CN104723472A - Temperature controller for use in vacuum degassing of epoxy resin - Google Patents
Temperature controller for use in vacuum degassing of epoxy resin Download PDFInfo
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- CN104723472A CN104723472A CN201510170859.1A CN201510170859A CN104723472A CN 104723472 A CN104723472 A CN 104723472A CN 201510170859 A CN201510170859 A CN 201510170859A CN 104723472 A CN104723472 A CN 104723472A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 43
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 43
- 238000009849 vacuum degassing Methods 0.000 title claims abstract description 19
- 238000003756 stirring Methods 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000000203 mixture Substances 0.000 claims abstract description 21
- 238000007872 degassing Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 18
- 150000001875 compounds Chemical class 0.000 claims description 32
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 17
- 238000002156 mixing Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000000630 rising effect Effects 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000010792 warming Methods 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 abstract 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 206010063493 Premature ageing Diseases 0.000 description 1
- 208000032038 Premature aging Diseases 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000019580 granularity Nutrition 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
Landscapes
- Degasification And Air Bubble Elimination (AREA)
- Epoxy Resins (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
The invention relates to a temperature controller for use in vacuum degassing of epoxy resin. The temperature controller is used for detecting the influence of different temperatures upon vacuum degassing so as to determine vacuum degassing temperature of epoxy resin and a set value of evacuating time; due to flexibility and diversity in ingredient materials of liquid epoxy resin mixture and their ratio, differences between vacuum-stirring degassing performances of the ingredient materials are great, and the process temperature needs to be determined specifically.
Description
(1) technical field:
The present invention relates to a kind of epoxide resin vacuum degassing temperature controller, for when change mixture of epoxy resins formula or when vacuumizing operating mode, by detecting different temperatures to the impact of vacuum outgas effect, determine temperature and the pumpdown time setting value of epoxide resin vacuum degasification technique, due to each composition material of liquid-state epoxy resin compound and the versatile and flexible of proportioning thereof, its vacuum stirring degassing performance widely different therefore needs determines process warm angle value pointedly.
(2) background technology:
The design flexibility of epoxide resin material formula and diversity, epoxy resin is used widely in the field such as electric power, electronic apparatus, the particularly mould material of electrical equipment and the Embedding Material of electronic device such as electric power mutual-inductor, transformer, insulator, when epoxy resin is applied to high voltage electrical equipment, require that it has extremely low partial discharge quantity, otherwise premature aging, electric leakage will puncture even because partial discharge quantity exceeds standard.Pore in epoxide resin material produces the main reason of shelf depreciation, therefore when poured with epoxy resin, all adopts vacuum pouring Degassing Technology to reduce air gap in cast product and bubble as far as possible.
Based on the principle of gas solubility and fluid temperature and pressure correlation in a liquid, applying more in high viscosity liquid degasification process is the methods such as the degassed and vacuum film of vacuum stirring is degassed.Typical technique resin, curing agent, silicon emblem powder, flexibilizer and mill base is calculated each component weight by proportioning, preheating in an oven in advance after weighing, and the semi-finished product coil that its coiling is good and mould also need carry out drying process in baking oven.The semi-finished product coil of different electric pressure, its drying time is unusual about 2 ~ 4h also.Then mixing tank, the heating system of pouring can and vacuum system is started.Mixing tank temperature is set as about 80 DEG C, cast is filled with temperature and is set as about 85 DEG C, then load weighted material is put in order successively batch mixing fill with, then open vavuum pump, vacuumize in the vacuum ranges of 100 ~ 300Pa, stir 80 ~ 120 minutes even, completely degassed to compound.Meanwhile, import pouring can carry out normal pressure or vacuum pouring by being preheating to 100-110 DEG C of mould for subsequent use.Under vacuo, by stirring, degassed compound completely slowly injects mould and completes cast.
(3) summary of the invention:
In aerial high-viscosity epoxy resin compound liquid, its gas also has certain solubility, very little at the liquid depths bubble size of compound, usually exist with microbubble form, the speed that microbubble relies on natural buoyancy to rise is extremely slow, external force must be relied on to take bubble to liquid level, and therefore at present comparatively effective degassed mode is the method such as adopt the degassed and vacuum film of vacuum stirring degassed.
Due to each composition material of liquid-state epoxy resin compound and each different of proportioning thereof, its vacuum stirring degasification technique performance difference is very large, also may due to epoxy resin, curing agent inherent quality problem, cause the gel time often criticizing compound inconsistent, and the vacuum stirring deaeration process variations of the vacuum deaerator plant performance used and employing thereof is very large, therefore the technological parameter that existing vacuum stirring is degassed arranges and is mostly by rule of thumb or arranges with reference to process similarity, specific aim is poor, its setting value does not change with prescription of mixed materials or the manufacturer of material or the change of operating mode, affect degasifying effect and product quality.The present invention introduces a kind of epoxide resin vacuum degassing temperature controller, for when change mixture of epoxy resins formula or factory or redefine technological parameter when vacuumizing operating mode, it is characterized in that it is by the impact of Site Detection different temperatures on vacuum stirring degasifying effect, determine the applicable deaeration temperature of mixture of epoxy resins, and desired temperature and the running time of vacuum stirring degassing process is selected according to compound gelling temp and time relationship, thus desired temperature can not affected in original system after production is determined to arrange as operational factor at ordinary times, make it stronger to the vacuum outgas specific aim of various mixture of epoxy resins.
Under the operating mode of specific pressure and agitator, when mixing tank temperature constantly raises, in compound, the solubility of gas reduces, around moisture just evaporates in the minute bubbles in compound, constantly expansion is grown along with temperature raises bubble, simultaneously because the viscosity of compound constantly declines, bubble surface tension force diminishes, after bubble rises to nearly liquid level, bubble can not be overflowed at once, but under the effect of pressure reduction, stays for some time under nearly liquid level, after shaking off liquid level tension force, could overflow or break.But because compound viscosity larger intermolecular movement friction larger bubble rising effusion resistance is larger, therefore escaping into the effusion of a large amount of bubble from first bubble is a progressive process relevant with compound viscosity B coefficent, decline along with temperature raises viscosity, bubble constantly grows and overflows, at specific compound, when bubble effusion quantity and volume in certain hour are difficult to rise the temperature continued when increasing with temperature under equipment and pressure, or because of the not allowable temperature continuation rising of this its technique of compound gelling temp time restriction, bubble is overflowed temperature that quantity and volume cannot continue when increasing, here the applicable deaeration temperature under this operating mode is all called.Do not get too high because compound degassing process temperature limits by gel time the technique had, and get lower temperature because it has longer degassing process to allow the time, but these all do not have degasifying effect foundation.In compound, gas constantly reduces in degasification process, and therefore bubble effusion quantity is relative with Volume Changes.The present invention when not affecting mix material proportioning and being stable, choose be suitable for deaeration temperature or slightly lower than the value of this temperature as the desired temperature of vacuum stirring degassing process.In fact, epoxy resin raises viscosity with temperature and declines fast, but when temperature rises to certain value, viscosity downward trend slows down, and is finally substantially tending towards certain numerical value.Because its compound viscosity thinner of the more granularities of the loading of inserts in mixture of epoxy resins increases more.It makes epoxy resin temperature, viscosity corresponding relation offset to viscosity augment direction in compound, simultaneously because agitator structure and speed thereof are selected different, the bubble being in different growing stages is made to be transported to liquid level and by effective conevying efficiency of overflowing, change also impact with the difference of temperature and viscosity and be suitable for deaeration temperature, on the other hand when mixture of epoxy resins is containing curing agent, also will increase gradually with temperature rising and passage of time viscosity.In sum, the viscosity of bubble effusion efficiency and mixture of epoxy resins is closely related, and mixture of epoxy resins viscosity relation non-linear with temperature, therefore different applicable deaeration temperature is just existed for different compounds.
Temperature set by mixture of epoxy resins vacuum stirring degasification technique and vacuum can not be too high, it determined by the material behavior forming this mixture of epoxy resins, if exceed the saturated vapor pressure of material, the volatilization of material will be caused, cause the change of mix material proportioning, the quality of cast product just cannot ensure.
System utilizes the change of vacuum to reflect bubble effusion efficiency in mixture of epoxy resins, under a certain design temperature, by temporary close vavuum pump, detect the time that vacuum reaches the lower limit (upper pressure limit value) of setting value, be reflected in the change of this specific operation bubble effusion quantity and volume and compared for optimizing temperature setting by the detection of different temperature points.
Select suitable desired temperature effectively can ensure each composition material of mixture of epoxy resins, product office can not be affected because of the too low desired temperature of employing and put performance and production efficiency, and blindly have employed too high desired temperature will reduce material quality, and composition material volatilizees because of too high desired temperature and affects the stability of its proportioning, too high desired temperature also makes allowed gel time shorten, compound viscosity increases fast, thus vacuum stirring degassing time is shortened, affect pouring piece electrical insulation capability, select rational technological temperature setting value not make it more extensively reasonably composition material range of choice by excessive temperature restriction simultaneously, production efficiency and energy-conservation is ensured with being easy to.
Described a kind of epoxide resin vacuum degassing temperature controller, the temperature detection for mixing tank vacuum stirring degasification process in epoxide resin vacuum degas system controls.When the system is operated, first epoxy resin, curing agent, silicon emblem powder, flexibilizer and mill base are calculated each component weight by proportioning, for subsequent use after carrying out preheating and drying process in advance by technological requirement in baking oven or hot-blast stove after weighing, then start mixing tank, the heating system of pouring can and vacuum system.Wherein mixing tank first drops into epoxy resin, drop into silicon powder again, and control to heat up under material temperature in mixing tank is cooled to top temperature, described top temperature refers to can guarantee that the temperature lower than being suitable for deaeration temperature such as gets 40 DEG C about-55 DEG C, then unlatching vavuum pump first stirs and makes compound evenly drop into curing agent again in 5 ~ 10 minutes, finally drop into flexibilizer, after having fed intake, then stir and make compound even in 3 ~ 6 minutes; Then vavuum pump is opened, vacuum is set within the scope of a bound, such as can be pressed the pressure set points of the degassed former technique of vacuum stirring, as low pressure limit value, and get vacuum decline (pressure increase) add 6-15% as higher limit to this low pressure limit value.The pressure signal of its reflection vacuum send temperature controller process, and its signal opening or closing vavuum pump is sent by temperature controller.Its control that heats up of temperature controller adopts staged heating mode, its agitator can by former technological requirement continuous operation, the identical warming room of each about desirable 3-8 DEG C every, and the terminal temperature that allows is determined according to compound gelling temp and time relationship, such as rise to 75 DEG C about-85 DEG C from top temperature, require that intensification power is large, speed is fast and evacuation rate is fast.Terminal temperature can not be too high with the vacuum stirring degassing time avoiding the too short impact of gel time to allow.First heat up at top temperature during system works and open vacuum pump evacuation when making vacuum reach setting pressure lower limit and reach relevant temperature section design temperature, close vavuum pump and valve, the drop timer timing when vacuum drops to setting pressure higher limit starting vacuum terminates, enter next section to do to open valve and vacuum pump evacuation again after too much bubble is eliminated in several seconds time delay, so go round and begin again, sequentially record the drop timer timing time of each vacuum, its drop timer reflection system bubble formation speed at each temperature, the drop timer timing time of the more each vacuum of deduction vaccum leakage rate impact, get its temperature corresponding to longer timing time as desired temperature, namely deaeration temperature is suitable for, then after terminal temperature stop heat up and under the desired temperature and activity time thereof of former technological requirement constant-temperature vacuum stir degassed after pour into a mould by former technological requirement again, solidification and the demoulding.
Produce at ordinary times and do not do the described detection being suitable for deaeration temperature, only use described desired temperature temperature-constant operation instead, and revise vacuum stirring degassing time according to compound gelling temp and time relationship, the vacuum still using former technique to determine and mixing speed setting value, all the other are all by former technological requirement operation.With PD meter, detection is put to pouring piece make-game if desired, checks whether it meets relevant national standard or inner controlling standard of enterprise adjusts pumpdown time and desired temperature again,
(4) accompanying drawing illustrates:
Accompanying drawing is the circuit system block diagram adopting a kind of epoxide resin vacuum degassing temperature controller.
(5) detailed description of the invention:
As shown in drawings, it is made up of temperature sensor 2, temperature controller 7, pressure sensor 3, pressure transmitter 4, vavuum pump 5, vavuum pump drive circuit 6 and vacuum degassing machine 1 a kind of circuit system block diagram of epoxide resin vacuum degassing temperature controller.Pressure sensor 3 is connected with the vacuum chamber of vacuum degassing machine 1, and for the vacuum of detection system, vacuum degassing machine 1 opens or closes by vavuum pump drive circuit 6 vacuum that vavuum pump 5 carrys out control system.The signal of pressure sensor 3 send temperature controller 7 to process through pressure transmitter 4, the vacuum ranges of circuit simultaneously for reaching in control system operation of temperature controller 7.After opening vacuum degassing machine 1, if the pressure in vacuum chamber reaches capping value, then temperature controller 7 stops timing sending signal enabling vavuum pump 5 to vavuum pump drive circuit 6 and magnetic valve.When the pressure in vacuum chamber reaches preset lower limit, temperature controller 7 will cut out vavuum pump 5.
Claims (2)
1. an epoxide resin vacuum degassing temperature controller, for when change mixture of epoxy resins formula or factory or when vacuumizing operating mode, redefine technological parameter, it is characterized in that it is by the impact of Site Detection different temperatures on vacuum stirring degasifying effect, determine the applicable deaeration temperature of mixture of epoxy resins, and select desired temperature and the running time of vacuum stirring degassing process according to compound gelling temp and time relationship, thus desired temperature can not affected in original system after production is determined to arrange as operational factor at ordinary times, when mixing tank temperature constantly raises, in compound, the solubility of gas reduces, bubble constantly grows and overflows, at specific compound, when bubble effusion quantity and volume in certain hour are difficult to rise the temperature continued when increasing with temperature under equipment and pressure, or because of the not allowable temperature continuation rising of this its technique of compound gelling temp time restriction, bubble is overflowed temperature that quantity and volume cannot continue when increasing, here the applicable deaeration temperature under this operating mode is all called, the present invention is not when affecting mix material proportioning and being stable, choose be suitable for deaeration temperature or slightly lower than the value of this temperature as the desired temperature of vacuum stirring degassing process, the viscosity of bubble effusion efficiency and mixture of epoxy resins is closely related, and mixture of epoxy resins viscosity relation non-linear with temperature, therefore different applicable deaeration temperature is just existed for different compounds, system utilizes the change of vacuum to reflect bubble effusion efficiency in mixture of epoxy resins, under a certain design temperature, by temporary close vavuum pump, detect the time that vacuum reaches the lower limit (upper pressure limit value) of setting value, be reflected in the change of this specific operation bubble effusion quantity and volume, and compare for optimizing temperature setting by the detection of different temperature points, specific practice is, in mixing tank, material temperature heats up under being cooled to top temperature, described top temperature refers to the temperature can guaranteed lower than being suitable for deaeration temperature, then vacuum is set within the scope of a bound, such as can be pressed the pressure set points of the degassed former technique of vacuum stirring, as low pressure limit value, and get vacuum decline (pressure increase) to this low pressure limit value add 6-15% as higher limit, the pressure signal of its reflection vacuum send temperature controller process, its signal opening or closing vavuum pump is sent by temperature controller, its control that heats up of temperature controller adopts staged heating mode, its agitator can by former technological requirement continuous operation, the identical warming room of each desirable 3-8 DEG C every, and the terminal temperature that allows is determined according to compound gelling temp and time relationship, such as rise to 75 DEG C-85 DEG C from top temperature, require that intensification power is large, speed is fast and evacuation rate is fast, terminal temperature can not be too high with the vacuum stirring degassing time avoiding the too short impact of gel time to allow, first heat up at top temperature during system works and open vacuum pump evacuation when making vacuum reach setting pressure lower limit and reach relevant temperature section design temperature, close vavuum pump and valve, the drop timer timing when vacuum drops to setting pressure higher limit starting vacuum terminates, entering next section does after several seconds time delay eliminates too much bubble, open valve and vacuum pump evacuation again, so go round and begin again, sequentially record the drop timer timing time of each vacuum, its drop timer reflection system bubble formation speed at each temperature, the impact of deduction vaccum leakage rate, the drop timer timing time of more each vacuum, get its temperature corresponding to longer timing time as desired temperature, namely deaeration temperature is suitable for, then stop heating up after terminal temperature, and constant-temperature vacuum stirs degassed under the desired temperature and activity time thereof of former technological requirement, pour into a mould by former technological requirement more afterwards, solidification and the demoulding,
Produce at ordinary times and use described desired temperature temperature-constant operation instead, and revise vacuum stirring degassing time according to compound gelling temp and time relationship, all the other are all by former technological requirement operation.
2. a kind of epoxide resin vacuum degassing temperature controller according to claim 1, is characterized in that it comprises:
It is made up of temperature sensor 2, temperature controller 7, pressure sensor 3, pressure transmitter 4, vavuum pump 5, vavuum pump drive circuit 6 and vacuum degassing machine 1, pressure sensor 3 is connected with the vacuum chamber of vacuum degassing machine 1, for the vacuum of detection system, vacuum degassing machine 1 opens or closes by vavuum pump drive circuit 6 vacuum that vavuum pump 5 carrys out control system, and the signal of pressure sensor 3 send temperature controller 7 to process through pressure transmitter 4.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510170859.1A CN104723472B (en) | 2015-04-13 | 2015-04-13 | Temperature controller for use in vacuum degassing of epoxy resin |
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| CN201510170859.1A CN104723472B (en) | 2015-04-13 | 2015-04-13 | Temperature controller for use in vacuum degassing of epoxy resin |
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| CN104723472A true CN104723472A (en) | 2015-06-24 |
| CN104723472B CN104723472B (en) | 2017-01-18 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104742266A (en) * | 2015-04-14 | 2015-07-01 | 张金木 | Epoxy resin vacuum degassing temperature/pressure control system |
| CN112372910A (en) * | 2020-10-28 | 2021-02-19 | 扬州工业职业技术学院 | Epoxy resin insulating material and pouring method thereof |
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| CN102190859A (en) * | 2010-03-19 | 2011-09-21 | 上海佳翰新材料科技有限公司 | Preparation method of epoxy resin zirconium tungstate composite material |
| CN202185185U (en) * | 2011-05-24 | 2012-04-11 | 杭州泰林生物技术设备有限公司 | Instant hot type vacuum degassing instrument |
| CN103471169A (en) * | 2013-08-30 | 2013-12-25 | 北京金房暖通节能技术股份有限公司 | Intelligent vacuum degassing system and control method thereof |
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2015
- 2015-04-13 CN CN201510170859.1A patent/CN104723472B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102190859A (en) * | 2010-03-19 | 2011-09-21 | 上海佳翰新材料科技有限公司 | Preparation method of epoxy resin zirconium tungstate composite material |
| CN202185185U (en) * | 2011-05-24 | 2012-04-11 | 杭州泰林生物技术设备有限公司 | Instant hot type vacuum degassing instrument |
| CN103471169A (en) * | 2013-08-30 | 2013-12-25 | 北京金房暖通节能技术股份有限公司 | Intelligent vacuum degassing system and control method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104742266A (en) * | 2015-04-14 | 2015-07-01 | 张金木 | Epoxy resin vacuum degassing temperature/pressure control system |
| CN104742266B (en) * | 2015-04-14 | 2019-03-05 | 张金木 | Epoxide resin vacuum degassing temperature control pressurer system |
| CN112372910A (en) * | 2020-10-28 | 2021-02-19 | 扬州工业职业技术学院 | Epoxy resin insulating material and pouring method thereof |
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| Publication number | Publication date |
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| CN104723472B (en) | 2017-01-18 |
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Effective date of registration: 20191022 Address after: No.678-15, Xinmin North Road, Wutong street, Tongxiang City, Jiaxing City, Zhejiang Province Patentee after: Tongxiang Levi new materials Co., Ltd. Address before: 350004 8 longevity garden, Yi Chau, Taijiang District, Fujian, Fuzhou 401 Patentee before: Zhang Jin Mu |