CN104726070B - A kind of composite phase-change material for LED heat interface and preparation method thereof - Google Patents
A kind of composite phase-change material for LED heat interface and preparation method thereof Download PDFInfo
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- CN104726070B CN104726070B CN201510060022.1A CN201510060022A CN104726070B CN 104726070 B CN104726070 B CN 104726070B CN 201510060022 A CN201510060022 A CN 201510060022A CN 104726070 B CN104726070 B CN 104726070B
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- change material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
Abstract
The invention discloses a kind of composite phase-change material for LED heat interface and preparation method thereof.It is made of the raw material of following mass percent：18 45% bismuth, 10 27% tin, 35 55% indium, 0 1% antimony, 0 2% gallium, the aquadag powder of surplus.Alternatively, it is made of the raw material of following mass percent：44.51% bismuth, 17.47% tin, 35.77% indium, 0.55% antimony, the aquadag powder of surplus.Alternatively, it is made of the raw material of following mass percent：34.75% bismuth, 13.47% tin, 49.53% indium, 0.55% antimony, the aquadag powder of surplus.Alternatively, it is made of the raw material of following mass percent：18.97% bismuth, 26.32% tin, 51.48% indium, 1.55% gallium, the aquadag powder of surplus.The preparation method of the composite material is：1）Stock；2）Sample preparation：Under protective atmosphere, by the raw material melting of mixing, room temperature is cooled to.The present invention's is used for LED heat Interface composites phase-change material, and thermal conductivity factor is high, phase alternating temperature threshold is wide, enthalpy of phase change is big, performance is stablized, and can effectively reduce thermal contact resistance.
Description
Technical field
The present invention relates to a kind of composite phase-change material for LED heat interface and preparation method thereof.
Background technology
Heat transfer heat accumulating is heat conversion, the basis of transmission and storage.Currently used heat transfer heat accumulating has water/steaming
Vapour, conduction oil, fuse salt and liquid metal etc..Wherein, metal and alloy are due to thermal conductivity factor height, use temperature range
Extensively, service life is long, steady performance and the extensive concern studied both at home and abroad, especially with Sn, Bi, Pb, Cd,
The low-melting alloy of the low-melting-point metal such as In, Ga, Sb element composition, with density is high, fusing point is low and the physics such as boiling point is high are special
Property, it is a kind of potential middle low temperature phase change heat accumulating and heat transfer medium.
Considerable electronics or electric equipment products can often cause the broken of circuit due to reasons such as overcurrent, overheats in use
It is bad, so as to influence the normal use of product.For the heat dissipation problem of high heat flux density electronic component, research staff have developed greatly
The interface heat control material of amount, such as exchange heat coating and phase-change material, and has been achieved with much being in progress.
However, also there are many deficiencies for the performance of interface heat control material of the prior art：Such as thermal conductivity factor is little, no
Thermal contact resistance can be effectively reduced, enthalpy of phase change is small, and phase alternating temperature threshold is narrow etc..
The content of the invention
It is an object of the invention to a kind of composite phase-change material for LED heat interface and preparation method thereof.
The technical solution used in the present invention is：
A kind of composite phase-change material for LED heat interface, it is made of the raw material of following mass percent：18-45%
Bismuth, the tin of 10-27%, the indium of 35-55%, the antimony of 0-1%, the gallium of 0-2%, the aquadag powder of surplus.
A kind of composite phase-change material for LED heat interface, it is made of the raw material of following mass percent：44.51%
Bismuth, 17.47% tin, 35.77% indium, 0.55% antimony, the aquadag powder of surplus.
A kind of composite phase-change material for LED heat interface, it is made of the raw material of following mass percent：34.75%
Bismuth, 13.47% tin, 49.53% indium, 0.55% antimony, the aquadag powder of surplus.
A kind of composite phase-change material for LED heat interface, it is made of the raw material of following mass percent：18.97%
Bismuth, 26.32% tin, 51.48% indium, 1.55% gallium, the aquadag powder of surplus.
The bismuth, indium, tin, antimony, the particle diameter of gallium are 10-40 μm.
The particle diameter of the aquadag powder is 30-40 μm.
A kind of preparation method of composite phase-change material for LED heat interface, step are：
1）Stock：All raw materials are uniformly mixed；
2）Sample preparation：Under protective atmosphere, by uniform raw material melting mixed above, room temperature is cooled to.
Step 2）Specially：Mixed material is put into smelting furnace and is passed through protective gas, temperature is risen to from room temperature
600-800 DEG C, 20min-1h is kept the temperature afterwards, and room temperature is naturally cooled to after being then shut off heating power supply.
The protective gas is at least one of nitrogen, helium, neon, argon gas, xenon.
The beneficial effects of the invention are as follows：The composite phase-change material for LED heat interface of the present invention, thermal conductivity factor is high, phase
Alternating temperature threshold is wide, enthalpy of phase change is big, performance is stablized, and can effectively reduce thermal contact resistance.
Specifically：
1. the low-melting-point metal raw material used has larger fusion enthalpy, the heat for having electronic component to transmit can quickly be inhaled
Receive；
2. the composite phase-change material of the series formula of the present invention has larger thermal conductivity factor, its leading in melting range
Hot coefficient is 55-85W/m.K, can quickly pass the heat that electronic component produces；
3. the melting range of the composite phase-change material of the series formula of the present invention is 30-80 DEG C, the composite wood of different component
Material is used in the LED of different capacity, it is liquid in the operating condition, that is, is attached to after melting into fluidised form on substrate, fills base
Gap on plate, greatly reduces thermal contact resistance, so as to fulfill the fast transfer of heat, prevents electronic component from being damaged because of overheat
It is bad；
4. the aquadag used can effectively be attached to composite material surface, it can effectively suppress metal material in recombination process
And the oxidation reaction in the natural cooling process of melting simultaneously can crystal grain thinning.
Embodiment
A kind of composite phase-change material for LED heat interface, it is made of the raw material of following mass percent：18-45%
Bismuth, the tin of 10-27%, the indium of 35-55%, the antimony of 0-1%, the gallium of 0-2%, the aquadag powder of surplus, it is preferred that the antimony
It is 0 when different with the dosage of gallium.
Preferably, a kind of composite phase-change material for LED heat interface, it is the raw material group by following mass percent
Into：The bismuth of 18.97-44.51%, the tin of 13.47-26.32%, the indium of 35.77-51.48%, the antimony of 0-0.55%, 0-1.55%
The aquadag powder of gallium, surplus, it is preferred that the antimony is 0 when different with the dosage of gallium.
It is further preferred that a kind of composite phase-change material for LED heat interface, it is by the original of following mass percent
Material composition：44.51% bismuth, 17.47% tin, 35.77% indium, 0.55% antimony, the aquadag powder of surplus.
It is further preferred that a kind of composite phase-change material for LED heat interface, it is by the original of following mass percent
Material composition：34.75% bismuth, 13.47% tin, 49.53% indium, 0.55% antimony, the aquadag powder of surplus.
It is further preferred that a kind of composite phase-change material for LED heat interface, it is by the original of following mass percent
Material composition：18.97% bismuth, 26.32% tin, 51.48% indium, 1.55% gallium, the aquadag powder of surplus.
The bismuth, indium, tin, antimony, the particle diameter of gallium are 10-40 μm.
The particle diameter of the aquadag powder is 30-40 μm.
A kind of preparation method of composite phase-change material for LED heat interface, step are：
1）Stock：All raw materials are uniformly mixed；
2）Sample preparation：Under protective atmosphere, by uniform raw material melting mixed above, room temperature is cooled to.
Preferably, step 2）Specially：Mixed material is put into smelting furnace and is passed through protective gas, by temperature from room temperature
600-800 DEG C is risen to, keeps the temperature 20min-1h afterwards, room temperature is naturally cooled to after being then shut off heating power supply.
The protective gas is at least one of nitrogen, helium, neon, argon gas, xenon.
Preferably, step 2）Specially：Mixed material is put into smelting furnace and is passed through protective gas, by temperature from room temperature
700 DEG C are risen to, keeps the temperature 30min afterwards, room temperature is naturally cooled to after being then shut off heating power supply.
With reference to specific embodiment, the present invention is described further：
Embodiment 1：
Stock：Each material powder that purity is more than 99.9% is taken, by mass percentage, bismuth 44.51%, tin
17.47%, indium 35.77%, antimony 0.55%, aquadag powder 1.7%, is added in corundum crucible and is mixed and stirred for.Sample preparation：It will add
Smelting furnace power switch is opened, and mixed material is put into smelting furnace and is passed through nitrogen, melting furnace temperature is taken from room temperature
2.5 are raised to 700 DEG C when small, keep 700 DEG C of half an hours afterwards, room temperature is naturally cooled to after being then shut off heating power supply.
The thermal interfacial material that the present embodiment is prepared tests fusing point with DSC-Q20, and obtained test result is：78.9
℃。
Embodiment 2：
Stock：Each material powder that purity is more than 99.9% is taken, by mass percentage, bismuth 34.75%, tin
13.47%, indium 49.53%, antimony 0.55%, aquadag powder 1.7%, is added in corundum crucible and is mixed and stirred for.Sample making course
With embodiment 1.
The thermal interfacial material that the present embodiment is prepared tests fusing point with DSC-Q20, and obtained test result is：61.6
℃。
Embodiment 3：
Stock：Each material powder that purity is more than 99.9% is taken, by mass percentage, bismuth 18.97%, tin
26.32%, indium 51.48%, gallium 1.55%, aquadag powder 1.68%, is added in corundum crucible and is mixed and stirred for.Sample making course
With embodiment 1.
The thermal interfacial material that the present embodiment is prepared tests fusing point with DSC-Q20, and obtained test result is：31.3
℃。
In addition, by test, the thermal conductivity factor for the product that embodiment 1-3 is obtained is answered in 55-85W/m.K, different component
Condensation material is used in the LED of different capacity, it is liquid in the operating condition, that is, is attached on substrate, fills out into fluidised form after melting
Fill the gap on substrate, greatly reduce thermal contact resistance, so as to fulfill the fast transfer of heat, prevent electronic component because of overheat and
Damage.
Claims (8)
- A kind of 1. composite phase-change material for LED heat interface, it is characterised in that：It is the raw material group by following mass percent Into：The bismuth of 18.97-44.51%, the tin of 13.47-26.32%, the indium of 35.77-51.48%, the antimony of 0-0.55%, 0-1.55% The aquadag powder of gallium, surplus；The antimony is 0 when different with the dosage of gallium；The particle diameter of the aquadag powder is 30-40 μm。
- A kind of 2. composite phase-change material for the hot interfaces of LED according to claim 1, it is characterised in that：Described Bismuth, indium, tin, antimony, the particle diameter of gallium are 10-40 μm.
- A kind of 3. composite phase-change material for LED heat interface, it is characterised in that：It is the raw material group by following mass percent Into：44.51% bismuth, 17.47% tin, 35.77% indium, 0.55% antimony, the aquadag powder of surplus.
- A kind of 4. composite phase-change material for LED heat interface, it is characterised in that：It is the raw material group by following mass percent Into：34.75% bismuth, 13.47% tin, 49.53% indium, 0.55% antimony, the aquadag powder of surplus.
- A kind of 5. composite phase-change material for LED heat interface, it is characterised in that：It is the raw material group by following mass percent Into：18.97% bismuth, 26.32% tin, 51.48% indium, 1.55% gallium, the aquadag powder of surplus.
- A kind of 6. preparation method of composite phase-change material for the hot interfaces of LED described in claim 1, it is characterised in that： Step is：1）Stock：All raw materials are uniformly mixed；2）Sample preparation：Under protective atmosphere, by uniform raw material melting mixed above, room temperature is cooled to.
- 7. a kind of preparation method of composite phase-change material for the hot interfaces of LED according to claim 6, its feature exist In：Step 2）Specially：Mixed material is put into smelting furnace and is passed through protective gas, temperature is risen into 600- from room temperature 800 DEG C, 20min-1h is kept the temperature afterwards, and room temperature is naturally cooled to after being then shut off heating power supply.
- 8. a kind of preparation method of composite phase-change material for the hot interfaces of LED according to claim 7, its feature exist In：The protective gas is at least one of nitrogen, helium, neon, argon gas, xenon.
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| CN105838333A (en) * | 2016-04-05 | 2016-08-10 | 中国科学院深圳先进技术研究院 | Phase change alloy thermal interface composite material and preparation method thereof |
| CN108772565B (en) * | 2018-06-29 | 2019-11-08 | 北京梦之墨科技有限公司 | A kind of the metal injection filler and its application method of room temperature self-curing |
| CN113755138A (en) * | 2021-09-02 | 2021-12-07 | 宁波施捷电子有限公司 | Thermal interface material and electronic device comprising same |
| CN117286387A (en) * | 2022-06-20 | 2023-12-26 | 财团法人工业技术研究院 | Composite material and composite material structure of low-melting-point alloy |
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Effective date of registration: 20170616 Address after: Soochow Industrial Park, Huang Town three community Huang Jing village 523750 Guangdong city in Dongguan Province, a building 2 floor -1 Applicant after: Dongguan Yi Fei Xun Photoelectric Technology Co., Ltd. Address before: 518110 Guangdong Province, Shenzhen city Longhua District Guanlan community Daping chapter Road No. 110 Fuxing building Applicant before: Yi Feixun heat transfer technology company limited of Shenzhen |
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