CN104726909A - Cyanide-free gold nickel alloy plating electroplate liquid - Google Patents
Cyanide-free gold nickel alloy plating electroplate liquid Download PDFInfo
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- CN104726909A CN104726909A CN201510131940.9A CN201510131940A CN104726909A CN 104726909 A CN104726909 A CN 104726909A CN 201510131940 A CN201510131940 A CN 201510131940A CN 104726909 A CN104726909 A CN 104726909A
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- gold
- nickel alloy
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- tungsten
- iron
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
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- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention provides a cyanide-free gold nickel alloy plating electroplate liquid and a plurality of additives applicable for the nickel alloy plating system. The cyanide-free gold nickel alloy plating electroplate liquid comprises the following components: 3-5g/L of organic salt of gold, 30-50g/L of inorganic salt of nickel, 30-120g/L of a coordination agent citric acid or citric acid salt thereof, 1-10g/L of supporting electrolyte, 0-100g/L of a pH regulator and gold nickel alloy plating additive system. The operation conditions of the cyanide-free gold nickel alloy plating electroplate liquid are as follows: the pH is 4-5, the current density is 1A/dm to 5A/dm<2>, and the temperature is 30-50 DEG C. The cyanide-free gold nickel alloy plating electroplate liquid has the following advantages of low toxicity or non toxicity, good stability, low replacement rate with nickel, copper and other metal substrates. The bonding power of the plating layer is favorable and the plating layer is bright, so the electroplate liquid is applicable for decorative electroplate, functional electroplate and other fields.
Description
Technical field
The present invention relates to a kind of gold-plated nickel alloy solution, be specifically related to a kind of containing golden salt and the gold-plated nickelalloy non-cyanogen type electroplating solution without cyanogen compound.
Background technology
Gold nickel alloy coating solidity to corrosion is strong, has good anti-tarnishing ability, and golden nickel alloy coating has multiple color tones simultaneously, is therefore widely used in plating jewellery, clock and watch part, artwork etc.Up to now, domestic and international gold-plated nickelalloy technique mainly adopts the gold-plated nickelalloy of cyaniding, this is because the gold-plated nickel alloy solution chemical stability of cyaniding is good, dispersive ability and depth capability good, coating bright property is good.But the gold-plated toxicity of cyaniding is very large, harm humans and environment, during production, require to possess good ventilation installation and wastewater treatment condition.Therefore corresponding policy is launched respectively in countries in the world, progressively eliminates the gold-plated nickelalloy technique of cyaniding.
In order to reduce use prussiate, reduce environmental pollution, galvanizer authors investigated the gold-plated nickelalloy of Citrate trianion, have had many consumers now in use, but golden salt is with potassium auric cyanide, does not truly realize without cyaniding.Therefore, use the enterprise of cyanogen-less gold nickelalloy technique little at present.In the case, seek a kind of toxicity low or nontoxic, research and development and the application of stable, that simple to operate and cost is low cyanogen-less gold nickel alloy solution become a Main way of field of electroplating.
Summary of the invention
The invention provides a kind of cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating for gold-plated nickelalloy and electroplating additive system, solve the problems such as cyanogen-less gold nickel alloy solution is unstable, cost is high, toxicity is large.
The mass concentration of each component of cyanogen-less gold Nickel alloy electroplating liquid formula of the present invention is the organic salt 3 ~ 5g/L of gold, inorganic salt 30 ~ the 50g/L of nickel, coordination agent citric acid and Citrate trianion 30 ~ 120g/L thereof, supporting electrolyte 1 ~ 10g/L, pH adjusting agent 0 ~ 100g/L and gold-plated nickelalloy additive system.Wherein said cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating coordination agent is one or more in citric acid and Citrate trianion thereof.
The organic salt of described gold is citric acid gold potassium.
The inorganic salt of described nickel are single nickel salt.
Described gold-plated nickelalloy additive system is one or several in L-Ala, phenylalanine, tryptophane, L-glutamic acid, aspartic acid.
The operational condition of a kind of cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating used in the present invention is: pH scope is 4 ~ 5, and current density is 1A/dm
2~ 5A/dm
2, temperature is 30 ~ 50 degree.
Gold-plated boron-tungsten-iron-nickel alloy electroplating of the present invention, not containing the prussiate of strong toxicity or the objectionable impurities of other strong toxicity, does not therefore pollute the environment and faces the problems such as liquid waste disposal difficulty.Cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating chemical stability of the present invention is fine, and deoxygenation is not needed in electroplating process, simple to operate, the crystal grain of gold-plated nickel alloy layer is careful, bright and bonding force is good, can meet the application that decorative electroplating and functional plating etc. are multi-field.
Embodiment
The invention provides a kind of cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating.
The organic salt of the gold that gold-plated boron-tungsten-iron-nickel alloy electroplating uses is citric acid gold potassium.
The inorganic salt of the nickel that gold-plated boron-tungsten-iron-nickel alloy electroplating uses are single nickel salt.
Coordination agent is one or more in citric acid and Citrate trianion thereof.
Plating solution pH adjusting agent is one or more in ammoniacal liquor, citric acid, Tripotassium Citrate and Trisodium Citrate.
The operational condition of a kind of cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating used in the present invention is: pH scope is 4 ~ 5, and current density is 1A/dm
2~ 5A/dm
2, temperature is 30 ~ 50 degree.
Gold-plated nickelalloy additive system is one or several in L-Ala, phenylalanine, tryptophane, L-glutamic acid, aspartic acid.Wherein L-Ala concentration is 30 ~ 5000mg/L; Phenyl-alanine concentration is 5 ~ 1200mg/L; Tryptophan concentration is 10 ~ 2000mg/L; Aminoglutaric acid concentration is 10 ~ 1800mg/L; Aspartic acid concentration is 10 ~ 800mg/L.
The plating step applying a kind of cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating of the present invention is: first coordination agent, supporting electrolyte and electroplate liquid pH adjusting agent are mixed according to described composition of raw materials, add the inorganic salt of nickel, stirring and dissolving, the last organic slat solution joining gold when stirred solution, makes cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating.In electroplating process, first bath temperature is maintained 30 ~ 50 DEG C, then, the metal base handled well is placed on the negative electrode of circuit integral part, negative electrode is placed in electroplate liquid together with attached substrate, and passes to electric current, the size of current of leading to and time to determine according to actual requirement.
Be below the preferred embodiment of the invention, the present invention is described in further detail.
Embodiment 1
When using following cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating to electroplate, select copper electrode as negative electrode, carbon plate is as anode.Temperature is adjusted to preset value, is 1A/dm in current density
2~ 5A/dm
2lower plating.
Gold-plated boron-tungsten-iron-nickel alloy electroplating composed as follows:
This cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating is used to carry out electroplating operations according to the plating step in embodiment.Result copper electrode has plated golden nickelalloy, tests by analysis, and the weight percent of gold is 95.83% (23K gold).
Embodiment 2
When using following cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating to electroplate, select copper electrode as negative electrode, carbon plate is as anode.Temperature is adjusted to preset value, is 1A/dm in current density
2~ 5A/dm
2lower plating.
Gold-plated boron-tungsten-iron-nickel alloy electroplating composed as follows:
This cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating is used to carry out electroplating operations according to the plating step in embodiment.Result copper electrode has plated golden nickelalloy, tests by analysis, and the weight percent of gold is 95.83% (23K gold).
Embodiment 3
When using following cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating to electroplate, select copper electrode as negative electrode, carbon plate is as anode.Temperature is adjusted to preset value, is 1A/dm in current density
2~ 5A/dm
2lower plating.
Gold-plated boron-tungsten-iron-nickel alloy electroplating composed as follows:
This cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating is used to carry out electroplating operations according to the plating step in embodiment.Result copper electrode has plated golden nickelalloy, tests by analysis, and the weight percent of gold is 95.83% (23K gold).
Embodiment 4
When using following cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating to electroplate, select copper electrode as negative electrode, carbon plate is as anode.Temperature is adjusted to preset value, is 1A/dm in current density
2~ 5A/dm
2lower plating.
Gold-plated boron-tungsten-iron-nickel alloy electroplating composed as follows:
This cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating is used to carry out electroplating operations according to the plating step in embodiment.Result copper electrode has plated golden nickelalloy, tests by analysis, and the weight percent of gold is 95.83% (23K gold).
Embodiment 5
When using following cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating to electroplate, select copper electrode as negative electrode, carbon plate is as anode.Temperature is adjusted to preset value, is 1A/dm in current density
2~ 5A/dm
2lower plating.
Gold-plated boron-tungsten-iron-nickel alloy electroplating composed as follows:
This cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating is used to carry out electroplating operations according to the plating step in embodiment.Result copper electrode has plated golden nickelalloy, tests by analysis, and the weight percent of gold is 95.83% (23K gold).
Embodiment 6
When using following cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating to electroplate, select copper electrode as negative electrode, carbon plate is as anode.Temperature is adjusted to preset value, is 1A/dm in current density
2~ 5A/dm
2lower plating.
Gold-plated boron-tungsten-iron-nickel alloy electroplating composed as follows:
This cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating is used to carry out electroplating operations according to the plating step in embodiment.Result copper electrode has plated golden nickelalloy, tests by analysis, and the weight percent of gold is 95.83% (23K gold).
Claims (4)
1. a cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating, it is characterized in that: the mass concentration of each component of described cyanogen-less gold Nickel alloy electroplating liquid formula is: the organic salt 3 ~ 5g/L of gold, inorganic salt 30 ~ the 50g/L of nickel, coordination agent citric acid and Citrate trianion 30 ~ 120g/L thereof, supporting electrolyte 1 ~ 10g/L, pH adjusting agent 0 ~ 100g/L and gold-plated nickelalloy additive system; Described gold-plated nickelalloy additive system is one or several in L-Ala, phenylalanine, tryptophane, L-glutamic acid, aspartic acid; The organic salt of described gold is citric acid gold potassium; Described coordination agent is one or more in citric acid and Citrate trianion thereof; Adopt the gold-plated nickelalloy additive system of one or more concentration following:
L-Ala concentration is 30 ~ 5000mg/L;
Phenyl-alanine concentration is 5 ~ 1200mg/L;
Tryptophan concentration is 10 ~ 2000mg/L;
Aminoglutaric acid concentration is 10 ~ 1800mg/L;
Aspartic acid concentration is 10 ~ 800mg/L.
2. a kind of cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating according to claim 1, is characterized in that: described supporting electrolyte is one or more in KCl, NaCl, KOH.
3. a kind of cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating according to claim 1, is characterized in that: described pH adjusting agent is one or more in ammoniacal liquor, citric acid, Tripotassium Citrate and Trisodium Citrate.
4. a kind of cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating according to claim 1, it is characterized in that: the operational condition of described cyanogen-less gold boron-tungsten-iron-nickel alloy electroplating is: pH scope is 4 ~ 5, current density is 1A/dm
2~ 5A/dm
2, temperature is 30 ~ 50 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510131940.9A CN104726909A (en) | 2015-03-25 | 2015-03-25 | Cyanide-free gold nickel alloy plating electroplate liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510131940.9A CN104726909A (en) | 2015-03-25 | 2015-03-25 | Cyanide-free gold nickel alloy plating electroplate liquid |
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| CN104726909A true CN104726909A (en) | 2015-06-24 |
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|---|---|---|---|
| CN201510131940.9A Pending CN104726909A (en) | 2015-03-25 | 2015-03-25 | Cyanide-free gold nickel alloy plating electroplate liquid |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57120685A (en) * | 1981-01-16 | 1982-07-27 | Seiko Epson Corp | Constitution of gold plating for armor parts for timepiece |
| CN101550571A (en) * | 2008-03-31 | 2009-10-07 | 恩伊凯慕凯特股份有限公司 | Electroplating solution containing gold for partly electroplating |
-
2015
- 2015-03-25 CN CN201510131940.9A patent/CN104726909A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57120685A (en) * | 1981-01-16 | 1982-07-27 | Seiko Epson Corp | Constitution of gold plating for armor parts for timepiece |
| CN101550571A (en) * | 2008-03-31 | 2009-10-07 | 恩伊凯慕凯特股份有限公司 | Electroplating solution containing gold for partly electroplating |
Non-Patent Citations (1)
| Title |
|---|
| 冯丽蓉: "无氰电镀金合金研究进展", 《电镀与涂饰》 * |
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