CN104750049B - The method and system of gas circuit configuration processing in semiconductor manufacturing - Google Patents

The method and system of gas circuit configuration processing in semiconductor manufacturing Download PDF

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CN104750049B
CN104750049B CN201310751394.XA CN201310751394A CN104750049B CN 104750049 B CN104750049 B CN 104750049B CN 201310751394 A CN201310751394 A CN 201310751394A CN 104750049 B CN104750049 B CN 104750049B
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file
configuration
gas circuit
gas
configuration file
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CN104750049A (en
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马永超
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Beijing North Microelectronics Co Ltd
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

The invention discloses a kind of method and system of gas circuit configuration processing in semiconductor manufacturing.Wherein this method comprises the following steps:In semiconductor fabrication process, multiple first configuration files with the relevant gas title of gas circuit, and multiple second configuration files of the corresponding gas circuit flow value of gas title are created;By the first configuration file and the second configuration file wildcard into process monitoring file;When carrying out engineer testing or technique manufactures, gas title and gas circuit flow value are written in corresponding first configuration file and the second configuration file according to demand, and be substituted into process monitoring file, required gas in process monitoring file and gas circuit flow value configured with batch.The present invention need to only change the content in the first configuration file or the second configuration file when needing to be modified the gas in gas circuit or flow, and modification is easy, reduces the error rate of modification, improves production efficiency.

Description

The method and system of gas circuit configuration processing in semiconductor manufacturing
Technical field
The present invention relates to a kind of method of gas circuit configuration processing in semiconductor applications, more particularly to semiconductor manufacturing and it is System.
Background technology
Semiconductor fabrication process is a complicated manufacturing field for being related to a variety of subject crossings.The process of etching technics is just It is under set process conditions, as processing chamber is heated to certain temperature, the pressure stability of processing chamber is in technological requirement In the range of, multiple gases are passed through to chamber according to a certain percentage, certain power are then added to radio-frequency apparatus, by ionizing work The technical process that skill gas performs etching silicon chip.
The species and flow of gas are a parameters important among technique.In engineer testing, gas can be frequently run into Species or gas range or both change at the same time has met the needs of technique.How software is accomplished quickly, accurately Meet that the demand is a critically important content by configuration file.In the conventional technology, when gas in semiconductor manufacturing , it is necessary to be modified to many places in multiple configuration files, heavy workload when species or flow change, error rate is high.
The content of the invention
Based on this, it is necessary to which provide a kind of can carry out letter to gaseous species of gas circuit in semiconductor manufacturing facility, flow Just the method and system of gas circuit configuration processing in the semiconductor manufacturing changed.
To realize the method for gas circuit configuration processing in a kind of semiconductor manufacturing of the object of the invention offer, including following step Suddenly:
In semiconductor fabrication process, multiple first configuration files with the relevant gas title of gas circuit, Yi Jisuo are created State multiple second configuration files of the corresponding gas circuit flow value of gas title;
By first configuration file and the second configuration file wildcard into process monitoring file;
When carrying out engineer testing or technique manufactures, the gas title and the gas circuit flow value are write according to demand Enter into corresponding first configuration file and second configuration file, and be substituted into the process monitoring file, will Required gas and gas circuit flow value configured with batch in the process monitoring file.
As a kind of embodiment, the process monitoring file includes gas circuit configuration startup file Driver_ Config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring File ProcessMonitor.xml.
As a kind of embodiment, first configuration file and second configuration file are XML file, it is logical ENTITY sentences wildcard is crossed into the process monitoring file.
As a kind of embodiment, the technique is MEMS, and the gas circuit is 8 tunnels or 4 tunnels.
As a kind of embodiment, following steps are further included:
When the species of gas circuit and/or flow change in engineer testing or technique manufacture, modification described first is matched somebody with somebody File and/or the second configuration file are put, by the gas title after change and/or gas circuit flow value write-in described first Configuration file and/or the second configuration file;
Amended first configuration file and/or the second configuration file are substituted into the process monitoring file, Gas needed for the process monitoring file and gas circuit flow value are subjected to same batch configuration again.
The system of gas circuit configuration processing includes file creation module in a kind of semiconductor manufacturing based on same inventive concept, Wildcard module, and Process configuration module, wherein:
The file creation module is more with the relevant gas title of gas circuit in semiconductor fabrication process, creating A first configuration file, and multiple second configuration files of the corresponding gas circuit flow value of the gas title;
The wildcard module, for by first configuration file and the second configuration file wildcard to process monitoring In file;
The Process configuration module, for when carrying out engineer testing or technique and manufacturing, according to demand by the gas Title and the gas circuit flow value are written in corresponding first configuration file and second configuration file, and are substituted into In the process monitoring file, required gas in the process monitoring file and gas circuit flow value configure with batch.
As a kind of embodiment, the process monitoring file includes gas circuit configuration startup file Driver_ Config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring File ProcessMonitor.xml.
As a kind of embodiment, first configuration file and second configuration file are XML file, it is logical ENTITY sentences wildcard is crossed into the process monitoring file.
As a kind of embodiment, the technique is MEMS, and the gas circuit is 8 tunnels or 4 tunnels.
As a kind of embodiment, modified module, and modification configuration module are further included, wherein:
The modified module, species and/or flow for gas circuit in being manufactured when engineer testing or technique change When, first configuration file and/or the second configuration file are changed, by the gas title after change and/or the gas circuit Flow value writes first configuration file and/or the second configuration file;
The modification configuration module, for amended first configuration file and/or the second configuration file to be replaced Into the process monitoring file, gas needed for the process monitoring file and gas circuit flow value are subjected to same batch again and configured.
Beneficial effects of the present invention include:
The method and system of gas circuit configuration processing, work as semiconductor fabrication process in a kind of semiconductor manufacturing provided by the invention It is middle when needing to be modified the gas in gas circuit or flow, it need to only change in the first configuration file or the second configuration file Content, without changing the correspondence position in other configurations file one by one.Modification is easy, reduces the error rate of modification, improves life Produce efficiency.
Brief description of the drawings
Fig. 1 is the flow chart of a specific embodiment of the method for gas circuit configuration processing in a kind of semiconductor manufacturing of the present invention;
Fig. 2 is the system structure of a specific embodiment of the system of gas circuit configuration processing in a kind of semiconductor manufacturing of the present invention Schematic diagram.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with attached drawing to of the invention real The method and system for applying gas circuit configuration processing in the semiconductor manufacturing of example illustrate.It is it should be appreciated that described herein specific Embodiment only to explain the present invention, is not intended to limit the present invention.
The method of gas circuit configuration processing in the semiconductor manufacturing of the embodiment of the present invention, as shown in Figure 1, comprising the following steps:
S100, in semiconductor fabrication process, creates multiple first configuration files with the relevant gas title of gas circuit, with And multiple second configuration files of the corresponding gas circuit flow value of gas title.
It is described entitled specifically, being actually added into semiconductor fabrication in semiconductor manufacturing facility gas circuit comprising gas Gas title.Gas is added into processing chamber according to the gas title in Subsequent semiconductor manufacturing process.
The gas flow is the specific flow value of equipment gas circuit in semiconductor fabrication process, and work is manufactured in Subsequent semiconductor The flow of the corresponding gas circuit of semiconductor manufacturing facility is controlled in skill according to the gas circuit flow value.
S200, by first configuration file and the second configuration file wildcard into process monitoring file.
S300, when carrying out engineer testing or technique manufactures, according to demand by the gas title and the gas circuit stream Value is written in corresponding first configuration file and second configuration file, and is substituted into the process monitoring file In, required gas in the process monitoring file and gas circuit flow value configured with batch.
In this way, need to be modified the gas in gas circuit or flow when in progress engineer testing either technique manufacture When, the content in the first configuration file or the second configuration file need to be only changed, without changing the configuration of other process monitorings one by one The sentence of correspondence position in file.Modification is easy, reduces the error rate of modification, improves production efficiency.Meanwhile make configuration file Structure become apparent from, it is easier to understand and modification.
In one of the embodiments, process monitoring file include gas circuit configuration startup file Driver_config.xml, Hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring file ProcessMonitor.xml。
Herein it should be noted that the gas circuit configures startup file, i.e. Driver_config.xml, is that program starts The file of every driver.Program code in corresponding conventional art is as follows:
Procedure above code snippet is that the gas circuit of gas circuit 1 in semiconductor equipment configures startup file part.Wherein MFC1 is The corresponding flow controller 1 of gas circuit 1.The flow of gas circuit is controlled by MFC, by above procedure code SetMaxGasFlow methods set the maximum range of gas circuit 1(Flow value)For 100.
The hardware context file, i.e. IO_config.xml are directly hard with semiconductor manufacturing facility for creating software The association of part.Program code in corresponding conventional art is as follows:
Procedure above code snippet is the gas circuit hardware context file part of gas circuit 1 in semiconductor equipment.Pass through SetGasFlow1 passages, can directly set the gas flow of the corresponding flow control MFC1 of gas circuit 1.
The Row control file, i.e. Control_config.xml, is the configuration file that software flow controls.It is corresponding to pass Program code in system technology is as follows:
Certain road gas is added in the vacuum system of semiconductor processing equipment by addGases methods, is grasped for flow Make.The title and flow of gas should be with actual board state consistencies.Gas title and flow are provided by setGases methods Host computer to semiconductor processing equipment is so as to the realization of gas circuit calibration function.
The monitoring file, i.e. ProcessMonitor.xml, is to monitor board in real time during semiconductor fabrication process The whether normal configuration file of parameters.Program code in corresponding conventional art is as follows:
When whether the actual flow of monitoring gas circuit 1 is identical with setting value gas circuit is provided by GasAr_inti (100SCCM) Title and flow information.
In one of the embodiments, first configuration file and second configuration file are XML file, it is logical ENTITY sentences wildcard is crossed into the process monitoring file.
For example, create corresponding the first configuration file for including gas title of the first gas circuit in semiconductor manufacturing facility For:Gas1Name.xml;Creating corresponding the second configuration file comprising gas circuit flow value of first gas circuit is: Gas1Value.xml.Gas1Name.xml can include the gas title in CF4 expression gas circuits 1;Gas1Value.xml can be with Comprising such as 400, the gas flow values for representing gas circuit 1 are 400.
Reference technology is used in the middle part of the file header of above-mentioned process monitoring file, is defined opposite with first configuration file The first instance answered, and with the corresponding second instance of the second configuration file.Defined entity is supervised for the technique Control file in itself and document associated there uses.
By defined entity, by first configuration file and the second configuration file wildcard to the technique Monitor in file, so that process monitoring file can be directly invoked in first configuration file and second configuration file Comprising content, namely specific gas title and gas circuit flow value.
Such as in process monitoring file using following sentence define the corresponding gas title of gas circuit 1, gas circuit flow entity:
The configuration file of above-mentioned sentence is with the addition of, process monitoring file can be used when running into character Gas1Name The content of Gas1Name.xml files is replaced, such as when content is CF4 in Gas1Name.xml, then configuration file is being met It is equivalent to be configured with CF4 during to character Gas1Name;Equally, can be used when running into character Gas1Value characters Content in Gas1Value.xml files is replaced.
According to definition as described above, to gas circuit configuration startup file, hardware context file, Row control file, monitoring text Corresponding sentence is modified in part.
For example, gas circuit in the gas circuit configuration startup file part of gas circuit 1 in above-mentioned semiconductor equipment is configured into startup file In gas circuit flow value be revised as character Gas1Value, amended new program code is as follows:
Equally to other gas circuits of gas circuit configuration startup file, and hardware context file, Row control file, monitors file Middle corresponding gas title, the character of gas circuit flow are modified.When configuration file runs into corresponding entity character, with corresponding first Content in configuration file or the second configuration file is replaced.
In one of the embodiments, the technique is MEMS, and the gas circuit is 8 tunnels or 4 tunnels.
In one of the embodiments, it is further comprising the steps of:
S400, when the species of gas circuit and/or flow change in engineer testing or technique manufacture, changes described the One configuration file and/or the second configuration file, by described in the gas title after change and/or gas circuit flow value write-in First configuration file and/or the second configuration file;
S500, the process monitoring text is substituted into by amended first configuration file and/or the second configuration file In part, gas needed for the process monitoring file and gas circuit flow value are subjected to same batch again and configured.
By changing the content in the first configuration file, the second configuration file, then in engineer testing or technique manufacture Content in first configuration file and the second configuration file can wildcard into process monitoring file, process monitoring file can obtain more Gas title and respective streams value after new, and avoid the tedious steps for changing process monitoring file one by one.It can provide significantly The production efficiency of semiconductor fabrication process.
Based on same inventive concept, the embodiment of the present invention provides the system that gas circuit configuration is handled in a kind of semiconductor manufacturing, Since the principle that this system solves the problems, such as is similar to a kind of foregoing method, the implementation of the system can be according to preceding method Specific steps realize, overlaps will not be repeated.
The system of gas circuit configuration processing in a kind of semiconductor manufacturing of the embodiment of the present invention, as shown in Fig. 2, being created including file Model block 100, wildcard module 200, and Process configuration module 300.
The file creation module 100, in semiconductor fabrication process, creating and the relevant gas title of gas circuit Multiple first configuration files, and multiple second configuration files of the corresponding gas circuit flow value of the gas title;
The wildcard module 200, for by first configuration file and the second configuration file wildcard to technique Monitor in file;
The Process configuration module 300, for when carrying out engineer testing or technique and manufacturing, according to demand by the gas Body title and the gas circuit flow value are written in corresponding first configuration file and second configuration file, and are replaced Into the process monitoring file, required gas in the process monitoring file and gas circuit flow value configure with batch.
In one of the embodiments, the process monitoring file includes gas circuit configuration startup file Driver_ Config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring File ProcessMonitor.xml.
In one of the embodiments, first configuration file and second configuration file are XML file, it is logical ENTITY sentences wildcard is crossed into the process monitoring file.
In one of the embodiments, the technique is MEMS, and the gas circuit is 8 tunnels or 4 tunnels.
In a wherein semiconductor manufacturing in the embodiment of the system of gas circuit configuration processing, modified module 400 is further included, And modification configuration module 500.
The modified module 400, species and/or flow for gas circuit in being manufactured when engineer testing or technique become When more, first configuration file and/or the second configuration file are changed, by the gas title after change and/or the gas Road flow value writes first configuration file and/or the second configuration file;
The modification configuration module 500, for amended first configuration file and/or the second configuration file to be replaced Change in the process monitoring file, gas needed for the process monitoring file and gas circuit flow value are carried out same batch again matches somebody with somebody Put.
The system of gas circuit configuration processing in semiconductor manufacturing of the embodiment of the present invention, when semiconductor technology manufacture or technique examination Test when needing to be modified the gas in gas circuit or flow, need to only change in the first configuration file or the second configuration file Content, without changing the correspondence position in other configurations file one by one.Modification is easy, reduces the error rate of modification, improves Production efficiency.Meanwhile become apparent from the structure of configuration file, it is easier to understand and change.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously Therefore the limitation to the scope of the claims of the present invention cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (10)

1. a kind of method of gas circuit configuration processing in semiconductor manufacturing, it is characterised in that comprise the following steps:
In semiconductor fabrication process, multiple first configuration files with the relevant gas title of gas circuit, and the gas are created Multiple second configuration files of the corresponding gas circuit flow value of body title;
By first configuration file and the second configuration file wildcard into process monitoring file;
When carrying out engineer testing or technique manufactures, the gas title and the gas circuit flow value are written to according to demand In corresponding first configuration file and second configuration file, and it is substituted into the process monitoring file, by described in Required gas and gas circuit flow value configured with batch in process monitoring file, the title of the gas and the gas circuit flow Value and actual board state consistency.
2. the method for gas circuit configuration processing in semiconductor manufacturing according to claim 1, it is characterised in that the technique prison Controlling file includes gas circuit configuration startup file Driver_config.xml, hardware context file I/O _ config.xml, flow control File Control_config.xml processed and/or monitoring file ProcessMonitor.xml.
3. the method for gas circuit configuration processing in semiconductor manufacturing according to claim 2, it is characterised in that described first matches somebody with somebody It is XML file to put file and second configuration file, it is by ENTITY sentences wildcard into the process monitoring file.
4. the method for gas circuit configuration processing in semiconductor manufacturing according to claim 3, it is characterised in that the technique is MEMS, the gas circuit are 8 tunnels or 4 tunnels.
5. the method for gas circuit configuration processing in semiconductor manufacturing according to claim 1, it is characterised in that further include as follows Step:
When the species of gas circuit and/or flow change in engineer testing or technique manufacture, modification the first configuration text Part and/or the second configuration file, by first configuration of the gas title after change and/or gas circuit flow value write-in File and/or the second configuration file;
Amended first configuration file and/or the second configuration file are substituted into the process monitoring file, by institute State gas needed for process monitoring file and gas circuit flow value and carry out same batch configuration again.
6. the system of gas circuit configuration processing in a kind of semiconductor manufacturing, it is characterised in that including file creation module, wildcard mould Block, and Process configuration module, wherein:
The file creation module, in semiconductor fabrication process, creates multiple the with the relevant gas title of gas circuit One configuration file, and multiple second configuration files of the corresponding gas circuit flow value of the gas title;
The wildcard module, for by first configuration file and the second configuration file wildcard to process monitoring file In;
The Process configuration module, for when carrying out engineer testing or technique and manufacturing, according to demand by the gas title It is written in corresponding first configuration file and second configuration file, and is substituted into described with the gas circuit flow value In process monitoring file, required gas in the process monitoring file and gas circuit flow value configure with batch, the gas The title of body and the gas circuit flow value and actual board state consistency.
7. the system of gas circuit configuration processing in semiconductor manufacturing according to claim 6, it is characterised in that the technique prison Controlling file includes gas circuit configuration startup file Driver_config.xml, hardware context file I/O _ config.xml, flow control File Control_config.xml processed and/or monitoring file ProcessMonitor.xml.
8. the system of gas circuit configuration processing in semiconductor manufacturing according to claim 7, it is characterised in that described first matches somebody with somebody It is XML file to put file and second configuration file, it is by ENTITY sentences wildcard into the process monitoring file.
9. the system of gas circuit configuration processing in semiconductor manufacturing according to claim 8, it is characterised in that the technique is MEMS, the gas circuit are 8 tunnels or 4 tunnels.
10. the system of gas circuit configuration processing in semiconductor manufacturing according to claim 6, it is characterised in that further include and repair Change module, and modification configuration module, wherein:
The modified module, for when the species of gas circuit and/or flow change in engineer testing or technique manufacture, repairing Change first configuration file and/or the second configuration file, by the gas title after change and/or the gas circuit flow value Write first configuration file and/or the second configuration file;
The modification configuration module, for amended first configuration file and/or the second configuration file to be substituted into institute State in process monitoring file, gas needed for the process monitoring file and gas circuit flow value are carried out same batch again configures.
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CN110952076A (en) * 2018-09-26 2020-04-03 北京北方华创微电子装备有限公司 Gas path control method and device and semiconductor processing equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002023364A1 (en) * 2000-09-15 2002-03-21 Wonderware Corporation An industrial process control data access server supporting multiple client data exchange protocols
CN101364175A (en) * 2008-07-02 2009-02-11 深圳国人通信有限公司 Configuration method and device for embedded system
CN101457351A (en) * 2007-12-12 2009-06-17 北京北方微电子基地设备工艺研究中心有限责任公司 Gas distribution system and semi-conductor processing arrangements employing the same
CN103049008A (en) * 2011-10-14 2013-04-17 东京毅力科创株式会社 Flow rate controller and processing apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100468256C (en) * 2003-02-18 2009-03-11 东京毅力科创株式会社 Method for automatic configuration of a processing system
CN102033762A (en) * 2010-11-02 2011-04-27 浪潮电子信息产业股份有限公司 Method for quickly setting firmware parameters by utilizing configuration file
CN102012896B (en) * 2010-12-29 2012-11-21 深圳市五巨科技有限公司 Method and device for realizing bulk editing of file contents

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002023364A1 (en) * 2000-09-15 2002-03-21 Wonderware Corporation An industrial process control data access server supporting multiple client data exchange protocols
CN101457351A (en) * 2007-12-12 2009-06-17 北京北方微电子基地设备工艺研究中心有限责任公司 Gas distribution system and semi-conductor processing arrangements employing the same
CN101364175A (en) * 2008-07-02 2009-02-11 深圳国人通信有限公司 Configuration method and device for embedded system
CN103049008A (en) * 2011-10-14 2013-04-17 东京毅力科创株式会社 Flow rate controller and processing apparatus

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