JPS57120685A - Constitution of gold plating for armor parts for timepiece - Google Patents

Constitution of gold plating for armor parts for timepiece

Info

Publication number
JPS57120685A
JPS57120685A JP486581A JP486581A JPS57120685A JP S57120685 A JPS57120685 A JP S57120685A JP 486581 A JP486581 A JP 486581A JP 486581 A JP486581 A JP 486581A JP S57120685 A JPS57120685 A JP S57120685A
Authority
JP
Japan
Prior art keywords
constitution
plating
gold plating
alloy
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP486581A
Other languages
Japanese (ja)
Other versions
JPS6358231B2 (en
Inventor
Katsuhiko Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP486581A priority Critical patent/JPS57120685A/en
Publication of JPS57120685A publication Critical patent/JPS57120685A/en
Publication of JPS6358231B2 publication Critical patent/JPS6358231B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To make titled constitution of gold plating low in cost and good in corrosion resistant by carrying out Au-Ag-In alloy plating between a blank material and gold alloy finish plating applied on the outside surface.
CONSTITUTION: In this constitution of gold plating for armor parts for timepieces, Au-Ag-In alloy plating is carried out on the surface of a blank material using a German Silver or brass material, and alloy plating of Au-Ni, Au-Co, Au-Cu, Au-Pd, Au-Sn, etc. is carried out as finish plating thereon. In this constitution for gold plating, the Au-Ag-In alloy plating consists, by weight, of 40W55% Ag, 5W15% In and the balance Au and unavoidable impurities and is of 0.25W5μ thicknesses.
COPYRIGHT: (C)1982,JPO&Japio
JP486581A 1981-01-16 1981-01-16 Constitution of gold plating for armor parts for timepiece Granted JPS57120685A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP486581A JPS57120685A (en) 1981-01-16 1981-01-16 Constitution of gold plating for armor parts for timepiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP486581A JPS57120685A (en) 1981-01-16 1981-01-16 Constitution of gold plating for armor parts for timepiece

Publications (2)

Publication Number Publication Date
JPS57120685A true JPS57120685A (en) 1982-07-27
JPS6358231B2 JPS6358231B2 (en) 1988-11-15

Family

ID=11595561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP486581A Granted JPS57120685A (en) 1981-01-16 1981-01-16 Constitution of gold plating for armor parts for timepiece

Country Status (1)

Country Link
JP (1) JPS57120685A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832964B2 (en) * 1986-02-04 1996-03-29 プレシ−コ−ト ソシエテ アノニム Abrasion resistant decorative coating deposition method and product
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath
CN104726909A (en) * 2015-03-25 2015-06-24 佛山科学技术学院 Cyanide-free gold nickel alloy plating electroplate liquid

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832964B2 (en) * 1986-02-04 1996-03-29 プレシ−コ−ト ソシエテ アノニム Abrasion resistant decorative coating deposition method and product
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath
CN104726909A (en) * 2015-03-25 2015-06-24 佛山科学技术学院 Cyanide-free gold nickel alloy plating electroplate liquid

Also Published As

Publication number Publication date
JPS6358231B2 (en) 1988-11-15

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