CN104750049A - Gas circuit configuration processing method and system in semiconductor manufacturing - Google Patents
Gas circuit configuration processing method and system in semiconductor manufacturing Download PDFInfo
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- CN104750049A CN104750049A CN201310751394.XA CN201310751394A CN104750049A CN 104750049 A CN104750049 A CN 104750049A CN 201310751394 A CN201310751394 A CN 201310751394A CN 104750049 A CN104750049 A CN 104750049A
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- file
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The invention discloses a gas circuit configuration processing method and system in semiconductor manufacturing. The gas circuit configuration processing method comprises the following steps of creating a plurality of first configuration files of gas names related to a gas circuit and a plurality of second configuration files of gas circuit flow values corresponding to the gas names in a semiconductor manufacturing process; configuring the first configuration files and the second configuration files into a process monitoring file; writing the gas names and the gas circuit flow values into the corresponding first configuration files and second configuration files to be replaced into the process monitoring file and performing the same batch configuration on the required gas and gas circuit flow values in the process monitoring file when a process test or the process manufacturing is performed. According to the gas circuit configuration processing method and system in the semiconductor manufacturing, only the content of the first configuration files or the second configuration files needs to be changed when the gas or the flow in the gas circuit needs to be changed and accordingly the change is simple and convenient, the error rate of the change is reduced, and the production efficiency is improved.
Description
Technical field
The present invention relates to semiconductor applications, particularly relate to the method and system of gas circuit configuration process in a kind of semiconductor manufacturing.
Background technology
Semiconductor fabrication process is that a complexity relating to multiple subject crossing manufactures field.The process of etching technics is exactly under set process conditions, as processing chamber is heated to uniform temperature, the pressure stability of processing chamber is in the scope of technological requirement, according to certain ratio, multiple gases is passed into chamber, then radio frequency equipment adds certain power, the technological process etched silicon chip by ionize process gases.
The kind of gas and flow are parameters important in the middle of technique.In engineer testing, gaseous species or gas range or both can be run into frequently and change simultaneously and met the needs of technique.How software can be accomplished fast, and meeting this demand by configuration file is accurately a very important content.In the conventional technology, when gaseous species in semiconductor manufacturing or flow change, need to change the many places in multiple configuration file, workload is large, and error rate is high.
Summary of the invention
Based on this, be necessary to provide a kind of method and system can carrying out gas circuit configuration process in the semiconductor manufacturing of easy amendment to the gaseous species of gas circuit in semiconductor manufacturing facility, flow.
For realizing the method for gas circuit configuration process in a kind of semiconductor manufacturing that the object of the invention provides, comprise the following steps:
In semiconductor fabrication process, create multiple first configuration files of the gas title relevant to gas circuit, and multiple second configuration files of described gas title corresponding gas circuit flow value;
By described first configuration file and described second configuration file wildcard in process monitoring file;
When carrying out engineer testing or manufacture technics, according to demand described gas title and described gas circuit flow value are written to accordingly in described first configuration file and described second configuration file, and be substituted in described process monitoring file, desired gas and gas circuit flow value in described process monitoring file are carried out with a batch configuration.
As a kind of embodiment, described process monitoring file comprises gas circuit configuration startup file Driver_config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring file ProcessMonitor.xml.
As a kind of embodiment, described first configuration file and described second configuration file are XML file, and it passes through ENTITY statement wildcard in described process monitoring file.
As a kind of embodiment, described technique is MEMS, and described gas circuit is 8 tunnels or 4 tunnels.
As a kind of embodiment, also comprise the steps:
When kind and/or the flow generation change of gas circuit in engineer testing or manufacture technics, revise described first configuration file and/or the second configuration file, the described gas title after change and/or described gas circuit flow value are write described first configuration file and/or the second configuration file;
Amended described first configuration file and/or the second configuration file are substituted in described process monitoring file, described process monitoring file desired gas and gas circuit flow value are carried out with a batch configuration again.
File creation module is comprised, wildcard module based on the system of gas circuit configuration process in a kind of semiconductor manufacturing of same inventive concept, and Process configuration module, wherein:
Described file creation module, in semiconductor fabrication process, creates multiple first configuration files of the gas title relevant to gas circuit, and multiple second configuration files of described gas title corresponding gas circuit flow value;
Described wildcard module, for by described first configuration file and described second configuration file wildcard in process monitoring file;
Described Process configuration module, for when carrying out engineer testing or manufacture technics, according to demand described gas title and described gas circuit flow value are written to accordingly in described first configuration file and described second configuration file, and be substituted in described process monitoring file, desired gas and gas circuit flow value in described process monitoring file are carried out with a batch configuration.
As a kind of embodiment, described process monitoring file comprises gas circuit configuration startup file Driver_config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring file ProcessMonitor.xml.
As a kind of embodiment, described first configuration file and described second configuration file are XML file, and it passes through ENTITY statement wildcard in described process monitoring file.
As a kind of embodiment, described technique is MEMS, and described gas circuit is 8 tunnels or 4 tunnels.
As a kind of embodiment, also comprise modified module, and amendment configuration module, wherein:
Described modified module, for when the kind of gas circuit in engineer testing or manufacture technics and/or flow occur to change, revise described first configuration file and/or the second configuration file, the described gas title after change and/or described gas circuit flow value are write described first configuration file and/or the second configuration file;
Described amendment configuration module, for being substituted in described process monitoring file by amended described first configuration file and/or the second configuration file, carries out described process monitoring file desired gas and gas circuit flow value with a batch configuration again.
Beneficial effect of the present invention comprises:
The method and system of gas circuit configuration process in a kind of semiconductor manufacturing provided by the invention, when needing in semiconductor fabrication process to change the gas in gas circuit or flow, only need change the content in the first configuration file or the second configuration file, and without the need to changing the correspondence position in other configuration files one by one.Revise easy, reduce the error rate of amendment, enhance productivity.
Accompanying drawing explanation
Fig. 1 is the process flow diagram of a specific embodiment of the method for gas circuit configuration process in a kind of semiconductor manufacturing of the present invention;
Fig. 2 is the system architecture schematic diagram of a specific embodiment of the system of gas circuit configuration process in a kind of semiconductor manufacturing of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with accompanying drawing, the method and system of gas circuit configuration process in the semiconductor manufacturing of the embodiment of the present invention are described.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The method of gas circuit configuration process in the semiconductor manufacturing of the embodiment of the present invention, as shown in Figure 1, comprises the following steps:
S100, in semiconductor fabrication process, creates multiple first configuration files of the gas title relevant to gas circuit, and multiple second configuration files of described gas title corresponding gas circuit flow value.
Described air inclusion name is called concrete, in semiconductor fabrication the title of the actual gas joined in semiconductor manufacturing facility gas circuit.In processing chamber, gas is added according to described gas title in Subsequent semiconductor manufacturing process.
Described gas flow is the concrete flow value of equipment gas circuit in semiconductor fabrication process, controls the flow of the corresponding gas circuit of semiconductor manufacturing facility in Subsequent semiconductor manufacturing process according to described gas circuit flow value.
S200, by described first configuration file and described second configuration file wildcard in process monitoring file.
S300, when carrying out engineer testing or manufacture technics, according to demand described gas title and described gas circuit flow value are written to accordingly in described first configuration file and described second configuration file, and be substituted in described process monitoring file, desired gas and gas circuit flow value in described process monitoring file are carried out with a batch configuration.
So, when carrying out needing in engineer testing or manufacture technics to change the gas in gas circuit or flow, only need change the content in the first configuration file or the second configuration file, and without the need to changing the statement of the correspondence position in other process monitoring configuration files one by one.Revise easy, reduce the error rate of amendment, enhance productivity.Meanwhile, make the structure of configuration file more clear, be easier to understand and amendment.
Wherein in an embodiment, process monitoring file comprises gas circuit configuration startup file Driver_config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring file ProcessMonitor.xml.
It should be noted that, described gas circuit configuration startup file, i.e. Driver_config.xml are the files that program starts every driver herein.Program code in corresponding conventional art is as follows:
Above code segment is the gas circuit configuration startup file part of gas circuit 1 in semiconductor equipment.Wherein MFC1 is the flow controller 1 of gas circuit 1 correspondence.The flow of gas circuit is controlled by MFC, and the maximum range (flow value) being arranged gas circuit 1 by the setMaxGasFlow method in said procedure code is 100.
Described hardware context file, i.e. IO_config.xml, for create software directly with the associating of the hardware of semiconductor manufacturing facility.Program code in corresponding conventional art is as follows:
Above code segment is the gas circuit hardware context file part of gas circuit 1 in semiconductor equipment.By setGasFlow1 passage, the gas flow of the flow control MFC1 of gas circuit 1 correspondence directly can be set.
Described Row control file, i.e. Control_config.xml is the configuration file that software flow controls.Program code in corresponding conventional art is as follows:
By addGases method, certain road gas is added in the vacuum system of semiconductor processing equipment, for flow operations.The title of gas and flow should with actual board state consistency.By setGases method, gas title and flow are supplied to the host computer of semiconductor processing equipment so that the realization of gas circuit calibration function.
Described monitoring file, i.e. ProcessMonitor.xml monitors the whether normal configuration file of board parameters in semiconductor fabrication process process in real time.Program code in corresponding conventional art is as follows:
Title and the flow information of gas circuit are provided by GasAr_inti (100SCCM) when whether the actual flow of monitoring gas circuit 1 is identical with setting value.
Wherein in an embodiment, described first configuration file and described second configuration file are XML file, and it passes through ENTITY statement wildcard in described process monitoring file.
Such as, the first configuration file of the air inclusion title that the first gas circuit in establishment semiconductor manufacturing facility is corresponding is: Gas1Name.xml; The second configuration file comprising gas circuit flow value creating described first gas circuit corresponding is: Gas1Value.xml.Gas1Name.xml can comprise CF4 and represent gas title in gas circuit 1; Gas1Value.xml can comprise as 400, represents that the gas flow values of gas circuit 1 is 400.
Use in the middle part of the file header of above-mentioned process monitoring file and quote technology, define the first instance corresponding with described first configuration file, and the second instance corresponding with described second configuration file.The entity defined is for described process monitoring file itself and document associated with it.
Pass through defined entity, by described first configuration file and described second configuration file wildcard in described process monitoring file, thus make process monitoring file directly can call the content comprised in described first configuration file and described second configuration file, be also concrete gas title and gas circuit flow value.
The gas title of gas circuit 1 correspondence, the entity of gas circuit flow is defined as utilized following statement in process monitoring file:
With the addition of the configuration file of above-mentioned statement, process monitoring file can be replaced by the content of Gas1Name.xml file when running into character Gas1Name, such as, when in Gas1Name.xml, content is CF4, then configuration file is when running into character Gas1Name, and equivalent and CF4 is configured; Equally, can replace by the content in Gas1Value.xml file when running into character Gas1Value character.
According to definition described above, corresponding statement in gas circuit configuration startup file, hardware context file, Row control file, monitoring file is modified.
Such as, the gas circuit flow value in gas circuit configuration startup file in the gas circuit of gas circuit 1 in above-mentioned semiconductor equipment configuration startup file part is revised as character Gas1Value, and amended new program code is as follows:
Equally to other gas circuits of gas circuit configuration startup file, and hardware context file, Row control file, in monitoring file, the character of corresponding gas title, gas circuit flow is modified.When configuration file runs into corresponding entity character, replace by the content in corresponding first configuration file or the second configuration file.
Wherein in an embodiment, described technique is MEMS, and described gas circuit is 8 tunnels or 4 tunnels.
Wherein in an embodiment, further comprising the steps of:
S400, when kind and/or the flow generation change of gas circuit in engineer testing or manufacture technics, revise described first configuration file and/or the second configuration file, the described gas title after change and/or described gas circuit flow value are write described first configuration file and/or the second configuration file;
S500, is substituted in described process monitoring file by amended described first configuration file and/or the second configuration file, described process monitoring file desired gas and gas circuit flow value is carried out with a batch configuration again.
By revising the content in the first configuration file, the second configuration file, content then in engineer testing or manufacture technics in the first configuration file and the second configuration file can wildcard in process monitoring file, process monitoring file can obtain the gas title after upgrading and respective streams value, and avoids the tedious steps changing process monitoring file one by one.The production efficiency of semiconductor fabrication process can be provided greatly.
Based on same inventive concept, the embodiment of the present invention provides the system of gas circuit configuration process in a kind of semiconductor manufacturing, and the principle of dealing with problems due to this system is similar to a kind of aforementioned method, therefore, the enforcement of this system can realize according to the concrete steps of preceding method, repeats part and repeats no more.
The system of gas circuit configuration process in a kind of semiconductor manufacturing of the embodiment of the present invention, as shown in Figure 2, comprises file creation module 100, wildcard module 200, and Process configuration module 300.
Described file creation module 100, in semiconductor fabrication process, creates multiple first configuration files of the gas title relevant to gas circuit, and multiple second configuration files of described gas title corresponding gas circuit flow value;
Described wildcard module 200, for by described first configuration file and described second configuration file wildcard in process monitoring file;
Described Process configuration module 300, for when carrying out engineer testing or manufacture technics, according to demand described gas title and described gas circuit flow value are written to accordingly in described first configuration file and described second configuration file, and be substituted in described process monitoring file, desired gas and gas circuit flow value in described process monitoring file are carried out with a batch configuration.
Wherein in an embodiment, described process monitoring file comprises gas circuit configuration startup file Driver_config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring file ProcessMonitor.xml.
Wherein in an embodiment, described first configuration file and described second configuration file are XML file, and it passes through ENTITY statement wildcard in described process monitoring file.
Wherein in an embodiment, described technique is MEMS, and described gas circuit is 8 tunnels or 4 tunnels.
Wherein in a semiconductor manufacturing system of gas circuit configuration process embodiment in, also comprise modified module 400, and amendment configuration module 500.
Described modified module 400, for when the kind of gas circuit in engineer testing or manufacture technics and/or flow occur to change, revise described first configuration file and/or the second configuration file, the described gas title after change and/or described gas circuit flow value are write described first configuration file and/or the second configuration file;
Described amendment configuration module 500, for being substituted in described process monitoring file by amended described first configuration file and/or the second configuration file, carries out described process monitoring file desired gas and gas circuit flow value with a batch configuration again.
The system of gas circuit configuration process in embodiment of the present invention semiconductor manufacturing, when needing in semiconductor technology manufacture or engineer testing to change the gas in gas circuit or flow, only need change the content in the first configuration file or the second configuration file, and without the need to changing the correspondence position in other configuration files one by one.Revise easy, reduce the error rate of amendment, enhance productivity.Meanwhile, make the structure of configuration file more clear, be easier to understand and amendment.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. the method for gas circuit configuration process in semiconductor manufacturing, is characterized in that, comprise the following steps:
In semiconductor fabrication process, create multiple first configuration files of the gas title relevant to gas circuit, and multiple second configuration files of described gas title corresponding gas circuit flow value;
By described first configuration file and described second configuration file wildcard in process monitoring file;
When carrying out engineer testing or manufacture technics, according to demand described gas title and described gas circuit flow value are written to accordingly in described first configuration file and described second configuration file, and be substituted in described process monitoring file, desired gas and gas circuit flow value in described process monitoring file are carried out with a batch configuration.
2. the method for gas circuit configuration process in semiconductor manufacturing according to claim 1, it is characterized in that, described process monitoring file comprises gas circuit configuration startup file Driver_config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring file ProcessMonitor.xml.
3. the method for gas circuit configuration process in semiconductor manufacturing according to claim 2, it is characterized in that, described first configuration file and described second configuration file are XML file, its by ENTITY statement wildcard in described process monitoring file.
4. the method for gas circuit configuration process in semiconductor manufacturing according to claim 3, it is characterized in that, described technique is MEMS, and described gas circuit is 8 tunnels or 4 tunnels.
5. the method for gas circuit configuration process in semiconductor manufacturing according to claim 1, is characterized in that, also comprise the steps:
When kind and/or the flow generation change of gas circuit in engineer testing or manufacture technics, revise described first configuration file and/or the second configuration file, the described gas title after change and/or described gas circuit flow value are write described first configuration file and/or the second configuration file;
Amended described first configuration file and/or the second configuration file are substituted in described process monitoring file, described process monitoring file desired gas and gas circuit flow value are carried out with a batch configuration again.
6. the system of gas circuit configuration process in semiconductor manufacturing, is characterized in that, comprise file creation module, wildcard module, and Process configuration module, wherein:
Described file creation module, in semiconductor fabrication process, creates multiple first configuration files of the gas title relevant to gas circuit, and multiple second configuration files of described gas title corresponding gas circuit flow value;
Described wildcard module, for by described first configuration file and described second configuration file wildcard in process monitoring file;
Described Process configuration module, for when carrying out engineer testing or manufacture technics, according to demand described gas title and described gas circuit flow value are written to accordingly in described first configuration file and described second configuration file, and be substituted in described process monitoring file, desired gas and gas circuit flow value in described process monitoring file are carried out with a batch configuration.
7. the system of gas circuit configuration process in semiconductor manufacturing according to claim 6, it is characterized in that, described process monitoring file comprises gas circuit configuration startup file Driver_config.xml, hardware context file I/O _ config.xml, Row control file Control_config.xml and/or monitoring file ProcessMonitor.xml.
8. the system of gas circuit configuration process in semiconductor manufacturing according to claim 7, it is characterized in that, described first configuration file and described second configuration file are XML file, its by ENTITY statement wildcard in described process monitoring file.
9. the system of gas circuit configuration process in semiconductor manufacturing according to claim 8, it is characterized in that, described technique is MEMS, and described gas circuit is 8 tunnels or 4 tunnels.
10. the system of gas circuit configuration process in semiconductor manufacturing according to claim 6, is characterized in that, also comprise modified module, and amendment configuration module, wherein:
Described modified module, for when the kind of gas circuit in engineer testing or manufacture technics and/or flow occur to change, revise described first configuration file and/or the second configuration file, the described gas title after change and/or described gas circuit flow value are write described first configuration file and/or the second configuration file;
Described amendment configuration module, for being substituted in described process monitoring file by amended described first configuration file and/or the second configuration file, carries out described process monitoring file desired gas and gas circuit flow value with a batch configuration again.
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| CN110952076A (en) * | 2018-09-26 | 2020-04-03 | 北京北方华创微电子装备有限公司 | Gas path control method and device and semiconductor processing equipment |
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