CN104651916A - Electroplating pretreatment process for insert surface and EDM deep cavity - Google Patents

Electroplating pretreatment process for insert surface and EDM deep cavity Download PDF

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Publication number
CN104651916A
CN104651916A CN201310580324.2A CN201310580324A CN104651916A CN 104651916 A CN104651916 A CN 104651916A CN 201310580324 A CN201310580324 A CN 201310580324A CN 104651916 A CN104651916 A CN 104651916A
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China
Prior art keywords
workpiece
electroplated
plated
electroplating
titanium metal
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CN104651916B (en
Inventor
叶文利
胡永森
陶俊
曹杰
朱启武
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TONGLING SANJIA YAMADA TECHNOLOGY Co Ltd
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TONGLING SANJIA YAMADA TECHNOLOGY Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses an electroplating pretreatment process for insert surface and EDM deep cavity. The process includes the following steps: (1), placing the workpiece to be plated on an organic glass plate; (2) uniformly punching a plurality of grid shaped holes on a titanium metal plate, placing the titanium metal plate on the cathode surface of the workpiece to be plated, and arranging the organic glass plate between the titanium metal plate and the periphery of the workpiece to be plated to maintain separation; and (3) fixedly connecting the titanium metal plate and the workpiece to be plated and then electroplating in a plating bath. The invention has the beneficial effect that the design of an auxiliary anode (titanium metal plate) is added based on the original electroplating process. Plating does not form on the titanium metal surface in the electroplating process, so that the metal cation fully loses electrons under the effect of current and so that plating positive ions effectively get electrons and are reduced to atoms for covering the cathode plating; and the a metal protective layer is to protect the edge smoothness of the workpiece to be plated and avoid burr.

Description

For the electroplating pretreatment process of mold insert surface with EDM deep-small hole
Technical field
The present invention relates to electroplating technology, particularly relate to for the electroplating pretreatment process of mold insert surface with EDM deep-small hole.
Background technology
At present, in Metal plating industry, be all simple technique.Be that the workpiece that will electroplate is done negative electrode, the metal that plate is connected on anode, for getting rid of other cationic interference, and making coating evenly, firmly, electroplate liquid need be done, to keep the cationic concentration of coated metal constant with containing the cationic solution of coated metal.The object of plating plates metal plating on base material, changes substrate surface character or size.Plating can strengthen metal erosion resistance (the corrosion resistant metal of the many employings of coated metal), increase hardness, prevent abrasion, improve electroconductibility, oilness, thermotolerance and surface aesthetic.
Pass to galvanic power supply in electroplating process after, the metal of anode can be oxidized (losing electronics), and the positive ion in solution then becomes atom in cathodic reduction (obtaining electronics) and accumulates in negative electrode top layer.In present electroplating process, when using common plating mode, it is uneven that surface after plating has electrolytic coating, or stick up skin, misty shape etc., and it not is very attractive in appearance that such outward appearance just seems; And in the middle of the comparatively deep-small hole workpiece of EDM processing, the phenomenon that die cavity bottom surface may have plating not go up, does not reach antirust effect, and there is obvious aberration in the region do not plated with the region plated, very unsightly.
Summary of the invention
The technical problem to be solved in the present invention is that existing electroplating technology makes the uneven periphery of plated item overlay coating jagged, the comparatively deep-small hole workpiece bottom of EDM processing does not cross aberration, provides a kind of for the electroplating pretreatment process of mold insert surface with EDM deep-small hole for this reason.
Technical scheme of the present invention is: for mold insert surface and the electroplating pretreatment process of EDM deep-small hole, it comprises the following steps: (1), the workpiece of electroplated is placed on poly (methyl methacrylate) plate; (2), titanium mesh will evenly be got some latticed holes, be placed on the cathode surface of electroplated workpiece, be provided with poly (methyl methacrylate) plate between titanium mesh and electroplated workpiece periphery to keep interval; (3), conductive metal sheet is connected with in the surperficial side of titanium mesh; (4) titanium mesh and the affixed plating tank of then putting into of electroplated workpiece are electroplated.
1-10mm is spaced apart in such scheme in step (2) between titanium mesh and electroplated workpiece.
Workpiece periphery at electroplated in step described in such scheme (1) is surrounded by coat of metal.
The invention has the beneficial effects as follows on the basis of original electroplating technology, add the design of complementary anode (titanium mesh).Titanium metal surface in chrome-plating process does not have coating, and what can make its metallic cation loses electronics fully under galvanic action, thus makes plating positive ion effectively obtain electron reduction to become atom to cover on negative electrode; The effect of coat of metal is the periphery planarization of protection electroplated workpiece, avoids the appearance of burr, allows burr appear at the periphery of coat of metal.
Embodiment
Below in conjunction with embodiment, the present invention will be further described.
Embodiment 1: comprise (1), the workpiece of electroplated is placed on poly (methyl methacrylate) plate; (2), titanium mesh will evenly be got some latticed holes, be placed on the cathode surface of electroplated workpiece, be provided with poly (methyl methacrylate) plate between titanium mesh and electroplated workpiece periphery to keep interval; (3), conductive metal sheet is connected with in the surperficial side of titanium mesh; (4) titanium mesh and the affixed plating tank of then putting into of electroplated workpiece are electroplated.
Embodiment 2:(1), the workpiece of electroplated is placed on poly (methyl methacrylate) plate, be surrounded by coat of metal at the workpiece periphery of electroplated; (2), titanium mesh will evenly be got some latticed holes, be placed on the cathode surface of electroplated workpiece, be provided with poly (methyl methacrylate) plate between titanium mesh and electroplated workpiece periphery to keep interval, be spaced apart 1mm; (3), conductive metal sheet is connected with in the surperficial side of titanium mesh; (4), titanium mesh is electroplated by bonding affixed plating tank of then putting into electroplated workpiece.
Embodiment 3:(1), the workpiece of electroplated is placed on poly (methyl methacrylate) plate, be surrounded by coat of metal at the workpiece periphery of electroplated; (2), titanium mesh will evenly be got some latticed holes, be placed on the cathode surface of electroplated workpiece, be provided with poly (methyl methacrylate) plate between titanium mesh and electroplated workpiece periphery to keep interval, be spaced apart: 10mm; (3), conductive metal sheet is connected with in the surperficial side of titanium mesh; (4), titanium mesh and electroplated workpiece are electroplated by the affixed plating tank of then putting into of bolt.
The part isolation that coat of metal will not need to electroplate on the one hand, avoid the periphery of electroplated workpiece to occur burr, the electric current strengthening negative electrode on the other hand connects.Interval between titanium mesh and electroplated workpiece periphery is less, acts on larger, but can not contact with negative electrode.
Having netted hole in the middle of titanium mesh, is in order to electroplate liquid has more positive ion to produce in electroplating process like this.Between titanium mesh and electroplated workpiece, be used for isolating with poly (methyl methacrylate) plate, avoid titanium mesh and negative electrode to have the possibility that electrical currency is logical, (if between metal, having contact to be short circuit).Finally by titanium mesh screw and negative plate to be plated, then just whole device can be put into plating tank and electroplate.By the reinforcement galvanic action of conductive metal sheet, achieve good conductive effect.Metal sheet can be copper coin, aluminium sheet, iron plate, is certainly preferably titanium plate.
On the coat of metal of conductive metal sheet and opposite side on the other side, connect suspender respectively when needing to electroplate, put into plating tank and prepare to electroplate.
Above in conjunction with the embodiments to invention has been exemplary description; obvious specific implementation of the present invention is not subject to the restrictions described above; as long as have employed the improvement of the various unsubstantialities that method of the present invention is conceived and technical scheme is carried out; or design of the present invention and technical scheme directly applied to other occasion, all within protection scope of the present invention without to improve.

Claims (3)

1. for mold insert surface and the electroplating pretreatment process of EDM deep-small hole, it is characterized in that it comprises the following steps: (1), the workpiece of electroplated is placed on poly (methyl methacrylate) plate; (2), titanium mesh will evenly be got some latticed holes, be placed on the cathode surface of electroplated workpiece, be provided with poly (methyl methacrylate) plate between titanium mesh and electroplated workpiece periphery to keep interval; (3), conductive metal sheet is connected with in the surperficial side of titanium mesh; (4) titanium mesh and the affixed plating tank of then putting into of electroplated workpiece are electroplated.
2., as claimed in claim 1 for the electroplating pretreatment process of mold insert surface with EDM deep-small hole, it is characterized in that being spaced apart 1-10mm in described step (2) between titanium mesh and electroplated workpiece.
3., as claimed in claim 1 or 2 for mold insert surface and the electroplating pretreatment process of EDM deep-small hole, it is characterized in that the workpiece periphery at electroplated in described step (1) is surrounded by coat of metal.
CN201310580324.2A 2013-11-19 2013-11-19 Electroplating pretreatment process for insert surface and EDM deep cavity Active CN104651916B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310580324.2A CN104651916B (en) 2013-11-19 2013-11-19 Electroplating pretreatment process for insert surface and EDM deep cavity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310580324.2A CN104651916B (en) 2013-11-19 2013-11-19 Electroplating pretreatment process for insert surface and EDM deep cavity

Publications (2)

Publication Number Publication Date
CN104651916A true CN104651916A (en) 2015-05-27
CN104651916B CN104651916B (en) 2017-04-19

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1544804A (en) * 2003-11-17 2004-11-10 烟台万斯特有限公司 Chromium plating rack for cylinder liner bore
CN101899697A (en) * 2010-08-13 2010-12-01 上海交通大学 Electroplating equipment for inner wall auxiliary anode of specially-shaped cavity
CN202482457U (en) * 2011-12-18 2012-10-10 沈阳黎明航空发动机(集团)有限责任公司 Auxiliary device for high pressure turbine journal inner diameter narrow side chromium plating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1544804A (en) * 2003-11-17 2004-11-10 烟台万斯特有限公司 Chromium plating rack for cylinder liner bore
CN101899697A (en) * 2010-08-13 2010-12-01 上海交通大学 Electroplating equipment for inner wall auxiliary anode of specially-shaped cavity
CN202482457U (en) * 2011-12-18 2012-10-10 沈阳黎明航空发动机(集团)有限责任公司 Auxiliary device for high pressure turbine journal inner diameter narrow side chromium plating

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
王洪奎: "组合式挂具在镀硬铬中的应用", 《电镀与精饰》 *
邹坚: "内(盲)孔镀缎面铬辅助阳极的设计", 《电镀与精饰》 *

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