CN104659501A - Connecting technology of nanowire and FPC - Google Patents
Connecting technology of nanowire and FPC Download PDFInfo
- Publication number
- CN104659501A CN104659501A CN201310587830.4A CN201310587830A CN104659501A CN 104659501 A CN104659501 A CN 104659501A CN 201310587830 A CN201310587830 A CN 201310587830A CN 104659501 A CN104659501 A CN 104659501A
- Authority
- CN
- China
- Prior art keywords
- technology
- curves
- wire
- fpc
- nano
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
Landscapes
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention discloses a connecting technology of a nano-sized metal wire and a controller. The connecting technology comprises the step of replacing straight lines with curves to solve the problem of connection pseudo soldering of the nano-sized metal wire and the external controller. In combination with a print technology and a printing technology, routing is realized. The curves are shown in attached drawings in the abstract, but are not limited, and the common point of the curves are shown as follows: good flexibility is provided, and the conduction ratio is improved through larger contact area.
Description
Technical field
The invention belongs to electronic technology, field of nanometer material technology.
Background technology
Along with universal at smart mobile phone end and panel computer of touch technology, the mankind have formed the custom of touch-control, and touch technology is just progressively to large scale future development, and two kinds of main flow large touch technology are commercial.
Take Japan as copper conductor (or other plain conductors) printing technology of representative, another is silver particles (or other conduction metallics) printing technique.These technology have a common ground, and using metallic as raw material, extremely low resistance, superfine wire, reaches nanoscale, and human eye almost be can't see.
But these technology have a common difficult problem, namely how these wire sensor are connected to controller hardware, typical structure is: as shown in Figure 1, and wire is linearly on the pad of FPC.This structure has following problem:
1) when pad is heated and product in packaging, install, in transportation, as easy as rolling off a logly make wire fracture.
2) contact area is too little, and the conducting probability of wire and pad is reduced.
In the application of reality, there is the problem of faulty soldering of large probability, cause mainly due to this respect reason.
Accompanying drawing explanation
Fig. 1 is the metallic conducting wire structure before improvement
Fig. 2 is typical curve
Fig. 3 is the metallic conducting wire structure after improvement
Summary of the invention
Occur above-mentioned 1) problem, mainly because wire is linear, when making to encounter external force, the space of stretching cannot be obtained; Problem 2) mainly because wire is very thin, actual contact area is little.
For this two problems, by changing wire by the present situation above pad, as shown in Figure 3, wire is become the curve having radian, curve can have several types shown in Fig. 2, but is not limited to these:
These curve common ground are: provide good retractility, larger contact area.
Embodiment
No matter be printing technique or printing technology, guarantee the wire with FPC contact pads, print or the curve shown in above being printed as.
In the protection range of spirit of the present invention and claim, any amendment make the present invention and change, all fall into protection scope of the present invention.
Claims (2)
1. replace straight line with curve, solve the connection problem of faulty soldering of nanoscale wire and peripheral control unit.
2., in conjunction with printing technique and printing technology, realize cabling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310587830.4A CN104659501A (en) | 2013-11-21 | 2013-11-21 | Connecting technology of nanowire and FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310587830.4A CN104659501A (en) | 2013-11-21 | 2013-11-21 | Connecting technology of nanowire and FPC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104659501A true CN104659501A (en) | 2015-05-27 |
Family
ID=53250358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310587830.4A Pending CN104659501A (en) | 2013-11-21 | 2013-11-21 | Connecting technology of nanowire and FPC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104659501A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201112571Y (en) * | 2007-01-31 | 2008-09-10 | 横店得邦电子有限公司 | Connecting structure for conducting wire and PCB plate |
| CN101803013A (en) * | 2007-09-13 | 2010-08-11 | 丰田自动车株式会社 | Semiconductor device and wire bonding method |
| JP2011180806A (en) * | 2010-03-01 | 2011-09-15 | Hitachi Displays Ltd | Touch panel and display device |
| CN202004170U (en) * | 2010-12-03 | 2011-10-05 | 宏纪电研股份有限公司 | Conductive connecting component |
| CN102789334A (en) * | 2012-07-10 | 2012-11-21 | 苏州泛普纳米科技有限公司 | Nanometer touch film production method |
-
2013
- 2013-11-21 CN CN201310587830.4A patent/CN104659501A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201112571Y (en) * | 2007-01-31 | 2008-09-10 | 横店得邦电子有限公司 | Connecting structure for conducting wire and PCB plate |
| CN101803013A (en) * | 2007-09-13 | 2010-08-11 | 丰田自动车株式会社 | Semiconductor device and wire bonding method |
| JP2011180806A (en) * | 2010-03-01 | 2011-09-15 | Hitachi Displays Ltd | Touch panel and display device |
| CN202004170U (en) * | 2010-12-03 | 2011-10-05 | 宏纪电研股份有限公司 | Conductive connecting component |
| CN102789334A (en) * | 2012-07-10 | 2012-11-21 | 苏州泛普纳米科技有限公司 | Nanometer touch film production method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150527 |