Summary of the invention
Vehicle glass hot line, to the particular/special requirement of wiring character, comprises conductivity, attachment fastness, acid resistance, sulfur resistive voltinism, non-oxidizability etc.
The object of the invention is to be achieved through the following technical solutions:
The formula of vehicle glass hot line conductive copper paste, it is characterized in that: each constituent mass percentage is: ultra-fine mixed metal powder 80 ~ 90%, glass dust 4 ~ 9.5%, organic carrier 5.5 ~ 10.5%, organic additive 0.1 ~ 1.0%, each constituent mass percentage sum is 100%;
Described ultra-fine mixed metal powder is made up of the raw material of following mass percent: blister copper powder 90 ~ 95%, thin copper powder 5 ~ 10%, low-melting alloy powder 0.5 ~ 2%.
Described blister copper powder equivalent sphere particle diameter is D
50=2 ~ 4 μm, S.S.A=0.5 ~ 1.0m
2/ g.
Described thin copper powder equivalent sphere particle diameter is D
50=80 ~ 200nm, S.S.A=6 ~ 15m
2/ g.
The fusing point of described low-melting alloy powder is 130 ~ 230 DEG C, and it comprises one or more in signal bronze, sn-bi alloy.
Described glass dust is a kind of B-Bi-Si-P glass frit, and its point of incipient sintering is 450 ~ 550 DEG C, obvious melt temperature higher than 600 DEG C, equivalent sphere particle diameter D
50=1 ~ 3 μm, S.S.A=4 ~ 10m
2/ g.
The each constituent mass percentage of described B-Bi-Si-P glass frit is: B
2o
310 ~ 15%, Bi
2o
375 ~ 85%, SiO
25 ~ 15%, P
2o
50 ~ 5%, BaO 0 ~ 5%, inorganic additive 0 ~ 0.5%, each constituent mass percentage sum is 100%.
Described inorganic additive adds in the process of glass dust powder process.
Described inorganic additive is made up of one or more in following material: zinc oxide, di-iron trioxide, iron sulfide, zirconia, cupric oxide, copper sulfide, cuprous sulfide, tungsten oxide, titanium dioxide, molybdenum oxide, rare earth oxide.
The each constituent mass percentage of described organic carrier is: acrylic resin 10 ~ 15%, terpinol 50 ~ 65%, tributyl citrate 15 ~ 20%, alcohol ester 12 ~ 10%, butyl carbitol 5 ~ 8%, rilanit special 0.3 ~ 0.6%, and each constituent mass percentage sum is 100%.
Described organic additive is the high molecular surfactant of a class with special end group, and it is made up of one or more in following material: the long chain alkane of acrylic resin, higher mercaptan, band sulfydryl, the long chain alkane of band hydrosulfamine base.
A kind of vehicle glass hot line conductive copper paste and preparation method thereof, it is characterized in that: preparation process is: (1) by ultra-fine mixed metal powder, glass dust respectively with the organic carrier of corresponding mass ratio and organic additive high-speed stirred even, rolling becomes viscous paste, obtains metal pulp and glass paste respectively; (2) by metal pulp and glass paste mixing, adopt high shear dispersion machine to carry out dispersed with stirring, obtain uniform viscous paste, be finished automotive glass hot line conductive copper paste.
Embodiment
Formula Design and the preparation process of conductive copper paste involved in the present invention will be described in detail below with application example.
Embodiment one
Mixed metal powder chooses preparation according to parameter shown in table 1 and ratio, mixes, for subsequent use.
The specification of table 1 mixed metal powder and proportioning
Powder type |
D50 |
S.S.A/ |
Mass fraction |
Blister copper powder |
3.75μm |
0.55m
2/g
|
94.5% |
Thin copper powder |
80nm |
10.0m
2/g
|
5% |
Signal bronze powder |
3.90 |
0.67m
2/g
|
0.5% |
Glass dust, according to the ratio precise shown in table 2, mixed 30 mesh sieves, and in 1150 DEG C of constant temperature 15min, shrend, adds the super fine zinc oxide of 0.5%, powder process; Obtaining glass dust specifications parameter is: D50=1.49 μm, S.S.A=6.45m2/g, and the point of incipient sintering is 490 DEG C.
Each component proportion of table 2 glass dust and specification
Oxide |
Bi2O3 |
B2O3 |
SiO2 |
P2O5 |
BaO |
Mass fraction/% |
70 |
15 |
9.5 |
3 |
2.5 |
Organic carrier, according to the ratio precise shown in table 3, mixes, and stirs 2h in 75 DEG C of constant temperature, crosses 80 order stainless steel mesh, obtains the thick liquid clarified.
Table 3 organic carrier formula table
Component |
Acrylic resin |
Terpinol |
Tributyl citrate |
Alcohol ester 12 |
Butyl carbitol |
Rilanit special |
Mass fraction/% |
12 |
60 |
16 |
5 |
6.7 |
0.3 |
Wet end furnish is in table 4.
Table 4 conductive copper paste formula
Component |
Mixed metal powder |
Glass dust |
Organic carrier |
Acrylic resin dispersant |
Mass fraction/% |
85.4 |
5.9 |
8.3 |
0.4 |
The preparation technology of slurry is as follows:
A, by metal mixed powder and glass dust precise respectively, mix 2h with three-dimensional mixer, as solid-state point;
B, by organic carrier and acrylic resin dispersant precise, stir, divide as liquid state;
C, by described in (a) solid-state point respectively and (b) described in liquid state divide mixing, stir 30min with homogenizer, fully mix, obtain two kinds of pastel, be called metal pastel and glass paste thing;
D, by kind of the pastel of two described in (c) respectively cross three-high mill, fineness controlled at 10 ~ 15 μm, viscosity controls at 80 ~ 120Pa.S, obtains bronzing pasty masses, is metal pulp; Linen paste is glass paste;
E, by the high shear dispersion machine high-speed stirred dispersion of the metal pulp described in (d) and glass paste, obtain bronzing pasty masses, be finished product conductive copper paste;
By the finished product conductive copper paste of gained, on the glass substrate, through silk screen printing, obtain bronzing wiring; Under N2 atmosphere protection, at 600 DEG C sinter, obtain the wiring having copper metallic luster of copper red look, after testing its performance reach silver-colored pulp-water put down.Its performance parameter is as table 5.
Table 5 copper slurry wiring performance test results
Embodiment two
Mixed metal powder chooses preparation according to parameter shown in table 6 and ratio, mixes, for subsequent use.
The specification of table 6 mixed metal powder and proportioning
Powder type |
D50 |
S.S.A/ |
Mass fraction |
Blister copper powder |
3.87μm |
0.67m
2/g
|
93.5% |
Thin copper powder |
80nm |
9.20m
2/g
|
6% |
Sn-bi alloy powder |
3.67μm |
0.50m
2/g
|
0.5% |
Glass dust, according to the ratio precise shown in table 7, mixed 30 mesh sieves, and in 1150 DEG C of constant temperature 15min, shrend, adds the super fine zinc oxide of 0.5%, powder process; Obtaining glass dust specifications parameter is: D50=1.47 μm, S.S.A=6.40m2/g, and the point of incipient sintering is 480 DEG C.
Each component proportion of table 7 glass dust and specification
Oxide |
Bi2O3 |
B2O3 |
SiO2 |
P2O5 |
BaO |
Mass fraction/% |
72 |
13 |
7.5 |
3 |
4.5 |
Organic carrier, according to the ratio precise shown in table 8, mixes, and stirs 2h in 75 DEG C of constant temperature, crosses 80 order stainless steel mesh, obtains the thick liquid clarified.
Table 8 organic carrier formula table
Component |
Acrylic resin |
Terpinol |
Tributyl citrate |
Alcohol ester 12 |
Butyl carbitol |
Rilanit special |
Mass fraction/% |
12 |
60 |
16 |
5 |
6.4 |
0.6 |
Wet end furnish is in table 9.
Table 9 conductive copper paste formula
Component |
Mixed metal powder |
Glass dust |
Organic carrier |
Acrylic resin dispersant |
Mass fraction/% |
82.6 |
7.4 |
10 |
0.4 |
The preparation technology of slurry is identical with blank preparation technics in embodiment one, and size performance parameter is as table 10.
Table 10 copper slurry wiring performance test results
Embodiment three
Mixed metal powder chooses preparation according to parameter shown in table 11 and ratio, mixes, for subsequent use.
The specification of table 6 mixed metal powder and proportioning
Powder type |
D50 |
S.S.A/ |
Mass fraction |
Blister copper powder |
2.70μm |
1.07m
2/g
|
97.5% |
Thin copper powder |
100nm |
6.70m
2/g
|
2% |
Sn-bi alloy powder |
3.67μm |
0.50m
2/g
|
0.5% |
Glass dust, according to the ratio precise shown in table 12, mixed 30 mesh sieves, and in 1150 DEG C of constant temperature 15min, shrend, adds the copper sulfide of 0.5%, powder process; Obtaining glass dust specifications parameter is: D50=1.45 μm, S.S.A=6.40m
2/ g, the point of incipient sintering is 480 DEG C.
Each component proportion of table 12 glass dust and specification
Oxide |
Bi2O3 |
B2O3 |
SiO2 |
P2O5 |
BaO |
Mass fraction/% |
75 |
15 |
2.5 |
3 |
4.5 |
Organic carrier, according to the ratio precise shown in table 13, mixes, and stirs 2h in 75 DEG C of constant temperature, crosses 80 order stainless steel mesh, obtains the thick liquid clarified.
Table 13 organic carrier formula table
Component |
Acrylic resin |
Terpinol |
Tributyl citrate |
Alcohol ester 12 |
Butyl carbitol |
Rilanit special |
Mass fraction/% |
12 |
60 |
16 |
5 |
6.4 |
0.6 |
Wet end furnish is in table 14.
Table 9 conductive copper paste formula
Component |
Mixed metal powder |
Glass dust |
Organic carrier |
Acrylic resin dispersant |
Mass fraction/% |
82.4 |
7.5 |
10.1 |
0.4 |
The preparation technology of slurry is identical with blank preparation technics in embodiment one, and size performance parameter is as table 15.
Table 15 copper slurry wiring performance test results