CN104742266A - Epoxy resin vacuum degassing temperature/pressure control system - Google Patents
Epoxy resin vacuum degassing temperature/pressure control system Download PDFInfo
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- CN104742266A CN104742266A CN201510173474.0A CN201510173474A CN104742266A CN 104742266 A CN104742266 A CN 104742266A CN 201510173474 A CN201510173474 A CN 201510173474A CN 104742266 A CN104742266 A CN 104742266A
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- temperature
- vacuum
- pressure
- time
- deaeration
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 40
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 40
- 238000009849 vacuum degassing Methods 0.000 title claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000002156 mixing Methods 0.000 claims abstract description 13
- 230000000694 effects Effects 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims description 26
- 238000003756 stirring Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 16
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000002131 composite material Substances 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 9
- 238000007872 degassing Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 229920006395 saturated elastomer Polymers 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 239000011863 silicon-based powder Substances 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 238000010792 warming Methods 0.000 claims description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 206010063493 Premature ageing Diseases 0.000 description 1
- 208000032038 Premature aging Diseases 0.000 description 1
- 238000005273 aeration Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000019580 granularity Nutrition 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Degasification And Air Bubble Elimination (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Epoxy Resins (AREA)
Abstract
The invention relates to an epoxy resin vacuum degassing temperature/pressure control system, which is used for determining the preset values of temperature and vacuumizing time of an epoxy resin vacuum degassing process by detecting the influence of temperature on the vacuum degassing effect when the formula of an epoxy resin mixture is changed or under vacuumizing conditions, and in the process of detecting, the preset pressure values are changed according to different preset temperature values. Due to the flexible components and ratios thereof of the liquid epoxy resin mixture, the vacuum mixing defoaming properties differ greatly, so that process parameter values are required to be determined in a targeted mode.
Description
(1) technical field:
The present invention relates to epoxide resin vacuum degassing temperature control pressurer system, for when change mixture of epoxy resins formula or when vacuumizing operating mode, by the impact of detected temperatures on vacuum outgas effect, determine temperature and the pumpdown time setting value of epoxide resin vacuum degasification technique, adopt during detection and change its pressure set points with the difference of desired temperature.Due to each composition material of liquid-state epoxy resin compound and the versatile and flexible of proportioning thereof, therefore its vacuum stirring deaeration performance difference needs to determine process parameter value pointedly very greatly.
(2) background technology:
The combination property of epoxy resin is splendid, and its material prescription flexible design is various, and epoxy resin is used widely in the field such as electric power, electronic apparatus, particularly the mould material of the electrical equipment such as electric power mutual-inductor, transformer, insulator.When epoxy resin is applied to high voltage electrical equipment, require that it has extremely low partial discharge quantity, otherwise premature aging, electric leakage will puncture even accidents caused because partial discharge quantity exceeds standard.Pore in epoxide resin material produces the main reason of shelf depreciation, therefore when poured with epoxy resin, all adopts vacuum pouring deaeration technology to reduce air gap in cast product and bubble as far as possible.In order to reach this purpose, all need to control well vacuum, temperature and activity time in each operation such as pretreatment, batch mixing, cast of raw material.
Typical technique resin, curing agent, silicon emblem powder, flexibilizer and mill base is calculated each component weight by proportioning, preheating in an oven in advance after weighing, and the semi-finished product coil that its coiling is good and mould also need carry out drying process in 100-110 DEG C of baking oven.The semi-finished product coil of different electric pressure, its drying time is unusual about 2 ~ 4h also.Then mixing tank, the heating system of pouring can and vacuum system is started.Mixing tank temperature is set as about 80 DEG C, cast is filled with temperature and is set as about 85 DEG C, then load weighted material is put in order successively batch mixing to fill with, then opens vavuum pump, vacuumize in the vacuum ranges of 100 ~ 300Pa, stir 80 ~ 120 minutes even, completely degassed to compound.Meanwhile, import pouring can carry out normal pressure or vacuum pouring by being preheating to 100-110 DEG C of mould for subsequent use, by stirring, degassed compound completely slowly injects mould.
(3) summary of the invention:
In aerial high-viscosity epoxy resin compound liquid, its gas also has certain solubility, but bubble size is very little in compound liquid depths, usually exist with microbubble form, the speed that microbubble relies on natural buoyancy to rise is extremely slow, external force must be relied on to take bubble to liquid level, and therefore comparatively effective deaeration mode adopts the method such as vacuum stirring deaeration and vacuum film deaeration at present.Pressure in tank diameter increases from top to bottom successively, has occurred larger low-pressure area in middle and upper part, therefore, according to the condition of bubble formation, bubble mainly in, upper grown, to gather and deaeration.
Due to each composition material of mixture of epoxy resins and the different of proportioning thereof, and may due to epoxy resin, curing agent inherent quality problem, cause the gel time often criticizing compound inconsistent, or the vacuum stirring deaeration process variations of the vacuum deaerator plant performance used and employing thereof is very large, therefore the technological parameter of existing vacuum stirring deaeration arranges and is mostly by rule of thumb or arranges with reference to process similarity, specific aim is poor, its setting value does not change with the manufacturer of prescription of mixed materials or material or working conditions change, affects deaeration effect and product quality.The present invention introduces epoxide resin vacuum degassing temperature control pressurer system, for when change mixture of epoxy resins formula or factory or redefine technological parameter when vacuumizing operating mode, it is characterized in that determining in technological parameter process, to adopt the difference with mixture temperature to change pressure (vacuum) value of its setting, and be suitable for deaeration temperature by Site Detection and it can be used as desired temperature, and desired temperature and the running time of vacuum stirring degassing process is selected according to compound gelling temp and time relationship, thus make desired temperature in original system, can not affect production to determine and arrange as operational factor at ordinary times after revising, make it stronger to the specific aim of various mixture of epoxy resins.
Under the operating mode of specific pressure and agitator, when temperature constantly raises, in fluid mix, the solubility of gas reduces, around moisture just evaporates in the minute bubbles in fluid mix, constantly expansion is grown along with temperature raises bubble, simultaneously because the viscosity of fluid mix constantly declines, bubble surface tension force diminishes, after bubble rises to nearly liquid level, bubble can not be overflowed at once, but under the effect of pressure reduction, stays for some time under nearly liquid level, after shaking off liquid level tension force, could overflow or break., but due to the larger intermolecular movement friction of compound viscosity comparatively large, the bubble effusion resistance that rises is larger.Decline along with temperature raises viscosity, bubble constantly grows and overflows, under specific compound, equipment and pressure, when in certain hour, bubble effusion quantity and volume are difficult to the temperature risen when continuing increase with temperature, or because of this compound gelling temp and its technique of time restriction not allowable temperature to continue to rise bubble is overflowed temperature that quantity and volume cannot continue when increasing, be all called the applicable deaeration temperature under this operating mode here.Do not get too high because fluid mix bubble removal step temperature limits by gel time the technique had, and get lower temperature because it has longer bubble removal step to allow the time, but these all do not have deaeration effect foundation.In fluid mix, gas constantly reduces at de-aeration, and therefore bubble effusion quantity is relative with Volume Changes.The present invention, when not affecting mix material proportioning and being stable, chooses and is suitable for deaeration temperature or slightly lower than the value of this temperature, as the desired temperature of vacuum stirring deaeration technique.In fact, liquid-state epoxy resin raises viscosity with temperature and declines fast, but when temperature rises to certain value, viscosity downward trend slows down, and is finally substantially tending towards certain numerical value.Because its compound viscosity thinner of the more granularities of the loading of filler in mixture of epoxy resins increases more.It makes epoxy resin temperature, viscosity corresponding relation offset to viscosity augment direction in compound, simultaneously because agitator structure and speed thereof are selected different, the bubble being in different growing stages is made to be transported to liquid level and by effective conevying efficiency of overflowing, change also impact with the difference of temperature and viscosity and be suitable for deaeration temperature, on the other hand when mixture of epoxy resins is containing curing agent, also will increase gradually with temperature rising and passage of time viscosity.
In sum, the viscosity of bubble effusion efficiency and mixture of epoxy resins is closely related, and mixture of epoxy resins viscosity relation non-linear with temperature, therefore different applicable deaeration temperature is just existed for different compounds.
High vacuum can improve vacuum outgas effect and shorten the vacuum outgas time, but it limited by the saturated vapor pressure of mould material.If vacuum exceedes the saturated vapor pressure of material, will cause the volatilization of material, cause the change of mix material proportioning, the quality of cast product just cannot ensure.And saturated vapor pressure is by the impact of temperature and pressure, therefore when vacuum stirring deaeration technique is owing to adopting different desired temperatures, just different vacuum setting values must be adopted according to the saturated vapor pressure of composition material, there to be best vacuum outgas optimum configurations.
System utilizes the change of vacuum to reflect bubble effusion efficiency in mixture of epoxy resins, under a certain design temperature, by temporary close vavuum pump, detect the time that vacuum reaches the lower limit (upper pressure limit value) of setting value, be reflected in the change of this specific operation bubble effusion quantity and volume and compared for optimizing temperature setting by the detection of different temperature points.
Select suitable desired temperature, effectively can ensure each composition material of mixture of epoxy resins, product office can not be affected because of the too low desired temperature of employing and put performance and production efficiency, and blindly have employed too high desired temperature, reduction material quality and composition material are volatilized because of too high desired temperature, affects the stability of its proportioning.Meanwhile, too high desired temperature makes allowed gel time shorten, and compound viscosity increases fast, thus makes the shortening of vacuum stirring degassing time affect pouring piece electrical insulation capability; Select rational technological temperature setting value not limit by excessive temperature simultaneously, made it more extensively reasonably composition material range of choice, and be easy to ensure production efficiency and energy-conservation.
Described epoxide resin vacuum degassing temperature control pressurer system, when the system is operated, first resin, curing agent, silicon emblem powder, flexibilizer and mill base are calculated each component weight by proportioning, for subsequent use after carrying out preheating and drying process in advance by former technological requirement in baking oven or hot-blast stove after weighing, then start heating system and the vacuum system of mixing tank.First epoxy resin is dropped in mixing tank, drop into silicon powder again, and control to heat up under material temperature in mixing tank is cooled to top temperature, described top temperature refers to can guarantee that the temperature lower than being suitable for deaeration temperature such as gets 45 DEG C about-55 DEG C, then unlatching vavuum pump first stirs and makes compound evenly drop into curing agent again in 5-10 minute, finally drop into flexibilizer, after having fed intake, stir again and make compound even in 3-6 minute, then vavuum pump is opened, vacuum is set within the scope of a bound, such as can by the setting value of former technological requirement as low pressure limit value, and get vacuum decline (pressure increase) to this low pressure limit value add 6-15% as higher limit, the pressure signal of its reflection vacuum send temperature controller process, its signal opening or closing vavuum pump is sent by temperature controller.Temperature controller adopts staged heating mode, its agitator can by former technological requirement continuous operation, the identical warming room of each about desirable 3-8 DEG C every, and the terminal temperature that allows is determined according to compound gelling temp and time relationship, such as rise to 75 DEG C about-85 DEG C from top temperature, require the vacuum stirring degassing time that intensification power is large, evacuation rate fast and terminal temperature can not too highly avoid the too short impact of gel time to allow.The pressure (vacuum) of mixing tank arranges to adopt and successively decreases according to described staged heating mode temperature section at different levels, namely pressure (vacuum) setting value under the determined design temperature of former technique, pressure set points is increased progressively and to low decreasing pressure setting value to height in proportion by this temperature, its pressure set points and relevant temperature setting value are engaged in the permission vacuum ranges that storage tank can reach and tolerate, and make it be no more than and slightly lower than the saturated vapor pressure of all composition materials.First heat up at top temperature and open vacuum pump evacuation during system works, vavuum pump and valve is closed when making vacuum reach relevant temperature section setting pressure lower limit and reach this temperature section design temperature, the drop timer timing when vacuum drops to setting pressure higher limit starting vacuum terminates, enter next section to do to open valve and vacuum pump evacuation again after too much bubble is eliminated in several seconds time delay, so go round and begin again, sequentially record the drop timer timing time of each vacuum, its drop timer reflection system bubble formation speed at each temperature, the drop timer timing time of the more each vacuum of deduction vaccum leakage rate impact, get temperature corresponding to its long period as desired temperature, namely deaeration temperature is suitable for, then stop heating up after terminal temperature, and constant-temperature vacuum stirs degassed under the desired temperature and activity time thereof of former technological requirement, pour into a mould by former technological requirement more afterwards, solidification and the demoulding.
Produce at ordinary times and do not do the described detection being suitable for deaeration temperature, only use described desired temperature instead and revise vacuum stirring degassing time according to compound gelling temp and time relationship, and pressure (vacuum) the setting value temperature-constant operation of described relevant temperature section, and the mixing speed setting value still using former technique to determine, all the other are all by former technological requirement operation.With PD meter, detection is put to pouring piece make-game if desired, check whether it meets relevant national standard or inner controlling standard of enterprise adjusts pumpdown time and desired temperature again.
(4) accompanying drawing illustrates:
Accompanying drawing is the circuit structure block diagram of epoxide resin vacuum degassing temperature control pressurer system.
(5) detailed description of the invention:
As shown in drawings, it is made up of temperature sensor 2, temperature controller 7, pressure sensor 3, pressure transmitter 4, vavuum pump 5, vavuum pump drive circuit 6 and vacuum degassing machine 1 the circuit system block diagram of epoxide resin vacuum degassing temperature controller.Pressure sensor 3 is connected with the vacuum chamber of vacuum degassing machine 1, and for the vacuum of detection system, vacuum degassing machine 1 opens or closes by vavuum pump drive circuit 6 vacuum that vavuum pump 5 carrys out control system.The signal of pressure sensor 3 send temperature controller 7 to process through pressure transmitter 4, the vacuum ranges of circuit simultaneously for reaching in control system operation of temperature controller 7.After opening vacuum degassing machine 1, if the pressure in vacuum chamber reaches capping value, then temperature controller 7 stops timing sending signal enabling vavuum pump 5 to vavuum pump drive circuit 6 and magnetic valve.When the pressure in vacuum chamber reaches preset lower limit, temperature controller 7 will cut out vavuum pump 5.
Claims (2)
1. epoxide resin vacuum degassing temperature control pressurer system, for when change mixture of epoxy resins formula or factory or redefine technological parameter when vacuumizing operating mode, it is characterized in that determining in technological parameter process, to adopt the difference with mixture temperature to change pressure (vacuum) value of its setting, and be suitable for deaeration temperature by Site Detection and it can be used as desired temperature, and the running time of vacuum stirring degassing process is selected according to compound gelling temp and time relationship, thus make desired temperature in original system, can not affect production to determine and arrange as operational factor at ordinary times after revising, under the operating mode of specific pressure and agitator, when temperature constantly raises, in fluid mix, the solubility of gas reduces, bubble constantly grows and overflows, at specific compound, under equipment and pressure, when in certain hour, bubble effusion quantity and volume are difficult to the temperature risen when continuing increase with temperature, or because of this compound gelling temp and its technique of time restriction not allowable temperature continue to rise, bubble is overflowed temperature that quantity and volume cannot continue when increasing, here the applicable deaeration temperature under this operating mode is all called, the present invention is not when affecting mix material proportioning and being stable, choose and be suitable for deaeration temperature or slightly lower than the value of this temperature, as the desired temperature of vacuum stirring deaeration technique, the viscosity of bubble effusion efficiency and mixture of epoxy resins is closely related, and mixture of epoxy resins viscosity relation non-linear with temperature, therefore different applicable deaeration temperature is just existed for different compounds, high vacuum can improve vacuum outgas effect and shorten the vacuum outgas time, but it limited by the saturated vapor pressure of mould material, therefore when vacuum stirring deaeration technique is owing to adopting different desired temperatures, just must adopt different vacuum setting values according to the saturated vapor pressure of composition material, there to be best vacuum outgas optimum configurations, system utilizes the change of vacuum to reflect bubble effusion efficiency in mixture of epoxy resins, under a certain design temperature, by temporary close vavuum pump, detect the time that vacuum reaches the lower limit (upper pressure limit value) of setting value, be reflected in the change of this specific operation bubble effusion quantity and volume, and compare for optimizing temperature setting by the detection of different temperature points,
Described epoxide resin vacuum degassing temperature control pressurer system, when first dropping into epoxy resin in mixing tank, drop into silicon powder again, and control to heat up under material temperature in mixing tank is cooled to top temperature, described top temperature refers to the temperature can guaranteed lower than being suitable for deaeration temperature, then unlatching vavuum pump first stirs and makes compound evenly drop into curing agent again in 5-10 minute, after having fed intake, stir again and make compound even in 3-6 minute, then vavuum pump is opened, vacuum is set within the scope of bound, can by the setting value of former technological requirement as low pressure limit value, and get vacuum decline (pressure increase) to this low pressure limit value add 6-15% as higher limit, the pressure signal of its reflection vacuum send temperature controller process, its signal opening or closing vavuum pump is sent by temperature controller, temperature controller adopts staged heating mode, its agitator can by former technological requirement continuous operation, the identical warming room getting 3-8 DEG C every, and the terminal temperature that allows is determined according to compound gelling temp and time relationship, require that intensification power is large, the vacuum stirring degassing time that the fast and terminal temperature of evacuation rate can not too highly avoid the too short impact of gel time to allow, the pressure (vacuum) of mixing tank arranges to adopt and successively decreases according to described staged heating mode temperature section at different levels, namely pressure (vacuum) setting value under the determined design temperature of former technique, pressure set points is increased progressively and to low decreasing pressure setting value to height in proportion by this temperature, its pressure set points and relevant temperature setting value are engaged in the permission vacuum ranges that storage tank can reach and tolerate, it is made to be no more than and slightly lower than the saturated vapor pressure of all composition materials, first heat up at top temperature and open vacuum pump evacuation during system works, vavuum pump and valve is closed when making vacuum reach relevant temperature section setting pressure lower limit and reach this temperature section design temperature, start the drop timer of vacuum, when vacuum drops to setting pressure higher limit, timing terminates, enter next section to do to open valve and vacuum pump evacuation again after too much bubble is eliminated in several seconds time delay, so go round and begin again, sequentially record the drop timer timing time of each vacuum, its drop timer reflection system bubble formation speed at each temperature, the drop timer timing time of the more each vacuum of deduction vaccum leakage rate impact, get temperature corresponding to its long period as desired temperature, namely deaeration temperature is suitable for, then stop heating up after terminal temperature, and constant-temperature vacuum stirs degassed under the desired temperature and activity time thereof of former technological requirement, pour into a mould by former technological requirement more afterwards, solidification and the demoulding, produce at ordinary times and use described desired temperature instead and revise vacuum stirring degassing time according to compound gelling temp and time relationship, and pressure (vacuum) the setting value temperature-constant operation of described relevant temperature section, all the other are all by former technological requirement operation.
2. epoxide resin vacuum degassing temperature control pressurer system according to claim 1, is characterized in that it comprises:
It is made up of temperature sensor 2, temperature controller 7, pressure sensor 3, pressure transmitter 4, vavuum pump 5, vavuum pump drive circuit 6 and vacuum degassing machine 1, pressure sensor 3 is connected with the vacuum chamber of vacuum degassing machine 1, for the vacuum of detection system, vacuum degassing machine 1 opens or closes by vavuum pump drive circuit 6 vacuum that vavuum pump 5 carrys out control system, and the signal of pressure sensor 3 send temperature controller 7 to process through pressure transmitter 4.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510173474.0A CN104742266B (en) | 2015-04-14 | 2015-04-14 | Epoxide resin vacuum degassing temperature control pressurer system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510173474.0A CN104742266B (en) | 2015-04-14 | 2015-04-14 | Epoxide resin vacuum degassing temperature control pressurer system |
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| CN104742266A true CN104742266A (en) | 2015-07-01 |
| CN104742266B CN104742266B (en) | 2019-03-05 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106921268A (en) * | 2015-12-28 | 2017-07-04 | 埃森纳赫精密电机(苏州)有限公司 | A kind of process for filling colloid and its equipment for servomotor |
| CN112433262A (en) * | 2018-12-29 | 2021-03-02 | 珠海优特智厨科技有限公司 | Detection method and detection device for food material throwing state |
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| EP0172726A2 (en) * | 1984-08-14 | 1986-02-26 | Philip Kenneth Freakley | Mixing polymers such as rubber |
| EP1035958B1 (en) * | 1997-11-06 | 2003-04-09 | M.A. Hannarubbercompounding | Dynamic mixer control in plastics and rubber processing |
| CN201702868U (en) * | 2010-06-12 | 2011-01-12 | 上海伟星光学有限公司 | Full automatic material preparation device of resin lens raw materials |
| CN103252849A (en) * | 2013-04-16 | 2013-08-21 | 刘汝斌 | Precise epoxy injector |
| CN104723472A (en) * | 2015-04-13 | 2015-06-24 | 张金木 | Temperature controller for use in vacuum degassing of epoxy resin |
-
2015
- 2015-04-14 CN CN201510173474.0A patent/CN104742266B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0172726A2 (en) * | 1984-08-14 | 1986-02-26 | Philip Kenneth Freakley | Mixing polymers such as rubber |
| EP1035958B1 (en) * | 1997-11-06 | 2003-04-09 | M.A. Hannarubbercompounding | Dynamic mixer control in plastics and rubber processing |
| CN201702868U (en) * | 2010-06-12 | 2011-01-12 | 上海伟星光学有限公司 | Full automatic material preparation device of resin lens raw materials |
| CN103252849A (en) * | 2013-04-16 | 2013-08-21 | 刘汝斌 | Precise epoxy injector |
| CN104723472A (en) * | 2015-04-13 | 2015-06-24 | 张金木 | Temperature controller for use in vacuum degassing of epoxy resin |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106921268A (en) * | 2015-12-28 | 2017-07-04 | 埃森纳赫精密电机(苏州)有限公司 | A kind of process for filling colloid and its equipment for servomotor |
| CN112433262A (en) * | 2018-12-29 | 2021-03-02 | 珠海优特智厨科技有限公司 | Detection method and detection device for food material throwing state |
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| CN104742266B (en) | 2019-03-05 |
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Effective date of registration: 20200428 Address after: 710300 No.8, Fenger Road, Fengjing Industrial Park, Xi'an, Qingyi District, Xi'an City, Shaanxi Province Patentee after: Shaanxi Jinchen Yongyue New Material Co., Ltd Address before: 350004 8 longevity garden, Yi Chau, Taijiang District, Fujian, Fuzhou 401 Patentee before: Zhang Jinmu |
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