CN104726904A - Auxiliary additive for potassium chloride or sodium chloride galvanizing process - Google Patents

Auxiliary additive for potassium chloride or sodium chloride galvanizing process Download PDF

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Publication number
CN104726904A
CN104726904A CN201510089124.6A CN201510089124A CN104726904A CN 104726904 A CN104726904 A CN 104726904A CN 201510089124 A CN201510089124 A CN 201510089124A CN 104726904 A CN104726904 A CN 104726904A
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CN
China
Prior art keywords
mass concentration
repone
supplementary additive
soidium
chloride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510089124.6A
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Chinese (zh)
Inventor
宋文超
胡哲
左正忠
李玉梁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUBEI JADECHEM CHEMICALS CO Ltd
WUHAN JADECHEM CHEMICALS CO Ltd
Original Assignee
HUBEI JADECHEM CHEMICALS CO Ltd
WUHAN JADECHEM CHEMICALS CO Ltd
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Filing date
Publication date
Application filed by HUBEI JADECHEM CHEMICALS CO Ltd, WUHAN JADECHEM CHEMICALS CO Ltd filed Critical HUBEI JADECHEM CHEMICALS CO Ltd
Priority to CN201510089124.6A priority Critical patent/CN104726904A/en
Publication of CN104726904A publication Critical patent/CN104726904A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/22Electroplating: Baths therefor from solutions of zinc

Abstract

The invention provides an auxiliary additive for a chloride or sodium chloride galvanizing process. The auxiliary additive is characterized by being prepared from the following components in concentration by mass: 1.0-2.0g/L of nicotinic acid, 0.4-0.8g/L of polyvinyl pyrrolidone, 2.0-4.0g/L of sodium propyne sulfonate, 2-6.0g/L of edible saccharin and the balance of ethanol and deionized water. The auxiliary additive has an auxiliary effect on a main brightener, and has an effect of making up for light in high and low current density regions, does not contain surfactant, is mild in composition and does not generate foam; the production process is optimized and the pollution to water sources, soil and the like is avoided.

Description

A kind of supplementary additive for Repone K or zinc electroplating in soidium chloride technique
Technical field
The present invention relates to Repone K or sodium chloride electrolysis method galvanizing technique field, refer to a kind of supplementary additive for Repone K or zinc electroplating in soidium chloride technique particularly.
Background technology
Without the Repone K under the sour environment of cyanogen or Sodium Chloride Based Bright Zinc Plating from last century the seventies by Japanese invention, since importing China into subsequently, the history of existing 40 years.The advantages such as it has cathode efficiency high (efficiency is up to 95%), sedimentation velocity is fast, dispersive ability good, the luminance brightness of coating luminance brightness similar plating Cr technique, plating solution operating environment condition (as temperature, current density) are wider, therefore enjoy great popularity.Domestic in China, in whole zinc-plated (alkali zinc or sour zinc) technique, Repone K or sodium-chlor account for 25% ~ 30% of technique as plating solution, reach 6800 ~ 13,000 ten thousand liters, the brightener of consumption more than about 600 ~ 8,000,000 tons/year.
But, in the prior art, in acid chlorization potassium or zinc electroplating in soidium chloride technique, there is major defect.Brightening agent conventional in this technique is benzylideneacetone, o-chlorobenzaldehyde or the two combine mixed mixture, these aromatic aldehydes, ketone have very strong irritating smell, damage the skin of operator, eyes, these aromatic aldehydes, ketone is insoluble to galvanizing flux, must first with the surfactant of 10 ~ 15 times (as OP-10 ~ 21 or polyalcohols, ether etc.) by these aromatic ketones, can use after aldehyde carries out sufficient emulsification, and in use, also need the supplementary additive (also known as softening agent) matched with it, and also containing a large amount of in these supplementary additives, the surfactant that foam very enriches, fragility is large owing to being mingled with surfactant in a large number for electro-galvanized layer, and the bonding force between workpiece substrate is poor, thus cause zinc coating to decline to the corrosion stability of workpiece, secondly in the cleaning process of electro-galvanized layer, because electro-galvanized layer surfactant foam is too many, a large amount of water need be used, and be difficult to clean up, have impact on bright dipping subsequently, the operations such as passivation, simultaneously, when to zinc bath process, can produce a large amount of with enriching foam, reluctant waste water, water source and soil is caused to be subject to serious pollution.
Summary of the invention
The object of the invention is according to above-mentioned deficiency, a kind of supplementary additive for Repone K or zinc electroplating in soidium chloride technique is provided, itself and main brightener are made multibrightener and are applied, main brightener is helped out, play in high and low current density district and make up light effect, moiety is water-soluble, does not produce foam, optimized production process, does not cause the environmental pollution such as water source and soil.
The present invention is achieved in the following ways: a kind of supplementary additive for Repone K or zinc electroplating in soidium chloride technique, is characterized in that: described supplementary additive comprises the following each component of mass concentration:
A kind of method preparing the supplementary additive for Repone K or zinc electroplating in soidium chloride technique described above, it is characterized in that: first by described nicotinic acid and polyvinylpyrrolidone mixing, ethanol as solvent dissolves, add described propargyl sodium sulfonate and edible asccharin again, and add deionized water to liter, the mass concentration of each component is as follows, the mass concentration of described nicotinic acid is 1.0 ~ 2.0g/L, the mass concentration of described polyvinylpyrrolidone is 0.4 ~ 0.8g/L, described propargyl sodium sulfonate mass concentration is 2.0 ~ 4.0g/L, the mass concentration of described food flavour is 2.0 ~ 6.0g/L.
Preferably, the mass concentration of described nicotinic acid is 1.5g/L, and the mass concentration of described polyvinylpyrrolidone is 0.4g/L, and described propargyl sodium sulfonate mass concentration is 4.0g/L, and the mass concentration of described food flavour is 4.0g/L.
Preferably, the mass concentration of described nicotinic acid is 2.0g/L, and the mass concentration of described polyvinylpyrrolidone is 0.8g/L, and the mass concentration of described propargyl sodium sulfonate is 2.0g/L, and the mass concentration of described edible asccharin is 2.0g/L.
Preferably, the mass concentration of described nicotinic acid is 1.0g/L, and the mass concentration of described polyvinylpyrrolidone is 0.5g/L, and the mass concentration of described propargyl sodium sulfonate is 2.0g/L, and the mass concentration of described edible asccharin is 6.0g/L.
Beneficial effect of the present invention is mainly manifested in:
(1) the present invention is used for the supplementary additive of Repone K or zinc electroplating in soidium chloride technique; itself and main brightener are made multibrightener and are applied, and help out to main brightener, play make up light effect in high and low current density district; moiety is water-soluble; convenient interpolation, does not produce foam, is easy to the cleaning of processing unit in use; reduce water consumption; easy filtration, decreases the discharge of waste water, effectively protects water source and soil.
(2) the present invention is used for the supplementary additive moiety gentleness of Repone K or zinc electroplating in soidium chloride technique, and not containing materials such as aromatic aldehydes, operational safety coefficient is high, does not damage human body.
(3) after interpolation uses the present invention to be used for the supplementary additive of Repone K or zinc electroplating in soidium chloride technique, effectively can affect Cathodic polarization behavior and polarization in zincincation, increase the zinc coating thickness in low current district, reduce the thickness of middle and high Current Zone zinc layers, and making zinc layers trend towards the premium properties of crystallization, the zinc layers obtained is bright, careful, soft, good dispersity.
Embodiment
Below in conjunction with specific embodiment, the present invention is further illustrated:
Embodiment 1
Supplementary additive composition and consumption are (being upgraded to example to configure 1, with water and ethanol for solvent):
All the other are ethanol and deionized water.
Embodiment 2
Supplementary additive composition and consumption are (being upgraded to example to configure 1, with water and ethanol for holding agent):
All the other are ethanol and deionized water.
Embodiment 3
Supplementary additive composition and consumption are (being upgraded to example to configure 1, with water and ethanol for holding agent):
All the other are ethanol and deionized water.
Embodiment 4
Supplementary additive composition and consumption are (being upgraded to example to configure 1, with water and ethanol for solvent):
All the other are ethanol and deionized water.
Embodiment 5
Supplementary additive composition and consumption are (being upgraded to example to configure 1, with water and ethanol for solvent):
All the other are ethanol and deionized water.
Embodiment 6
Supplementary additive composition and consumption are (being upgraded to example to configure 1, with water and ethanol for solvent):
All the other are ethanol and deionized water.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as described technical field routine techniques personnel do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.

Claims (5)

1., for a supplementary additive for Repone K or zinc electroplating in soidium chloride technique, it is characterized in that: described supplementary additive comprises the following each component of mass concentration:
2. prepare the method for the supplementary additive for Repone K or zinc electroplating in soidium chloride technique according to claim 1 for one kind, it is characterized in that: first by described nicotinic acid and polyvinylpyrrolidone mixing, ethanol as solvent dissolves, add described propargyl sodium sulfonate and edible asccharin again, and add deionized water to liter, the mass concentration of each component is as follows, the mass concentration of described nicotinic acid is 1.0 ~ 2.0g/L, the mass concentration of described polyvinylpyrrolidone is 0.4 ~ 0.8g/L, described propargyl sodium sulfonate mass concentration is 2.0 ~ 4.0g/L, the mass concentration of described food flavour is 2.0 ~ 6.0g/L.
3. the supplementary additive for Repone K or zinc electroplating in soidium chloride technique according to claim 2, it is characterized in that: the mass concentration of described nicotinic acid is 1.5g/L, the mass concentration of described polyvinylpyrrolidone is 0.4g/L, described propargyl sodium sulfonate mass concentration is 4.0g/L, and the mass concentration of described food flavour is 4.0g/L.
4. the supplementary additive for Repone K or zinc electroplating in soidium chloride technique according to claim 2, it is characterized in that: the mass concentration of described nicotinic acid is 2.0g/L, the mass concentration of described polyvinylpyrrolidone is 0.8g/L, the mass concentration of described propargyl sodium sulfonate is 2.0g/L, and the mass concentration of described edible asccharin is 2.0g/L.
5. the supplementary additive for Repone K or zinc electroplating in soidium chloride technique according to claim 2, it is characterized in that: the mass concentration of described nicotinic acid is 1.0g/L, the mass concentration of described polyvinylpyrrolidone is 0.5g/L, the mass concentration of described propargyl sodium sulfonate is 2.0g/L, and the mass concentration of described edible asccharin is 6.0g/L.
CN201510089124.6A 2015-02-27 2015-02-27 Auxiliary additive for potassium chloride or sodium chloride galvanizing process Pending CN104726904A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
CN201510089124.6A CN104726904A (en) 2015-02-27 2015-02-27 Auxiliary additive for potassium chloride or sodium chloride galvanizing process

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106283131A (en) * 2016-08-26 2017-01-04 湖北吉和昌化工科技有限公司 Subacidity plating solution bright copper plating brightener and preparation method thereof
CN106835217A (en) * 2017-03-17 2017-06-13 湖北吉和昌化工科技有限公司 Imitation gold plating bright property dispersant and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4221970A1 (en) * 1992-06-30 1994-01-05 Schering Ag Sodium alkenyl or alkynyl salt use in metal electroplating bath to bind halogen - useful for preventing toxic halogen gas emission, esp. from zinc@, nickel@ or copper@ plating bath e.g. fluorine@, chlorine@, bromine@ or iodine@ at inert anode
CN103184479A (en) * 2013-04-12 2013-07-03 北京美坚默克化工产品有限公司 Galvanized composite brightening agent and preparation method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4221970A1 (en) * 1992-06-30 1994-01-05 Schering Ag Sodium alkenyl or alkynyl salt use in metal electroplating bath to bind halogen - useful for preventing toxic halogen gas emission, esp. from zinc@, nickel@ or copper@ plating bath e.g. fluorine@, chlorine@, bromine@ or iodine@ at inert anode
CN103184479A (en) * 2013-04-12 2013-07-03 北京美坚默克化工产品有限公司 Galvanized composite brightening agent and preparation method thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
徐滨士著: "《材料表面工程技术》", 31 December 2014 *
陈范才: "《现代电镀技术》", 31 August 2009 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106283131A (en) * 2016-08-26 2017-01-04 湖北吉和昌化工科技有限公司 Subacidity plating solution bright copper plating brightener and preparation method thereof
CN106835217A (en) * 2017-03-17 2017-06-13 湖北吉和昌化工科技有限公司 Imitation gold plating bright property dispersant and preparation method thereof

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