CN104729919B - A kind of method and system for the micro- beam tensile break strength for extracting bulk silicon technological manufacture - Google Patents
A kind of method and system for the micro- beam tensile break strength for extracting bulk silicon technological manufacture Download PDFInfo
- Publication number
- CN104729919B CN104729919B CN201510108879.6A CN201510108879A CN104729919B CN 104729919 B CN104729919 B CN 104729919B CN 201510108879 A CN201510108879 A CN 201510108879A CN 104729919 B CN104729919 B CN 104729919B
- Authority
- CN
- China
- Prior art keywords
- micro
- break strength
- tensile break
- bulk silicon
- chip machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention discloses a kind of method and system for the micro- beam tensile break strength for extracting bulk silicon technological manufacture, the system being combined using newly-designed on-chip machine structure and microelectronic technique detection and analysis with probe station extracts the tensile break strength parameter of micro- beam.The method can be utilized for etching (corrosion) process-monitor, it is also possible to predict the Mechanical Reliability of device.Possess it is self-positioning, from dynamometry ability；Possess the ability (more than mN power) for applying heavy load, meet various measurement requests；Method is simple, it is not necessary to large-scale highly sophisticated device.
Description
Technical field
The invention belongs to the monitoring of microelectromechanical systems (MEMS) processing quality and reliability testing field, it is related to extraction body
The method and system of micro- beam tensile break strength of silicon technology manufacture, are particularly applicable in micro- beam of quantitative extraction bulk silicon technological manufacture
The field of tensile break strength and prediction device Mechanical Reliability.
Background technology
Since the nineties, microelectromechanical systems (MEMS) technology enters the high speed development stage, is not only due to general
Read novel, and be due to that MEMS is compared with traditional devices, it is special with miniaturization, integrated and more excellent performance prospect
Point.Nowadays MEMS is widely used for the fields such as automobile, Aero-Space, information control, medical science, biology.
The MEMS manufactured using bulk silicon MEMS technique, its mechanical structure, which is substantially, utilizes dry etching (or wet method
Corrosion) release formation.Due to etching the particularity of (corrosion) technique, surface certainly exists damage or micro-crack, causes it to break
Resistance to spalling does not reach the value of preferable silicon materials much, has a strong impact on the Mechanical Reliability of device.So in order to predict that device can
By property, need to carry out parameter extraction to the fracture strength of this micro mechanical structure in MEMS scale process.Wherein,
The tensile break strength of micro- beam is exactly a very important parameter.
The method of existing measurement tensile strength of material mainly has two kinds, and a kind of is traditional instron (ten thousand
Energy testing machine), the method is applied to the measurement of macrostructure, and for the micro girder construction in MEMS, but because gripping and positioning
Difficulty, it is impossible to carry out the measurement of tensile strength；Another is the corresponding on-chip machine structure of design, although the method is solved
Determine positioning and the problem of grip, but enough load force can not be provided and (typically driven using electrostatic attraction or heat
Mode provides load force), it is impossible to measure the slightly larger structure (it can not be broken) of this size of bulk silicon technological making.Therefore need
The tensile break strength for the micro- beam for proposing more rational method to extract bulk silicon technological manufacture.
The content of the invention
By analysis above, traditional tensile break strength extracting method can not apply what is manufactured in bulk silicon technological
On micro girder construction, the purpose of the present invention is to propose to it is a kind of extract bulk silicon technological manufacture micro- beam tensile break strength method and be
System, the system being combined using newly-designed on-chip machine structure and microelectronic technique detection and analysis with probe station is extracted micro-
The tensile break strength parameter of beam.The method can be utilized for etching (corrosion) process-monitor, it is also possible to predict the machine of device
Tool reliability.
The technical solution adopted by the present invention is as follows：
A kind of system for the micro- beam tensile break strength for extracting bulk silicon technological manufacture, including on-chip machine and for piece
Upper testing machine applies the probe station of load force, and the on-chip machine includes being tied by micrometer beam, cylindrical pivoting support, elasticity
Structure, anticollison block, movable framework, dynamometry scale and substrate, described one end by micrometer beam are connected on piece by elastic construction and tried
Test on the movable framework of machine, one end is enclosed on cylindrical pivoting support by loop configuration.The cylindrical pivoting support passes through anchor
Leg (anchor) is fixed on substrate.The anticollison block spreads over on-chip machine movable frame frame peripheral, is fixed on by anchor leg
On substrate, the dynamometry scale is connected on elastic construction.
Wherein, the elastic construction is used to transmit load force, and the anticollison block is used to ensure on-chip machine operationally
Course, the dynamometry scale is used to record the deformation data of the elastic construction.
Further, the cylindrical pivoting support is rigidly connected by anchor leg with substrate formation, and the anticollison block passes through
Anchor leg is rigidly fixed on substrate, and the dynamometry scale is rigidly attached on elastic construction.
Further, the anchor leg can be circular section anchor leg, square-section anchor leg or the combination of many anchor legs.
A kind of method for the micro- beam tensile break strength for extracting bulk silicon technological manufacture, its step includes：
1) on-chip machine is made；
2) displacement load is applied to the on-chip machine using probe station probe, until by micrometer beam in on-chip machine
Fracture, in documentary film in testing machine dynamometry scale reading；
3) measure and calculate when being broken by micrometer beam by tensile force suffered on micrometer beam, obtain tensile break strength.
Further, step 1) in by be bonded deep etching release standard technique make on-chip machine.
Further, step 1) specifically include following steps：
(1) anchor leg is manufactured：Photoetching and lithographic technique are utilized on silicon chip, anchor leg structure is formed；
(2) anchor leg is rigidly fixed on substrate：The silicon face with anchor leg is set to be bonded in substrate using anode linkage technology
On sheet glass；
(3) back side (non-anchor leg face) photoetching and deep etching technology are utilized, structure is discharged, is made
On-chip machine.
Further, the cylindrical pivoting support is collectively forming the hinge of micro- beam and cylindrical pivoting support with loop configuration
Binding structure, only provides power to micro- beam in the work of on-chip machine and can not provide moment of flexure, it is ensured that the accuracy of measurement data is (only
Tensile power is acted on).
Further, the dynamometry scale is used for recording the deformation data of the elastic construction, then has by ANSYS etc.
The first emulation tool of limit obtains the stress of elastic construction, is by tensile force suffered on micrometer beam.
Further, using the tensile force, divided by micro- beam cross-sectional area, you can obtain tensile break strength.
The present invention devises corresponding on-chip machine knot to extract the tensile break strength that bulk silicon technological manufactures micro- beam
Structure, it is proposed that one kind is combined extraction bulk silicon technological with probe station using on-chip machine and microelectronic technique detection and analysis and manufactured
Micro- beam tensile break strength method and system.Compared with existing tensile strength extracting method and system, have the following advantages：
1) possess it is self-positioning, from dynamometry ability；
2) be articulated and connected the influence for effectively reducing probe deviation to accuracy of measurement；
3) possess the ability (more than mN power) for applying heavy load, meet various measurement requests；
4) method is simple, it is not necessary to large-scale highly sophisticated device.
Brief description of the drawings
Fig. 1 is overall schematic；1 is on-chip machine, and 2 be probe station probe.
Fig. 2 is by the top view (a) and side view (b) of micrometer beam portion point；101 be that, by micrometer beam, 105 be cylindrical anchor
Point.
Fig. 3 is the top view (a) and side view (b) of whole on-chip machine；101 be that 102 be spring beam by micrometer beam,
103 be dynamometry scale, and 104 be anticollison block, and 105 be cylindrical anchor point.
Fig. 4 is the preparation flow figure of on-chip machine, and 3 be anchor leg, and 4 be silicon chip, and 5 be anti-footing electrodes, and 6 be glass.
Embodiment
The present invention proposes a kind of method for the micro- beam tensile break strength for extracting bulk silicon technological manufacture.North is just combined below
How the bonding deep etching release standard technique of capital university, description extracts the stretching of micro- beam of this technique manufacture using the method
Fracture strength, main step is as follows：
(1) technique flow.The technique used is bonding deep etching release standard technique, as shown in figure 4, mainly including：
(a) ASE silicon chips 4,4 μm, carve anchor leg step, form anchor leg 3；
(b) BHF etching glass 6,1000~Ti/Pt/Au is sputtered, anti-footing electrodes 5 are formed；
(c) silicon chip and sheet glass anode linkage；
(d) silicon face is thinned in KOH, remaining thick 75 ± 5 μm；
(e) ASE silicon chips, structure release obtains the whole on-chip machine structure as described in Fig. 3, dash area is anchor
Leg, anchor leg is fixed on underlying substrate glass (substrate sheet glass is not drawn), and non-shaded portion is suspension movable structure.
(2) probe station is tested.As shown in figure 1, using probe station probe 2, slowly position is evenly applied to on-chip machine 1
Load is moved, displacement is continuously increased, until being broken by micrometer beam, the index for recording dynamometry scale when being broken by micrometer beam (also may be used
The index of record whole process dynamometry scale in real time), then by ANSYS finite element simulation instruments, when obtaining tested beam fracture by
The power arrived, tensile stress when being readily available fracture in conjunction with the mechanics of materials in micro- beam.Said process is repeated several times to be surveyed
Amount, you can obtain the statistics tensile break strength value of micro- beam manufactured by this technique, this measurement result average out to
1.3GPa (but due to the unstability of technique, the measurement results of difference manufacture batches by difference).
An application of the inventive method is described above by one embodiment, that is, extracts bonding deep etching release standard
The tensile break strength of micro- beam of technique manufacture.But it should be recognized that the inventive method is adapted to pass through other silicon bulk fabrication works
The extraction of the tensile break strength of micro- beam of skill manufacture.It will be understood by those of skill in the art that not departing from this patent essence
In the range of, keep in this patent being combined this feature with probe station with microelectronic technique detection and analysis using on-chip machine
Outside, structure can be done it is certain change and modifications, the bonding deep etching that its its preparation process is also not necessarily limited in the present embodiment is released
Put standard technology.Protection scope of the present invention should be to be defined described in claim.
Claims (9)
1. a kind of system for the micro- beam tensile break strength for extracting bulk silicon technological manufacture, including on-chip machine and for piece
Testing machine applies the probe station of load force, the on-chip machine include by micrometer beam, cylindrical pivoting support, elastic construction,
Anticollison block, movable framework, dynamometry scale and substrate, described one end by micrometer beam is connected to on-chip machine by elastic construction
On movable framework, one end is enclosed on cylindrical pivoting support by loop configuration, and the cylindrical pivoting support is solid by anchor leg
It is scheduled on substrate, the anticollison block spreads over on-chip machine movable frame frame peripheral, is fixed on by anchor leg on substrate, it is described to survey
Power scale is connected on elastic construction.
2. the system of micro- beam tensile break strength of bulk silicon technological manufacture is extracted as claimed in claim 1, it is characterised in that institute
State cylindrical pivoting support to be rigidly connected with substrate formation by anchor leg, the anticollison block is rigidly fixed in substrate by anchor leg
On, the dynamometry scale is rigidly attached on elastic construction.
3. the system of micro- beam tensile break strength of bulk silicon technological manufacture is extracted as claimed in claim 1, it is characterised in that institute
It is circular section anchor leg, square-section anchor leg or the combination of many anchor legs to state anchor leg.
4. the method for micro- beam tensile break strength of bulk silicon technological manufacture is extracted using any described systems of claim 1-3,
Its step includes：
1) on-chip machine is made；
2) displacement load is applied to the on-chip machine using probe station probe, until being broken in on-chip machine by micrometer beam
Split, in documentary film in testing machine dynamometry scale reading；
3) measure and calculate when being broken by micrometer beam by tensile force suffered on micrometer beam, obtain tensile break strength.
5. the method for micro- beam tensile break strength of bulk silicon technological manufacture is extracted as claimed in claim 4, it is characterised in that step
It is rapid 1) in by be bonded deep etching release standard technique make on-chip machine.
6. the method for micro- beam tensile break strength of bulk silicon technological manufacture is extracted as claimed in claim 4, it is characterised in that step
It is rapid 1) to specifically include following steps：
I) photoetching and lithographic technique are utilized on silicon chip, anchor leg structure is formed；
Ii) the silicon face with anchor leg is made to be bonded on substrate sheet glass using anode linkage technology；
Iii the photoetching of non-anchor leg face and deep etching technology) are utilized, structure is discharged, on-chip machine is made.
7. the method for micro- beam tensile break strength of bulk silicon technological manufacture is extracted as claimed in claim 4, it is characterised in that institute
The articulated structure that cylindrical pivoting support is collectively forming micro- beam and cylindrical pivoting support with loop configuration is stated, in on-chip machine
Only power is provided in work to micro- beam and moment of flexure can not be provided, it is ensured that the accuracy of measurement data.
8. the method for micro- beam tensile break strength of bulk silicon technological manufacture is extracted as claimed in claim 4, it is characterised in that institute
The deformation data that dynamometry scale is used for recording the elastic construction is stated, elastic construction is then obtained by finite element simulation instrument
Stress, is by tensile force suffered on micrometer beam.
9. the method for micro- beam tensile break strength of bulk silicon technological manufacture is extracted as claimed in claim 4, it is characterised in that profit
Use the tensile force, divided by the cross-sectional area by micrometer beam, you can obtain tensile break strength.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510108879.6A CN104729919B (en) | 2015-03-12 | 2015-03-12 | A kind of method and system for the micro- beam tensile break strength for extracting bulk silicon technological manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510108879.6A CN104729919B (en) | 2015-03-12 | 2015-03-12 | A kind of method and system for the micro- beam tensile break strength for extracting bulk silicon technological manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104729919A CN104729919A (en) | 2015-06-24 |
| CN104729919B true CN104729919B (en) | 2017-09-22 |
Family
ID=53454017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510108879.6A Active CN104729919B (en) | 2015-03-12 | 2015-03-12 | A kind of method and system for the micro- beam tensile break strength for extracting bulk silicon technological manufacture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104729919B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106370520A (en) * | 2015-07-21 | 2017-02-01 | 北京大学 | Method for micro anchor leg torsion bonding strength by using thermal driving |
| CN106365107B (en) * | 2015-07-21 | 2021-11-16 | 北京大学 | Method and system for extracting beam etching verticality |
| CN113218755B (en) * | 2021-04-23 | 2022-05-03 | 北京大学 | System for biaxial tension test of nanoscale film and manufacturing method thereof |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63171338A (en) * | 1987-01-09 | 1988-07-15 | Hitachi Cable Ltd | Strength tester for optical fiber |
| CN100480667C (en) * | 2006-07-15 | 2009-04-22 | 大连理工大学 | Micro-stretching sample structure with elastic beam |
| CN101832895A (en) * | 2010-03-26 | 2010-09-15 | 北京纳克分析仪器有限公司 | Visual tensile testing system |
| CN102583224B (en) * | 2012-03-08 | 2014-11-26 | 北京大学 | MEMS (micro-electromechanical system) and IC (integrated circuit) monolithical integration method |
| CN102967510B (en) * | 2012-10-18 | 2014-11-05 | 北京大学 | Method and apparatus for applying forces perpendicular to cantilever beam |
| CN102944339A (en) * | 2012-10-22 | 2013-02-27 | 北京大学 | Piezoresistive pressure sensor of MEMS (Micro-Electro-Mechanical Systems) and preparation method thereof |
| CN103011056B (en) * | 2012-11-29 | 2015-12-02 | 北京大学 | A kind of method strengthening SOG technique micro-structural bond strength |
| CN103884605B (en) * | 2014-03-27 | 2016-03-02 | 北京大学 | A kind of method and device utilizing surface fracture intensity detection etching surface quality |
| CN104007014B (en) * | 2014-06-18 | 2016-03-02 | 哈尔滨工业大学 | Micro structures comprehensive mechanical property proving installation |
-
2015
- 2015-03-12 CN CN201510108879.6A patent/CN104729919B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104729919A (en) | 2015-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Sharpe et al. | Measurements of Young's modulus, Poisson's ratio, and tensile strength of polysilicon | |
| Brookhuis et al. | Six-axis force–torque sensor with a large range for biomechanical applications | |
| CN104729919B (en) | A kind of method and system for the micro- beam tensile break strength for extracting bulk silicon technological manufacture | |
| Chasiotis et al. | Mechanical properties of thin polysilicon films by means of probe microscopy | |
| Grech et al. | Highly linear and large spring deflection characteristics of a Quasi-Concertina MEMS device | |
| Luo et al. | A simple deflection-testing method to determine Poisson's ratio for MEMS applications | |
| Mishra et al. | Theoretical modeling and numerical simulation of elliptical capacitive pressure microsensor | |
| Ozaki et al. | Biaxial flexure testing of free-standing thin film membrane with nanoindentation system | |
| Hazra et al. | Demonstration of an in situ on-chip tensile tester | |
| Qu et al. | A MEMS microgripper with two-axis actuators and force sensors for microscale mechanical characterization of soft materials | |
| CN102374948A (en) | Duplex measurement method for non-silicon film mechanical property of microelectronic mechanical system | |
| Rauscher et al. | Electrical contact resistance force sensing in SOI-DRIE MEMS | |
| Chou et al. | Fabrication and analysis of awl-shaped serpentine microsprings for large out-of-plane displacement | |
| Zhang et al. | An electro-thermal SU-8 cantilever micro actuator based on bimorph effect | |
| Nie et al. | Measurement of residual stress in multilayered thin films by a full-field optical method | |
| CN103884605B (en) | A kind of method and device utilizing surface fracture intensity detection etching surface quality | |
| CN106370375B (en) | The novel heat of one kind drives on-line testing micro-structure impact strength test machine and detection method | |
| CN113218755B (en) | System for biaxial tension test of nanoscale film and manufacturing method thereof | |
| Chen et al. | A dual-parameter on-chip test platform based on thermal actuator for testing fracture strength of microstructure | |
| CN106365107B (en) | Method and system for extracting beam etching verticality | |
| Jing et al. | Design and fabrication of a micromachined bilayer cantilever probe card | |
| Zhou et al. | Wide-band piezoresistive aero-acoustic microphone | |
| CN106370520A (en) | Method for micro anchor leg torsion bonding strength by using thermal driving | |
| Osaka et al. | A novel 3-axis tiny tactile sensor developed by 3-D microstructuring using punch creep forming process | |
| Vujanic et al. | Silicon microstructure for precise measurements of mechanical moments |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |