CN104710939B - It is a kind of to improve the processing method and composite abrasive grain polishing solution of optical element edge surface shape - Google Patents
It is a kind of to improve the processing method and composite abrasive grain polishing solution of optical element edge surface shape Download PDFInfo
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- CN104710939B CN104710939B CN201310675688.9A CN201310675688A CN104710939B CN 104710939 B CN104710939 B CN 104710939B CN 201310675688 A CN201310675688 A CN 201310675688A CN 104710939 B CN104710939 B CN 104710939B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/14—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention belongs to Ultraprecision Machining, it is related to the processing method and composite abrasive grain polishing solution of a kind of improvement optical element edge surface shape.The composite abrasive grain polishing solution is 1 μm~30 μm by particle size range, modulus of elasticity is formulated in 1~10GPa organic polymer microparticles, the polishing powder that particle size range is 0.3 μm~3 μm and water, wherein, the mass fraction scope of scattered organic polymer microparticles is 0.1%~5%, and the mass fraction scope of polishing powder is 0.1%~5%.The present invention adsorbs CeO using by polystyrene (PS) microsphere surface2The composite abrasive grain polishing solution of abrasive particle formation substitutes single CeO2Abrasive grain polishing solution, is polished on twin polishing lathe using the technological parameter recommended to optical element surface, and reaching improves the purpose of optical element edge surface shape, while not influenceing surface roughness.This method is easy, practical, and a diameter of 30mm, thickness are 6mm.
Description
Technical field
The invention belongs to Ultraprecision Machining, it is related to a kind of processing method for improving optical element edge surface shape and compound
Abrasive grain polishing solution.
Background technology
With the continuous development of scientific technology, the required precision to optical element is also being improved constantly, the face of optical mirror slip
Shape requirement reaches that PV values are λ/20 (λ=632.8nm), and surface roughness requirements reach Ra1nm.Double-Sided Polishing Technology is a kind of wide
The Ultraprecision Machining of the general high-efficiency high-precision applied to optical element, is carried out using Double-Sided Polishing Technology to optical element
Processing, is stained with polyurethane polishing pad up and down on polishing disk, polyurethane polishing pad, which is accommodated, contains abrasive particle (such as CeO2、SiO2Deng) throwing
Light liquid, mechanical scratching, chemical reaction are carried out to optical element surface, the purpose for improving optical element face shape and roughness is reached.
In actual production, although Double-Sided Polishing Technology results in preferable surface roughness, the depth of parallelism and material removal rate,
But in twin polishing, the U-shaped distribution of optical element surface pressure be edge pressure it is larger, in addition polishing fluid it is poly- in part edge
Collect, cause edge polishing liquid concentration height, skirt materials clearance big, cause easily occur turned-down edge phenomenon at optical element edge
(as shown in Figure 1), has a strong impact on the surface figure accuracy of optical element.Therefore Double-Sided Polishing Technology application is restricted.
The content of the invention
The purpose of the present invention：Optical element edge turned-down edge can be reduced by providing one kind, improve twin polishing optical element side
The processing method of edge face shape.
In addition, also providing a kind of composite abrasive grain polishing solution.
Technical scheme：A kind of composite abrasive grain polishing solution, its by particle size range be 1 μm~60 μm, modulus of elasticity
Single dispersing organic polymer microparticles, particle size range in 1~10GPa are formulated for 0.3 μm~3 μm of polishing powder and water, its
In, the mass fraction scope of single dispersing organic polymer microparticles is 0.1%~5%, and the mass fraction scope of polishing powder is 0.1%
~5%.
Single dispersing organic polymer microparticles are in spherical.
Single dispersing organic polymer microparticles are polystyrene.
The single dispersing organic polymer microparticles of composite abrasive grain polishing solution and abrasive particle formation Electrostatic Absorption.
Band alkalescent after being adjusted through pH value of composite abrasive grain polishing solution.
It is a kind of improve optical element edge surface shape processing method, using composite abrasive grain polishing solution on Twp-sided polishing machine it is right
Optical element is polished experiment, so as in the case where not reducing optical element surface roughness, reduce optical element edge
Turned-down edge, improves optical element edge partial face shape.
Described to improve the processing method of optical element edge surface shape, its detailed process is as follows：
The first step:Prepare composite abrasive grain polishing solution
From monodispersed large grain-size PS microballoons, particle size range is 1 μm~60 μm, and PS microballoons are in spherical；CeO2Polishing powder,
CeO2Abrasive particle is in irregular polyhedronses, and particle size range is 0.3 μm~3 μm；Deionized water, takes PS microballoons and CeO2Polishing powder, is added
Ultra-pure water mixing shakes up, and is made into the composite abrasive grain polishing solution with extra fine quality concentration ratio, PS microspheres quality fraction ranges are
0.1%~5%, CeO2The mass fraction scope of abrasive particle is 0.1%~5%；
Second step：The setting of composite abrasive grain polishing solution pH value
PS microsphere surfaces by electric charge modify, with CeO2Electrostatic Absorption is formed, using pH=10 KOH solution to compound
The pH of abrasive grain polishing solution is adjusted, and the polishing fluid pH scopes after regulation are 8~11 so that PS microballoons can be realized to CeO2Surely
Fixed absorption；
3rd step：The measure of composite abrasive grain polishing solution
Take composite abrasive grain polishing solution to drip in glass substrate, the glass substrate for uniformly filling polishing fluid is placed in hundred-grade super-clean
Interior, is placed under laser confocal microscope after drying, observation PS microballoons and CeO2Absorption situation under electrostatic force,
With CeO2Abrasive particle can fully wrapped around PS microballoons be optimal, and formed Compostie abrasive particles be uniformly dispersed, without obvious agglomeration
To be optimal；
4th step：Pretreatment before polishing
25 DEG C of operating ambient temperature, humidity 70%, from the optical element after W7~W14 grounds travel fine grinding, surface is thick
Within 3~10 μm of rugosity scope, 2 μm of dimensional uniformity, optical element is cleaned up；Posting the polishing disk of polyurethane polishing pad makes
Repaired with diamond disk and stainless steel disc, it is ensured that the face shape of polishing disk；The composite abrasive grain polishing solution of preparation is sonicated
0.5h~1h；
5th step：Polishing
Erratic star wheel is uniformly positioned in lower polishing disk, pretreated optical element is uniformly put into erratic star wheel, is first dripped
Plus composite abrasive grain polishing solution make above and below polishing pad wetting, then upper polishing disk is fallen,
In polishing starting stage, technological parameter：Lower polishing disk rotating speed 4~10r/min, upper polishing disk rotating speed -1~-3r/
Min, erratic star wheel autobiography 2~5r/min of rotating speed, erratic star wheel revolution 2~5r/min of rotating speed, polish 10~50mL/min of flow quantity, pressure
Under strong 3~5KPa of scope, 3~5min of polishing time, the slow-speed of revolution low pressure polishing fluid can be sufficient filling with into polyurethane polishing pad
Gap between optical element, sufficient lubrication, it is to avoid dry friction produces scuffing；
In polishing interstage, technological parameter：Lower polishing disk rotating speed 6~30r/min, upper polishing disk rotating speed -2~-6r/
Min, erratic star wheel autobiography 2~11r/min of rotating speed, erratic star wheel revolution 2~11r/min of rotating speed, polish 10~50mL/min of flow quantity,
3~20KPa of pressure range, 1~10h of polishing time, Compostie abrasive particles insertion polyurethane polishing pad are right under the drive of polishing disk
The material that optical surface carries out mechanochemical treatment is removed；
In polishing end stage, technological parameter：Lower polishing disk rotating speed 4~10r/min, upper polishing disk rotating speed -1~-3r/
Min, erratic star wheel autobiography 2~5r/min of rotating speed, erratic star wheel revolution 2~5r/min of rotating speed, 10~50mL/min of de-ionized water flow rate,
3~5KPa of pressure range, 3~5min of polishing time, optical element is cleaned using clear water, while slow decompression, discharges optics zero
The residual stress that part is produced by polishing；
6th step：The cleaning of optical element after polishing, the optical element after polishing is put into supersonic wave cleaning machine and carried out
Cleaning, removes the polishing powder of remained on surface；
7th step：The detection of optical element after polishing, such as undesirable, then repeat step five is further polished, until
The indices such as face shape meet workpiece design requirement.
The advantages of the present invention are：The manufacturing cost of PS microballoons is cheap, adds PS (polystyrene) microballoon
Composite abrasive grain polishing solution can obtain surface roughness and surface face shape be satisfied by the case where not changing existing process condition
The optical element of demand, has the advantages that method is easy, practical；Face shape requirement reaches that PV values can drop to λ/20 from λ/5 (i.e.
Below 20nm is dropped to from 125nm), composite abrasive grain polishing solution also has good application in optical element surface tear is reduced in addition
Prospect.
Brief description of the drawings
Fig. 1 is the turned-down edge face shape that Double-Sided Polishing Technology processing optical part is obtained；
Fig. 2 is the optical element face shape that acquisition is processed under technological parameter in instances；
Embodiment
The present invention is further illustrated below in conjunction with the accompanying drawings：
The present invention adsorbs CeO using by polystyrene (PS) microsphere surface2The composite abrasive grain polishing solution of abrasive particle formation is substituted
Single CeO2Abrasive grain polishing solution, is polished on twin polishing lathe using specific technological parameter to optical element surface,
Reaching improves the purpose of optical element edge surface shape.Composite abrasive grain polishing solution can improve the edge surface shape of optical element, and it is former
Reason is that PS microsphere surfaces adsorb CeO2The Compostie abrasive particles of abrasive particle formation form one layer between polyurethane polishing pad and optical element
Pad, improves the pressure distribution of piece surface, is especially reduction of the pressure of part edge, so that optical element surface
Material removal is more uniform, and the edge surface shape of optical element is improved；In addition, Compostie abrasive particles are in polyurethane polishing pad and optics
Larger gap is formed between part, is easy to the flowing of polishing fluid, it is to avoid accumulation of the polishing fluid in part edge, zero is improved
The edge surface shape of part.
The detailed process that the present invention improves the processing method of optical element edge surface shape is as follows：
The first step:Prepare composite abrasive grain polishing solution
From monodispersed large grain-size PS (polystyrene) microballoon, particle size range is 1 μm~60 μm, and PS microballoons are in spherical；
CeO2(cerium oxide) polishing powder, CeO2Abrasive particle is in irregular polyhedronses, and particle size range is 0.3 μm~3 μm；Deionized water, takes PS micro-
Ball and CeO2Polishing powder, adds ultra-pure water mixing and shakes up, be made into the composite abrasive grain polishing solution with extra fine quality concentration ratio, PS is micro-
Ball mass fraction scope is 0.1%~5%, CeO2The mass fraction scope of abrasive particle is 0.1%~5%.
Second step：The setting of composite abrasive grain polishing solution pH value
PS microsphere surfaces by electric charge modify, with CeO2Electrostatic Absorption is formed, using pH=10 KOH solution to compound
The pH of abrasive grain polishing solution is adjusted, and the polishing fluid pH scopes after regulation are 8~11 so that PS microballoons can be realized to CeO2Surely
Fixed absorption；
3rd step：The measure of composite abrasive grain polishing solution
Take 2mL composite abrasive grain polishing solutions to drip in glass substrate, the glass substrate for uniformly filling polishing fluid is placed in hundred grades
In clean room, it is placed on after drying under laser confocal microscope, observation PS microballoons and CeO2Absorption under electrostatic force
Situation, with CeO2Abrasive particle can fully wrapped around PS microballoons be optimal, and formed Compostie abrasive particles be uniformly dispersed, without substantially reunion
Phenomenon is optimal；
4th step：Pretreatment before polishing
25 DEG C of operating ambient temperature, humidity 70%, from the optical element after W7~W14 grounds travel fine grinding, surface is thick
Within 3~10 μm of rugosity scope, 2 μm of dimensional uniformity, optical element is cleaned up；Posting the polishing disk of polyurethane polishing pad makes
Repaired with diamond disk and stainless steel disc, it is ensured that the face shape of polishing disk；The composite abrasive grain polishing solution of preparation is sonicated
0.5h~1h；
5th step：Polishing
Erratic star wheel is uniformly positioned in lower polishing disk, pretreated optical element is uniformly put into erratic star wheel, is first dripped
Plus composite abrasive grain polishing solution make above and below polishing pad wetting, then upper polishing disk is fallen,
In polishing starting stage, technological parameter：Lower polishing disk rotating speed 4~10r/min, upper polishing disk rotating speed -1~-3r/
Min, erratic star wheel autobiography 2~5r/min of rotating speed, erratic star wheel revolution 2~5r/min of rotating speed, polish 10~50mL/min of flow quantity, pressure
Under strong 3~5KPa of scope, 3~5min of polishing time, the slow-speed of revolution low pressure polishing fluid can be sufficient filling with into polyurethane polishing pad
Gap between optical element, sufficient lubrication, it is to avoid dry friction produces scuffing；
In polishing interstage, technological parameter：Lower polishing disk rotating speed 6~30r/min, upper polishing disk rotating speed -2~-6r/
Min, erratic star wheel autobiography 2~11r/min of rotating speed, erratic star wheel revolution 2~11r/min of rotating speed, polish 10~50mL/min of flow quantity,
3~20KPa of pressure range, 1~10h of polishing time, Compostie abrasive particles insertion polyurethane polishing pad are right under the drive of polishing disk
The material that optical surface carries out mechanochemical treatment is removed, and the stage is the Main Stage of polishing；
In polishing end stage, technological parameter：Lower polishing disk rotating speed 4~10r/min, upper polishing disk rotating speed -1~-3r/
Min, erratic star wheel autobiography 2~5r/min of rotating speed, erratic star wheel revolution 2~5r/min of rotating speed, 10~50mL/min of de-ionized water flow rate,
3~5KPa of pressure range, 3~5min of polishing time, it is therefore an objective to which optical element is cleaned using clear water, while slow decompression, release
The residual stress that optical element is produced by polishing.
6th step：The cleaning of optical element after polishing, the optical element after polishing is put into supersonic wave cleaning machine and carried out
Cleaning, removes the polishing powder of remained on surface.
7th step：The detection of optical element after polishing, using Zygo laser plane interferometers and white light interferometer to optics
Piece surface is detected, verifies whether to reach workpiece design requirement.Can further it be polished with repeat step five if necessary, until
The indices such as face shape meet workpiece design requirement.
Example：
With a diameter of 30mm, the substrate that thickness is 6mm is processing object, it is desirable to polish meron surface roughness Ra<
1nm, face shape λ/20.
The first step：It is in positive potential to take PS microballoons 10.2g, the PS microsphere surface that particle diameter is 20 μm to be modified through electric charge；Particle diameter is 1
μm CeO2 polishing powders 10.2g；Stirred after deionized water 1000g, mixing, ultrasonic 30min.
Second step；PH value regulation is carried out to the composite abrasive grain polishing solution of preparation with pH=10 KOH solution, pH test paper is used
Measure the pH value of composite abrasive grain polishing solution, regulation to pH=8.
3rd step：With PS microballoons and CeO in confocal laser scanning microscope polishing fluid2The absorption situation of abrasive particle, amplification
Multiple is 3000 multiples, PS microballoons and CeO2The mass concentration ratio of abrasive particle is 1:When 1, PS microsphere surfaces are completely by CeO2Mill
Grain parcel, and it is adsorbed with CeO2It can be good at scattering between the PS microballoons of abrasive particle, obvious reunion do not occur.
4th step：Lappingout, surface roughness Ra are carried out with W7 grounds travels substrate<6μm.Optical element is cleaned up；To patch
The polishing disk for having polyurethane polishing pad is repaired using diamond disk and stainless steel disc；The composite abrasive grain polishing solution of preparation is through super
Sonication 0.5h~1h；
5th step：Experiment is polished in SPEEDFAM twin polishing lathes.Polishing pad polyurethane material, erratic star wheel is
Teflon material.The burnishing parameters of starting stage：Lower polishing disk rotating speed 5r/min, upper polishing disk rotating speed -2r/min, erratic star wheel is certainly
Rotating speed 3r/min, erratic star wheel revolution rotating speed 3r/min are passed, flow quantity 30mL/min, pressure 4KPa, polishing time 3min is polished；In
Between the stage burnishing parameters：Lower polishing disk rotating speed 12r/min, upper polishing disk rotating speed -4r/min, erratic star wheel autobiography rotating speed 6r/
Min, erratic star wheel revolution rotating speed 5r/min, polishes flow quantity 20mL/min, pressure 10KPa, polishing time 6h；The throwing of end stage
Optical parameter：Lower polishing disk rotating speed 5r/min, upper polishing disk rotating speed -2r/min, erratic star wheel autobiography rotating speed 3r/min, erratic star wheel revolution
Rotating speed 3r/min, de-ionized water flow rate 50mL/min, pressure 3KPa, polishing time 3min；
6th step：By the part after polishing by being cleaned by ultrasonic, remained on surface polishing powder is removed.
7th step：3 parts are therefrom taken out, the face shape of optical element are measured using Zygo laser plane interferometers, as a result such as
Shown in Fig. 2, face shape PV has reached the requirement of 20nm (i.e. λ/20), and edge is without turned-down edge.Surface roughness Ra is actually reached simultaneously
0.8nm, disclosure satisfy that Product Process requirement.
Claims (6)
1. a kind of composite abrasive grain polishing solution, it is characterised in that by particle size range be 1 μm~60 μm, modulus of elasticity is in 1~10GPa
Single dispersing organic polymer microparticles, particle size range for 0.3 μm~3 μm polishing powder and water be formulated, wherein, single dispersing has
The mass fraction scope of machine polymer particles is 0.1%~5%, and the mass fraction scope of polishing powder is 0.1%~5%, single point
It is polystyrene to dissipate organic polymer microparticles, and polishing powder is CeO2, polystyrene surface absorption CeO2Abrasive particle formation Compostie abrasive particles are thrown
Light liquid.
2. composite abrasive grain polishing solution according to claim 1, it is characterised in that single dispersing organic polymer microparticles are in ball
Shape.
3. composite abrasive grain polishing solution according to claim 1, it is characterised in that the single dispersing of composite abrasive grain polishing solution is organic
Polymer particles and abrasive particle formation Electrostatic Absorption.
4. composite abrasive grain polishing solution according to claim 1, it is characterised in that composite abrasive grain polishing solution is adjusted through pH value
Afterwards with alkalescent.
5. a kind of improve the processing method of optical element edge surface shape, it is characterised in that using any one of Claims 1-4 institute
The composite abrasive grain polishing solution stated is polished experiment on Twp-sided polishing machine to optical element, so as to not reduce optical element table
In the case of surface roughness, reduce optical element edge turned-down edge, improve optical element edge partial face shape.
6. according to claim 5 improve the processing method of optical element edge surface shape, it is characterised in that detailed process is such as
Under：
The first step:Prepare composite abrasive grain polishing solution
From monodispersed large grain-size PS microballoons, particle size range is 1 μm~60 μm, and PS microballoons are in spherical；CeO2Polishing powder, CeO2Mill
Grain is in irregular polyhedronses, and particle size range is 0.3 μm~3 μm；Deionized water, takes PS microballoons and CeO2Polishing powder, is added ultrapure
Water mixing shakes up, and is made into the composite abrasive grain polishing solution with extra fine quality concentration ratio, and PS microspheres qualities fraction range is 0.1%~
5%, CeO2The mass fraction scope of abrasive particle is 0.1%~5%；
Second step：The setting of composite abrasive grain polishing solution pH value
PS microsphere surfaces by electric charge modify, with CeO2Electrostatic Absorption is formed, using pH=10 KOH solution to Compostie abrasive particles
The pH of polishing fluid is adjusted, and the polishing fluid pH scopes after regulation are 8~11 so that PS microballoons can be realized to CeO2It is stable to inhale
It is attached；
3rd step：The measure of composite abrasive grain polishing solution
Take composite abrasive grain polishing solution to drip in glass substrate, the glass substrate for uniformly filling polishing fluid is placed in hundred-grade super-clean room
It is interior, it is placed on after drying under laser confocal microscope, observation PS microballoons and CeO2Absorption situation under electrostatic force, with
CeO2Abrasive particle can fully wrapped around PS microballoons be optimal, and formed Compostie abrasive particles be uniformly dispersed, be without obvious agglomeration
Most preferably；
4th step：Pretreatment before polishing
25 DEG C of operating ambient temperature, humidity 70%, from the optical element after W7~W14 grounds travel fine grinding, surface roughness
Within 3~10 μm of scope, 2 μm of dimensional uniformity, optical element is cleaned up；The polishing disk for posting polyurethane polishing pad uses gold
Hard rock disk and stainless steel disc are repaired, it is ensured that the face shape of polishing disk；The sonicated 0.5h of composite abrasive grain polishing solution of preparation
~1h；
5th step：Polishing
Erratic star wheel is uniformly positioned in lower polishing disk, pretreated optical element is uniformly put into erratic star wheel, be first added dropwise multiple
Close abrasive grain polishing solution make above and below polishing pad wetting, then upper polishing disk is fallen,
In polishing starting stage, technological parameter：Lower polishing disk rotating speed 4~10r/min, upper polishing disk rotating speed -1~-3r/min, trip
Star-wheel autobiography 2~5r/min of rotating speed, erratic star wheel revolution 2~5r/min of rotating speed, polishes 10~50mL/min of flow quantity, pressure range
Under 3~5KPa, 3~5min of polishing time, the slow-speed of revolution low pressure polishing fluid can be sufficient filling with into polyurethane polishing pad and optics
Gap between part, sufficient lubrication, it is to avoid dry friction produces scuffing；
In polishing interstage, technological parameter：Lower polishing disk rotating speed 6~30r/min, upper polishing disk rotating speed -2~-6r/min, trip
Star-wheel autobiography 2~11r/min of rotating speed, erratic star wheel revolution 2~11r/min of rotating speed, polishes 10~50mL/min of flow quantity, pressure model
Enclose 3~20KPa, 1~10h of polishing time, Compostie abrasive particles insertion polyurethane polishing pad, under the drive of polishing disk, to optics table
The material that face carries out mechanochemical treatment is removed；
In polishing end stage, technological parameter：Lower polishing disk rotating speed 4~10r/min, upper polishing disk rotating speed -1~-3r/min, trip
Star-wheel autobiography 2~5r/min of rotating speed, erratic star wheel revolution 2~5r/min of rotating speed, 10~50mL/min of de-ionized water flow rate, pressure model
3~5KPa, 3~5min of polishing time are enclosed, optical element is cleaned using clear water, while slow decompression, release optical element is because throwing
The residual stress that light is produced；
6th step：The cleaning of optical element after polishing, the optical element after polishing is put into supersonic wave cleaning machine and cleaned,
Remove the polishing powder of remained on surface；
7th step：The detection of optical element after polishing, such as undesirable, then repeat step five is further polished, until face shape
Workpiece design requirement is met Deng indices.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101368084A (en) * | 2008-09-24 | 2009-02-18 | 上海大学 | Aluminum oxide/polystyrolsulfon acid graft copolymer composite abrasive grain and preparation method thereof |
| CN101870851A (en) * | 2010-06-02 | 2010-10-27 | 浙江工业大学 | Chemico-mechanical polishing liquid and polishing method |
| CN102492233A (en) * | 2011-12-05 | 2012-06-13 | 张莉娟 | Composite abrasive grain as well as preparation method and application thereof |
| CN202346953U (en) * | 2011-12-05 | 2012-07-25 | 张莉娟 | Composite abrasive particle |
| CN102775915A (en) * | 2012-06-25 | 2012-11-14 | 深圳市力合材料有限公司 | Silicon wafer fine polishing combined solution capable of inhibiting particle deposition and preparation method thereof |
-
2013
- 2013-12-11 CN CN201310675688.9A patent/CN104710939B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101368084A (en) * | 2008-09-24 | 2009-02-18 | 上海大学 | Aluminum oxide/polystyrolsulfon acid graft copolymer composite abrasive grain and preparation method thereof |
| CN101870851A (en) * | 2010-06-02 | 2010-10-27 | 浙江工业大学 | Chemico-mechanical polishing liquid and polishing method |
| CN102492233A (en) * | 2011-12-05 | 2012-06-13 | 张莉娟 | Composite abrasive grain as well as preparation method and application thereof |
| CN202346953U (en) * | 2011-12-05 | 2012-07-25 | 张莉娟 | Composite abrasive particle |
| CN102775915A (en) * | 2012-06-25 | 2012-11-14 | 深圳市力合材料有限公司 | Silicon wafer fine polishing combined solution capable of inhibiting particle deposition and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| High-performance CMP Slurry with Inorganic/Resin Abrasive for Al/Low k Damascene;Hiroyuki Yano等;《Materials Research Society》;20011230(第671期);第241-246页 * |
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