CN104752289A - Transmission system and semiconductor processing device - Google Patents
Transmission system and semiconductor processing device Download PDFInfo
- Publication number
- CN104752289A CN104752289A CN201310750274.8A CN201310750274A CN104752289A CN 104752289 A CN104752289 A CN 104752289A CN 201310750274 A CN201310750274 A CN 201310750274A CN 104752289 A CN104752289 A CN 104752289A
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- China
- Prior art keywords
- transmission system
- manipulator
- recessed channel
- workpiece
- machined
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Abstract
The invention provides a transmission system and a semiconductor processing device. The transmission system comprises a mechanical arm, wherein the upper surface of the mechanical arm is used for bearing the workpiece to be processed; at least one concave channel is formed in the upper surface of the mechanical arm, at least one end of each concave channel extends towards the boundary of the mechanical arm along the radial direction of the mechanical arm, each concave channel and the lower surface of the workpiece to be processed can form the air flow passage, thus the air flow between the mechanical arm and the workpiece to be processed can be discharged through the air flow passage. The transmission system can effectively prevent the workpiece to be processed from slipping relative to the mechanical arm, improve the stability of the transmission system, improve the transmission quality of the transmission system and improve the applicability of the transmission system.
Description
Technical field
The invention belongs to semiconductor equipment and manufacture field, be specifically related to a kind of transmission system and semiconductor bulk process equipment.
Background technology
Semiconductor processing equipment is Application comparison process equipment widely, carries out the technique such as plated film, etching mainly through plasma to the workpiece to be machined of substrate etc.In semiconductor equipment, often need by transmission system, the workpiece to be machined not carrying out technique to be imported into in reaction chamber, and the workpiece to be machined completing technique is spread out of reaction chamber.
Fig. 1 is the structural representation of manipulator in existing transmission system.Refer to Fig. 1, transmission system comprises manipulator 11.Wherein, the upper surface of manipulator 11 is provided with at least three small embossments 12, the top of at least three small embossments 12 is for carrying workpiece to be machined S, and, each small embossment 12 adopts rubber or quartz material to make, and the diameter of each small embossment 12 is at about 3mm, and height is at about 1mm.Easy understand, the gap existed between the lower surface of workpiece to be machined S and the upper surface of manipulator 11, can as the passage of being derived by air-flow therebetween.
But, above-mentioned transmission system is adopted inevitably to there is following problem in actual applications: because manipulator 11 supports workpiece to be machined S by least three small embossments 12, make the contact area of workpiece to be machined S and manipulator 11 and frictional force little, therefore, manipulator 11 accelerate or retarded motion process in, and workpiece to be machined S and other parts generation wipings are when touching, easily cause the position of workpiece to be machined S on manipulator 11 to be moved even to come off from manipulator 11, this can cause harmful effect to follow-up work, even cause fragment rate high, thus cause economic benefit low.And when workpiece to be machined is the bonding pad that warpage is large, material is soft, easily there is warpage in workpiece to be machined, thus causes processing quality poor.
Summary of the invention
The present invention is intended to solve the technical problem existed in prior art, and provide a kind of transmission system and semiconductor processing equipment, it not only can prevent workpiece to be machined relative mechanical hand from sliding effectively, thus can improve the stability of transmission system; And the transmission quality of transmission system can be improved, the applicability of transmission system can also be improved.
The invention provides a kind of transmission system, comprise manipulator, the upper surface of described manipulator is for carrying workpiece to be machined, the upper surface of described manipulator is distributed with at least one recessed channel, at least one end of each described recessed channel extends to the boundary of described manipulator along the radial direction of described manipulator, the lower surface of each described recessed channel and described workpiece to be machined forms gas channel, discharges via this gas channel in order to make the air-flow between described manipulator and described workpiece to be machined.
Wherein, at least one recessed channel described is uniformly distributed on the upper surface of described manipulator.
Wherein, at least one recessed channel described comprises at least two annular concave paths and at least one straight recessed channel, and wherein said at least two annular concave paths are with the center of described manipulator upper surface for the center of circle, and radius is different; One end of at least one straight recessed channel described is positioned at the center position of the upper surface of described manipulator, and the other end extends to the boundary of described manipulator along the radial direction of described manipulator.
Wherein, at least two annular concave paths interval and evenly arranging in the radial direction of described manipulator.
Wherein, the quantity of described straight recessed channel is multiple, and multiple described straight recessed channel along described manipulator circumferential interval and evenly arrange.
Wherein, each described recessed channel is made up of at least two recessed channel sections independent of each other, and the shape that described at least two recessed channel sections are formed on described manipulator upper surface comprises the shape that broken line, curve or broken line are connected in series with curve.
Wherein, each described recessed channel is the helicoidal structure be wound around on described manipulator upper surface.
Wherein, the width range of each described recessed channel is 1 ~ 2mm.
The depth bounds of each described recessed channel is 1 ~ 2mm.
The present invention also provides a kind of semiconductor processing equipment, comprise transmission system and reaction chamber, wherein, described transmission system is used for the workpiece to be machined not completing technique to import in described reaction chamber, and the workpiece to be machined completing technique is spread out of in described reaction chamber, described transmission system adopts above-mentioned transmission system provided by the invention.
The present invention has following beneficial effect:
Transmission system provided by the invention, it by being distributed with at least one recessed channel on the upper surface of manipulator, and at least one end of each recessed channel extends to the boundary of manipulator along the radial direction of manipulator, each recessed channel and workpiece to be machined form gas channel, discharge via this gas channel in order to make the air-flow between manipulator and workpiece to be machined.As from the foregoing, workpiece to be machined is positioned on the upper surface of manipulator, this carries compared with workpiece to be machined with prior art by three small embossments, contact area and the frictional force of workpiece to be machined and manipulator can be increased, thus not only can effectively prevent workpiece to be machined relative mechanical hand from sliding, and then the stability of transmission system can be improved; And, because the contact area of workpiece to be machined and manipulator becomes large, thus the workpiece to be machined warpage that warpage is large or material is soft in the process of transmission workpiece to be machined can be prevented serious, thus the transmission quality of transmission system can be improved, the applicability of transmission system can also be improved.
Semiconductor processing equipment provided by the invention, it adopts transmission system provided by the invention, not only effectively can prevent workpiece to be machined relative mechanical hand from sliding, and then can improve the stability of transmission system; And the transmission quality of transmission system can be improved, the applicability of transmission system can also be improved.
Accompanying drawing explanation
Fig. 1 is the structural representation of manipulator in existing transmission system;
Fig. 2 is the first structural representation of manipulator in transmission system provided by the invention;
Fig. 3 is the end view of the manipulator in Fig. 2;
Fig. 4 is the partial enlarged drawing in I region in Fig. 3;
Fig. 5 is the second structural representation of manipulator in transmission system provided by the invention; And
Fig. 6 is the third structural representation of manipulator in transmission system provided by the invention.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, transmission system provided by the invention and semiconductor processing equipment are described in detail.
Fig. 2 is the first structural representation of manipulator in transmission system provided by the invention.Fig. 3 is the end view of the manipulator in Fig. 2.Fig. 4 is the partial enlarged drawing in I region in Fig. 3.See also Fig. 2, Fig. 3 and Fig. 4, the transmission system that the present embodiment provides comprises manipulator 20, the upper surface of manipulator 20 is for carrying workpiece to be machined S, and on the upper surface of manipulator 20, be distributed with at least one recessed channel 21, at least one end of each recessed channel 21 extends to the boundary of manipulator 20 along the radial direction of manipulator 20, each recessed channel 21 forms gas channel with the upper surface of workpiece to be machined S, discharges via this gas channel in order to make the air-flow between manipulator 20 and workpiece to be machined S.
In the present embodiment, as shown in Figure 3, at least one recessed channel 21 comprises at least two annular concave paths 211 and at least one straight recessed channel 212, and wherein, at least two annular concave paths 211 are with the center of manipulator 20 upper surface for the center of circle, and radius is different; One end of at least one straight recessed channel 212 is positioned at the center position of the upper surface of manipulator 20, and the other end extends to the boundary of manipulator 20 along the radial direction of manipulator 20.Easy understand, due to the setting of straight recessed channel 212, air-flow between annular concave path 211 and workpiece to be machined S lower surface can be discharged, further, preferably, straight recessed channel 212 is straight line in the shape of manipulator 20 upper surface, straight gas channel is defined between itself and workpiece to be machined S lower surface, this makes the flow path of air-flow relatively short, thus air-flow can be made to discharge rapidly, and then can improve the stability of transmission system.Certainly, in actual applications, straight recessed channel 212 also can comprise in the shape of manipulator 20 upper surface the shape that broken line, curve or broken line be connected in series with curve.
Preferably, at least one recessed channel 21 is uniformly distributed on the upper surface of manipulator 20, this can make the uniform stream at diverse location place between manipulator 20 upper surface and workpiece to be machined S lower surface and discharge rapidly, thus can reduce air-flow to have an impact to the workpiece to be machined being positioned at manipulator 20 upper surface, thus the stability of transmission system can be improved.In this enforcement, at least two annular concave paths 211 interval and evenly arranging in the radial direction of manipulator 20.
Further preferably, the quantity of straight recessed channel 212 is multiple, and multiple straight recessed channel 212 along manipulator 20 circumferential interval and evenly arrange, this not only can by the air-flow between annular concave path 211 and workpiece to be machined S lower surface from diverse location evenly and discharge rapidly, and can be discharged rapidly by the uniform stream at diverse location place between manipulator 20 upper surface and workpiece to be machined S lower surface further, thus the stability of transmission system can be improved further.
In the present embodiment, as shown in Figure 2, annular concave path 211 quantity is 4, the quantity of straight recessed channel 212 is 12, but, in actual applications, can according to the characteristic of the size of manipulator 20 upper surface, workpiece to be machined S and for avoiding workpiece to be machined S-phase specifically to set the quantity of annular concave path 211 and straight recessed channel 212 to factors such as the minimum friction needed for manipulator slip therebetween, wherein, the characteristic of workpiece to be machined S comprises the character such as soft or hard degree, friction factor of such as workpiece to be machined S material.Particularly, area for the upper surface of manipulator 20 material that is comparatively large, workpiece to be machined S is soft, warpage large, friction factor is less and/or workpiece to be machined and manipulator minimum friction therebetween larger time, it is relative more with the quantity of straight recessed channel 212 that annular concave path 211 can be set; When area for the upper surface of manipulator 20 is less, the material of workpiece to be machined S is hard, warpage is little, friction factor is comparatively large and/or workpiece to be machined is less with manipulator minimum friction therebetween, can arrange that annular concave path 211 is relative with the quantity of straight recessed channel 212 to be lacked.Certainly, in actual applications, need to consider various factors, the quantity of annular concave path 211 and straight recessed channel 212 is specifically set.In the present embodiment, manipulator 20 also can adopt structure as shown in Figure 5 and Figure 6, and in Figure 5, the quantity of annular concave path 211 is 2, and the quantity of straight recessed channel 212 is 12; In figure 6, the quantity of annular concave path 211 is 4, and the quantity of straight recessed channel 212 is 3.
In the present embodiment, due to the out-of-shape of manipulator 20 upper surface, as shown in Figure 2, therefore, the recessed channel that manipulator 20 upper surface is arranged not only comprises annular concave path 211 and straight recessed channel 212, but also comprise auxiliary recessed channel 213, wherein, auxiliary recessed channel 213 is curve in the shape of manipulator 20 upper surface, the position that can realize annular concave path 211 and straight recessed channel 212 do not relate on manipulator 20 upper surface by auxiliary recessed channel 213 compensates, thus the air-flow of any position between manipulator 20 and workpiece to be machined S can be realized to discharge.In actual applications, specifically according to the execution mode of the shape setting recessed channel 21 of manipulator 20 upper surface, such as, recessed channel 21 only can comprise auxiliary recessed channel 213, or recessed channel 21 comprises auxiliary recessed channel 213 and straight recessed channel 212.
It should be noted that, at least one recessed channel 21 that manipulator 20 is arranged, manipulator 20 is by workpiece to be machined S firm support to need consideration to ensure, namely, ensure there are enough contacts area between manipulator 20 and workpiece to be machined S, to prevent workpiece to be machined S-phase, manipulator 20 is slided; In addition, at guarantee manipulator 20 by under the prerequisite of workpiece to be machined S firm support, air-flow between manipulator 20 and workpiece to be machined S be ensured to discharge, to prevent from having an impact to the steadiness of workpiece to be machined S, therefore, the depth H and the width L that consider recessed channel 21 is just needed.In the present embodiment, preferably, the width L scope of each recessed channel 21 is 1 ~ 2mm; The depth H scope of each recessed channel 21 is 1 ~ 2mm.
Also it should be noted that, in the present embodiment, recessed channel 21 comprises annular concave path, straight recessed channel and auxiliary recessed channel 213, but the present invention is not limited thereto, in actual applications, the embodiment of recessed channel is a lot, such as, in actual applications, each recessed channel 21 can for be made up of at least two recessed channel sections independent of each other, and the shape that at least two recessed channel sections are formed on manipulator 20 upper surface comprises the shape that broken line, curve or broken line are connected in series with curve; And for example; also can each recessed channel 21 be the helicoidal structure that edge on manipulator 20, radial surface is wound around; because the embodiment of recessed channel 21 is a lot; do not enumerate at this; therefore; every can and workpiece to be machined form the recessed channel of gas channel being used for the air-flow between workpiece to be machined and manipulator to discharge, all belong to protection scope of the present invention.
It should be noted that in addition, transmission system provided by the invention also comprises retractable driving device and lifting drive, wherein, retractor device is used for driving device hand 20 and moves in the horizontal direction, lifting drive is used for driving device hand 20 in the vertical direction and moves, by the cooperation between retractable driving device, lifting drive and manipulator 20 realize transmit workpiece to be machined, due to its detailed process and prior art similar, do not repeat them here.
The transmission system that the present embodiment provides, it by being distributed with at least one recessed channel 21 on the upper surface of manipulator 20, and at least one end of each recessed channel 21 extends to the boundary of manipulator 20 along the radial direction of manipulator 20, each recessed channel 21 forms gas channel with workpiece to be machined S, discharges via this gas channel in order to make the air-flow between manipulator 20 and workpiece to be machined S.As from the foregoing, workpiece to be machined S is positioned on the upper surface of manipulator 20, this carries compared with workpiece to be machined with prior art by three small embossments, contact area and the frictional force of workpiece to be machined S and manipulator 20 can be increased, thus not only can effectively prevent workpiece to be machined S-phase from sliding to manipulator 20, and then the stability of transmission system can be improved; And, because the contact area of workpiece to be machined S and manipulator 20 becomes large, the workpiece to be machined warpage that warpage is large or material is soft in the process of transmission workpiece to be machined can be prevented serious, thus the transmission quality of transmission system can be improved, the applicability of transmission system can also be improved.
As another technical scheme, the present invention also provides a kind of semiconductor processing equipment, comprise transmission system and reaction chamber, wherein, transmission system is used for the workpiece to be machined not completing technique to import in reaction chamber, and spread out of in the workpiece to be machined autoreaction chamber completing technique, the transmission system that transmission system adopts above-described embodiment to provide.
Semiconductor processing equipment provided by the invention, its transmission system adopting above-described embodiment to provide, not only effectively can prevent workpiece to be machined relative mechanical hand from sliding, and then can improve the stability of transmission system; And the transmission quality of transmission system can be improved, the applicability of transmission system can also be improved.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, when not departing from principle of the present invention and essence, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a transmission system, comprise manipulator, the upper surface of described manipulator is for carrying workpiece to be machined, it is characterized in that, the upper surface of described manipulator is distributed with at least one recessed channel, at least one end of each described recessed channel extends to the boundary of described manipulator along the radial direction of described manipulator
The lower surface of each described recessed channel and described workpiece to be machined forms gas channel, discharges via this gas channel in order to make the air-flow between described manipulator and described workpiece to be machined.
2. transmission system according to claim 1, is characterized in that, at least one recessed channel described is uniformly distributed on the upper surface of described manipulator.
3. transmission system according to claim 1, is characterized in that, at least one recessed channel described comprises at least two annular concave paths and at least one straight recessed channel, wherein
Described at least two annular concave paths are with the center of described manipulator upper surface for the center of circle, and radius is different; One end of at least one straight recessed channel described is positioned at the center position of the upper surface of described manipulator, and the other end extends to the boundary of described manipulator along the radial direction of described manipulator.
4. transmission system according to claim 3, is characterized in that, at least two annular concave paths interval and evenly arranging in the radial direction of described manipulator.
5. transmission system according to claim 3, is characterized in that, the quantity of described straight recessed channel is multiple, and multiple described straight recessed channel along described manipulator circumferential interval and evenly arrange.
6. transmission system according to claim 1, it is characterized in that, each described recessed channel is made up of at least two recessed channel sections independent of each other, and the shape that described at least two recessed channel sections are formed on described manipulator upper surface comprises the shape that broken line, curve or broken line are connected in series with curve.
7. transmission system according to claim 1, is characterized in that, each described recessed channel is the helicoidal structure be wound around on described manipulator upper surface.
8. transmission system according to claim 1, is characterized in that, the width range of each described recessed channel is 1 ~ 2mm.
9. transmission system according to claim 1, is characterized in that, the depth bounds of each described recessed channel is 1 ~ 2mm.
10. a semiconductor processing equipment, comprise transmission system and reaction chamber, wherein, described transmission system is used for the workpiece to be machined not completing technique to import in described reaction chamber, and the workpiece to be machined completing technique is spread out of in described reaction chamber, it is characterized in that, described transmission system adopts the transmission system described in claim 1-9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750274.8A CN104752289B (en) | 2013-12-31 | 2013-12-31 | Transmission system and semiconductor processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750274.8A CN104752289B (en) | 2013-12-31 | 2013-12-31 | Transmission system and semiconductor processing equipment |
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| Publication Number | Publication Date |
|---|---|
| CN104752289A true CN104752289A (en) | 2015-07-01 |
| CN104752289B CN104752289B (en) | 2018-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310750274.8A Active CN104752289B (en) | 2013-12-31 | 2013-12-31 | Transmission system and semiconductor processing equipment |
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| CN (1) | CN104752289B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108122817A (en) * | 2016-11-30 | 2018-06-05 | 细美事有限公司 | Substrate supporting unit, thermal treatment unit and the substrate board treatment for including it |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6244641B1 (en) * | 1999-12-02 | 2001-06-12 | M.E.C. Technology, Inc. | Wafer transfer arm |
| CN1922724A (en) * | 2004-02-24 | 2007-02-28 | 应用材料股份有限公司 | Contaminant reducing substrate transport and support system |
| CN101097844A (en) * | 2006-06-29 | 2008-01-02 | Ips有限公司 | Apparatus for semiconductor processing |
-
2013
- 2013-12-31 CN CN201310750274.8A patent/CN104752289B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6244641B1 (en) * | 1999-12-02 | 2001-06-12 | M.E.C. Technology, Inc. | Wafer transfer arm |
| CN1922724A (en) * | 2004-02-24 | 2007-02-28 | 应用材料股份有限公司 | Contaminant reducing substrate transport and support system |
| CN101097844A (en) * | 2006-06-29 | 2008-01-02 | Ips有限公司 | Apparatus for semiconductor processing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108122817A (en) * | 2016-11-30 | 2018-06-05 | 细美事有限公司 | Substrate supporting unit, thermal treatment unit and the substrate board treatment for including it |
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| Publication number | Publication date |
|---|---|
| CN104752289B (en) | 2018-05-08 |
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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