC CAPACITOR AND A MANUFACTURINGMETHOD THEREOF (multilayer ceramic capacitor and manufacture method thereof) in Korean Patent; On May 9th, 2012 is open) in open.
Summary of the invention
The invention provides multilayer ceramic capacitor and manufacture method thereof, in described multilayer ceramic capacitor, be formed with electrostatic discharge (ESD) protection layer.
An aspect of of the present present invention provides a kind of multilayer ceramic capacitor.Multilayer ceramic capacitor according to embodiment of the present invention can comprise: ceramic body, and described ceramic body middle level is pressed with multiple dielectric layer; Multiple internal electrode, described multiple internal electrode is to be respectively formed at above described dielectric layer with the mode of dielectric layer alternatively laminated; Outer electrode, to be electrically connected with described internal electrode on the surface that described outer electrode is formed in described ceramic body; And electrostatic discharge (ESD) protection layer, described electrostatic discharge (ESD) protection layer between described multiple dielectric layer to protect described internal electrode from the impact of the electrostatic brought into from described outer electrode.
Electrostatic discharge (ESD) protection layer can comprise at least one in barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) and zirconium (Zr).
Electrostatic discharge (ESD) protection layer can contact with internal electrode.
Dielectric layer can be formed with receiving slit, and internal electrode can be formed in receiving slit.
The degree of depth of receiving slit can be identical with the thickness of internal electrode.
The length of the comparable internal electrode of length of electrostatic discharge (ESD) protection layer is longer.
Electrostatic discharge (ESD) protection layer can the side surface of covering internal electrode.
Dielectric piece can between internal electrode and electrostatic discharge (ESD) protection layer.
Electrostatic discharge (ESD) protection layer can be formed in the below of the mid-plane of ceramic body.
Multilayer ceramic capacitor according to another execution mode of the present invention can comprise: ceramic body, and described ceramic body middle level is pressed with multiple dielectric layer; Multiple internal electrode, described multiple internal electrode is to be respectively formed at above described dielectric layer with the mode of dielectric layer alternatively laminated; Outer electrode, to be electrically connected with internal electrode on the surface that described outer electrode is formed in ceramic body; And electrostatic discharge (ESD) protection layer, to wrap up internal electrode on the surface that described electrostatic discharge (ESD) protection layer is formed in internal electrode, thus protection internal electrode is from the impact of the electrostatic brought into from outer electrode.
Electrostatic discharge (ESD) protection layer can comprise at least one in barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) and zirconium (Zr).
Another aspect provides the manufacture method of multilayer ceramic capacitor.Manufacture method according to the multilayer ceramic capacitor of embodiment of the present invention can comprise: prepare multiple dielectric layer and electrostatic discharge (ESD) protection layer; The upper surface of each dielectric layer prints internal electrode; By to make the mode laminated dielectric layer of electrostatic discharge (ESD) protection layer all between dielectric layer and electrostatic discharge (ESD) protection layer and to form laminate.
Electrostatic discharge (ESD) protection layer can comprise at least one in barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) and zirconium (Zr).
The step preparing multiple dielectric layer and electrostatic discharge (ESD) protection layer can be included on each dielectric layer and form receiving slit, and the step of printing internal electrode can comprise and being printed in receiving slit by internal electrode.
In the step of printing internal electrode, the thickness of internal electrode can be identical with the degree of depth of receiving slit.
The step forming laminate can comprise to be put into dielectric piece between internal electrode and electrostatic discharge (ESD) protection layer.
Manufacture method according to the multilayer ceramic capacitor of another execution mode of the present invention can comprise: prepare multiple dielectric layer; Mixed slurry is made by being blended in electrode slurry by electrostatic discharge (ESD) protection material; By mixed slurry printing is formed internal electrode on the dielectric layer; Laminate is formed by laminated dielectric layer; And sinter layer casting die is to allow electrostatic discharge (ESD) protection material to form electrostatic discharge (ESD) protection layer, described electrostatic discharge (ESD) protection layer is configured for the impact of protection internal electrode from the electrostatic on the top layer of internal electrode.
Electrostatic discharge (ESD) protection material can comprise at least one in barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) and zirconium (Zr).
The manufacture method of multilayer ceramic capacitor can also comprise, and after the step of sinter layer casting die, the side surface of laminate forms outer electrode, and outer electrode is configured to be electrically connected with internal electrode.
Accompanying drawing explanation
Fig. 1, Fig. 2, Fig. 3 and Fig. 4 show the multilayer ceramic capacitor according to embodiment of the present invention.
Fig. 5 shows the flow chart of the manufacture method of the multilayer ceramic capacitor according to embodiment of the present invention.
Fig. 6 shows the process of the manufacture method of the multilayer ceramic capacitor according to embodiment of the present invention.
Fig. 7 and Fig. 8 shows the process of the manufacture method of the multilayer ceramic capacitor according to other execution modes of the present invention.
Fig. 9 shows the flow chart of the manufacture method of the multilayer ceramic capacitor according to the another execution mode of the present invention.
Embodiment
Hereinafter, some execution mode according to multilayer ceramic capacitor of the present invention and manufacture method thereof is described in detail with reference to accompanying drawing.When being described with reference to the drawings of the present invention, any identical or corresponding element will be assigned with identical reference number, and can not carry out unnecessary description to it.
The term of such as " first " and " second " can only for separating identical with another for element or corresponding element region, but said elements should not be limited to above-mentioned term.
When an element is described to " coupling " to another element, this not merely refer to physics between these two elements, directly contact, but also following possibility should be comprised, namely, another element is between these two elements, and each in these two elements contacts with described another element.
Fig. 1 shows the multilayer ceramic capacitor according to embodiment of the present invention, and Fig. 2, Fig. 3 and Fig. 4 show the multilayer ceramic capacitor according to other execution modes of the present invention.
With reference to Fig. 1, ceramic body 110, outer electrode 140, internal electrode 120 and electrostatic discharge (ESD) protection layer 130 can be comprised according to the multilayer ceramic capacitor 100 of embodiment of the present invention.
Lamination in ceramic body 110 is also formed with multiple dielectric layer.Dielectric layer 111 is by based on barium titanate (BaTiO
3) material in additive package and making.Ceramic body 110 can have cubical shape.
Internal electrode 120 is formed on the upper surface of dielectric layer 111 of ceramic body 110.Internal electrode 120 can comprise the first internal electrode 121 and the second internal electrode 122, described first internal electrode and the second internal electrode alternatively laminated and have reciprocal polarity.First internal electrode 121 is formed as the surface being exposed to ceramic body 110, and the second internal electrode 122 is formed as another surface relative with an above-mentioned surface of described ceramic body 110 being exposed to ceramic body 110.Internal electrode 120 is formed as shorter than dielectric layer 111.
The outer electrode 140 be formed on the surface of ceramic body 110 can be formed on the side surface of ceramic body 110.Outer electrode 140 is electrically connected with internal electrode 120.Outer electrode 140 comprises the first outer electrode 141 and the second outer electrode 142, and the first outer electrode 141 is connected with the second internal electrode 122 with the first internal electrode 121 respectively with the second outer electrode 142.When ceramic body 110 has cubic shaped, first outer electrode 141 can be formed on a surface of ceramic body 110, and the second outer electrode 142 can be formed in another surface relative with an above-mentioned surface of described ceramic body 110 of ceramic body 110.
Electrostatic discharge (ESD) protection layer 130 can to protect internal electrode 120 from the impact of the electrostatic brought into from outer electrode 140 between multiple dielectric layer 111.
electrostaticdischarge prevention layer 130 has antistatic property and can comprise at least one in barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) and zirconium (Zr).
Electrostatic discharge (ESD) protection layer 130 can comprise the oxide of barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) or zirconium (Zr).
Such as, electrostatic discharge (ESD) protection layer 130 can comprise aluminium oxide (Al
2o
3), zirconia (ZrO
2), carborundum (SiC) etc.
With reference to Fig. 1, electrostatic discharge (ESD) protection layer 130 can be formed as having the length identical with the length of dielectric layer 111.In other words, the first internal electrode 121 and the second outer electrode 142 spatially can be separated each other by electrostatic discharge (ESD) protection layer 130.
Electrostatic discharge (ESD) protection layer 130 can be formed as contacting with internal electrode 120.In this case, except internal electrode 120, other material is not had to be present between dielectric layer 111 and electrostatic discharge (ESD) protection layer 130.
At this, in dielectric layer 111, receiving slit 112 can be had, and internal electrode 120 can be formed in receiving slit 112.The degree of depth of receiving slit 112 can be identical with the thickness of internal electrode 120.
Therefore, dielectric layer and internal electrode 120 can form smooth plane, and electrostatic discharge (ESD) protection layer 130 can be formed in described smooth plane.
Electrostatic discharge (ESD) protection layer 130 can be formed in the below of the mid-plane of ceramic body 110.Because internal electrode 120 may be mainly in the electrostatic damage at the bottom place of ceramic body 110, therefore electrostatic discharge (ESD) protection layer 130 can be formed in the below of the mid-plane of ceramic body 110 effectively to utilize space.
On the vertical section of multilayer ceramic capacitor 100, being needed by the internal electrode 120 being placed on orlop place and the area of part that is placed in ceramic body 110 that electrostatic discharge (ESD) protection layer 130 that the superiors locate limits is at least the predetermined value of effective area.At this, " effective area " is the area of the electric capacity being enough to realize capacitor, refers to the longitudinal cross-section area from nethermost internal electrode 120 to uppermost internal electrode 120.
On the vertical section of multilayer ceramic capacitor 100, can be at least 3% of effective area by the internal electrode 120 being placed on orlop place and the area of part that is placed in ceramic body 110 that electrostatic discharge (ESD) protection layer 130 that the superiors locate limits.
With reference to Fig. 2, according in the multilayer ceramic capacitor 100 of another execution mode of the present invention, electrostatic discharge (ESD) protection layer 130 can be formed as longer than internal electrode 120 and the side surface of covering internal electrode 120.
With reference to Fig. 3, according in the multilayer ceramic capacitor 100 of the another execution mode of the present invention, dielectric piece 113 can between internal electrode 120 and electrostatic discharge (ESD) protection layer 130.Dielectric piece 113 can be made up of the dielectric material identical with the dielectric material of dielectric layer 111 as above.Utilize dielectric piece 113, electrostatic discharge (ESD) protection layer 130 can be formed as separating with internal electrode 120.
With reference to Fig. 4, according in the multilayer ceramic capacitor 100 of the another execution mode of the present invention, internal electrode 120 can be formed on dielectric layer 111, and electrostatic discharge (ESD) protection layer 130 can be formed in internal electrode 120 surface on to wrap up internal electrode 120.
As mentioned above, utilize the multilayer ceramic capacitor according to embodiment of the present invention, electrostatic discharge (ESD) protection layer and internal electrode are adjacent to be formed, and make it possible to the multilayer ceramic capacitor providing high electrostatic resistance.
So far, the multilayer ceramic capacitor according to some execution modes of the present invention has been described.Hereinafter, the manufacture method according to the multilayer ceramic capacitor of some execution modes of the present invention will be described.
Fig. 5 shows the flow chart of the manufacture method of the multilayer ceramic capacitor according to embodiment of the present invention.Fig. 6 shows the process of the manufacture method of the multilayer ceramic capacitor according to embodiment of the present invention.Fig. 7 and Fig. 8 shows the process of the manufacture method of the multilayer ceramic capacitor according to other execution modes of the present invention.
With reference to Fig. 5, the manufacture method according to the multilayer ceramic capacitor of an execution mode can comprise: prepare multiple dielectric layer and electrostatic discharge (ESD) protection layer (S110); The upper surface of each dielectric layer prints internal electrode (S120); Laminate (S130) is formed to make the mode of each electrostatic discharge (ESD) protection layer between dielectric layer; And form outer electrode (S140).
With reference to Fig. 6, in the step preparing multiple dielectric layer 111 and electrostatic discharge (ESD) protection layer 130 (S110), prepare the multiple dielectric layers 111 be made up of dielectric material and the multiple electrostatic discharge (ESD) protection layers 130 be made up of electrostatic discharge (ESD) protection material.
Electrostatic discharge (ESD) protection layer 130 has antistatic property and can comprise at least one in barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) and zirconium (Zr).
Electrostatic discharge (ESD) protection layer 130 can comprise the oxide of barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) or zirconium (Zr).
Such as, electrostatic discharge (ESD) protection layer 130 can comprise aluminium oxide (Al
2o
3), zirconia (ZrO
2), carborundum (SiC) etc.
In the present embodiment, receiving slit 112 can be formed with in dielectric layer 111.Receiving slit 112 can have towards dielectric layer 111 shape that surface is opened.
Print on the upper surface of each dielectric layer 111 wherein in the step of internal electrode 120 (S120), internal electrode 120 by printing electrode slurry and being formed on the upper surface of each dielectric layer 111.Internal electrode 120 can be formed in receiving slit 112 and can be formed as having the degree of depth identical with thickness with the degree of depth of receiving slit 112 and thickness.
To make the mode of each electrostatic discharge (ESD) protection layer 130 between dielectric layer 111 form (S130) in the step of laminate; dielectric layer 111 and electrostatic discharge (ESD) protection layer 130 are by whole lamination, but each electrostatic discharge (ESD) protection layer 130 is all between dielectric layer 111.The product with all dielectric layers 111 and electrostatic discharge (ESD) protection layer 130 can be called as " laminate ".Laminate can be pressed after lamination.
In the step forming outer electrode 140 (S140), the outer electrode 140 be electrically connected with internal electrode 120 is formed on the surface of laminate.Outer electrode 140 can be formed on the surface of the either side of laminate.
With reference to Fig. 7, in the manufacture method of the multilayer ceramic capacitor 100 according to another execution mode of the present invention, internal electrode 120 is formed on the upper surface of dielectric layer 111, instead of internal electrode 120 is formed in receiving slit 112.When laminate layers casting die, when pressing layer casting die, flexible electrostatic discharge (ESD) protection layer 130 becomes the surface contact with dielectric layer 111.At this, the thickness of the either end of laminate can be less than the thickness of intermediate portion.
With reference to Fig. 8, in the manufacture method of the multilayer ceramic capacitor 100 according to the another execution mode of the present invention, the step (S130) forming laminate can comprise to be put into dielectric piece 113 between internal electrode 120 and electrostatic discharge (ESD) protection layer 130.Dielectric piece 113 can be made up of the dielectric material identical with the dielectric material of dielectric layer 111.
Fig. 9 is the flow chart of the manufacture method of the multilayer ceramic capacitor illustrated according to the another execution mode of the present invention.
With reference to Fig. 9, the manufacture method according to the multilayer ceramic capacitor of the another execution mode of the present invention can comprise: prepare multiple dielectric layer (S210); Make mixed slurry (S220); Form internal electrode (S230); Form laminate (S240); Sinter layer casting die (S250); And form outer electrode (S260).
In the step forming multiple dielectric layer 111 (S210), prepare the multiple layers be made up of dielectric material.
In the step manufacturing mixed slurry (S220), form mixed slurry by being blended in electrode slurry by electrostatic discharge (ESD) protection material.
Electrode slurry is the slurry with conductivity.The electrode slurry of fluid can become electrode after printing and solidification.Electrode slurry can comprise at least one in nickel (Ni), palladium (Pd) and copper (Cu).
Electrostatic discharge (ESD) protection material has antistatic property and can comprise at least one in barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) and zirconium (Zr).
Electrostatic discharge (ESD) protection material can comprise the oxide of barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) or zirconium (Zr).
Such as, electrostatic discharge (ESD) protection material can comprise aluminium oxide (Al
2o
3), zirconia (ZrO
2), carborundum (SiC) etc.
In the step forming internal electrode 120 (S230), form internal electrode 120 by being printed on dielectric layer 111 by mixed slurry.
In the step forming laminate (S240), form laminate by the multiple dielectric layer 111 of lamination.
In the step of sinter layer casting die (S250), under predetermined high temperature, fire laminate.At this, between electrode slurry and electrostatic discharge (ESD) protection material, there is the difference of sintering temperature.Therefore, the electrode slurry be first sintered is towards internal contraction, and electrostatic discharge (ESD) protection material sintering is on the superficial layer of internal electrode 120, forms the electrostatic discharge (ESD) protection layer 130 of protection internal electrode 120 from electrostatic influence.
In the step forming outer electrode 140 (S260), outer electrode 140 is printed in the laminate of sintering, and sintered electrode.As mentioned above, outer electrode 140 is electrically connected with internal electrode 120 and is formed on the surface of laminate.
According to this method, the additional step that (skip saves) forms electrostatic discharge (ESD) protection layer 130 can be skipped, and electrostatic discharge (ESD) protection layer 130 easily can be formed by the difference of sintering temperature, simplifies manufacture process thus.
As mentioned above, utilize the manufacture method of the multilayer ceramic capacitor according to some execution mode of the present invention, electrostatic discharge (ESD) protection layer can be adjacent to be formed with internal electrode, makes it possible to the multilayer ceramic capacitor providing high electrostatic resistance.
Although describe some embodiments of the present invention so far, but should be understood that for those skilled in the art, when not departing from technical conceive of the present invention, by supplementing, amendment, deleting and/or increase element can modifications and variations of the present invention are, and technical conceive of the present invention should be defined by the following claims.Will also be understood that such amendment and/or change are included in right of the present invention equally.
Claims (19)
1. a multilayer ceramic capacitor, comprising:
Ceramic body, described ceramic body middle level is pressed with multiple dielectric layer;
Multiple internal electrode, described multiple internal electrode is respectively formed on the upper surface of described dielectric layer to make the mode of described internal electrode and described dielectric layer alternatively laminated;
Outer electrode, to be electrically connected with described internal electrode on the surface that described outer electrode is formed in described ceramic body; And
Electrostatic discharge (ESD) protection layer, described electrostatic discharge (ESD) protection layer between described multiple dielectric layer to protect described internal electrode from the impact of the electrostatic brought into from described outer electrode.
2. multilayer ceramic capacitor according to claim 1; wherein, described electrostatic discharge (ESD) protection layer comprises at least one in barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) and zirconium (Zr).
3. multilayer ceramic capacitor according to claim 1, wherein, described electrostatic discharge (ESD) protection layer contacts with described internal electrode.
4. multilayer ceramic capacitor according to claim 3, wherein, described dielectric layer is formed with receiving slit, and described internal electrode is formed in described receiving slit.
5. multilayer ceramic capacitor according to claim 4, wherein, the degree of depth of described receiving slit is identical with the thickness of described internal electrode.
6. multilayer ceramic capacitor according to claim 1, wherein, the length of described electrostatic discharge (ESD) protection layer is longer than the length of described internal electrode.
7. multilayer ceramic capacitor according to claim 6, wherein, described electrostatic discharge (ESD) protection layer covers the side surface of described internal electrode.
8. multilayer ceramic capacitor according to claim 1, wherein, dielectric piece is between described internal electrode and described electrostatic discharge (ESD) protection layer.
9. multilayer ceramic capacitor according to claim 1, wherein, described electrostatic discharge (ESD) protection layer is formed in the below of the mid-plane of described ceramic body.
10. a multilayer ceramic capacitor, comprising:
Ceramic body, described ceramic body middle level is pressed with multiple dielectric layer;
Multiple internal electrode, described multiple internal electrode is respectively formed on described dielectric layer to make the mode of described internal electrode and described dielectric layer alternatively laminated;
Outer electrode, to be electrically connected with described internal electrode on the surface that described outer electrode is formed in described ceramic body; And
Electrostatic discharge (ESD) protection layer, to wrap up described internal electrode on the surface that described electrostatic discharge (ESD) protection layer is formed in described internal electrode, thus protects described internal electrode from the impact of the electrostatic brought into from described outer electrode.
11. multilayer ceramic capacitors according to claim 10; wherein, described electrostatic discharge (ESD) protection layer comprises at least one in barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) and zirconium (Zr).
The manufacture method of 12. 1 kinds of multilayer ceramic capacitors, comprising:
Prepare multiple dielectric layer and electrostatic discharge (ESD) protection layer;
The upper surface of each dielectric layer prints internal electrode;
By forming laminate with dielectric layer described in the mode lamination making each described electrostatic discharge (ESD) protection layer all insert between described dielectric layer and described electrostatic discharge (ESD) protection layer.
13. manufacture methods according to claim 12; wherein, described electrostatic discharge (ESD) protection layer comprises at least one in barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) and zirconium (Zr).
14. manufacture methods according to claim 12, wherein, the step preparing multiple dielectric layer and electrostatic discharge (ESD) protection layer is included on each described dielectric layer and forms receiving slit, and
The step of wherein printing internal electrode comprises prints described internal electrode by described receiving slit.
15. manufacture methods according to claim 14, wherein, in the step of printing internal electrode, the thickness of described internal electrode is identical with the degree of depth of described receiving slit.
16. manufacture methods according to claim 12, the step forming laminate comprises to be put into dielectric piece between described internal electrode and described electrostatic discharge (ESD) protection layer.
The manufacture method of 17. 1 kinds of multilayer ceramic capacitors, comprising:
Prepare multiple dielectric layer;
Mixed slurry is made by being blended in electrode slurry by electrostatic discharge (ESD) protection material;
Internal electrode is formed by being printed on described dielectric layer by described mixed slurry;
Laminate is formed by dielectric layer described in lamination; And
Sinter described laminate to allow described electrostatic discharge (ESD) protection material to form electrostatic discharge (ESD) protection layer, described electrostatic discharge (ESD) protection layer is configured for the impact protecting described internal electrode from the electrostatic on the superficial layer of described internal electrode.
18. manufacture methods according to claim 17; wherein, described electrostatic discharge (ESD) protection material comprises at least one in barium (Ba), titanium (Ti), calcium (Ca), zinc (Zn), manganese (Mn), lanthanum (La), strontium (Sr), silicon (Si), aluminium (Al) and zirconium (Zr).
19. manufacture methods according to claim 17, after the step of the described laminate of sintering, the side surface being also included in described laminate is formed the step of outer electrode, described outer electrode is constructed to be electrically connected with described internal electrode.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0002478 | 2014-01-08 | ||
| KR1020140002478A KR102078014B1 (en) | 2014-01-08 | 2014-01-08 | Multi-layered ceramic capacitor and method for the same |
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| CN104766721A true CN104766721A (en) | 2015-07-08 |
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| JP (1) | JP2015130475A (en) |
| KR (1) | KR102078014B1 (en) |
| CN (1) | CN104766721A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11282646B2 (en) * | 2019-09-02 | 2022-03-22 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component having effective coverage of external electrode |
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| KR102166128B1 (en) | 2015-12-29 | 2020-10-15 | 삼성전기주식회사 | Multilayer ceramic capacitor and manufacturing method of the same |
| KR102163418B1 (en) | 2018-11-02 | 2020-10-08 | 삼성전기주식회사 | Multi-layered ceramic capacitor |
| CN117275943B (en) * | 2023-09-26 | 2024-05-28 | 德阳三环科技有限公司 | Method for improving bending resistance of multilayer chip ceramic capacitor |
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| JP2000340450A (en) * | 1999-05-26 | 2000-12-08 | Kyocera Corp | Laminated ceramic capacitor and manufacture thereof |
| JP5182129B2 (en) * | 2009-02-02 | 2013-04-10 | 富士通株式会社 | Multilayer capacitor and manufacturing method thereof |
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2014
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| US11282646B2 (en) * | 2019-09-02 | 2022-03-22 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component having effective coverage of external electrode |
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| JP2015130475A (en) | 2015-07-16 |
| KR20150082936A (en) | 2015-07-16 |
| KR102078014B1 (en) | 2020-02-17 |
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Application publication date: 20150708 |