CN104750049B - The method and system of gas circuit configuration processing in semiconductor manufacturing - Google Patents
The method and system of gas circuit configuration processing in semiconductor manufacturing Download PDFInfo
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- CN104750049B CN104750049B CN201310751394.XA CN201310751394A CN104750049B CN 104750049 B CN104750049 B CN 104750049B CN 201310751394 A CN201310751394 A CN 201310751394A CN 104750049 B CN104750049 B CN 104750049B
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- 238000000034 method Methods 0.000 title claims abstract description 119
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 61
- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 238000012545 processing Methods 0.000 title claims abstract description 30
- 230000008569 process Effects 0.000 claims abstract description 66
- 238000012544 monitoring process Methods 0.000 claims abstract description 54
- 230000008859 change Effects 0.000 claims abstract description 20
- 238000012986 modification Methods 0.000 claims abstract description 18
- 230000004048 modification Effects 0.000 claims abstract description 18
- 238000012360 testing method Methods 0.000 claims abstract description 17
- 238000010978 in-process monitoring Methods 0.000 claims abstract description 5
- 239000007789 gas Substances 0.000 description 135
- 238000005516 engineering process Methods 0.000 description 5
- 101100023111 Schizosaccharomyces pombe (strain 972 / ATCC 24843) mfc1 gene Proteins 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
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- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of method and system of gas circuit configuration processing in semiconductor manufacturing.Wherein this method comprises the following steps：In semiconductor fabrication process, multiple first configuration files with the relevant gas title of gas circuit, and multiple second configuration files of the corresponding gas circuit flow value of gas title are created；By the first configuration file and the second configuration file wildcard into process monitoring file；When carrying out engineer testing or technique manufactures, gas title and gas circuit flow value are written in corresponding first configuration file and the second configuration file according to demand, and be substituted into process monitoring file, required gas in process monitoring file and gas circuit flow value configured with batch.The present invention need to only change the content in the first configuration file or the second configuration file when needing to be modified the gas in gas circuit or flow, and modification is easy, reduces the error rate of modification, improves production efficiency.
Description
Technical field
The present invention relates to a kind of method of gas circuit configuration processing in semiconductor applications, more particularly to semiconductor manufacturing and it is
System.
Background technology
Semiconductor fabrication process is a complicated manufacturing field for being related to a variety of subject crossings.The process of etching technics is just
It is under set process conditions, as processing chamber is heated to certain temperature, the pressure stability of processing chamber is in technological requirement
In the range of, multiple gases are passed through to chamber according to a certain percentage, certain power are then added to radio-frequency apparatus, by ionizing work
The technical process that skill gas performs etching silicon chip.
The species and flow of gas are a parameters important among technique.In engineer testing, gas can be frequently run into
Species or gas range or both change at the same time has met the needs of technique.How software is accomplished quickly, accurately
Meet that the demand is a critically important content by configuration file.In the conventional technology, when gas in semiconductor manufacturing
, it is necessary to be modified to many places in multiple configuration files, heavy workload when species or flow change, error rate is high.
The content of the invention
Based on this, it is necessary to which provide a kind of can carry out letter to gaseous species of gas circuit in semiconductor manufacturing facility, flow
Just the method and system of gas circuit configuration processing in the semiconductor manufacturing changed.
To realize the method for gas circuit configuration processing in a kind of semiconductor manufacturing of the object of the invention offer, including following step
Suddenly：
In semiconductor fabrication process, multiple first configuration files with the relevant gas title of gas circuit, Yi Jisuo are created
State multiple second configuration files of the corresponding gas circuit flow value of gas title；
By first configuration file and the second configuration file wildcard into process monitoring file；
When carrying out engineer testing or technique manufactures, the gas title and the gas circuit flow value are write according to demand
Enter into corresponding first configuration file and second configuration file, and be substituted into the process monitoring file, will
Required gas and gas circuit flow value configured with batch in the process monitoring file.
As a kind of embodiment, the process monitoring file includes gas circuit configuration startup file Driver_
Config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring
File ProcessMonitor.xml.
As a kind of embodiment, first configuration file and second configuration file are XML file, it is logical
ENTITY sentences wildcard is crossed into the process monitoring file.
As a kind of embodiment, the technique is MEMS, and the gas circuit is 8 tunnels or 4 tunnels.
As a kind of embodiment, following steps are further included：
When the species of gas circuit and/or flow change in engineer testing or technique manufacture, modification described first is matched somebody with somebody
File and/or the second configuration file are put, by the gas title after change and/or gas circuit flow value write-in described first
Configuration file and/or the second configuration file；
Amended first configuration file and/or the second configuration file are substituted into the process monitoring file,
Gas needed for the process monitoring file and gas circuit flow value are subjected to same batch configuration again.
The system of gas circuit configuration processing includes file creation module in a kind of semiconductor manufacturing based on same inventive concept,
Wildcard module, and Process configuration module, wherein：
The file creation module is more with the relevant gas title of gas circuit in semiconductor fabrication process, creating
A first configuration file, and multiple second configuration files of the corresponding gas circuit flow value of the gas title；
The wildcard module, for by first configuration file and the second configuration file wildcard to process monitoring
In file；
The Process configuration module, for when carrying out engineer testing or technique and manufacturing, according to demand by the gas
Title and the gas circuit flow value are written in corresponding first configuration file and second configuration file, and are substituted into
In the process monitoring file, required gas in the process monitoring file and gas circuit flow value configure with batch.
As a kind of embodiment, the process monitoring file includes gas circuit configuration startup file Driver_
Config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring
File ProcessMonitor.xml.
As a kind of embodiment, first configuration file and second configuration file are XML file, it is logical
ENTITY sentences wildcard is crossed into the process monitoring file.
As a kind of embodiment, the technique is MEMS, and the gas circuit is 8 tunnels or 4 tunnels.
As a kind of embodiment, modified module, and modification configuration module are further included, wherein：
The modified module, species and/or flow for gas circuit in being manufactured when engineer testing or technique change
When, first configuration file and/or the second configuration file are changed, by the gas title after change and/or the gas circuit
Flow value writes first configuration file and/or the second configuration file；
The modification configuration module, for amended first configuration file and/or the second configuration file to be replaced
Into the process monitoring file, gas needed for the process monitoring file and gas circuit flow value are subjected to same batch again and configured.
Beneficial effects of the present invention include：
The method and system of gas circuit configuration processing, work as semiconductor fabrication process in a kind of semiconductor manufacturing provided by the invention
It is middle when needing to be modified the gas in gas circuit or flow, it need to only change in the first configuration file or the second configuration file
Content, without changing the correspondence position in other configurations file one by one.Modification is easy, reduces the error rate of modification, improves life
Produce efficiency.
Brief description of the drawings
Fig. 1 is the flow chart of a specific embodiment of the method for gas circuit configuration processing in a kind of semiconductor manufacturing of the present invention；
Fig. 2 is the system structure of a specific embodiment of the system of gas circuit configuration processing in a kind of semiconductor manufacturing of the present invention
Schematic diagram.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with attached drawing to of the invention real
The method and system for applying gas circuit configuration processing in the semiconductor manufacturing of example illustrate.It is it should be appreciated that described herein specific
Embodiment only to explain the present invention, is not intended to limit the present invention.
The method of gas circuit configuration processing in the semiconductor manufacturing of the embodiment of the present invention, as shown in Figure 1, comprising the following steps：
S100, in semiconductor fabrication process, creates multiple first configuration files with the relevant gas title of gas circuit, with
And multiple second configuration files of the corresponding gas circuit flow value of gas title.
It is described entitled specifically, being actually added into semiconductor fabrication in semiconductor manufacturing facility gas circuit comprising gas
Gas title.Gas is added into processing chamber according to the gas title in Subsequent semiconductor manufacturing process.
The gas flow is the specific flow value of equipment gas circuit in semiconductor fabrication process, and work is manufactured in Subsequent semiconductor
The flow of the corresponding gas circuit of semiconductor manufacturing facility is controlled in skill according to the gas circuit flow value.
S200, by first configuration file and the second configuration file wildcard into process monitoring file.
S300, when carrying out engineer testing or technique manufactures, according to demand by the gas title and the gas circuit stream
Value is written in corresponding first configuration file and second configuration file, and is substituted into the process monitoring file
In, required gas in the process monitoring file and gas circuit flow value configured with batch.
In this way, need to be modified the gas in gas circuit or flow when in progress engineer testing either technique manufacture
When, the content in the first configuration file or the second configuration file need to be only changed, without changing the configuration of other process monitorings one by one
The sentence of correspondence position in file.Modification is easy, reduces the error rate of modification, improves production efficiency.Meanwhile make configuration file
Structure become apparent from, it is easier to understand and modification.
In one of the embodiments, process monitoring file include gas circuit configuration startup file Driver_config.xml,
Hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring file
ProcessMonitor.xml。
Herein it should be noted that the gas circuit configures startup file, i.e. Driver_config.xml, is that program starts
The file of every driver.Program code in corresponding conventional art is as follows：
Procedure above code snippet is that the gas circuit of gas circuit 1 in semiconductor equipment configures startup file part.Wherein MFC1 is
The corresponding flow controller 1 of gas circuit 1.The flow of gas circuit is controlled by MFC, by above procedure code
SetMaxGasFlow methods set the maximum range of gas circuit 1（Flow value）For 100.
The hardware context file, i.e. IO_config.xml are directly hard with semiconductor manufacturing facility for creating software
The association of part.Program code in corresponding conventional art is as follows：
Procedure above code snippet is the gas circuit hardware context file part of gas circuit 1 in semiconductor equipment.Pass through
SetGasFlow1 passages, can directly set the gas flow of the corresponding flow control MFC1 of gas circuit 1.
The Row control file, i.e. Control_config.xml, is the configuration file that software flow controls.It is corresponding to pass
Program code in system technology is as follows：
Certain road gas is added in the vacuum system of semiconductor processing equipment by addGases methods, is grasped for flow
Make.The title and flow of gas should be with actual board state consistencies.Gas title and flow are provided by setGases methods
Host computer to semiconductor processing equipment is so as to the realization of gas circuit calibration function.
The monitoring file, i.e. ProcessMonitor.xml, is to monitor board in real time during semiconductor fabrication process
The whether normal configuration file of parameters.Program code in corresponding conventional art is as follows：
When whether the actual flow of monitoring gas circuit 1 is identical with setting value gas circuit is provided by GasAr_inti (100SCCM)
Title and flow information.
In one of the embodiments, first configuration file and second configuration file are XML file, it is logical
ENTITY sentences wildcard is crossed into the process monitoring file.
For example, create corresponding the first configuration file for including gas title of the first gas circuit in semiconductor manufacturing facility
For：Gas1Name.xml；Creating corresponding the second configuration file comprising gas circuit flow value of first gas circuit is：
Gas1Value.xml.Gas1Name.xml can include the gas title in CF4 expression gas circuits 1；Gas1Value.xml can be with
Comprising such as 400, the gas flow values for representing gas circuit 1 are 400.
Reference technology is used in the middle part of the file header of above-mentioned process monitoring file, is defined opposite with first configuration file
The first instance answered, and with the corresponding second instance of the second configuration file.Defined entity is supervised for the technique
Control file in itself and document associated there uses.
By defined entity, by first configuration file and the second configuration file wildcard to the technique
Monitor in file, so that process monitoring file can be directly invoked in first configuration file and second configuration file
Comprising content, namely specific gas title and gas circuit flow value.
Such as in process monitoring file using following sentence define the corresponding gas title of gas circuit 1, gas circuit flow entity：
The configuration file of above-mentioned sentence is with the addition of, process monitoring file can be used when running into character Gas1Name
The content of Gas1Name.xml files is replaced, such as when content is CF4 in Gas1Name.xml, then configuration file is being met
It is equivalent to be configured with CF4 during to character Gas1Name；Equally, can be used when running into character Gas1Value characters
Content in Gas1Value.xml files is replaced.
According to definition as described above, to gas circuit configuration startup file, hardware context file, Row control file, monitoring text
Corresponding sentence is modified in part.
For example, gas circuit in the gas circuit configuration startup file part of gas circuit 1 in above-mentioned semiconductor equipment is configured into startup file
In gas circuit flow value be revised as character Gas1Value, amended new program code is as follows：
Equally to other gas circuits of gas circuit configuration startup file, and hardware context file, Row control file, monitors file
Middle corresponding gas title, the character of gas circuit flow are modified.When configuration file runs into corresponding entity character, with corresponding first
Content in configuration file or the second configuration file is replaced.
In one of the embodiments, the technique is MEMS, and the gas circuit is 8 tunnels or 4 tunnels.
In one of the embodiments, it is further comprising the steps of：
S400, when the species of gas circuit and/or flow change in engineer testing or technique manufacture, changes described the
One configuration file and/or the second configuration file, by described in the gas title after change and/or gas circuit flow value write-in
First configuration file and/or the second configuration file；
S500, the process monitoring text is substituted into by amended first configuration file and/or the second configuration file
In part, gas needed for the process monitoring file and gas circuit flow value are subjected to same batch again and configured.
By changing the content in the first configuration file, the second configuration file, then in engineer testing or technique manufacture
Content in first configuration file and the second configuration file can wildcard into process monitoring file, process monitoring file can obtain more
Gas title and respective streams value after new, and avoid the tedious steps for changing process monitoring file one by one.It can provide significantly
The production efficiency of semiconductor fabrication process.
Based on same inventive concept, the embodiment of the present invention provides the system that gas circuit configuration is handled in a kind of semiconductor manufacturing,
Since the principle that this system solves the problems, such as is similar to a kind of foregoing method, the implementation of the system can be according to preceding method
Specific steps realize, overlaps will not be repeated.
The system of gas circuit configuration processing in a kind of semiconductor manufacturing of the embodiment of the present invention, as shown in Fig. 2, being created including file
Model block 100, wildcard module 200, and Process configuration module 300.
The file creation module 100, in semiconductor fabrication process, creating and the relevant gas title of gas circuit
Multiple first configuration files, and multiple second configuration files of the corresponding gas circuit flow value of the gas title；
The wildcard module 200, for by first configuration file and the second configuration file wildcard to technique
Monitor in file；
The Process configuration module 300, for when carrying out engineer testing or technique and manufacturing, according to demand by the gas
Body title and the gas circuit flow value are written in corresponding first configuration file and second configuration file, and are replaced
Into the process monitoring file, required gas in the process monitoring file and gas circuit flow value configure with batch.
In one of the embodiments, the process monitoring file includes gas circuit configuration startup file Driver_
Config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring
File ProcessMonitor.xml.
In one of the embodiments, first configuration file and second configuration file are XML file, it is logical
ENTITY sentences wildcard is crossed into the process monitoring file.
In one of the embodiments, the technique is MEMS, and the gas circuit is 8 tunnels or 4 tunnels.
In a wherein semiconductor manufacturing in the embodiment of the system of gas circuit configuration processing, modified module 400 is further included,
And modification configuration module 500.
The modified module 400, species and/or flow for gas circuit in being manufactured when engineer testing or technique become
When more, first configuration file and/or the second configuration file are changed, by the gas title after change and/or the gas
Road flow value writes first configuration file and/or the second configuration file；
The modification configuration module 500, for amended first configuration file and/or the second configuration file to be replaced
Change in the process monitoring file, gas needed for the process monitoring file and gas circuit flow value are carried out same batch again matches somebody with somebody
Put.
The system of gas circuit configuration processing in semiconductor manufacturing of the embodiment of the present invention, when semiconductor technology manufacture or technique examination
Test when needing to be modified the gas in gas circuit or flow, need to only change in the first configuration file or the second configuration file
Content, without changing the correspondence position in other configurations file one by one.Modification is easy, reduces the error rate of modification, improves
Production efficiency.Meanwhile become apparent from the structure of configuration file, it is easier to understand and change.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of method of gas circuit configuration processing in semiconductor manufacturing, it is characterised in that comprise the following steps：
In semiconductor fabrication process, multiple first configuration files with the relevant gas title of gas circuit, and the gas are created
Multiple second configuration files of the corresponding gas circuit flow value of body title；
By first configuration file and the second configuration file wildcard into process monitoring file；
When carrying out engineer testing or technique manufactures, the gas title and the gas circuit flow value are written to according to demand
In corresponding first configuration file and second configuration file, and it is substituted into the process monitoring file, by described in
Required gas and gas circuit flow value configured with batch in process monitoring file, the title of the gas and the gas circuit flow
Value and actual board state consistency.
2. the method for gas circuit configuration processing in semiconductor manufacturing according to claim 1, it is characterised in that the technique prison
Controlling file includes gas circuit configuration startup file Driver_config.xml, hardware context file I/O _ config.xml, flow control
File Control_config.xml processed and/or monitoring file ProcessMonitor.xml.
3. the method for gas circuit configuration processing in semiconductor manufacturing according to claim 2, it is characterised in that described first matches somebody with somebody
It is XML file to put file and second configuration file, it is by ENTITY sentences wildcard into the process monitoring file.
4. the method for gas circuit configuration processing in semiconductor manufacturing according to claim 3, it is characterised in that the technique is
MEMS, the gas circuit are 8 tunnels or 4 tunnels.
5. the method for gas circuit configuration processing in semiconductor manufacturing according to claim 1, it is characterised in that further include as follows
Step：
When the species of gas circuit and/or flow change in engineer testing or technique manufacture, modification the first configuration text
Part and/or the second configuration file, by first configuration of the gas title after change and/or gas circuit flow value write-in
File and/or the second configuration file；
Amended first configuration file and/or the second configuration file are substituted into the process monitoring file, by institute
State gas needed for process monitoring file and gas circuit flow value and carry out same batch configuration again.
6. the system of gas circuit configuration processing in a kind of semiconductor manufacturing, it is characterised in that including file creation module, wildcard mould
Block, and Process configuration module, wherein：
The file creation module, in semiconductor fabrication process, creates multiple the with the relevant gas title of gas circuit
One configuration file, and multiple second configuration files of the corresponding gas circuit flow value of the gas title；
The wildcard module, for by first configuration file and the second configuration file wildcard to process monitoring file
In；
The Process configuration module, for when carrying out engineer testing or technique and manufacturing, according to demand by the gas title
It is written in corresponding first configuration file and second configuration file, and is substituted into described with the gas circuit flow value
In process monitoring file, required gas in the process monitoring file and gas circuit flow value configure with batch, the gas
The title of body and the gas circuit flow value and actual board state consistency.
7. the system of gas circuit configuration processing in semiconductor manufacturing according to claim 6, it is characterised in that the technique prison
Controlling file includes gas circuit configuration startup file Driver_config.xml, hardware context file I/O _ config.xml, flow control
File Control_config.xml processed and/or monitoring file ProcessMonitor.xml.
8. the system of gas circuit configuration processing in semiconductor manufacturing according to claim 7, it is characterised in that described first matches somebody with somebody
It is XML file to put file and second configuration file, it is by ENTITY sentences wildcard into the process monitoring file.
9. the system of gas circuit configuration processing in semiconductor manufacturing according to claim 8, it is characterised in that the technique is
MEMS, the gas circuit are 8 tunnels or 4 tunnels.
10. the system of gas circuit configuration processing in semiconductor manufacturing according to claim 6, it is characterised in that further include and repair
Change module, and modification configuration module, wherein：
The modified module, for when the species of gas circuit and/or flow change in engineer testing or technique manufacture, repairing
Change first configuration file and/or the second configuration file, by the gas title after change and/or the gas circuit flow value
Write first configuration file and/or the second configuration file；
The modification configuration module, for amended first configuration file and/or the second configuration file to be substituted into institute
State in process monitoring file, gas needed for the process monitoring file and gas circuit flow value are carried out same batch again configures.
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| CN110952076A (en) * | 2018-09-26 | 2020-04-03 | 北京北方华创微电子装备有限公司 | Gas path control method and device and semiconductor processing equipment |
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| WO2002023364A1 (en) * | 2000-09-15 | 2002-03-21 | Wonderware Corporation | An industrial process control data access server supporting multiple client data exchange protocols |
| CN101364175A (en) * | 2008-07-02 | 2009-02-11 | 深圳国人通信有限公司 | Configuration method and device for embedded system |
| CN101457351A (en) * | 2007-12-12 | 2009-06-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas distribution system and semi-conductor processing arrangements employing the same |
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| CN100468256C (en) * | 2003-02-18 | 2009-03-11 | 东京毅力科创株式会社 | Method for automatic configuration of a processing system |
| CN102033762A (en) * | 2010-11-02 | 2011-04-27 | 浪潮电子信息产业股份有限公司 | Method for quickly setting firmware parameters by utilizing configuration file |
| CN102012896B (en) * | 2010-12-29 | 2012-11-21 | 深圳市五巨科技有限公司 | Method and device for realizing bulk editing of file contents |
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|---|---|---|---|---|
| WO2002023364A1 (en) * | 2000-09-15 | 2002-03-21 | Wonderware Corporation | An industrial process control data access server supporting multiple client data exchange protocols |
| CN101457351A (en) * | 2007-12-12 | 2009-06-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas distribution system and semi-conductor processing arrangements employing the same |
| CN101364175A (en) * | 2008-07-02 | 2009-02-11 | 深圳国人通信有限公司 | Configuration method and device for embedded system |
| CN103049008A (en) * | 2011-10-14 | 2013-04-17 | 东京毅力科创株式会社 | Flow rate controller and processing apparatus |
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