CN104710939A - Processing method for improving edge surface shape of optical part, and composite abrasive particle polishing solution - Google Patents
Processing method for improving edge surface shape of optical part, and composite abrasive particle polishing solution Download PDFInfo
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- CN104710939A CN104710939A CN201310675688.9A CN201310675688A CN104710939A CN 104710939 A CN104710939 A CN 104710939A CN 201310675688 A CN201310675688 A CN 201310675688A CN 104710939 A CN104710939 A CN 104710939A
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- composite abrasive
- abrasive grain
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/14—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention belongs to an ultra-precision processing technology, and relates to a processing method for improving the edge surface shape of an optical part, and a composite abrasive particle polishing solution. The composite abrasive particle polishing solution is prepared by using 0.1-5mass% of organic polymer particles with the particle size range of 1-30[mu]m and the elastic modulus of 1-10GPa, and 0.1-5mass% of polishing powder with the particle size range of 0.3-3[mu]m and water. The composite abrasive particle polishing solution formed after adsorption of CeO2 abrasive particles to the surfaces of polystyrene (PS) microspheres is adopted to substitute a single CeO2 abrasive particle polishing solution, and the surface of the optical part is polished by adopting recommended technological parameters on a double face polishing machine tool in order to improve the edge surface shape of the optical part without influencing the surface roughness. The method is simple and practical, and allows the diameter to be 30mm and the thickness to be 6mm.
Description
Technical field
The invention belongs to Ultraprecision Machining, relate to a kind of working method and the composite abrasive grain polishing solution that improve optical element edge surface shape.
Background technology
Along with the development of science and technology, also improving constantly the accuracy requirement of optical element, the face shape of optical mirror slip requires to reach PV value for λ/20(λ=632.8nm), surface roughness requirements reaches Ra1nm.Double-Sided Polishing Technology is a kind of Ultraprecision Machining being widely used in the high-efficiency high-precision of optical element, Double-Sided Polishing Technology is adopted to process optical element, upper and lower polishing disk is stained with polyurethane polishing pad, and polyurethane polishing pad holds containing abrasive particle (as CeO
2, SiO
2deng) polishing fluid, mechanical scratching, chemical reaction are carried out to optical element surface, reach the object improving optical element face shape and roughness.In the production of reality, although Double-Sided Polishing Technology can obtain good surfaceness, parallelism and material removal rate, but when twin polishing, the U-shaped distribution of optical element surface pressure and edge pressure is comparatively large, in addition polishing fluid assemble at part edge, cause that edge polishing liquid concentration is high, skirt materials clearance is large, cause, at optical element edge, turned-down edge phenomenon (as shown in Figure 1) easily occurs, have a strong impact on the surface figure accuracy of optical element.Therefore Double-Sided Polishing Technology application is restricted.
Summary of the invention
Object of the present invention: provide one can reduce optical element edge turned-down edge, improve the working method of twin polishing optical element edge surface shape.
In addition, a kind of composite abrasive grain polishing solution is also provided.
Technical scheme of the present invention: a kind of composite abrasive grain polishing solution, it is 1um ~ 60um by particle size range, Young's modulus is that the polishing powder of 0.3um ~ 3um and water are formulated in the organic polymer microparticles of 1 ~ 10GPa, particle size range, wherein, the massfraction scope of dispersion organic polymer microparticles is 0.1% ~ 5%, and the massfraction scope of polishing powder is 0.1% ~ 5%.
Single dispersing organic polymer microparticles is spherical.
Dispersion organic polymer microparticles is polystyrene.
The dispersion organic polymer microparticles of composite abrasive grain polishing solution and abrasive particle form electrostatic adhesion.
Composite abrasive grain polishing solution through pH value regulate after be with weakly alkaline.
A kind of working method improving optical element edge surface shape, composite abrasive grain polishing solution is adopted to carry out polishing test to optical element on Twp-sided polishing machine, thus when not reducing optical element surfaceness, reducing optical element edge turned-down edge, improving optical element edge partial face shape.
The described working method improving optical element edge surface shape, its detailed process is as follows:
The first step: preparation composite abrasive grain polishing solution
Select monodispersed large grain-size PS microballoon, particle size range is 1um ~ 60um, PS microballoon is spherical; CeO
2polishing powder, CeO
2abrasive particle is irregular polyhedrons, and particle size range is 0.3um ~ 3um; Deionized water, gets PS microballoon and CeO
2polishing powder, add ultrapure water mixing and shake up, be made into the composite abrasive grain polishing solution with extra fine quality concentration ratio, PS microspheres quality fraction range is 0.1% ~ 5%, CeO
2the massfraction scope of abrasive particle is 0.1% ~ 5%;
Second step: the setting of composite abrasive grain polishing solution pH value
PS microsphere surface is modified through electric charge, with CeO
2form electrostatic adhesion, adopt the PH of KOH solution to composite abrasive grain polishing solution of PH=10 to regulate, the polishing fluid PH scope after adjustment is 8 ~ 11, and PS microballoon can be realized CeO
2stable absorption;
3rd step: the mensuration of composite abrasive grain polishing solution
Getting composite abrasive grain polishing solution drips on glass substrate, and the glass substrate evenly filling polishing fluid is placed in hundred-grade super-clean indoor, under being placed on laser confocal microscope, observes PS microballoon and CeO after drying
2absorption situation under electrostatic forcing, with CeO
2abrasive particle can wrap up PS microballoon completely for best, and the Compostie abrasive particles formed is uniformly dispersed, and is best without obvious agglomeration;
4th step: the pre-treatment before polishing
Operating ambient temperature 25 DEG C, humidity 70%, select the optical element after the lapping powder fine grinding of W7 ~ W14, range of surface roughness 3 ~ 10um, within dimensional uniformity 2um, optical element cleans up; The polishing disk posting polyurethane polishing pad uses diamond disk and Stainless Steel Disc to repair, and ensures the face shape of polishing disk; The composite abrasive grain polishing solution of preparation is through supersound process 0.5h ~ 1h;
5th step: polishing
Evenly be positioned over by erratic star wheel in lower polishing disk, pretreated optical element evenly puts into erratic star wheel, first drips composite abrasive grain polishing solution and upper and lower polishing pad is soaked, then fallen by upper polishing disk,
In the polishing starting stage, processing parameter: lower polishing disk rotating speed 4 ~ 10r/min, upthrow CD speed-1 ~-3r/min, erratic star wheel autobiography rotating speed 2 ~ 5r/min, erratic star wheel revolution rotating speed 2 ~ 5r/min, polishing fluid flow 10 ~ 50mL/min, pressure range 3 ~ 5KPa, polishing time 3 ~ 5min, allow polishing fluid fully can be filled into gap between polyurethane polishing pad and optical element under slow speed of revolution low pressure, sufficient lubrication, avoids metal to-metal contact to produce and scratches;
In the polishing intermediate stage, processing parameter: lower polishing disk rotating speed 6 ~ 30r/min, upthrow CD speed-2 ~-6r/min, erratic star wheel autobiography rotating speed 2 ~ 11r/min, erratic star wheel revolution rotating speed 2 ~ 11r/min, polishing fluid flow 10 ~ 50mL/min, pressure range 3 ~ 20KPa, polishing time 1 ~ 10h, Compostie abrasive particles embeds polyurethane polishing pad, under the drive of polishing disk, material optical surface being carried out to mechanochemical treatment is removed;
In polishing end stage, processing parameter: lower polishing disk rotating speed 4 ~ 10r/min, upthrow CD speed-1 ~-3r/min, erratic star wheel autobiography rotating speed 2 ~ 5r/min, erratic star wheel revolution rotating speed 2 ~ 5r/min, de-ionized water flow rate 10 ~ 50mL/min, pressure range 3 ~ 5KPa, polishing time 3 ~ 5min, adopt clear water to clean optical element, slowly decompression simultaneously, the unrelieved stress that release optical element produces because of polishing;
6th step: the cleaning of optical element after polishing, puts into Ultrasonic Cleaners by the optical element after polishing and cleans, and removes the polishing powder of remained on surface;
7th step: the detection of optical element after polishing, as undesirable, then repeating step five polishing further, until the indices such as face shape meet workpiece design requirements.
Advantage of the present invention and beneficial effect are: PS microballoon cheap for manufacturing cost, adding PS(polystyrene) composite abrasive grain polishing solution of microballoon can when not changing existing processing condition, the optical element that acquisition surfaceness and surperficial face shape all satisfy the demands, has the advantage that method is easy, practical; Face shape requires to reach PV value and can drop to λ/20(from λ/5 and namely drop to below 20nm from 125nm), composite abrasive grain polishing solution also has good application prospect reducing in optical element surface tear in addition.
Accompanying drawing explanation
Fig. 1 be Double-Sided Polishing Technology processing optical part obtain turned-down edge face shape;
Fig. 2 is the optical element face shape of processing acquisition under processing parameter in instances;
Embodiment
Below in conjunction with accompanying drawing, the present invention is further illustrated:
The present invention adopts adsorbs CeO by polystyrene (PS) microsphere surface
2the composite abrasive grain polishing solution that abrasive particle is formed substitutes single CeO
2abrasive grain polishing solution, twin polishing lathe adopts specific processing parameter carry out polishing to optical element surface, reaches the object improving optical element edge surface shape.Composite abrasive grain polishing solution can improve the edge surface shape of optical element, and its principle is, PS microsphere surface absorption CeO
2the Compostie abrasive particles that abrasive particle is formed forms one deck liner between polyurethane polishing pad and optical element, improve the pressure distribution of piece surface, especially reduce the pressure of part edge, thus it is more even that the material on optical element surface is removed, the edge surface shape of optical element improves; In addition, Compostie abrasive particles forms larger gap between polyurethane polishing pad and optical element, is convenient to the flowing of polishing fluid, avoids the accumulation of polishing fluid at part edge, improves the edge surface shape of part.
The detailed process that the present invention improves the working method of optical element edge surface shape is as follows:
The first step: preparation composite abrasive grain polishing solution
Select monodispersed large grain-size PS(polystyrene) microballoon, particle size range is 1um ~ 60um, PS microballoon is spherical; CeO
2(cerium oxide) polishing powder, CeO
2abrasive particle is irregular polyhedrons, and particle size range is 0.3um ~ 3um; Deionized water, gets PS microballoon and CeO
2polishing powder, add ultrapure water mixing and shake up, be made into the composite abrasive grain polishing solution with extra fine quality concentration ratio, PS microspheres quality fraction range is 0.1% ~ 5%, CeO
2the massfraction scope of abrasive particle is 0.1% ~ 5%.
Second step: the setting of composite abrasive grain polishing solution pH value
PS microsphere surface is modified through electric charge, with CeO
2form electrostatic adhesion, adopt the PH of KOH solution to composite abrasive grain polishing solution of PH=10 to regulate, the polishing fluid PH scope after adjustment is 8 ~ 11, and PS microballoon can be realized CeO
2stable absorption;
3rd step: the mensuration of composite abrasive grain polishing solution
Getting 2mL composite abrasive grain polishing solution drips on glass substrate, and the glass substrate evenly filling polishing fluid is placed in hundred-grade super-clean indoor, under being placed on laser confocal microscope, observes PS microballoon and CeO after drying
2absorption situation under electrostatic forcing, with CeO
2abrasive particle can wrap up PS microballoon completely for best, and the Compostie abrasive particles formed is uniformly dispersed, and is best without obvious agglomeration;
4th step: the pre-treatment before polishing
Operating ambient temperature 25 DEG C, humidity 70%, select the optical element after the lapping powder fine grinding of W7 ~ W14, range of surface roughness 3 ~ 10um, within dimensional uniformity 2um, optical element cleans up; The polishing disk posting polyurethane polishing pad uses diamond disk and Stainless Steel Disc to repair, and ensures the face shape of polishing disk; The composite abrasive grain polishing solution of preparation is through supersound process 0.5h ~ 1h;
5th step: polishing
Evenly be positioned over by erratic star wheel in lower polishing disk, pretreated optical element evenly puts into erratic star wheel, first drips composite abrasive grain polishing solution and upper and lower polishing pad is soaked, then fallen by upper polishing disk,
In the polishing starting stage, processing parameter: lower polishing disk rotating speed 4 ~ 10r/min, upthrow CD speed-1 ~-3r/min, erratic star wheel autobiography rotating speed 2 ~ 5r/min, erratic star wheel revolution rotating speed 2 ~ 5r/min, polishing fluid flow 10 ~ 50mL/min, pressure range 3 ~ 5KPa, polishing time 3 ~ 5min, allow polishing fluid fully can be filled into gap between polyurethane polishing pad and optical element under slow speed of revolution low pressure, sufficient lubrication, avoids metal to-metal contact to produce and scratches;
In the polishing intermediate stage, processing parameter: lower polishing disk rotating speed 6 ~ 30r/min, upthrow CD speed-2 ~-6r/min, erratic star wheel autobiography rotating speed 2 ~ 11r/min, erratic star wheel revolution rotating speed 2 ~ 11r/min, polishing fluid flow 10 ~ 50mL/min, pressure range 3 ~ 20KPa, polishing time 1 ~ 10h, Compostie abrasive particles embeds polyurethane polishing pad, under the drive of polishing disk, material optical surface being carried out to mechanochemical treatment is removed, and this stage is the main phase of polishing;
In polishing end stage, processing parameter: lower polishing disk rotating speed 4 ~ 10r/min, upthrow CD speed-1 ~-3r/min, erratic star wheel autobiography rotating speed 2 ~ 5r/min, erratic star wheel revolution rotating speed 2 ~ 5r/min, de-ionized water flow rate 10 ~ 50mL/min, pressure range 3 ~ 5KPa, polishing time 3 ~ 5min, object adopts clear water to clean optical element, slowly decompression simultaneously, the unrelieved stress that release optical element produces because of polishing.
6th step: the cleaning of optical element after polishing, puts into Ultrasonic Cleaners by the optical element after polishing and cleans, and removes the polishing powder of remained on surface.
7th step: the detection of optical element after polishing, use Zygo laser plane interferometer and white light interferometer to detect optical element surface, whether checking reaches workpiece design requirements.If desired can repeating step five further polishing, until the indices such as face shape meet workpiece design requirements.
Example:
Take diameter as 30mm, thickness is the substrate of 6mm is processing object, requires polishing mera surface roughness Ra <1nm, shape λ/20, face.
The first step: get the PS microballoon 10.2g that particle diameter is 20um, PS microsphere surface is modified in positive potential through electric charge; Particle diameter is the CeO2 polishing powder 10.2g of 1um; Deionized water 1000g, stirs after mixing, ultrasonic 30min.
Second step; Carry out pH value adjustment with the composite abrasive grain polishing solution of KOH solution to preparation of PH=10, use PH test paper to measure the pH value of composite abrasive grain polishing solution, be adjusted to PH=8.
3rd step: with PS microballoon and CeO in confocal laser scanning microscope polishing fluid
2the absorption situation of abrasive particle, magnification is 3000 multiples, PS microballoon and CeO
2when the mass concentration ratio of abrasive particle is 1:1, PS microsphere surface is completely by CeO
2abrasive particle wraps up, and is adsorbed with CeO
2can be good at scattering between the PS microballoon of abrasive particle, do not occur significantly reuniting.
4th step: carry out lappingout, surface roughness Ra <6um with W7 lapping powder substrate.Optical element cleans up; Diamond disk and Stainless Steel Disc is used to repair to the polishing disk posting polyurethane polishing pad; The composite abrasive grain polishing solution of preparation is through supersound process 0.5h ~ 1h;
5th step: carry out polishing test at SPEEDFAM twin polishing lathe.Polishing pad polyurethane material, erratic star wheel is Teflon material.The burnishing parameters of starting stage: lower polishing disk rotating speed 5r/min, upthrow CD speed-2r/min, erratic star wheel autobiography rotating speed 3r/min, erratic star wheel revolution rotating speed 3r/min, polishing fluid flow 30mL/min, pressure 4KPa, polishing time 3min; The burnishing parameters in intermediate stage: lower polishing disk rotating speed 12r/min, upthrow CD speed-4r/min, erratic star wheel autobiography rotating speed 6r/min, erratic star wheel revolution rotating speed 5r/min, polishing fluid flow 20mL/min, pressure 10KPa, polishing time 6h; The burnishing parameters of end stage: lower polishing disk rotating speed 5r/min, upthrow CD speed-2r/min, erratic star wheel autobiography rotating speed 3r/min, erratic star wheel revolution rotating speed 3r/min, de-ionized water flow rate 50mL/min, pressure 3KPa, polishing time 3min;
6th step: by the part after polishing through ultrasonic cleaning, removes remained on surface polishing powder.
7th step: therefrom take out 3 parts, use Zygo laser plane interferometer to measure the face shape of optical element, as shown in Figure 2, face shape PV reaches 20nm(and λ/20 to result) requirement, edge is without turned-down edge.Surface roughness Ra is actual simultaneously reaches 0.8nm, can meet Product Process requirement.
Claims (7)
1. a composite abrasive grain polishing solution, it is characterized in that, be 1um ~ 60um by particle size range, Young's modulus is that the polishing powder of 0.3um ~ 3um and water are formulated in the organic polymer microparticles of 1 ~ 10GPa, particle size range, wherein, the massfraction scope of dispersion organic polymer microparticles is 0.1% ~ 5%, and the massfraction scope of polishing powder is 0.1% ~ 5%.
2. composite abrasive grain polishing solution according to claim 1, is characterized in that, single dispersing organic polymer microparticles is spherical.
3. composite abrasive grain polishing solution according to claim 1, is characterized in that, dispersion organic polymer microparticles is polystyrene.
4. composite abrasive grain polishing solution according to claim 1, is characterized in that, the dispersion organic polymer microparticles of composite abrasive grain polishing solution and abrasive particle form electrostatic adhesion.
5. composite abrasive grain polishing solution according to claim 1, is characterized in that, composite abrasive grain polishing solution through pH value regulate after be with weakly alkaline.
6. one kind is improved the working method of optical element edge surface shape, it is characterized in that, the composite abrasive grain polishing solution described in any one of claim 1 to 5 is adopted to carry out polishing test to optical element on Twp-sided polishing machine, thus when not reducing optical element surfaceness, reduce optical element edge turned-down edge, improve optical element edge partial face shape.
7. the working method improving optical element edge surface shape according to claim 6, it is characterized in that, detailed process is as follows:
The first step: preparation composite abrasive grain polishing solution
Select monodispersed large grain-size PS microballoon, particle size range is 1um ~ 60um, PS microballoon is spherical; CeO
2polishing powder, CeO
2abrasive particle is irregular polyhedrons, and particle size range is 0.3um ~ 3um; Deionized water, gets PS microballoon and CeO
2polishing powder, add ultrapure water mixing and shake up, be made into the composite abrasive grain polishing solution with extra fine quality concentration ratio, PS microspheres quality fraction range is 0.1% ~ 5%, CeO
2the massfraction scope of abrasive particle is 0.1% ~ 5%;
Second step: the setting of composite abrasive grain polishing solution pH value
PS microsphere surface is modified through electric charge, with CeO
2form electrostatic adhesion, adopt the PH of KOH solution to composite abrasive grain polishing solution of PH=10 to regulate, the polishing fluid PH scope after adjustment is 8 ~ 11, and PS microballoon can be realized CeO
2stable absorption;
3rd step: the mensuration of composite abrasive grain polishing solution
Getting composite abrasive grain polishing solution drips on glass substrate, and the glass substrate evenly filling polishing fluid is placed in hundred-grade super-clean indoor, under being placed on laser confocal microscope, observes PS microballoon and CeO after drying
2absorption situation under electrostatic forcing, with CeO
2abrasive particle can wrap up PS microballoon completely for best, and the Compostie abrasive particles formed is uniformly dispersed, and is best without obvious agglomeration;
4th step: the pre-treatment before polishing
Operating ambient temperature 25 DEG C, humidity 70%, select the optical element after the lapping powder fine grinding of W7 ~ W14, range of surface roughness 3 ~ 10um, within dimensional uniformity 2um, optical element cleans up; The polishing disk posting polyurethane polishing pad uses diamond disk and Stainless Steel Disc to repair, and ensures the face shape of polishing disk; The composite abrasive grain polishing solution of preparation is through supersound process 0.5h ~ 1h;
5th step: polishing
Evenly be positioned over by erratic star wheel in lower polishing disk, pretreated optical element evenly puts into erratic star wheel, first drips composite abrasive grain polishing solution and upper and lower polishing pad is soaked, then fallen by upper polishing disk,
In the polishing starting stage, processing parameter: lower polishing disk rotating speed 4 ~ 10r/min, upthrow CD speed-1 ~-3r/min, erratic star wheel autobiography rotating speed 2 ~ 5r/min, erratic star wheel revolution rotating speed 2 ~ 5r/min, polishing fluid flow 10 ~ 50mL/min, pressure range 3 ~ 5KPa, polishing time 3 ~ 5min, allow polishing fluid fully can be filled into gap between polyurethane polishing pad and optical element under slow speed of revolution low pressure, sufficient lubrication, avoids metal to-metal contact to produce and scratches;
In the polishing intermediate stage, processing parameter: lower polishing disk rotating speed 6 ~ 30r/min, upthrow CD speed-2 ~-6r/min, erratic star wheel autobiography rotating speed 2 ~ 11r/min, erratic star wheel revolution rotating speed 2 ~ 11r/min, polishing fluid flow 10 ~ 50mL/min, pressure range 3 ~ 20KPa, polishing time 1 ~ 10h, Compostie abrasive particles embeds polyurethane polishing pad, under the drive of polishing disk, material optical surface being carried out to mechanochemical treatment is removed;
In polishing end stage, processing parameter: lower polishing disk rotating speed 4 ~ 10r/min, upthrow CD speed-1 ~-3r/min, erratic star wheel autobiography rotating speed 2 ~ 5r/min, erratic star wheel revolution rotating speed 2 ~ 5r/min, de-ionized water flow rate 10 ~ 50mL/min, pressure range 3 ~ 5KPa, polishing time 3 ~ 5min, adopt clear water to clean optical element, slowly decompression simultaneously, the unrelieved stress that release optical element produces because of polishing;
6th step: the cleaning of optical element after polishing, puts into Ultrasonic Cleaners by the optical element after polishing and cleans, and removes the polishing powder of remained on surface;
7th step: the detection of optical element after polishing, as undesirable, then repeating step five polishing further, until the indices such as face shape meet workpiece design requirements.
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| CN109880533A (en) * | 2019-03-26 | 2019-06-14 | 中南大学 | A kind of composite abrasive grain polishing solution and preparation method thereof |
| US20220080549A1 (en) * | 2018-02-09 | 2022-03-17 | Siltronic Ag | Method for polishing a semiconductior wafer |
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| CN101368084B (en) * | 2008-09-24 | 2011-08-10 | 上海大学 | Aluminum oxide/polystyrolsulfon acid graft copolymer composite abrasive grain and preparation method thereof |
| CN101870851B (en) * | 2010-06-02 | 2013-01-30 | 浙江工业大学 | Chemico-mechanical polishing liquid and polishing method |
| CN202346953U (en) * | 2011-12-05 | 2012-07-25 | 张莉娟 | Composite abrasive particle |
| CN102492233A (en) * | 2011-12-05 | 2012-06-13 | 张莉娟 | Composite abrasive grain as well as preparation method and application thereof |
| CN102775915B (en) * | 2012-06-25 | 2014-04-16 | 深圳市力合材料有限公司 | Silicon wafer fine polishing combined solution capable of inhibiting particle deposition and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220080549A1 (en) * | 2018-02-09 | 2022-03-17 | Siltronic Ag | Method for polishing a semiconductior wafer |
| CN109880533A (en) * | 2019-03-26 | 2019-06-14 | 中南大学 | A kind of composite abrasive grain polishing solution and preparation method thereof |
| CN109880533B (en) * | 2019-03-26 | 2020-07-17 | 中南大学 | Composite abrasive particle polishing solution and preparation method thereof |
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