CN106283131A - Subacidity plating solution bright copper plating brightener and preparation method thereof - Google Patents
Subacidity plating solution bright copper plating brightener and preparation method thereof Download PDFInfo
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- CN106283131A CN106283131A CN201610742233.8A CN201610742233A CN106283131A CN 106283131 A CN106283131 A CN 106283131A CN 201610742233 A CN201610742233 A CN 201610742233A CN 106283131 A CN106283131 A CN 106283131A
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- brightener
- subacidity
- plating
- gamma
- pvp
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a kind of subacidity plating solution bright copper plating brightener and preparation method thereof.The formula of the present invention is as follows: nicotinic acid 15～25g/L .gamma.-pyridinecarboxylic acid 15～25g/L, PVP 5～10g/L.The preparation method of the present invention is as follows: first weigh nicotinic acid .gamma.-pyridinecarboxylic acid, PVP, by KOH solution, nicotinic acid .gamma.-pyridinecarboxylic acid are dissolved completely respectively again, with ethanol, PVP is dissolved completely, then gained solution is inserted in container successively, distilled water or deionized water is supplemented in the most backward container, stir,.Apply the present invention in electroplate liquid, electroplate liquid can be made to maintain a long-term stability, can guarantee that electroplate liquid has good electric conductivity, dispersive property, anti-impurity performance, coordination ability, ensure that copper plate has good toughness, the copper coating that flexibility is good, good dispersion, light, compact crystallization, adhesion is good can be obtained.
Description
Technical field
The present invention relates to electroplating technology field, be specifically related to a kind of subacidity plating solution bright copper plating brightener and preparation thereof
Method.
Background technology
Plating utilizes electrolysis principle to plate the process of other metal or alloy of a thin layer on some metal surface exactly, is
Utilize electrolysis to make the technique of surface attachment layer of metal film of metal or other material thus play and prevent metal oxygen
Change, improve the effects such as wearability, electric conductivity, reflective, corrosion resistance (copper sulfate etc.) and having improved aesthetic appearance.As long as there being work in the world
Industry, comprises heavy industry, light industry, aerospace industry, war industry, electronic information industry all be unable to do without plating.And electro-coppering is especially
A very important plating.
At present, electro-coppering can be divided into alkaline solution copper facing and acid solution copper facing.The copper-plated feature of alkaline solution is: copper facing
Layer less light, cathode efficiency low (45～65%), advantage is layers of copper and iron-based body good bonding strength, and layers of copper crystal grain is fine and close
It is referred to as " high density copper facing "；And the feature of acid copper-plating is cathode efficiency height (95～100%), coating light is like mirror
Face, shortcoming is that copper plate crystal grain composition is the finest and close, and layers of copper and iron-based body are because being easily generated copper displacement reaction and adhesion is very poor, need elder generation
Carry out alkaline copper plating and carry out acid copper-plating again, and after having the surfactant of absorption to cause because of coating surface after acid copper-plating
Continuous light plating Ni, Cr adhesion is bad.
For prior art, market being badly in need of a kind of novel copper facing brightener, this brightener can overcome above-mentioned alkalescence molten
Liquid copper facing and the copper-plated shortcoming of acid solution, and the advantage retaining both.
Summary of the invention
Present invention aims to above-mentioned the deficiencies in the prior art, it is provided that a kind of subacidity plating solution bright copper plating is used up
Bright dose and preparation method thereof.This brightener can improve cathode efficiency, is applied in electroplate liquid by this brightener, can obtain and divide
Dissipate the copper coating that property is good, light, compact crystallization, adhesion is good.
To achieve these goals, the present invention adopts the following technical scheme that
A kind of subacidity plating solution bright copper plating brightener, it is characterised in that this brightener formula is as follows: nicotinic acid 15～
25g/L .gamma.-pyridinecarboxylic acid 15～25g/L, PVP 5～10g/L.
Preferably, described brightener formula is as follows: nicotinic acid 20～25g/L .gamma.-pyridinecarboxylic acid 20～25g/L, polyethylene
Pyrrolinone 10g/L.
Preferably, the solvent that described brightener formula uses is distilled water or deionized water.
A kind of preparation method of subacidity plating solution bright copper plating brightener, it is characterised in that: first weigh nicotinic acid, different cigarette
Acid, PVP, then by KOH solution, nicotinic acid .gamma.-pyridinecarboxylic acid are dissolved completely respectively, with ethanol by PVP
Dissolve completely, then gained solution is inserted in container successively, supplement distilled water or deionized water in the most backward container, fully stir
Mix uniformly,.
Preferably, the mass percent of described KOH is 5%, and the mass percent of described ethanol is 95%.
The present invention obtains and provides the benefit that:
1, the invention provides a kind of novel brightener formula, this brightener can expand the negative electrode pole of high current density region
Change and polarizability, cathode efficiency can be improved.
2, apply the present invention in electroplate liquid, electroplate liquid can be made to maintain a long-term stability, can guarantee that electroplate liquid has well
Electric conductivity, dispersive property, anti-impurity performance, coordination ability, it is ensured that copper plate has good toughness, flexibility can be obtained good
, good dispersion, light, compact crystallization, copper coating that adhesion is good.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in further detail, but its not rights protection to the present invention
Scope constitutes restriction.
Embodiment 1:
A kind of subacidity plating solution bright copper plating brightener, its brightener formula is as follows: nicotinic acid 15g/L .gamma.-pyridinecarboxylic acid 20g/
L, PVP 5g/L.
A kind of preparation method of subacidity plating solution bright copper plating brightener: first weigh 15g nicotinic acid, 20g .gamma.-pyridinecarboxylic acid, 5g gather
Ethylene pyrrolinone, then by the KOH solution that the mass percent of 100ml is 5%, nicotinic acid .gamma.-pyridinecarboxylic acid are dissolved completely respectively, use
The mass percent of 100ml be 95% ethanol PVP is dissolved completely, then gained solution is inserted successively
In container, in the most backward container, supplementary distilled water or deionized water are to 1000ml, stir, i.e. can get brightener.
The application of a kind of subacidity plating solution bright copper plating brightener: add above-mentioned brightener 15ml in electroplate liquid, i.e.
Available light copper coating.
When applying the present invention to copper facing in above-mentioned electroplate liquid, can use copper sulfate, boric acid, ortho-sulphobenzimide and
2-ethylhexylsulfate sodium, as plating solution formula, is 40～50 DEG C at temperature of electroplating solution, and bath pH values is 4.5～5.5,
Cathode-current density is 0.2～3.0A/dm2Under conditions of, available copper coating bright, that compact crystallization, adhesion is good,
Now cathode efficiency is between 56～80%.
Embodiment 2:
A kind of subacidity plating solution bright copper plating brightener, its brightener formula is as follows: nicotinic acid 20g/L .gamma.-pyridinecarboxylic acid 15g/
L, PVP 8g/L.
A kind of preparation method of subacidity plating solution bright copper plating brightener: first weigh 20g nicotinic acid, 15g .gamma.-pyridinecarboxylic acid, 8g gather
Ethylene pyrrolinone, then by the KOH solution that the mass percent of 100ml is 5%, nicotinic acid .gamma.-pyridinecarboxylic acid are dissolved completely respectively, use
The mass percent of 100ml be 95% ethanol PVP is dissolved completely, then gained solution is inserted successively
In container, in the most backward container, supplementary distilled water or deionized water are to 1000ml, stir, i.e. can get brightener.
The application of a kind of subacidity plating solution bright copper plating brightener: add above-mentioned brightener 12ml in electroplate liquid, i.e.
The copper coating of available light.
When applying the present invention to copper facing in above-mentioned electroplate liquid, can use copper sulfate, boric acid, ortho-sulphobenzimide and
2-ethylhexylsulfate sodium, as plating solution formula, is 40～50 DEG C at temperature of electroplating solution, and bath pH values is 4.5～5.5,
Cathode-current density is 0.2～3.0A/dm2Under conditions of, available copper coating bright, that compact crystallization, adhesion is good,
Now cathode efficiency is between 56～80%.
Embodiment 3:
A kind of subacidity plating solution bright copper plating brightener, its brightener formula is as follows: nicotinic acid 25g/L .gamma.-pyridinecarboxylic acid 25g/
L, PVP 10g/L.
The preparation method of a kind of subacidity plating solution bright copper plating brightener: first weigh 25g nicotinic acid, 25g .gamma.-pyridinecarboxylic acid, 10g
PVP, then by the KOH solution that the mass percent of 100ml is 5%, nicotinic acid .gamma.-pyridinecarboxylic acid are dissolved completely respectively,
With the ethanol that the mass percent of 100ml is 95%, PVP is dissolved completely, then gained solution is put successively
Entering in container, in the most backward container, supplementary distilled water or deionized water are to 1000ml, stir, i.e. available light
Agent.
The application of a kind of subacidity plating solution bright copper plating brightener: add above-mentioned brightener 10ml in electroplate liquid, i.e.
The copper coating of available light.
When applying the present invention to copper facing in above-mentioned electroplate liquid, can use copper sulfate, boric acid, ortho-sulphobenzimide and
2-ethylhexylsulfate sodium, as plating solution formula, is 40～50 DEG C at temperature of electroplating solution, and bath pH values is 4.5～5.5,
Cathode-current density is 0.2～3.0A/dm2Under conditions of, available copper coating bright, that compact crystallization, adhesion is good,
Now cathode efficiency is between 56～80%.
The content that this specification is not described in detail belongs to prior art known to professional and technical personnel in the field.
Claims (5)
1. a subacidity plating solution bright copper plating brightener, it is characterised in that this brightener formula is as follows: nicotinic acid 15～25g/
L .gamma.-pyridinecarboxylic acid 15～25g/L, PVP 5～10g/L.
Subacidity plating solution bright copper plating brightener the most according to claim 1, it is characterised in that: described brightener formula
As follows: nicotinic acid 20～25g/L .gamma.-pyridinecarboxylic acid 20～25g/L, PVP 10g/L.
Subacidity plating solution bright copper plating brightener the most according to claims 1 to 2, it is characterised in that: described brightener
The solvent that formula uses is distilled water or deionized water.
4. the preparation method of a subacidity plating solution bright copper plating brightener, it is characterised in that: first weigh nicotinic acid .gamma.-pyridinecarboxylic acid,
PVP, then by KOH solution, nicotinic acid .gamma.-pyridinecarboxylic acid are dissolved completely respectively, with ethanol, PVP is molten
Solve completely, then gained solution is inserted in container successively, supplement distilled water or deionized water in the most backward container, be sufficiently stirred for
Uniformly,.
The preparation method of subacidity plating solution bright copper plating brightener the most according to claim 4, it is characterised in that: described
The mass percent of KOH is 5%, and the mass percent of described ethanol is 95%.
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| CN201610742233.8A CN106283131A (en) | 2016-08-26 | 2016-08-26 | Subacidity plating solution bright copper plating brightener and preparation method thereof |
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| CN201610742233.8A CN106283131A (en) | 2016-08-26 | 2016-08-26 | Subacidity plating solution bright copper plating brightener and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111663156A (en) * | 2020-07-09 | 2020-09-15 | 惠州市腾达宇科技有限公司 | Brightener for VCP electroplating and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1038676A (en) * | 1988-06-21 | 1990-01-10 | M&T化学品公司 | The electroplate liquid of the bright smooth functional chromium of high-level efficiency deposition |
| CN104726904A (en) * | 2015-02-27 | 2015-06-24 | 武汉吉和昌化工科技有限公司 | Auxiliary additive for potassium chloride or sodium chloride galvanizing process |
| CN105177643A (en) * | 2014-05-28 | 2015-12-23 | 无锡永发电镀有限公司 | Electroplating solution for acidic copper plating by phenol dye system and electroplating method thereof |
-
2016
- 2016-08-26 CN CN201610742233.8A patent/CN106283131A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1038676A (en) * | 1988-06-21 | 1990-01-10 | M&T化学品公司 | The electroplate liquid of the bright smooth functional chromium of high-level efficiency deposition |
| CN105177643A (en) * | 2014-05-28 | 2015-12-23 | 无锡永发电镀有限公司 | Electroplating solution for acidic copper plating by phenol dye system and electroplating method thereof |
| CN104726904A (en) * | 2015-02-27 | 2015-06-24 | 武汉吉和昌化工科技有限公司 | Auxiliary additive for potassium chloride or sodium chloride galvanizing process |
Non-Patent Citations (2)
| Title |
|---|
| 上海科学技术情报研究所: "《电镀译文集 第三辑》", 28 February 1980, 上海科学技术文献出版社 * |
| 冯立明: "《电镀工艺学》", 31 August 2010 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111663156A (en) * | 2020-07-09 | 2020-09-15 | 惠州市腾达宇科技有限公司 | Brightener for VCP electroplating and preparation method thereof |
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