CN104765170B - The long line restorative procedure of COA array substrate - Google Patents
The long line restorative procedure of COA array substrate Download PDFInfo
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- CN104765170B CN104765170B CN201510181326.3A CN201510181326A CN104765170B CN 104765170 B CN104765170 B CN 104765170B CN 201510181326 A CN201510181326 A CN 201510181326A CN 104765170 B CN104765170 B CN 104765170B
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- long line
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
Abstract
The invention discloses a kind of long line restorative procedures of COA array substrate, belong to field of display technology, solve the technical issues of prior art middle or long line metal is easy to fall off.The long line restorative procedure includes: to open up the first via hole at the both ends in the first long line region, exposes compound wire to be repaired；The transparent electrode and color blocking in the described first long line region are removed, first groove is formed；The first long line metal is formed in the first groove, connect the both ends of the described first long line metal by first via hole with the compound wire to be repaired.The present invention can be used for the manufacturing process of COA array substrate.
Description
Technical field
The present invention relates to field of display technology, specifically, being related to a kind of long line restorative procedure of COA array substrate.
Background technique
With the development of display technology, liquid crystal display has become most commonly seen display device.
Currently, the demand of the display quality of liquid crystal display is continuously improved in people, therefore color blocking and black matrix are set
The technology for setting in array substrate (Color Filter on Array, abbreviation COA) is more and more applied in liquid crystal
In display.Because the color blocking and black matrix in COA technology are arranged in array substrate, pair of color blocking layer and metallic circuit
Position is more accurate, and the deviation generated when can be avoided traditional array substrate and color membrane substrates to box causes aperture opening ratio to reduce and leak
The problem of light, to improve the display quality of liquid crystal display.
In the manufacturing process of COA array substrate, long line reparation is a critical processes, and principle is to make to plate using laser
Film Metal gasification condenses in long line region, shape growth line metal, thus enable disconnect metal wire by long line metal again
It connects.Long line reparation is the final step of COA array substrate processing procedure, because long line renovation technique can make the temperature in long line region
Spend it is high, so the color blocking for being located at long line region can be carbonized because cannot withstand high temperature.The color blocking of carbonization is easy to make
Long line metal falls off, and the success rate of long line reparation is caused to reduce.
Summary of the invention
The purpose of the present invention is to provide a kind of long line restorative procedures of COA array substrate, to solve to grow in the prior art
The technical issues of line metal is easy to fall off.
The present invention provides a kind of long line restorative procedure of COA array substrate, comprising:
The first via hole is opened up at the both ends in the first long line region, exposes compound wire to be repaired；
The transparent electrode and color blocking in the described first long line region are removed, first groove is formed；
In the first groove formed the first long line metal, make the both ends of the described first long line metal with it is described to be repaired
Metal wire is connected by first via hole.
Preferably, the transparent electrode and color blocking in the removal first long line region, specifically:
Using laser, the transparent electrode in the first long line region is removed；
Using laser, the color blocking in the first long line region is removed.
Preferably, the described first long line metal is tungsten or molybdenum.
In one embodiment, the compound wire to be repaired is located at second metal layer.
In another embodiment, the compound wire to be repaired is located at the first metal layer.
Further, if there is overlapping, institute with the data line for being located at second metal layer in the first long line metal
State long line restorative procedure further include:
Place is being overlapped with the described first long line metal, is cutting off the data line.
Further, the long line restorative procedure further include:
The data line is repaired, specifically:
The second via hole is opened up at the both ends in the second long line region, exposes the data line；
The transparent electrode and color blocking in the described second long line region are removed, second groove is formed；
The second long line metal is formed in the second groove, makes the both ends of the described second long line metal and the data line
It is connected by second via hole.
Preferably, the described first long line region and the described second long line region are non-overlapping.
Preferably, the described second long line metal is tungsten or molybdenum.
Present invention offers it is following the utility model has the advantages that COA array substrate provided by the invention long line restorative procedure in,
After the both ends in one long line region open up the first via hole, the transparent electrode and color blocking in the first long line region are eliminated, forms
One groove.Because the color blocking in the first long line region has been removed, when forming the first long line metal in first groove,
The color blocking in the first long line region will not be caused to be carbonized, to solve the technical issues of long line metal falls off, greatly improved
The success rate of long line reparation.
Other features and advantages of the present invention will be illustrated in the following description, also, partly becomes from specification
It obtains it is clear that understand through the implementation of the invention.The objectives and other advantages of the invention can be by specification, right
Specifically noted structure is achieved and obtained in claim and attached drawing.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, required in being described below to embodiment
Attached drawing does simple introduction:
Fig. 1 is the schematic diagram one that the COA array substrate that the embodiment of the present invention one provides carries out long line reparation；
Fig. 2 is the sectional view in Fig. 1 along line A-A；
Fig. 3 is the schematic diagram two that the COA array substrate that the embodiment of the present invention one provides carries out long line reparation；
Fig. 4 is the sectional view in Fig. 3 along line B-B；
Fig. 5 is the schematic diagram one that COA array substrate provided by Embodiment 2 of the present invention carries out long line reparation；
Fig. 6 is the sectional view in Fig. 5 along line C-C；
Fig. 7 is the schematic diagram two that COA array substrate provided by Embodiment 2 of the present invention carries out long line reparation.
Specific embodiment
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings and examples, how to apply to the present invention whereby
Technological means solves technical problem, and the realization process for reaching technical effect can fully understand and implement.It needs to illustrate
As long as not constituting conflict, each feature in each embodiment and each embodiment in the present invention can be combined with each other,
It is within the scope of the present invention to be formed by technical solution.
Embodiment one:
The embodiment of the present invention provides a kind of long line restorative procedure of COA array substrate, can be applied to the length of COA array substrate
Line is repaired in processing procedure.As depicted in figs. 1 and 2, the COA array substrate in the present embodiment includes glass substrate 1, is located at the first metal
The scan line 21 of layer, data line 22, the first insulating layer 31, second insulating layer 32, color blocking 41, color blocking positioned at second metal layer
42, transparent electrode 5.Wherein, the first insulating layer 31 and the usually optional silicon nitride material of second insulating layer 32, transparent electrode 5 are logical
Often optional indium tin oxide (ITO), data line 22 are the compound wire to be repaired in the present embodiment.
After long line region has been determined, long line reparation can be carried out, which includes:
S11: via hole 6 is opened up at the both ends in long line region, exposes data line 22.
As shown in Figure 1, being punched using laser at the both ends in long line region, data should be penetrated by being formed by via hole 6
The structures such as second insulating layer 32, color blocking 41,42 above line 22, are exposed data line 22.
S12: removing the transparent electrode 5 and color blocking 41,42 in long line region, forms groove.
As depicted in figs. 1 and 2, first with the laser of small energy appropriate, the transparent electrode 5 in long line region is removed.So
The laser for recycling small energy appropriate afterwards removes the color blocking 41,42 in long line region, forms groove 7.In order to guarantee long line region
Color blocking 41,42 can completely remove, groove 7 should have enough depth, can be deep to and get rid of part second insulating layer
32。
The design parameter of the laser of the small energy used twice above can lead to for the COA array substrate of different size
Experimental debugging is crossed to obtain.
S13: the shape growth line metal 8 in groove 7.
As shown in Figure 3 and Figure 4, condense in plating filmed metals gasification in groove 7 using laser, shape growth line metal 8, and
It connect the both ends of long line metal 8 by via hole 6 with data line 22, to realize the long line reparation of data line 22.The present embodiment
In long line metal 8 be preferably tungsten or molybdenum.
In the long line restorative procedure of COA array substrate provided in an embodiment of the present invention, opened up at the both ends in long line region
After hole 6, the transparent electrode 5 and color blocking 41,42 in long line region are eliminated, groove 7 is formd.Because of the color blocking in long line region
41, it 42 has been removed, so the color blocking carbonization in growth line region will not be made in groove 7 when shape growth line metal 8, from
And solve the technical issues of long line metal falls off, the success rate of long line reparation greatly improved.
Embodiment two:
As shown in Figure 5 and Figure 6, the COA array substrate in the present embodiment is basically the same as the first embodiment, including glass substrate
1, positioned at the scan line of the first metal layer 21, the data line 22 positioned at second metal layer, the first insulating layer 31, second insulating layer
32, color blocking 41, color blocking 42, transparent electrode 5.It is between the present embodiment and embodiment one the difference lies in that in the present embodiment to
Reparation metal wire is scan line 21.
Long line restorative procedure provided in an embodiment of the present invention includes:
S21: the first via hole 61 is opened up at the both ends in the first long line region, exposes scan line 21.
Specifically, being punched using laser at the both ends in the first long line region, being formed by the first via hole 61 should be worn
The structures such as the first insulating layer 31, second insulating layer 32, color blocking 41,42 above saturating scan line, are exposed scan line 21.
S22: the transparent electrode 5 and color blocking 41,42 in the first long line region of removal form first groove.
First with the laser of small energy appropriate, the transparent electrode 5 in the first long line region is removed.Then it is appropriate to recycle
Small energy laser, remove the first long line region color blocking 41,42, formed first groove.In order to guarantee the first long line region
Color blocking 41,42 can completely remove, first groove should have enough depth, can be deep to get rid of part second insulation
Layer 32.
The design parameter of the laser of the small energy used twice above can lead to for the COA array substrate of different size
Experimental debugging is crossed to obtain.
S23: the first long line metal 81 is formed in first groove.
As shown in Figure 5 and Figure 6, plating filmed metals gasification is condensed in first groove using laser, form the first long line gold
Belong to 81, and connect the both ends of the first long line metal 81 by the first via hole 61 with scan line 21, to realize scan line 21
Long line reparation.
In the long line restorative procedure of COA array substrate provided in an embodiment of the present invention, opened at the both ends in the first long line region
If after the first via hole 61, eliminating the transparent electrode 5 and color blocking 41,42 in the first long line region, foring first groove.Because
Color blocking 41,42 in first long line region has been removed, so when forming the first long line metal 81 in first groove, also not
The color blocking carbonization that will cause the first long line region, to solve the technical issues of long line metal falls off, greatly improved long line
The success rate of reparation.
Further, overlapped if the first long line metal 81 exists with the data line 22 for being located at second metal layer, this
The long line restorative procedure that inventive embodiments provide further include:
S24: place is being overlapped with the first long line metal 81, is cutting off data line 22.
As shown in Figure 5 and Figure 6, the first groove formed in step S22 is deeper, and causes second insulating layer 32 impaired,
Due to second insulating layer 32 thickness usually only 1000 toSo the first long line metal 81 in first groove holds very much
Short circuit easily occurs with data line 22, and then leads to 22 short circuit of scan line 21 and data line.Therefore, in data line 22 and the first long line
The overlapping place of metal 81 all cuts off in the region positioned at the first long 81 two sides of line metal of data line 22.
In other embodiments, it if the first long line metal and any one data line are all not present overlapping, is not required to
Data line is cut off, that is, carries out that long line reparation can be completed to step S23.
Since in above-mentioned step S24, data line 22 is cut off, therefore long line reparation provided in an embodiment of the present invention
Repair data line 22 is also needed in method.Its specific repair process and the description in embodiment one are essentially identical:
S25: the second via hole 62 is opened up at the both ends in the second long line region, exposes data line 22.
As shown in fig. 7, being punched using laser at the both ends in the second long line region, being formed by the second via hole 62 should
The structures such as second insulating layer 32, the color blocking 41,42 of 22 top of data line are penetrated, data line 22 is exposed.
S26: the transparent electrode 5 and color blocking 41,42 in the second long line region of removal form second groove.
First with the laser of small energy appropriate, the transparent electrode 5 in the second long line region is removed.Then it is appropriate to recycle
Small energy laser, remove the second long line region color blocking 41,42, formed second groove.In order to guarantee the second long line region
Color blocking 41,42 can completely remove, second groove should also be as having enough depth, can be deep to that get rid of part second exhausted
Edge layer 32.
The design parameter of the laser of the small energy used twice above can lead to for the COA array substrate of different size
Experimental debugging is crossed to obtain.
S27: the second long line metal 82 is formed in second groove.
Plating filmed metals gasification is condensed in second groove using laser, forms the second long line metal 82, and make second
The both ends of long line metal 82 are connect with data line 22 by the second via hole 62, so that the data line 22 that will be switched off is repaired again.This
The first long line metal 81 and the second long line metal 82 in embodiment are both preferably tungsten or molybdenum.
It should be noted that the first long line region in the present embodiment should be non-overlapping with the second long line region, and protect
Certain distance is held, then also can be non-overlapping between first groove and second groove and keeping certain distance, is formed by
One long line metal 81 and the second long line metal 82 also can be non-overlapping and keep certain distance, so as to avoid the first long line
It is short-circuit between metal 81 and the second long line metal 82, and then avoid short-circuit between scan line 21 and data line 22.
While it is disclosed that embodiment content as above but described only to facilitate understanding the present invention and adopting
Embodiment is not intended to limit the invention.Any those skilled in the art to which this invention pertains are not departing from this
Under the premise of the disclosed spirit and scope of invention, any modification and change can be made in the implementing form and in details,
But scope of patent protection of the invention, still should be subject to the scope of the claims as defined in the appended claims.
Claims (10)
1. a kind of long line restorative procedure of COA array substrate characterized by comprising
The first via hole is opened up at the both ends in the first long line region, exposes compound wire to be repaired；
The transparent electrode and color blocking in the described first long line region are removed, first groove is formed；
The first long line metal is formed in the first groove, makes the both ends of the described first long line metal and the metal to be repaired
Line is connected by first via hole.
2. the long line restorative procedure of COA array substrate according to claim 1, which is characterized in that the removal described the
The transparent electrode and color blocking in one long line region, specifically:
Using laser, the transparent electrode in the first long line region is removed；
Using laser, the color blocking in the first long line region is removed.
3. the long line restorative procedure of COA array substrate according to claim 1, which is characterized in that the first long line gold
Belong to is tungsten or molybdenum.
4. the long line restorative procedure of COA array substrate according to claim 1, which is characterized in that the metal to be repaired
Line is located at second metal layer.
5. the long line restorative procedure of COA array substrate according to claim 1, which is characterized in that the metal to be repaired
Line is located at the first metal layer.
6. the long line restorative procedure of COA array substrate according to claim 5, which is characterized in that if described first is long
Line metal exists with the data line for being located at second metal layer to be overlapped, then the long line restorative procedure further include:
Place is being overlapped with the described first long line metal, is cutting off the data line.
7. the long line restorative procedure of COA array substrate according to claim 6, which is characterized in that further include:
Repair the data line.
8. the long line restorative procedure of COA array substrate according to claim 7, which is characterized in that described to repair the number
According to line, specifically:
The second via hole is opened up at the both ends in the second long line region, exposes the data line；
The transparent electrode and color blocking in the described second long line region are removed, second groove is formed；
The second long line metal is formed in the second groove, passes through the both ends of the described second long line metal with the data line
The second via hole connection.
9. the long line restorative procedure of COA array substrate according to claim 8, which is characterized in that the area first Chang Xian
Domain and the described second long line region are non-overlapping.
10. the long line restorative procedure of COA array substrate according to claim 8, which is characterized in that the second long line gold
Belong to is tungsten or molybdenum.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510181326.3A CN104765170B (en) | 2015-04-17 | 2015-04-17 | The long line restorative procedure of COA array substrate |
| PCT/CN2015/078199 WO2016165173A1 (en) | 2015-04-17 | 2015-05-04 | Long-line repair method for coa array substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510181326.3A CN104765170B (en) | 2015-04-17 | 2015-04-17 | The long line restorative procedure of COA array substrate |
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| CN104765170A CN104765170A (en) | 2015-07-08 |
| CN104765170B true CN104765170B (en) | 2019-01-01 |
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| CN105759522B (en) * | 2016-05-11 | 2019-01-22 | 深圳市华星光电技术有限公司 | The broken wire repair method of TFT substrate |
| CN105785678B (en) * | 2016-05-12 | 2019-04-30 | 深圳市华星光电技术有限公司 | The broken wire repair method of TFT substrate |
| CN108227324B (en) * | 2018-01-15 | 2020-12-04 | 深圳市华星光电技术有限公司 | Test key and test method for broken line repair and broken line repair method |
| CN112700724B (en) * | 2020-12-30 | 2022-09-06 | 友达光电（昆山）有限公司 | Display panel |
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| CN101551560A (en) * | 2008-04-03 | 2009-10-07 | 上海广电Nec液晶显示器有限公司 | Liquid crystal display unit with broken wire restoring function and restoring method thereof |
| JP5552247B2 (en) * | 2009-03-26 | 2014-07-16 | 株式会社ジャパンディスプレイ | Liquid crystal display device and manufacturing method thereof |
| CN101776808B (en) * | 2010-02-10 | 2012-02-29 | 深超光电（深圳）有限公司 | Liquid crystal display array base plate and patching method thereof |
| CN102213879A (en) * | 2010-04-12 | 2011-10-12 | 北京京东方光电科技有限公司 | Film transistor array substrate and manufacturing and repairing methods thereof |
| CN103760727B (en) * | 2013-12-31 | 2016-07-06 | 深圳市华星光电技术有限公司 | The restorative procedure of thin-film transistor array base-plate, display panels and display panels |
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| CN104765170A (en) | 2015-07-08 |
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